text:
JP2014182227A - Optical scanner, image display device, and head-mounted display - Google Patents
Optical scanner, image display device, and head-mounted display Download PDF
shaft portion
strain detection
JP2014182227A5 (en
Takeshi Shimizu
武士 清水
Seiko Epson Corp
セイコーエプソン株式会社
2013-03-18 Application filed by Seiko Epson Corp, セイコーエプソン株式会社 filed Critical Seiko Epson Corp
2016-04-28 Publication of JP2014182227A5 publication Critical patent/JP2014182227A5/ja
230000003287 optical Effects 0 abstract title 5
238000005452 bending Methods 0 abstract 1
230000003405 preventing Effects 0 abstract 1
G02B26/00—Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating
G02B26/08—Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating for controlling the direction of light
G02B26/10—Scanning systems
G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
G02B26/0816—Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating for controlling the direction of light by means of one or more reflecting elements
G02B26/0833—Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
G02B26/085—Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by electromagnetic means
PROBLEM TO BE SOLVED: To provide an optical scanner capable of preventing a strain sensor from being influenced by external heat in a gimbal structure comprising a movable unit supported inside a frame body unit and of detecting motion of the movable unit using the strain sensor, and to provide a highly reliable image display device and head-mounted display having such optical scanner.SOLUTION: An optical scanner 1 includes; a movable mirror unit 11 which has an optically reflective area having optical reflectance and is swingable about a Y-axis; a frame body unit 13 which is swingable about an X-axis perpendicular to the Y-axis; shafts 12a, 12b which connect the movable mirror unit 11 to the frame body unit 13; a stationary unit 15; shafts 14a, 14b which connect the frame body unit 13 to the stationary unit 15; a strain sensor 51 which is located at an end of the shaft 14a on the frame body unit 13 side; and a first signal processing unit which receives a detection signal from the strain sensor 51 and outputs a signal representing bending deformation of the shaft 14a.
The present invention relates to an optical scanner, an image display device, and a head mounted display.
For example, an optical scanner that is used in a projector, a head-mounted display, or the like and scans light in a two-dimensional manner is known (for example, see Patent Document 1).
For example, the optical scanner described in Patent Document 1 includes a frame-shaped outer frame (fixed portion), a frame-shaped inner frame (frame body portion) provided inside the outer frame, and the inner frame with respect to the outer frame. A pair of second elastic beams (second shaft portion) that are rotatably supported, a mirror portion (movable portion) provided inside the inner frame, and the mirror portion being rotatable with respect to the inner frame. And a pair of first elastic beams (first shaft portions).
In such an optical scanner, the inner frame is rotated with respect to the outer frame while twisting and deforming the second elastic beam, and the mirror portion is rotated with respect to the inner frame while twisting and deforming the first elastic beam. By doing so, the light reflected by the mirror part is scanned two-dimensionally.
Further, in the optical scanner described in Patent Document 1, a piezoresistor is disposed at an end of the second elastic beam between the inner frame and the outer frame on the outer frame side. Thereby, the rotation of the inner frame and the mirror portion due to the torsional deformation of the second elastic beam can be detected based on the change in the resistance value of the piezoresistor.
JP 2003-207737 A
The piezoresistor has a temperature characteristic that response sensitivity to stress changes with temperature change.
On the other hand, in the optical scanner described in Patent Document 1, since the piezoresistor is disposed at the end of the second elastic beam on the outer frame side, when the outer frame is supported and installed, heat from outside is externally applied. It is transmitted to the frame and the piezoresistors are easily affected by external heat.
Therefore, the temperature of the piezoresistor is different from the temperature of the main part that causes the torsional deformation of the second elastic beam, which causes a decrease in piezoresistor detection accuracy due to the temperature characteristics of the piezoresistor described above. There was a problem.
An object of the present invention is to provide an optical scanner capable of detecting the behavior of a movable part using a strain detection element while suppressing the influence of heat from the outside on the strain detection element, and to provide such an optical scanner. An object of the present invention is to provide an image display device and a head-mounted display that are excellent in reliability.
Such an object is achieved by the present invention described below.
The optical scanner of the present invention is provided with a light reflecting portion having light reflectivity, and a movable portion that can swing around a first axis;
A frame portion swingable around a second axis intersecting the first axis;
A first shaft portion connecting the movable portion and the frame body portion;
A fixed part;
A second shaft portion connecting the frame body portion and the fixed portion;
A first strain detection element disposed on an end of the second shaft portion on the frame body side, or one of the movable portion, the frame body portion, and the first shaft portion;
An end of the second shaft portion on the side of the frame body portion, or a second strain detection element disposed at any of the movable portion, the frame body portion, and the first shaft portion;
A first signal processing unit that receives a detection signal of the first strain detection element and outputs a signal based on bending deformation of the second shaft portion;
And a second signal processing unit that receives a detection signal of the second strain detection element and outputs a signal based on the torsional deformation of the second shaft portion.
According to such an optical scanner, it is possible to detect the behavior of the movable part around the first axis based on the signal output from the first signal processing part. Further, the behavior of the movable part around the second axis can be detected based on the signal output from the second signal processing part. Further, the first strain detection element and the second strain detection element are disposed at the end of the second shaft portion on the frame body side, or at any of the movable portion, the frame body portion, and the first shaft portion. Therefore, it is possible to suppress the influence of heat from the external fixing portion on the first strain detection element and the second strain detection element.
In the optical scanner according to the aspect of the invention, it is preferable that the first strain detection element is disposed at an end portion of the second shaft portion on the frame body portion side to detect deformation of the second shaft portion.
Thereby, the influence which the heat by the light which injected into the movable part has on a 1st distortion | strain detection element can be suppressed. Moreover, since it is not necessary to provide the first shaft portion with a strain resistance element used for detecting the behavior of the movable portion around the first axis, the degree of freedom in designing the first shaft portion can be increased.
In the optical scanner according to the aspect of the invention, the first strain detection element may include a piezoresistive region having a longitudinal shape extending in a direction along the longitudinal direction of the second shaft portion, and the second shaft portion on the piezoresistive region. And a pair of terminals arranged side by side in a direction along the longitudinal direction.
Thereby, the signal based on the bending deformation of the second shaft portion included in the signal output from the first strain detection element can be increased.
In the optical scanner according to the aspect of the invention, it is preferable that the behavior of the movable unit around the first axis is detected based on a signal output from the first signal processing unit.
Thereby, based on the detected behavior, the behavior of the movable part around the first axis is controlled to be in a desired state, or the behavior of the movable part around the first axis and the operation of other devices are controlled. Can be synchronized.
In the optical scanner according to the aspect of the invention, it is preferable that the behavior of the movable part around the first axis is estimated based on a signal output from the first signal processing unit using an observer.
Thereby, even if the swing of the movable part around the first axis is not in the resonance state, the behavior of the movable part around the first axis is detected based on the signal output from the first signal processing part. Can do.
In the optical scanner according to the aspect of the invention, the ratio of the amplitude at the resonance frequency related to the oscillation of the movable portion around the first axis to the amplitude at the resonance frequency related to the oscillation of the frame body portion around the first axis is calculated. It is preferable to estimate the behavior of the movable part around the first axis based on the signal output from the first signal processing part.
Thereby, it is possible to detect the behavior of the movable portion around the first axis with high accuracy based on the signal output from the first signal processing portion with a relatively simple configuration.
In the optical scanner according to the aspect of the invention, it is preferable that the second strain detection element is disposed at an end portion of the second shaft portion on the frame body portion side to detect deformation of the second shaft portion.
Thereby, the influence which the heat by the light which injected into the movable part has on a 2nd distortion | strain detection element can be suppressed. In addition, since it is not necessary to provide the first shaft portion with a strain resistance element used for detecting the behavior of the movable portion around the second axis, the degree of freedom in designing the first shaft portion can be increased.
In the optical scanner according to the aspect of the invention, it is preferable that the behavior of the movable unit around the second axis is detected based on a signal output from the second signal processing unit.
Thereby, based on the detected behavior, the behavior of the movable part around the second axis is controlled to be in a desired state, or the behavior of the movable part around the second axis and the operation of other devices are controlled. Can be synchronized.
A strain detecting element that is disposed at an end of the second shaft portion on the frame body portion side and detects deformation of the second shaft portion;
A first signal processing unit that receives a detection signal of the strain detection element and outputs a signal based on a bending deformation of the second shaft portion;
And a second signal processing unit that receives a detection signal of the strain detection element and outputs a signal based on the torsional deformation of the second shaft portion.
According to such an optical scanner, it is possible to detect the behavior of the movable part around the first axis based on the signal output from the first signal processing part. Further, the behavior of the movable part around the second axis can be detected based on the signal output from the second signal processing part. In addition, since the strain detection element is disposed at the end of the second shaft portion on the frame body side, or one of the movable portion, the frame body portion, and the first shaft portion, the strain detection element is externally provided. The influence of heat through the fixed portion can be suppressed.
In the optical scanner of the present invention, the strain detection element includes a piezoresistive region, a pair of terminals arranged on the piezoresistive region in a direction inclined with respect to the longitudinal direction of the second shaft portion, It is preferable to provide.
Thereby, the signal based on each of the bending deformation and the torsional deformation of the second shaft portion included in the signal output from the strain detection element can be increased.
In the optical scanner of the present invention, the second shaft portion is provided in a pair with the frame body portion interposed therebetween,
It is preferable that the strain detection element is disposed on each of the pair of second shaft portions.
Accordingly, a signal based on the bending deformation of the second shaft portion and a signal based on the torsional deformation of the second shaft portion can be efficiently extracted from the detection signals of the pair of strain detection elements.
