ANSYS is a technology-leading software for numerical simulation in product development. The functionality spans all steps of CAE simulations, combined with very powerful simulation technology for Fluid Dynamics, Structural Mechanics, Electromagnetics, Multiphysics and System Simulation as well as Temperature Fields.
ANSYS users come from various industrial sectors. ANSYS is particularly widespread in the following industries: industrial equipment, energy, automotive, aerospace and defense, railway and ship building, consumer goods and healthcare technology. Even in higher education and research institutes ANSYS is used intensively.
Since 1985 CADFEM GmbH is established distributor of ANSYS software in Central Europe and Elite Channel Partner of ANSYS, the world's largest independent provider of simulation software.
The ANSYS 3-D Design products enable CAD modeling and simulation for all design engineers. Since the demands on today’s design engineer to build optimized, lighter and smarter products are greater than ever, using the appropriate design tools is more important than ever.
ANSYS Workbench is the ANSYS simulation platform in which multi-physics calculations are organized and controlled. It provides a common graphic interface with gateways to common CAD and meshing tools.
A comprehensive approach covering the whole spectrum of structural applications both statics and dynamics.
ANSYS CFX and ANSYS FLUENT are technically leading solutions for the requirements of flow simulation (Computational Fluid Dynamics, CFD).
High Performance Computing (HPC) is the key for fast and precise calculations of particularly large and complex models. Most important for the effective use of HPC solutions is the optimal interaction between hardware and software.
These additional modules add functionality to ANSYS: e.g. certificates (FKM standards, VDI 2230), interfaces to other software, and data compression.
ANSYS products cover very broad areas of electromagnetism in high and low frequencies.
Analysis of complex multi-physical systems by means of strong and weak coupling between fields and connectors.
Thermal analysis at different scales, from micro-components to a complete system.