The vision of functional components program is to demonstrate next-generation power and RF components and modules with simultaneous improvements in electrical performance, miniaturization, reduced cost and reliability at component and module levels for applications ranging from smartphones, wireless sensors, IoTs, and automotive applications. This will be accomplished by: 1) performance enhancement of functional components with better properties, 2) miniaturization in X-Y and Z directions, and 3) integration with actives to form ultra-miniaturized modules. A variety of advanced passive component technologies are being developed, including filters, diplexers, matching networks, EMI shields, antennas and thermal structures for RF; and high-density capacitors, high-density inductors, inductive links, transformers, and EMI filters for power. These advanced passives are integrated with actives to demonstrate functional modules such as power converters, LTE diversity and WLAN modules.
3D IPD and 3D IPAC concepts benchmarked with current component and module technologies.
The key building blocks being explored and developed are high-Q passives, embedded matching networks, diplexers, thermal structures for power amplifier (PA) cooling, and EMI shield.
The key building blocks for enhancing performance with miniaturization in future smart systems include capacitors, inductors and wireless power components such as inductive link, EMI shield and EMI filters.
For more information about Functional Components Research at GT PRC, please contact Dr. Raj Pulugurtha, Program Manager at raj.pulugurtha@prc.gatech.edu.