The image display device of the present invention includes the optical scanner of the present invention,
A light source that emits light,
The light emitted from the light source is reflected by the light reflecting portion to display an image.
Thereby, an image display device having excellent reliability can be provided.
The head-mounted display of the present invention includes the optical scanner of the present invention,
The light emitted from the light source is reflected by the light reflecting portion, and an image is displayed as a virtual image.
Thereby, a head mounted display having excellent reliability can be provided.
It is a top view which shows the optical scanner which concerns on 1st Embodiment of this invention. FIG. 2 is a cross-sectional view (cross-sectional view along the X axis) of the optical scanner shown in FIG. 1. It is a block diagram which shows the control system of the optical scanner shown in FIG. It is a block diagram for demonstrating the voltage application part of the drive part with which the optical scanner shown in FIG. 1 is provided. FIG. 5 is a diagram illustrating an example of voltages generated in a first voltage generation unit and a second voltage generation unit illustrated in FIG. 4. It is a figure for demonstrating the 1st distortion | strain detection element of the optical scanner shown in FIG. It is a figure for demonstrating the 2nd distortion | strain detection element of the optical scanner shown in FIG. (A) is a graph showing a frequency characteristic related to a ratio between a torque around the first axis applied to the frame body part and a swing angle around the Y axis of the movable part and the frame body part, and (b) shows a frame characteristic. It is a graph which shows the frequency characteristic regarding the phase difference of the torque around the 1st axis | shaft applied to a body part, and the rocking | fluctuation around the 1st axis | shaft of a movable part and a frame part. (A) is the graph which expanded the resonance frequency vicinity of FIG. 8 (a), (b) is the graph which expanded the resonance frequency vicinity of FIG.8 (b). It is a top view which shows the optical scanner which concerns on 2nd Embodiment of this invention. It is a block diagram which shows the control system of the optical scanner shown in FIG. It is a figure for demonstrating the distortion | strain detection element of the optical scanner shown in FIG. It is a figure for demonstrating the relationship between the attitude | position of a 2 terminal type strain sensing element, and the crystal orientation of a silicon | silicone. It is a graph which shows the relationship between the attitude | position (angle (alpha)) of a 2 terminal type distortion | strain detection element, and the absolute value of the resistance value change rate by a tensile stress and a shear stress in the case of using p-type silicon for a piezoresistive area. It is a graph which shows the relationship between the attitude | position (angle (alpha)) of a 2 terminal type distortion | strain detection element at the time of using n-type silicon for a piezoresistive area | region, and the absolute value of resistance value change rate by a tensile stress and a shear stress. It is a graph which shows the relationship between the attitude | position (angle (alpha)) of a 2 terminal type strain sensing element, and the ratio of the absolute value of the resistance value change rate by a tensile stress and a shear stress. It is a top view which shows the optical scanner which concerns on 3rd Embodiment of this invention. It is a figure for demonstrating the distortion | strain detection element of the optical scanner shown in FIG. It is a graph which shows the relationship between the attitude | position (angle (alpha)) of a 4-terminal type strain sensing element, and the absolute value of the resistance value change rate by a tensile stress and a shear stress at the time of using p-type silicon for a piezoresistive area | region. It is a graph which shows the relationship between the attitude | position (angle (alpha)) of a 4-terminal type strain sensing element, and the absolute value of the resistance value change rate by a tensile stress and a shear stress in the case of using n-type silicon for a piezoresistive region. It is a graph which shows the relationship between the attitude | position (angle (alpha)) of a 4-terminal type strain sensing element, and the ratio of the absolute value of the resistance value change rate by a tensile stress and a shear stress. It is a top view which shows the optical scanner which concerns on 4th Embodiment of this invention. It is a top view which shows the optical scanner which concerns on 5th Embodiment of this invention. It is a top view which shows the optical scanner which concerns on 6th Embodiment of this invention. It is a figure which shows typically embodiment of the image display apparatus of this invention. FIG. 26 is a block diagram showing a control system of the image display device shown in FIG. 25. It is a perspective view which shows the application example 1 of the image display apparatus of this invention. It is a perspective view which shows the application example 2 of the image display apparatus of this invention. It is a perspective view which shows the application example 3 of the image display apparatus of this invention.
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of an optical scanner, an image display device, and a head mounted display according to the invention will be described with reference to the accompanying drawings.
(Optical scanner)
<First Embodiment>
FIG. 1 is a plan view showing an optical scanner according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view (cross-sectional view along the X axis) of the optical scanner shown in FIG. 1, and FIG. It is a block diagram which shows the control system of the optical scanner shown. 4 is a block diagram for explaining a voltage application unit of a drive unit included in the optical scanner shown in FIG. 1, and FIG. 5 shows a first voltage generation unit and a second voltage generation unit shown in FIG. It is a figure which shows an example of the generated voltage.
In the following, for convenience of explanation, the upper side in FIG. 2 is referred to as "upper" and the lower side is referred to as "lower".
As shown in FIGS. 1 and 2, the optical scanner 1 includes a movable mirror unit 11, a pair of shaft portions 12a and 12b (first shaft portion), a frame body portion 13, and a pair of shaft portions 14a. 14b (second shaft part), fixed part 15, permanent magnet 21, coil 31, magnetic core 32, voltage application part 4, strain detection element 51 (first strain detection element) and strain detection element 52 ( Second strain detection element).
Here, the movable mirror portion 11 and the pair of shaft portions 12a and 12b constitute a first vibration system that swings (reciprocates) around the Y axis (first axis). In addition, the movable mirror part 11, the pair of shaft parts 12a and 12b, the frame part 13, the pair of shaft parts 14a and 14b, and the permanent magnet 21 swing around the X axis (second axis) (reciprocating). A second vibration system that moves).
Further, the permanent magnet 21, the coil 31, and the voltage application unit 4 drive the first vibration system and the second vibration system described above by the interaction of the magnetic fields of the permanent magnet 21 and the coil 31 (that is, the movable mirror unit 11). Is configured to swing around the X axis and the Y axis.
In particular, in the optical scanner 1, the strain detection element 51 is disposed at the end of the shaft portion 14a on the frame body portion 13 side, and the detection signal of the strain detection element 51 includes a signal based on bending deformation of the shaft portion 14a. As shown in FIG. 3, the signal is input to the first signal processing circuit 71. The first signal processing circuit 71 outputs a signal based on the bending deformation of the shaft portion 14a. The signal output from the first signal processing circuit 71 is input to the control unit 6. The control unit 6 detects the behavior around the Y axis of the movable mirror unit 11 based on the signal output from the first signal processing circuit 71. As described above, the behavior of the movable mirror portion 11 around the Y axis is detected using a signal based on the bending deformation of the shaft portion 14a included in the detection signal of the strain detection element 51.
Further, the strain detection element 52 is disposed at the end of the shaft portion 14b on the frame body portion 13 side, and the detection signal of the strain detection element 52 includes a signal based on the torsional deformation of the shaft portion 14b, as shown in FIG. Thus, the signal is input to the second signal processing circuit 72. The second signal processing circuit 72 outputs a signal based on the torsional deformation of the shaft portion 14b. The signal output from the second signal processing circuit 72 is input to the control unit 6. The control unit 6 detects the behavior around the X axis of the movable mirror unit 11 based on the signal output from the second signal processing circuit 72.
In such an optical scanner 1, since the strain detection elements 51 and 52 are disposed at the ends of the shaft portions 14 a and 14 b on the frame body 13 side, the fixing portion 15 from the outside with respect to the strain detection elements 51 and 52 is provided. It is possible to suppress the influence of heat. Here, the end portions of the shaft portions 14a and 14b on the frame body portion 13 side are portions on the frame body portion 13 side from the centers of the shaft portions 14a and 14b.
Hereinafter, each part of the optical scanner 1 will be described in detail sequentially.
The movable mirror part 11 includes a base part (movable part) 111 and a light reflection plate 113 fixed to the base part 111 via a spacer 112. Here, the base (movable part) 111 has a function capable of swinging (turning) with respect to the fixed part 15.
A light reflecting portion 114 having light reflectivity is provided on the upper surface (one surface) of the light reflecting plate 113.
The light reflecting plate 113 is separated from the shaft portions 12a and 12b in the thickness direction of the light reflecting plate 113, and when viewed from the thickness direction (hereinafter also referred to as "plan view"), the shaft portions 12a and 12b. It is provided to overlap.
Therefore, the area of the plate surface of the light reflecting plate 113 can be increased while shortening the distance between the shaft portion 12a and the shaft portion 12b. Further, since the distance between the shaft portion 12a and the shaft portion 12b can be shortened, the size of the frame body portion 13 can be reduced. Furthermore, since the size of the frame body portion 13 can be reduced, the distance between the shaft portion 14a and the shaft portion 14b can be shortened.
For this reason, even if the area of the plate surface of the light reflecting plate 113 is increased, the optical scanner 1 can be downsized.
Further, the light reflection plate 113 is formed so as to cover the entire shaft portions 12a and 12b in plan view. In other words, each of the shaft portions 12a and 12b is located inside the outer periphery of the light reflecting plate 113 in plan view. Thereby, the area of the plate | board surface of the light reflection board 113 becomes large, As a result, the area of the light reflection part 114 can be enlarged. In addition, unnecessary light (for example, light that could not be incident on the light reflecting portion 114) can be prevented from being reflected by the shaft portions 12a and 12b and becoming stray light.
