Material deposition in the manner of dispensing has been widely used in microelectronics for decades. Traditional manufacturing and packaging processes including micro-dispensing has been challenged by the trend towards more compact and complicated electronic devices at lower cost. In addition to the interest of miniaturizing, relatively large area coating for applications such as underfilling, encapsulating, heat transfer, EMI shielding, structural support, shock protection and etc. Enabling technologies and tools are greatly needed to provide not only accuracy, repeatability and flexibility but also wide range of material choices, dimensionality and the ability for in-line integration. The high speed micro-dispensing/direct printing technology of nScrypt provides such a solution with precise volume control, advanced computerized motion control, high resolution vision system and the ability of printing on 3D conformal surfaces. The materials can be processed includes but not limited to, conductive, dielectric, adhesive, epoxy, rubberized polymer and encapsulate. This paper presents several case studies of the above applications.