The new Batch In-Line Sputtering Systems Models BH3F and BH4F from TFE are flexible process tools, with an inline architecture designed for a variety of different substrates.
The new batch inline sputtering system from TFE provides DC magnetron, RF magnetron and RF diode capabilities in all sputtering positions, without changing the cathode. RF etch capability is also included. System operation is under PLC control (Mitsubishi model). A wide variety of options add to system’s flexibility and include PULSED power supply, DC bias, co-sputtering capabilities, through-the-wall capability, high uniformity heating station, dual cathode.
Standard pallets for the new Batch inline sputtering system from TFE are in stainless steel and are available in a variety of configurations, depending on substrate size. Capacities range from thirty six 2” wafers to four 150mm wafers (for example)- Custom pallets can be provided upon request.
Specially designed stainless steel shutters protect adjacent targets from contamination during sputtering and keep optional heater from being coated.