The light reflecting plate 113 is formed so as to cover the entire frame body portion 13 in plan view. In other words, the frame body portion 13 is located on the inner side with respect to the outer periphery of the light reflecting plate 113 in plan view. Thereby, the area of the plate | board surface of the light reflection board 113 becomes large, As a result, the area of the light reflection part 114 can be enlarged. Moreover, it can suppress that unnecessary light reflects in the frame part 13 and becomes stray light.
Furthermore, the light reflecting plate 113 is formed so as to cover the entire shaft portions 14a and 14b in plan view. In other words, each of the shaft portions 14a and 14b is located on the inner side with respect to the outer periphery of the light reflecting plate 113 in plan view. Thereby, the area of the plate | board surface of the light reflection board 113 becomes large, As a result, the area of the light reflection part 114 can be enlarged. Moreover, it can suppress that unnecessary light reflects in the axial parts 14a and 14b and becomes stray light.
In the present embodiment, the light reflecting plate 113 has a circular shape in plan view. In addition, the planar view shape of the light reflection plate 113 is not limited to this, and may be a polygon such as an ellipse or a rectangle. Further, by making the shape of the light reflecting plate 113 in plan view so as to protrude in the direction along the X axis and the Y axis, stray light at each shaft portion can be efficiently reduced while suppressing the moment of inertia of the light reflecting plate 113 to be small. it can.
A hard layer 115 is provided on the lower surface of the light reflecting plate 113 (the other surface, the surface on the base 111 side of the light reflecting plate 113).
The hard layer 115 is made of a material harder than the constituent material of the light reflecting plate 113 main body. Thereby, the rigidity of the light reflecting plate 113 can be increased. Therefore, it is possible to suppress the bending when the light reflecting plate 113 swings. Further, the thickness of the light reflecting plate 113 can be reduced, and the moment of inertia when the light reflecting plate 113 swings around the X axis and the Y axis can be suppressed.
The constituent material of such a hard layer 115 is not particularly limited as long as it is a material harder than the constituent material of the light reflecting plate 113 main body. For example, diamond, crystal, sapphire, lithium tantalate, potassium niobate, A carbon nitride film or the like can be used, but it is particularly preferable to use diamond.
The thickness (average) of the hard layer 115 is not particularly limited, but is preferably about 1 to 10 μm, and more preferably about 1 to 5 μm.
Moreover, the hard layer 115 may be comprised by the single layer, and may be comprised by the laminated body of several layers. The hard layer 115 may be provided on the entire lower surface of the light reflecting plate 113 or may be provided on a part of the lower surface. The hard layer 115 is provided as necessary, and can be omitted.
The hard layer 115 can be formed by, for example, chemical vapor deposition (CVD) such as plasma CVD, thermal CVD, or laser CVD, dry plating such as vacuum deposition, sputtering, or ion plating, electrolytic plating, or immersion plating. Further, wet plating methods such as electroless plating, thermal spraying, and joining of sheet-like members can be used.
In addition, the lower surface of the light reflecting plate 113 is fixed to the base 111 via a spacer 112. Thereby, the light reflecting plate 113 can be swung around the Y axis while suppressing contact with the shaft portions 12a and 12b, the frame body portion 13 and the shaft portions 14a and 14b.
In addition, the base 111 is located on the inner side with respect to the outer periphery of the light reflecting plate 113 in plan view. The area of the base 111 in plan view is preferably as small as possible if the base 111 can support the light reflecting plate 113 via the spacer 112. Thereby, the distance between the shaft part 12a and the shaft part 12b can be reduced while increasing the area of the plate surface of the light reflecting plate 113.
The frame body portion 13 has a frame shape and is provided so as to surround the base portion 111 of the movable mirror portion 11 described above. In other words, the base 111 of the movable mirror portion 11 is provided inside the frame body portion 13 having a frame shape.
The frame body portion 13 has a shape along the outer shape of the structure including the base portion 111 of the movable mirror portion 11 and the pair of shaft portions 12a and 12b in plan view. Thus, the frame body portion 13 while allowing the vibration of the first vibration system constituted by the movable mirror portion 11 and the pair of shaft portions 12a and 12b, that is, swinging around the Y axis of the movable mirror portion 11 is allowed. Can be miniaturized.
In addition, the frame body part 13 includes ribs 131 protruding from the shaft parts 12 a and 12 b and the shaft parts 14 a and 14 b in the thickness direction of the frame body part 13. Such ribs 131 can reduce the deformation of the frame body portion 13. The rib 131 also has a function (function as a spacer) for suppressing the movable mirror portion 11 from coming into contact with the permanent magnet 21.
In addition, if the shape of the frame part 13 is a frame shape, it will not be limited to the thing of illustration.
Further, the frame body portion 13 has a length in the direction along the Y-axis that is longer than a length in the direction along the X-axis. Thereby, the length of the optical scanner 1 in the direction along the X-axis can be shortened while ensuring the length necessary for the shaft portions 12a and 12b.
And the frame part 13 is supported by the fixing | fixed part 15 via axial part 14a, 14b. Further, the base 111 of the movable mirror part 11 is supported by the frame body part 13 via the shaft parts 12a and 12b.
The shaft portions 12a and 12b and the shaft portions 14a and 14b can be elastically deformed.
The shaft portions 12a and 12b (first shaft portion) are configured so that the movable mirror portion 11 and the frame body portion can swing (turn) around the Y axis (first axis). 13 is connected. In addition, the shaft portions 14a and 14b (second shaft portions) are configured so that the frame body portion 13 can swing (turn) around the X axis (second axis) orthogonal to the Y axis. 13 and the fixed part 15 are connected.
More specifically, the shaft portions 12 a and 12 b are disposed so as to face each other via (base) the base portion 111 of the movable mirror portion 11.
Each of the shaft portions 12a and 12b has a long shape (bar shape) extending in the direction along the Y axis. Each of the shaft portions 12 a and 12 b has one end connected to the base 111 and the other end connected to the frame body portion 13. In addition, the shaft portions 12a and 12b are arranged so that the central axis thereof coincides with the Y axis.
Thus, the shaft portions 12a and 12b support the base portion 111 of the movable mirror portion 11 from both sides. The shaft portions 12a and 12b are torsionally deformed as the movable mirror portion 11 swings around the Y axis.
The shapes of the shaft portions 12a and 12b are not limited to those described above as long as the movable mirror portion 11 is supported so as to be swingable around the Y axis with respect to the frame body portion 13, and for example, It may have a bent or curved portion, a branched portion, or a portion having a different width at at least one point in the middle.
The shaft portions 14 a and 14 b are disposed so as to face each other with the frame body portion 13 interposed therebetween.
Further, each of the pair of shaft portions 14a and 14b is disposed along the X axis in a plan view, and has a longitudinal shape (bar shape) along the X axis. Each of the shaft portions 14 a and 14 b has one end connected to the frame body portion 13 and the other end connected to the fixed portion 15. In addition, the shaft portions 14a and 14b are arranged so that the central axis coincides with the X axis.
Thus, the shaft portions 14a and 14b support the frame body portion 13 from both sides. The shaft portions 14a and 14b are torsionally deformed as the frame body portion 13 swings around the X axis.
Note that the shapes of the shaft portions 14a and 14b are not limited to those described above as long as they support the frame body portion 13 so as to be swingable around the X axis with respect to the fixed portion 15. At least one portion of the above may have a bent or curved portion, a branched portion, or a portion having a different width.
As described above, the movable mirror unit 11 (in other words, the light reflecting plate 113) can be swung around the Y axis and the frame body unit 13 can be swung around the X axis. Can be swung (rotated) around two axes of the X axis and the Y axis orthogonal to each other.
The base part 111, the shaft parts 12a and 12b, the frame part 13, the shaft parts 14a and 14b and the fixing part 15 as described above are integrally formed.
In the present embodiment, the base 111, the shaft portions 12a and 12b, the frame body portion 13, the shaft portions 14a and 14b, and the fixing portion 15 include a first Si layer (device layer), a SiO 2 layer (box layer), A second Si layer (handle layer) is formed by etching the SOI substrate laminated in this order. Thereby, the vibration characteristics of the first vibration system and the second vibration system can be made excellent. Further, since the SOI substrate can be finely processed by etching, the base portion 111, the shaft portions 12a and 12b, the frame portion 13, the shaft portions 14a and 14b, and the fixing portion 15 are formed by using the SOI substrate. These dimensional accuracy can be made excellent, and the optical scanner 1 can be miniaturized.
The base 111, the shaft portions 12a and 12b, and the shaft portions 14a and 14b are each composed of a first Si layer of an SOI substrate. Thereby, the elasticity of shaft part 12a, 12b and shaft part 14a, 14b can be made excellent. Further, it is possible to suppress the base portion 111 from coming into contact with the frame body portion 13 when rotating around the Y axis.
Here, the first Si layer of the SOI substrate is a p-type silicon single crystal substrate or an n-type silicon single crystal substrate. For example, when the first Si layer is a (100) plane p-type silicon single crystal substrate, the shaft portions 14a and 14b are formed on the crystal axis of the (100) plane p-type silicon single crystal substrate, respectively. It extends along the <110> direction. When the first Si layer is a (100) plane n-type silicon single crystal substrate, the shaft portions 14a and 14b are each <100 of the crystal axis of the (100) plane n-type silicon single crystal substrate. > It extends along the direction.
Further, the frame body portion 13 and the fixed portion 15, respectively, a first Si layer of the SOI substrate, and a stack of the SiO 2 layer and the second Si layer. Thereby, the rigidity of the frame body part 13 and the fixing | fixed part 15 can be made excellent.
