CEA and Intel sign 5yr IoT research agreement

Intel and French company CEA have signed a five-year deal to collaborate on research programs at CEA-Leti in Grenoble that will focus on the Internet of Things (IoT), as well as 3D displays, wireless communication and security. Intel and CEA will also work together on projects for the Horizon 2020 program. CEA-Leti director Marie-Noelle Semeria said the deal marked CEA-Leti out as "one of Europe’s most innovative players in the IoT".

An agreement between CEA and Intel will see the organisations working on several strategic research programmes, including the IoT, high speed wireless communication, security technologies and 3D displays. The partners will also work together to submit projects to the Horizon 2020 research programme.

CEA-Leti director Marie-Noelle Semeria said: “CEA and Intel have a long history of shared technological development in high performance computing. This collaboration marks the recognition of the CEA-Leti as one of Europe’s most innovative players in the IoT and the basic technologies of Cloud computing and Big Data. It also increases the attractiveness of the Grenoble Valley in terms of microelectronics.”

The agreement, which will run for at least five years, focuses on: the development of new materials in order to further the miniaturisation and adaptability of electronic components used in mobile phones; the development of wireless communication systems and faster data exchange; and the integration of connected objects and the study of low-consumption communication technologies.

Raj Hazra, general manager of Intel’s Enterprise and HPC Platform Group, added: “This announcement expands upon our long standing high performance computing relationship with CEA to drive leading edge innovation in IoT, wireless and security in the European community. We look forward to the important innovations and discoveries to come from this collaboration.