The EM-4075A-1 Die Bonder is designed for bonding semiconductor chips in production of integrated circuits, hybrids, UHV-transistors, diode and transistor assemblies and other electronic devices by vibration eutectic soldering in manual mode.
The bonder is a desk-top version.
The system has following features: a scrubbing die bond head with a tool heater, heated work stage, gas heater for soldering in a protective gas environment, an object stage for the dice in bulk, light indicator.
The pick up of the dice is carried out by vacuum from the object stage or from a multi-row cellular cassette. The cases or substrates are placed discretely into working area of the heated table.