Further, the SiO 2 layer and the second Si layer of the frame body portion 13, that is, the portions protruding in the thickness direction from the shaft portions 12 a and 12 b or the shaft portions 14 a and 14 b of the frame body portion 13 are the frame body described above. A rib 131 is provided to increase the rigidity of the portion 13.
Moreover, it is preferable that the upper surface of the portion (in the present embodiment, the fixing portion 15) located outside the light reflecting plate 113 is subjected to an antireflection treatment in plan view. Thereby, it can suppress that the unnecessary light irradiated other than the light reflection board 113 turns into a stray light.
The antireflection treatment is not particularly limited, and examples thereof include formation of an antireflection film (dielectric multilayer film), roughening treatment, and black treatment.
In addition, the constituent material and the formation method of the base 111, the shaft portions 12a and 12b, the frame body portion 13, the shaft portions 14a and 14b, and the fixing portion 15 described above are examples, and the present invention is not limited thereto. Absent. For example, the base 111, the shaft portions 12a and 12b, the frame body portion 13, the shaft portions 14a and 14b, and the fixing portion 15 may be formed by etching a silicon substrate.
In this embodiment, the spacer 112 and the light reflecting plate 113 are also formed by etching the SOI substrate. The spacer 112 is composed of a laminate composed of the SiO 2 layer and the second Si layer of the SOI substrate. The light reflecting plate 113 is composed of a first Si layer of an SOI substrate.
Thus, by forming the spacer 112 and the light reflecting plate 113 using the SOI substrate, the spacer 112 and the light reflecting plate 113 joined to each other can be manufactured easily and with high accuracy.
Such a spacer 112 is bonded to the base 111 by a bonding material (not shown) such as an adhesive or a brazing material.
The fixing portion 15 is not limited to the above-described one as long as it supports the frame body portion 13. For example, the fixing portion 15 and the shaft portions 14 a and 14 b may be separate.
The permanent magnet 21 is joined to the lower surface (the surface opposite to the light reflecting plate 113) of the frame body portion 13, that is, the tip surface of the rib 131.
Although it does not specifically limit as a joining method of the permanent magnet 21 and the frame part 13, For example, the joining method using an adhesive agent can be used.
The permanent magnet 21 is magnetized in a direction inclined with respect to the X axis and the Y axis in plan view.
In the present embodiment, the permanent magnet 21 has a longitudinal shape (bar shape) extending in a direction inclined with respect to the X axis and the Y axis. The permanent magnet 21 is magnetized in the longitudinal direction. That is, the permanent magnet 21 is magnetized so that one end is an S pole and the other end is an N pole.
Further, the permanent magnet 21 is provided so as to be symmetric with respect to the intersection of the X axis and the Y axis in plan view.
In this embodiment, the case where the number of one permanent magnet is installed in the frame body portion 13 will be described as an example. However, the present invention is not limited to this. For example, two permanent magnets are installed in the frame body portion 13. Also good. In this case, for example, two long permanent magnets may be installed on the frame body portion 13 so as to face each other via the base portion 111 in a plan view and to be parallel to each other.
The inclination angle θ in the magnetization direction (extending direction) of the permanent magnet 21 with respect to the X axis is not particularly limited, but is preferably 30 ° or more and 60 ° or less, and more preferably 30 ° or more and 45 ° or less. 45 ° is more preferable. By providing the permanent magnet 21 in this way, the movable mirror portion 11 can be rotated around the X axis smoothly and reliably.
On the other hand, if the tilt angle θ is less than the lower limit value, the movable mirror unit 11 is sufficiently rotated around the X axis depending on various conditions such as the strength of the voltage applied to the coil 31 by the voltage application unit 4. It may not be possible to move it. On the other hand, if the inclination angle θ exceeds the upper limit value, the movable mirror unit 11 may not be sufficiently rotated around the Y axis depending on various conditions.
As such a permanent magnet 21, for example, a neodymium magnet, a ferrite magnet, a samarium cobalt magnet, an alnico magnet, a bond magnet, or the like can be suitably used. Such a permanent magnet 21 is formed by magnetizing a high magnetic material, and is formed, for example, by magnetizing a hard magnetic material before magnetization in the frame body portion 13. This is because if the permanent magnet 21 that has already been magnetized is to be installed in the frame body portion 13, the permanent magnet 21 may not be installed at a desired position due to the influence of the magnetic field of the outside or other components.
A coil 31 is provided immediately below the permanent magnet 21. That is, the coil 31 is provided so as to face the lower surface of the frame body portion 13. Thereby, the magnetic field generated from the coil 31 can be applied to the permanent magnet 21 efficiently. Thereby, power saving and size reduction of the optical scanner 1 can be achieved.
In the present embodiment, the coil 31 is provided by being wound around the magnetic core 32. Thereby, the magnetic field generated by the coil 31 can be efficiently applied to the permanent magnet 21. The magnetic core 32 may be omitted.
Such a coil 31 is electrically connected to the voltage application unit 4.
Then, when a voltage is applied to the coil 31 by the voltage application unit 4, a magnetic field in a direction orthogonal to the X axis and the Y axis is generated from the coil 31.
As shown in FIG. 4, the voltage application unit 4 includes a first voltage generation unit 41 that generates a first voltage V 1 for rotating the movable mirror unit 11 around the Y axis, and a movable mirror unit 11. a second voltage generating unit 42 for generating a second voltage V 2 for rotating around the X axis, and a voltage superimposing unit 43 for superimposing the first voltages V 1 and a second voltage V 2 The voltage superimposed by the voltage superimposing unit 43 is applied to the coil 31.
As shown in FIG. 5A, the first voltage generator 41 generates a first voltage V 1 (horizontal scanning voltage) that periodically changes in a cycle T 1 . That is, the first voltage generator 41 generates the first voltage V 1 having the first frequency (1 / T 1 ).
First voltages V 1 is a waveform like a sine wave. Therefore, the optical scanner 1 can perform main scanning of light effectively. Incidentally, the first wave of the voltage V 1, but is not limited thereto.
The first frequency (1 / T 1 ) is not particularly limited as long as it is a frequency suitable for horizontal scanning, but is preferably 10 to 40 kHz.
In the present embodiment, the first frequency is set to be equal to the torsional resonance frequency (f1) of the first vibration system (torsional vibration system) composed of the movable mirror portion 11 and the pair of shaft portions 12a and 12b. Has been. That is, the first vibration system is designed (manufactured) so that the torsional resonance frequency f1 is a frequency suitable for horizontal scanning. Thereby, the rotation angle of the movable mirror portion 11 around the Y axis can be increased.
On the other hand, as shown in FIG. 5B, the second voltage generator 42 generates a second voltage V 2 (vertical scanning voltage) that periodically changes at a period T 2 different from the period T 1 . Is. That is, the second voltage generator 42 generates the second voltage V 2 having the second frequency (1 / T 2 ).
Second voltage V 2 has a waveform like a sawtooth wave. Therefore, the optical scanner 1 can effectively perform vertical scanning (sub-scanning) of light. Incidentally, the second waveform of the voltage V 2, but is not limited thereto.
The second frequency (1 / T 2 ) is different from the first frequency (1 / T 1 ) and is not particularly limited as long as the frequency is suitable for vertical scanning, but is 30 to 120 Hz (about 60 Hz). Is preferred. Thus, the second frequency of the voltage V 2 is set to about 60 Hz, the frequency of the first voltage V 1 as described above by a 10 to 40 kHz, at a frequency suitable for rendering on the display, movable mirrors The part 11 can be rotated around each of two axes (X axis and Y axis) orthogonal to each other. However, if it is possible to rotate the movable mirror 11 about their respective axes of X-axis and Y-axis, the first and the frequency of the voltages V 1 combined with the frequency of the second voltage V 2 it is not particularly limited .
In the present embodiment, the frequency of the second voltage V 2 is configured by the movable mirror portion 11, the pair of shaft portions 12 a and 12 b, the frame body portion 13, the pair of shaft portions 14 a and 14 b, and the permanent magnet 21. The frequency is adjusted to be different from the torsional resonance frequency (resonance frequency) of the second vibration system (torsional vibration system).
The second voltage V 2 of the frequency (second frequency) is preferably smaller than the first voltage V 1 of the frequency (first frequency). That is, the period T 2 are, is preferably longer than the period T 1. Thereby, the movable mirror part 11 can be rotated around the X axis at the second frequency while rotating the movable mirror unit 11 around the Y axis at a second frequency more reliably and smoothly.
Further, when the torsional resonance frequency of the first vibration system is f1 [Hz] and the torsional resonance frequency of the second vibration system is f2 [Hz], f1 and f2 satisfy the relationship of f2 <f1. Is preferable, and it is more preferable to satisfy the relationship of f1 ≧ 10f2. Thereby, the movable mirror unit 11 can be rotated more smoothly around the X axis at the frequency of the second voltage V 2 while being rotated at the frequency of the first voltage V 1. . On the other hand, when f1 ≦ f2, the vibration of the first vibration system may occur due to the second frequency.
The first voltage generation unit 41 and the second voltage generation unit 42 are connected to the control unit 6 and are driven based on signals from the control unit 6. A voltage superimposing unit 43 is connected to the first voltage generating unit 41 and the second voltage generating unit 42 as described above.
The voltage superimposing unit 43 includes an adder 43 a for applying a voltage to the coil 31. The adder 43 a receives the first voltage V 1 from the first voltage generator 41 and receives the second voltage V 2 from the second voltage generator 42, and superimposes these voltages and applies them to the coil 31. It is supposed to be.
Next, a method for driving the optical scanner 1 will be described. In the present embodiment, as described above, the frequency of the first voltage V 1 is set equal to the torsional resonance frequency of the first vibration system, and the frequency of the second voltage V 2 is the second frequency. Is set to a value different from the torsional resonance frequency of the vibration system of FIG. 5 and smaller than the frequency of the first voltage V 1 (for example, the frequency of the first voltage V 1 is 18 kHz, the second voltage frequency of V 2 is set to 60Hz).
For example, the first voltage V 1 as shown in FIG. 5A and the second voltage V 2 as shown in FIG. 5B are superimposed by the voltage superimposing unit 43, and the superimposed voltage is coiled. 31 is applied.
Then, the first voltage V 1 is used to attract one magnetic pole of the permanent magnet 21 to the coil 31 and to magnetically separate the other magnetic pole of the permanent magnet 21 from the coil 31 (this magnetic field is referred to as "magnetic field"). A1 ") and a magnetic field that attempts to attract one magnetic pole 211 of the permanent magnet 21 away from the coil 31 and attract the other magnetic pole 212 of the permanent magnet 21 to the coil 31 (this magnetic field is referred to as" magnetic field A2 "). Are alternately switched.
Here, as described above, in the plan view of FIG. 1, the north pole of the permanent magnet 21 is located on one side of the Y axis, and the south pole of the permanent magnet 21 is located on the other side. Therefore, by alternately switching between the magnetic field A1 and the magnetic field A2, vibration having a torsional vibration component around the Y axis is excited in the frame body portion 13 and the shaft portions 12a and 12b are twisted and deformed along with the vibration. while, the movable mirror 11 is rotated around the Y-axis at a first frequency of the voltage V 1.
Also, the frequency of the first voltage V 1 is equal to the torsional resonance frequency of the first vibration system. Therefore, the movable mirror part 11 can be efficiently rotated around the Y axis by the first voltage V 1 . That is, even if the vibration having the torsional vibration component around the Y axis of the frame portion 13 described above is small, the rotation angle of the movable mirror portion 11 around the Y axis associated with the vibration can be increased.
On the other hand, the second voltage V 2 tries to attract one magnetic pole 211 of the permanent magnet 21 to the coil 31, and to magnetically separate the other magnetic pole 212 of the permanent magnet 21 from the coil 31. "Magnetic field B1") and a magnetic field that attempts to separate one magnetic pole 211 of the permanent magnet 21 from the coil 31 and attract the other magnetic pole 212 of the permanent magnet 21 to the coil 31 (this magnetic field is referred to as "magnetic field" And B2 ") are alternately switched.
Here, as described above, the N pole of the permanent magnet 21 is located on one side and the S pole of the permanent magnet 21 is located on the other side in the plan view of FIG. Therefore, by the magnetic field B1 and field B2 are alternately switched, the shaft portion 14a, while twisting each deformed 14b, the frame body portion 13 together with the movable mirror unit 11, X-axis at the frequency of the second voltage V 2 Rotate around.
Also, the frequency of the second voltage V 2 is set extremely low in comparison with the first frequency of the voltage V 1. Further, the torsional resonance frequency of the second vibration system is designed to be lower than the torsional resonance frequency of the first vibration system. Therefore, it is possible to prevent the movable mirror 11 will be rotated around the Y axis at the frequency of the second voltage V 2.
In this way, by applying a voltage obtained by superimposing the first voltage V 1 and the second voltage V 2 to the coil 31, the movable mirror unit 11 is caused to have a frequency of the first voltage V 1 around the Y axis. in while rotating, it can be rotated at the frequency of the second voltage V 2 around X-axis. Accordingly, the cost and size of the apparatus can be reduced, and the movable mirror portion 11 can be rotated around the X axis and the Y axis by an electromagnetic drive system (moving magnet system). In addition, since the number of parts (permanent magnets and coils) constituting the drive source can be reduced, a simple and small configuration can be achieved. In addition, since the coil 31 is separated from the vibration system of the optical scanner 1, adverse effects due to heat generated by the coil 31 with respect to the vibration system can be suppressed.
Such behavior of the movable mirror unit 11 is detected based on the detection signals of the strain detection elements 51 and 52.
Hereinafter, the strain detection elements 51 and 52 will be described in detail.
6 is a diagram for explaining the first strain detection element of the optical scanner shown in FIG. 1, and FIG. 7 is a diagram for explaining the second strain detection element of the optical scanner shown in FIG.
The strain detection element 51 (first strain detection element) is disposed at the end of the shaft portion 14a on the frame body portion 13 side, and detects deformation (mainly bending deformation) of the shaft portion 14a. Thereby, the influence which the heat | fever by the light which injected into the movable mirror part 11 has on the distortion | strain detection element 51 can be suppressed. Further, since there is no need to provide the strain resistance elements used for detecting the behavior of the movable mirror portion 11 around the Y axis in the shaft portions 12a and 12b, the degree of freedom in designing the shaft portions 12a and 12b can be increased.
The strain detecting element 51 is a two-terminal piezoresistive element.
More specifically, as shown in FIG. 6, the strain detection element 51 includes a piezoresistive region 511 and a pair of terminals 512 and 513 disposed on the piezoresistive region 511.
The piezoresistive region 511 is formed by doping impurities on the surface of the shaft portion 14a. More specifically, when the shaft portion 14a is formed by processing a p-type silicon single crystal substrate, the piezoresistive region 511 is formed by doping the surface of the shaft portion 14a with an impurity such as phosphorus. It is an n-type silicon single crystal (n-type resistance region). On the other hand, when the shaft portion 14a is formed by processing an n-type silicon single crystal substrate, the piezoresistive region 511 has a p-type silicon single layer formed by doping impurities such as boron on the surface of the shaft portion 14a. It is a crystal (p-type resistance region).
The piezoresistive region 511 has a longitudinal shape that extends in a direction along the longitudinal direction of the shaft portion 14a (that is, the X-axis direction). In addition, the piezoresistive region 511 is disposed at the center in the width direction of the shaft portion 14a in plan view.
In the present embodiment, the entire piezoresistive region 511 is provided on the shaft portion 14a. However, if the piezoresistive region 511 can receive a tensile stress or a compressive stress due to bending deformation of the shaft portion 14a, it is illustrated. It is not limited to a position, For example, you may provide so that the boundary part of the axial part 14a and the fixing | fixed part 15 may be straddled.
On such a piezoresistive region 511, a pair of terminals 512 and 513 are arranged side by side in a direction along the longitudinal direction of the shaft portion 14a (that is, the X-axis direction).
In the present embodiment, a pair of terminals 512 and 513 are disposed at both ends of the piezoresistive region 511 in the longitudinal direction.
The pair of terminals 512 and 513 are electrically connected to the first signal processing circuit 71.
In such a strain detection element 51, when a tensile stress or a compressive stress is generated in the piezoresistive region 511 along with the bending deformation of the shaft portion 14a, the ratio of the piezoresistive region 511 is determined according to the degree of the tensile stress or compressive stress. The resistance value changes.
In the present embodiment, the piezoresistive region 511 has a longitudinal shape extending in the X-axis direction, and the pair of terminals 512 and 513 are arranged side by side on the piezoresistive region 511 in the X-axis direction. The signal based on the bending deformation of the shaft portion 14a included in the signal output from can be increased.
Here, the piezoresistive region 511 and the pair of terminals 512 and 513 are arranged so as to be symmetric with respect to the X axis in plan view. Therefore, the strain detection element 51 can detect only the tensile stress or the compressive stress accompanying the bending deformation of the shaft portion 14a. In other words, the strain detection element 51 can prevent the shear due to the torsional deformation of the shaft portion 14a from being detected. Therefore, it is possible to suppress or prevent the signal output from the strain detection element 51 from including a signal based on the torsional deformation of the shaft portion 14a. As a result, using the signal output from the strain detection element 51, the behavior around the Y axis of the movable mirror unit 11 can be detected with high accuracy with a relatively simple configuration.
Such a detection signal of the strain detection element 51 is input to the first signal processing circuit 71 (first signal processing unit) via a pair of terminals 81 a and 81 b provided in the fixing unit 15.
The first signal processing circuit 71 has a function of converting the detection signal of the strain detection element 51 into a signal suitable for signal processing by a predetermined process.
Specific processing in the first signal processing circuit 71 includes, for example, impedance conversion, temperature compensation, signal amplification, a filter, an AD converter, and the like.
As described above, the detection signal of the strain detection element 51 includes a signal based on the bending deformation of the shaft portion 14a. And the 1st signal processing circuit 71 performs the above processes as needed, and outputs the signal based on the bending deformation of the axial part 14a. Thereby, based on the signal output from the first signal processing circuit 71, the behavior of the movable mirror unit 11 around the Y axis can be detected.
In the present embodiment, the first signal processing circuit 71 includes resistance elements 711, 712, and 713 as shown in FIG.
The resistance elements 711, 712, and 713 and the strain detection element 51 constitute a bridge circuit (Wheatstone bridge circuit). The bridge circuit is supplied with electric power from the strain detection element driving circuit 53 and outputs a signal (voltage) corresponding to a change in the resistance value of the strain detection element 51 to the control unit 6.
Each of such resistance elements 711, 712, and 713 preferably has a temperature characteristic equivalent to that of the strain detection element 51. Accordingly, a signal (voltage) corresponding to the bending deformation amount of the shaft portion 14a can be stably output regardless of the temperature characteristics of the strain detection element 51.
Note that the resistance elements 711, 712, and 713 may be disposed on the fixed portion 15 at positions that do not receive stress accompanying deformation of the shaft portions 14a and 14b. In this case, each of the resistance elements 711, 712, and 713 can be configured by a resistance area configured in the same manner as the piezoresistive area of the strain detection element 51 and a pair of terminals provided in the resistance area. . In this case, it is preferable that the resistance elements 711, 712, and 713 are arranged at positions where the temperature conditions are the same as those of the strain detection element 51.
Such a signal output from the first signal processing circuit 71 is input to the control unit 6 shown in FIG.
On the other hand, the strain detection element 52 is disposed at the end of the shaft portion 14b on the frame body portion 13 side, and detects deformation (mainly torsional deformation) of the shaft portion 14b. Thereby, the influence which the heat | fever by the light which injected into the movable mirror part 11 has on the distortion | strain detection element 52 can be suppressed. Further, since it is not necessary to provide the strain resistance elements used for detecting the behavior of the movable mirror portion 11 around the X axis in the shaft portions 12a and 12b, the degree of freedom in designing the shaft portions 12a and 12b can be increased.
The strain detection element 52 is a four-terminal piezoresistive element.
More specifically, as shown in FIG. 7, the strain detection element 52 includes a piezoresistive region 521, a pair of input terminals 522 and 523 and a pair of output terminals 524 arranged on the piezoresistive region 521, 525.
The piezoresistive region 521 is formed by doping impurities on the surface of the shaft portion 14b. More specifically, when the shaft portion 14b is formed by processing a p-type silicon single crystal substrate, the piezoresistive region 521 is formed by doping the surface of the shaft portion 14b with an impurity such as phosphorus. It is an n-type silicon single crystal (n-type resistance region). On the other hand, when the shaft portion 14b is formed by processing an n-type silicon single crystal substrate, the piezoresistive region 521 has a p-type silicon single layer formed by doping impurities such as boron on the surface of the shaft portion 14b. It is a crystal (p-type resistance region).
In the present embodiment, the piezoresistive region 521 has a quadrangular shape having a pair of sides along the X-axis direction and a pair of sides along the Y-axis direction in plan view.
In the present embodiment, the entire piezoresistive region 521 is provided on the shaft portion 14b. However, the piezoresistive region 521 is limited to the illustrated position as long as the piezoresistive region 521 can receive shearing stress due to torsional deformation of the shaft portion 14b. For example, you may provide so that the boundary part of the axial part 14b and the fixing | fixed part 15 may be straddled.
On such a piezoresistive region 521, a pair of input terminals 522 and 523 are arranged side by side in the direction along the longitudinal direction of the shaft portion 14b (that is, the X-axis direction), and the length of the shaft portion 14b is long. A pair of output terminals 524 and 525 are arranged side by side in a direction perpendicular to the direction (that is, the Y-axis direction).
In the present embodiment, a pair of input terminals 522 and 523 are disposed at both ends in the X-axis direction of the piezoresistive region 521, and a pair of output terminals 524 at both ends in the Y-axis direction of the piezoresistive region 521. 525 is arranged.
The pair of input terminals 522 and 523 are electrically connected to the strain detection element driving circuit 53 via a pair of terminals 82 a and 82 b provided on the fixed portion 15.
On the other hand, the pair of output terminals 524 and 525 are electrically connected to the second signal processing circuit 72 via a pair of terminals 82 c and 82 d provided in the fixed portion 15.
In such a strain detection element 52, the strain detection element drive circuit 53 applies a voltage with a constant voltage or a constant current between the pair of input terminals 522 and 523. Thereby, an electric field E is generated on the piezoresistive region 521. When shear stress is generated in the piezoresistive region 521 in accordance with the torsional deformation of the shaft portion 14b under the electric field E, the specific resistance value of the piezoresistive region 521 is changed according to the degree of the shear stress. The potential difference between the output terminals 524 and 525 changes. This potential difference changes according to the amount of torsional deformation of the shaft portion 14b and the swing angles of the movable mirror portion 11 and the frame body portion 13 around the X axis. Therefore, the behavior around the X axis of the movable mirror unit 11 can be detected based on the potential difference.
Moreover, such a strain detection element 52 can detect only the shear stress accompanying the torsional deformation of the shaft portion 14b. That is, the strain detecting element 52 can prevent the tensile or compressive stress accompanying the bending deformation of the shaft portion 14b from being detected. Therefore, it is possible to suppress or prevent the signal output from the strain detection element 52 from including a signal based on the bending deformation of the shaft portion 14b. As a result, the behavior around the X axis of the movable mirror unit 11 can be detected with high accuracy using a signal output from the strain detection element 52 with a relatively simple configuration.
Such a detection signal of the strain detection element 52 is input to the second signal processing circuit 72 (second signal processing unit).
The second signal processing circuit 72 has a function of converting the detection signal of the strain detection element 52 into a signal suitable for signal processing by a predetermined process.
Specific processing in the second signal processing circuit 72 includes, for example, impedance conversion, temperature compensation, signal amplification, a filter, an AD converter, and the like.
As described above, the detection signal of the strain detection element 52 includes a signal based on the torsional deformation of the shaft portion 14b. The second signal processing circuit 72 performs the above-described processing as necessary, and outputs a signal based on the torsional deformation of the shaft portion 14b. Thereby, based on the signal output from the second signal processing circuit 72, the behavior of the movable mirror unit 11 around the X axis can be detected.
The signal output from the second signal processing circuit 72 is input to the control unit 6 shown in FIG.
The control unit 6 detects the behavior of the movable mirror unit 11 around the Y axis based on the signal output from the first signal processing circuit 71. Thus, based on the detected behavior, the behavior of the movable mirror unit 11 around the Y axis is controlled to be in a desired state, or the behavior of the movable mirror unit 11 around the Y axis and the operation of other devices are controlled. Can be synchronized.
The control unit 6 detects the behavior around the X axis of the movable mirror unit 11 based on the signal output from the second signal processing circuit 72. Thereby, based on the detected behavior, the behavior of the movable mirror unit 11 around the X axis is controlled to be in a desired state, or the behavior of the movable mirror unit 11 around the X axis and the operation of other devices are controlled. Can be synchronized.
In the present embodiment, as shown in FIG. 3, the control unit 6 includes an H detection unit 61, a V detection unit 62, an H control unit 63, a V control unit 64, an H target value storage unit 65, and a V And a target value generation unit 66.
Based on the signal output from the first signal processing circuit 71, the H detection unit 61 generates a signal corresponding to the swing angle of the movable mirror unit 11 around the Y axis, for example, as a signal necessary for horizontal scanning control. To do. A method for detecting the swing angle of the movable mirror 11 around the Y axis will be described in detail later.
Based on the signal output from the second signal processing circuit 72, the V detection unit 62 generates a signal corresponding to, for example, the swing angle of the movable mirror unit 11 around the X axis as a signal necessary for vertical scanning control. To do.
The H control unit 63 generates a horizontal scanning drive signal based on the H target value stored in advance in the H target value storage unit 65 and the signal output from the H detection unit 61.
The H target value storage unit 65 stores (stores) the H target value, for example, the phase difference from the horizontal scanning drive signal and the maximum swing angle around the Y axis of the movable mirror unit 11.
The V control unit 64 generates a drive signal for vertical scanning based on the V target value output from the V target value generation unit 66 and the signal output from the V detection unit 62.
The V target value generation unit 66 generates, for example, a swing angle around the X axis of the movable mirror unit 11 as the V target value based on the line information in the vertical scanning direction input from the outside.
Here, a method for detecting the behavior of the movable mirror unit 11 around the Y axis using the detection signal of the strain detection element 51 will be described by taking as an example a case where the swing angle of the movable mirror unit 11 around the Y axis is detected. .
(First detection method)
In the first detection method, the behavior around the Y axis of the movable mirror unit 11 (in this example, the swing angle) is estimated based on the signal output from the first signal processing circuit 71 using an observer.
Hereinafter, the first detection method will be described in detail.
As described above, the optical scanner 1 applies the first voltage for horizontal scanning and the second voltage for vertical scanning to the coil 31 by superimposing the first voltage for horizontal scanning on the Y-axis (first axis). The first voltage is oscillated at the frequency of the first voltage and the second voltage is oscillated around the X axis (second axis).
Here, since the frequency of the first voltage (horizontal scanning drive frequency) and the frequency of the second voltage (vertical scanning driving frequency) are sufficiently separated, the torque generated by the first voltage and the second voltage It is not necessary to consider the crosstalk with the torque generated by the voltage. Therefore, the movement about the X axis and the movement about the Y axis in the optical scanner 1 can be considered independently.
Then, the equation of motion about the Y axis of the optical scanner 1 can be expressed by the following equation (1).
Here, in the formula (1), θ hh : the swing angle around the Y axis of the movable mirror portion 11, θ vh : the swing angle around the Y axis of the frame body portion 13, I hh : the swing mirror portion 11. Inertia around the Y axis, I vh : Inertia around the Y axis of the frame part 13, C hh : Damping coefficient of oscillation (vibration) around the Y axis of the movable mirror part 11, C vh : Y of the frame part 13 damping coefficient of the swinging (vibration) about the axis, k hh: shaft portion 12a, the torsion spring constant around the Y axis 12b, k vh: shaft portion 14a, the torsion spring constant around the Y axis 14b, T (t) : Torque around the Y axis received by the frame body portion 13 due to the interaction between the magnetic fields of the permanent magnet 21 and the coil 31.
When the output of the detection signal of the strain detection element 51 relating to the bending stress of the shaft portion 14a is y and the conversion coefficient of the strain detection element 51 is α, the following X and y are obtained from the above equation (1). Can lead the relationship.
The observable coefficient of the system given by the relationship between X and y is
Then, the following equation is obtained.
Here, since M obs = 4, this system is observable. Therefore, based on a signal based on the bending deformation of the shaft portion 14a included in the detection signal of the strain detection element 51 disposed on the shaft portion 14a, the observer makes a swing angle (a swing angle) around the Y axis of the movable mirror portion 11 by the observer. Can be estimated.
In such an observer, the observer gain is L, and the relationship between the estimated values of X and y is expressed as follows.
By using such a relationship between the estimated values of X and y, based on the signal based on the bending deformation of the shaft portion 14a included in the detection signal of the strain detection element 51, the swing of the movable mirror portion 11 around the Y axis is performed. The angle can be estimated.
According to the first detection method as described above, based on the signal output from the first signal processing circuit 71, even if the swing of the movable mirror unit 11 around the Y-axis is not in a resonance state, the movable mirror unit 11 behaviors around the Y-axis can be detected.
(Second detection method)
In the second detection method, the first signal is obtained by using the ratio of the amplitude at the resonance frequency related to the oscillation of the movable mirror 11 around the Y axis to the amplitude at the resonance frequency related to the oscillation of the frame body 13 around the Y axis. Based on the signal output from the processing circuit 71, the behavior of the movable mirror unit 11 around the Y axis (in this example, the swing angle) is estimated.
Hereinafter, the second detection method will be described in detail.
In the above formula (1), when Laplace transforms of θ hh and θ vh are respectively X hh and X vh and the initial values are all 0, the following formula (2) is obtained.
When this equation (2) is transformed, the following equation (3) is obtained.
Here, the resonance frequencies related to the swing of the movable mirror portion 11 and the frame body portion 13 about the Y axis depend on s (= jω, ω: angular frequency) when the denominator of the equation (3) is minimum. Determined. As can be seen from the equation (3), since the denominator of X hh and X vh are equal, and the resonant frequency for rocking around the Y axis of the movable mirror 11, to swing around the Y axis of the frame body portion 13 The resonance frequency matches.
Specifically, the frequency characteristic regarding the ratio between the torque around the Y axis applied to the frame body portion 13 and the swing angle around the Y axis of the movable mirror portion 11 and the frame body portion 13 is shown in FIG. As shown in FIG.
Further, the frequency characteristics regarding the phase difference between the torque around the Y axis applied to the frame body portion 13 and the swing of the movable mirror portion 11 and the frame body portion 13 around the Y axis are shown in FIGS. As shown in b).
FIG. 8A is a graph showing frequency characteristics relating to the ratio between the torque around the first axis applied to the frame body part and the swing angle around the Y axis of the movable part and the frame body part. (B) is a graph showing the frequency characteristics regarding the phase difference between the torque around the first axis applied to the frame body and the swing of the movable part and the frame around the first axis. FIG. 9A is a graph in which the vicinity of the resonance frequency in FIG. 8A is enlarged, and FIG. 9B is a graph in which the vicinity of the resonance frequency in FIG. 8B is enlarged.
By the way, the swing of the movable mirror part 11 and the frame part 13 around the Y axis appears as tensile stress of the shaft parts 14a and 14b. Therefore, based on the detection signal of the strain detection element 51 disposed on the shaft portion 14a, it can be determined whether or not the movable mirror portion 11 is in a resonance state related to the oscillation around the Y axis. More specifically, based on the phase difference between the torque around the Y-axis applied to the frame body portion 13 and the swing of the movable mirror portion 11 and the frame body portion 13 around the Y-axis, the movable mirror portion 11 Whether or not the resonance state is related to the oscillation around the axis can be grasped.
In order to estimate the swing angle (swing angle) of the movable mirror unit 11 based on the detection signal of the strain detection element 51, the resonance state related to the swing of the movable mirror unit 11 around the Y-axis in response to the strain detection element 51. The ratio of the amplitude around the Y axis of the movable mirror portion 11 and the amplitude around the Y axis of the frame body portion 13 may be multiplied.
When such a ratio changes due to a temperature change, a temperature sensor may be installed near the optical scanner 1 and the ratio may be corrected according to the temperature detected by the temperature sensor.
According to the second detection method as described above, the behavior around the Y axis of the movable mirror unit 11 can be detected with high accuracy based on the signal output from the first signal processing circuit 71 with a relatively simple configuration. can do.
According to the optical scanner 1 described above, the behavior around the Y axis of the movable mirror unit 11 can be detected based on the signal output from the first signal processing circuit 71. Further, based on the signal output from the second signal processing circuit 72, the behavior around the X axis of the movable mirror unit 11 can be detected. In addition, since the strain detection elements 51 and 52 are disposed at the ends of the shaft portions 14a and 14b on the frame body portion 13 side, the strain detection elements 51 and 52 are affected by heat from the outside via the fixing portion 15. Can be suppressed.
Second Embodiment
Next, a second embodiment of the present invention will be described.
FIG. 10 is a plan view showing an optical scanner according to the second embodiment of the present invention, and FIG. 11 is a block diagram showing a control system of the optical scanner shown in FIG. FIG. 12 is a diagram for explaining a strain detection element of the optical scanner shown in FIG. FIG. 13 is a diagram for explaining the relationship between the orientation of the two-terminal strain detection element and the crystal orientation of silicon. FIG. 14 shows the relationship between the orientation (angle α) of the two-terminal strain detection element and the absolute value of the rate of change in resistance value due to tensile stress and shear stress when p-type silicon is used for the piezoresistive region. It is a graph. FIG. 15 shows the relationship between the attitude (angle α) of the two-terminal strain detection element and the absolute value of the resistance value change rate due to tensile stress and shear stress when n-type silicon is used in the piezoresistive region. It is a graph. FIG. 16 is a graph showing the relationship between the orientation (angle α) of the two-terminal strain detection element and the ratio of the absolute value of the rate of change in resistance value due to tensile stress and shear stress.
The optical scanner according to the present embodiment is the same as the optical scanner according to the first embodiment described above except that the configurations of the strain detection element, the first signal processing unit, and the second signal processing unit are different.
In the following description, the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. 10 to 12, the same reference numerals are given to the same configurations as those in the above-described embodiment.
An optical scanner 1A shown in FIG. 10 includes strain detection elements 51A and 52A instead of the strain detection elements 51 and 52 of the first embodiment described above. Further, as shown in FIG. 11, the optical scanner 1A includes a first signal processing circuit 71A and a second signal processing circuit in place of the first signal processing circuit 71 and the second signal processing circuit 72 of the first embodiment described above. 72A.
The strain detection element 51A (first strain detection element) is disposed at the end of the shaft portion 14a on the frame body portion 13 side, and detects deformation (bending deformation and torsion deformation) of the shaft portion 14a. On the other hand, the strain detection element 52A (second strain detection element) is disposed at the end of the shaft portion 14b on the frame body portion 13 side, and detects deformation (bending deformation and torsion deformation) of the shaft portion 14b.
The strain detection elements 51A and 52A are arranged so as to be symmetric with respect to the Y axis in plan view. In the following, the strain detection element 51A will be mainly described, and since the strain detection element 52A is the same as the strain detection element 51A, the description thereof will be omitted.
The strain detection element 51A is a two-terminal piezoresistive element.
More specifically, as shown in FIG. 12, the strain detection element 51A has a piezoresistive region 511A and a pair of terminals 512A and 513A arranged on the piezoresistive region 511A.
The piezoresistive region 511A is formed by doping impurities on the surface of the shaft portion 14a.
The piezoresistive region 511A has a longitudinal shape extending in a direction inclined with respect to the longitudinal direction of the shaft portion 14a (that is, the X-axis direction). The piezoresistive region 511A is disposed across the center in the width direction of the shaft portion 14a in plan view.
In this embodiment, the entire piezoresistive region 511A is provided on the shaft portion 14a. However, the piezoresistive region 511A receives tensile stress or compressive stress due to bending deformation of the shaft portion 14a and twists the shaft portion 14a. If it can receive the shear stress by a deformation | transformation, it will not be limited to the position of illustration, For example, you may provide so that the boundary part of the axial part 14a and the fixing | fixed part 15 may be straddled.
On the piezoresistive region 511A, a pair of terminals 512A and 513A are arranged side by side in a direction inclined with respect to the longitudinal direction of the shaft portion 14a (that is, the X-axis direction).
In the present embodiment, a pair of terminals 512A and 513A are arranged at both ends in the longitudinal direction of the piezoresistive region 511A.
The pair of terminals 512A and 513A are electrically connected to the first signal processing circuit 71A. Although not shown in FIG. 12, the pair of terminals 512A and 513A are also electrically connected to the second signal processing circuit 72A shown in FIG.
In such a strain detection element 51A, when a tensile stress or a compressive stress is generated in the piezoresistive region 511A along with the bending deformation of the shaft portion 14a, the ratio of the piezoresistive region 511A depends on the degree of the tensile stress or the compressive stress. The resistance value changes.
In the strain detection element 51A, when shear stress is generated in the piezoresistive region 511A due to the torsional deformation of the shaft portion 14a, the specific resistance value of the piezoresistive region 511A changes according to the degree of the shear stress.
Therefore, the detection signal of the strain detection element 51A includes a signal based on bending deformation and torsional deformation of the shaft portion 14a.
In this embodiment, since the pair of terminals 512A and 513A are arranged side by side in the direction inclined with respect to the X-axis direction on the piezoresistive region 511A, the axis included in the signal output from the strain detection element 51A The signal based on each of the bending deformation and the torsional deformation of the portion 14a can be increased.
The ratio of the signal based on the bending deformation of the shaft portion 14a and the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detecting element 51A depends on the angle α (inclination angle) of the strain detecting element 51A. Change. Here, the angle α is the longitudinal direction of the shaft portion 14a (that is, the X-axis direction) and the direction in which the pair of terminals 512A and 513A are aligned (the direction of a straight line connecting the pair of terminals 512 and 513 with the shortest distance). This is the angle formed by
Hereinafter, the detection signal of the strain detection element 51A will be described in detail with reference to an example in which the longitudinal direction of the shaft portion 14a is the <110> direction of the crystal axis of the silicon single crystal as shown in FIG.
When the piezoresistive region 511A is composed of a p-type silicon single crystal, as shown in FIG. 14A, the absolute value of the resistance value change rate related to the tensile stress of the piezoresistive region 511A between the pair of terminals 512A and 513A. Decreases as the angle α (offset from <110>) increases. That is, as the angle α increases, the signal based on the bending deformation of the shaft portion 14a included in the detection signal of the strain detection element 51A decreases.
On the other hand, in this case, as shown in FIG. 14B, the absolute value of the resistance value change rate related to the shear stress of the piezoresistive region 511A between the pair of terminals 512A and 513A increases as the angle α increases. That is, as the angle α increases, the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detection element 51A increases. However, the change due to the angle α of the signal based on the torsional deformation is smaller than the change due to the angle α of the signal based on the bending deformation.
Further, when the piezoresistive region 511A is composed of an n-type silicon single crystal, as shown in FIG. 15A, the rate of change in resistance value related to the tensile stress of the piezoresistive region 511A between a pair of terminals 512A and 513A. The absolute value decreases as the angle α increases. That is, as the angle α increases, the signal based on the bending deformation of the shaft portion 14a included in the detection signal of the strain detection element 51A decreases. However, the change due to the angle α of the signal based on the bending deformation is small.
On the other hand, in this case, as shown in FIG. 15B, the absolute value of the resistance value change rate related to the shear stress of the piezoresistive region 511A between the pair of terminals 512A and 513A increases as the angle α increases. That is, as the angle α increases, the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detection element 51A increases. Moreover, the change due to the angle α of the signal based on the torsional deformation is larger than the change due to the angle α of the signal based on the bending deformation.
Further, when the piezoresistive region 511A is composed of a p-type silicon single crystal, as shown in FIG. 16A, the rate of change in resistance value related to the tensile stress of the piezoresistive region 511A between a pair of terminals 512A and 513A. The ratio (R1 / R2) between the absolute value (R1) and the absolute value (R2) of the resistance value change rate related to the shear stress decreases as the angle α increases. That is, as the angle α increases, the ratio of the signal based on the bending deformation to the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detection element 51A decreases.
Further, even when the piezoresistive region 511A is composed of an n-type silicon single crystal, as shown in FIG. 16B, the rate of change in resistance value relating to the tensile stress of the piezoresistive region 511A between the pair of terminals 512A and 513A. The ratio (R1 / R2) between the absolute value (R1) and the absolute value (R2) of the resistance value change rate related to the shear stress decreases as the angle α increases. That is, as the angle α increases, the ratio of the signal based on the bending deformation to the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detection element 51A decreases. However, this ratio is small irrespective of the angle α, and the change due to the angle α is also small.
As described above, when the longitudinal direction of the shaft portion 14a is the <110> direction of the crystal axis of the silicon single crystal, the piezoresistive region 511A is formed of a p-type silicon single crystal, whereby the strain detection element 51A The signal based on each of the bending deformation and the torsional deformation of the shaft portion 14a included in the signal output from can be efficiently increased.
The angle α varies depending on the conductivity type and crystal axis direction of the silicon single crystal constituting the shaft portions 14a and 14b, and is not particularly limited. For example, the longitudinal direction of the shaft portions 14a and 14b is the crystal axis of the silicon single crystal. When the piezoresistive region 511A is made of p-type silicon single crystal, the angle is preferably 3 ° or more and 25 ° or less, and more preferably 5 ° or more and 8 ° or less. As shown in FIG. 16A, by setting the angle α to 3 ° or more and 25 ° or less, the above-described ratio (R1 / R2) can be in the range of about 10% to 90%. Further, by setting the angle α to 5 ° or more and 8 ° or less, the above-described ratio (R1 / R2) can be set in a range from about 40% to 60%.
Such a detection signal of the strain detection element 51A is sent to the first signal processing circuit 71A (first signal processing unit) and the second signal processing circuit 72A via a pair of terminals 81a and 81b provided in the fixing unit 15. (Second signal processing unit) (see FIG. 11). The detection signal of the strain detection element 52A is input to the first signal processing circuit 71A and the second signal processing circuit 72A via a pair of terminals 83a and 83b provided in the fixing unit 15.
The first signal processing circuit 71A has a function of converting the detection signals of the strain detection elements 51A and 52A into signals suitable for signal processing by a predetermined process.
Specific processing in the first signal processing circuit 71A includes, for example, impedance conversion, temperature compensation, signal amplification, a filter, an AD converter, and the like.
As described above, the detection signals of the strain detection elements 51A and 52A include signals based on bending deformation and torsional deformation of the shaft portions 14a and 14b. Then, the first signal processing circuit 71A performs the processing as described above as necessary, and removes signals based on the torsional deformation of the shaft portions 14a and 14b from the detection signals of the strain detection elements 51A and 52A. A signal based on the torsional deformation of 14a and 14b is output. Thereby, based on the signal output from the first signal processing circuit 71A, the behavior of the movable mirror portion 11 around the Y axis can be detected.
In the present embodiment, the first signal processing circuit 71A includes resistance elements 711, 712, and 713 and a processing unit 714 as shown in FIG.
The resistance elements 711, 712, and 713 and the strain detection element 51A constitute a bridge circuit (Wheatstone bridge circuit). The bridge circuit is supplied with electric power from the strain detection element driving circuit 53 and outputs a signal (voltage) corresponding to a change in the resistance value of the strain detection element 51 </ b> A to the processing unit 714.
The processing unit 714 removes a component based on torsional deformation of the shaft portion 14a from the signal (voltage) from the bridge circuit including the strain detection element 51A as described above.
For example, the processing unit 714 is a differential amplifier circuit, and a signal (voltage) from the bridge circuit including the strain detection element 51A and a signal from the bridge circuit including the distortion detection element 52A configured similarly to the bridge circuit. Amplifies the difference from (voltage). As a result, the torsional deformation component included in the signals from these bridge circuits can be removed and the bending deformation component can be amplified.
As described above, based on the detection signals of the pair of strain detection elements 51A and 52A disposed on the pair of shaft portions 14a and 14b provided with the frame body portion 13 interposed therebetween, it is based on the bending deformation of the shaft portions 14a and 14b. The signal can be extracted in a composition rate.
The signal output from the first signal processing circuit 71A is input to the control unit 6 shown in FIG.
On the other hand, the second signal processing circuit 72A has a function of converting the detection signals of the strain detection elements 51A and 52A into signals suitable for signal processing through predetermined processing.
Specific processing in the second signal processing circuit 72A includes, for example, impedance conversion, temperature compensation, signal amplification, a filter, an AD converter, and the like.
As described above, the detection signals of the strain detection elements 51A and 52A include signals based on bending deformation and torsional deformation of the shaft portions 14a and 14b. Then, the second signal processing circuit 72A performs the processing as described above as necessary, and removes signals based on the bending deformation of the shaft portions 14a and 14b from the detection signals of the strain detection elements 51A and 52A. A signal based on the torsional deformation of 14a and 14b is output. Thereby, the behavior around the X axis of the movable mirror portion 11 can be detected based on the signal output from the second signal processing circuit 72A.
For example, the second signal processing circuit 72A includes a differential amplifier circuit, and a signal (voltage) from a bridge circuit including the strain detection element 51A as described above, and a strain detection element 52A configured similarly to the bridge circuit. The sum with the signal (voltage) from the bridge circuit including is amplified. As a result, the bending deformation component included in the signals from these bridge circuits can be removed and the torsional deformation component can be amplified.
Thus, based on the torsional deformation of the shaft portions 14a and 14b from the detection signals of the pair of strain detection elements 51A and 52A arranged on the pair of shaft portions 14a and 14b provided with the frame body portion 13 interposed therebetween. The signal can be extracted in a composition rate.
The signal output from the second signal processing circuit 72A is input to the control unit 6 shown in FIG.
Even with the optical scanner 1A according to the second embodiment as described above, the behavior of the movable mirror unit 11 using the strain detection elements 51A and 52A while suppressing the influence of external heat on the strain detection elements 51A and 52A. Can be detected.
<Third Embodiment>
Next, a third embodiment of the present invention will be described.
FIG. 17 is a plan view showing an optical scanner according to the third embodiment of the present invention, and FIG. 18 is a diagram for explaining a strain detection element of the optical scanner shown in FIG. FIG. 19 shows the relationship between the attitude (angle α) of the 4-terminal strain detection element and the absolute value of the rate of change in resistance value due to tensile stress and shear stress when p-type silicon is used for the piezoresistive region. It is a graph. FIG. 20 shows the relationship between the attitude (angle α) of the 4-terminal strain detection element and the absolute value of the rate of change in resistance value due to tensile stress and shear stress when n-type silicon is used in the piezoresistive region. It is a graph. FIG. 21 is a graph showing the relationship between the attitude (angle α) of the four-terminal strain detection element and the ratio of the absolute value of the rate of change in resistance value due to tensile stress and shear stress.
The optical scanner according to the present embodiment is the same as the optical scanner according to the first embodiment described above except that the configurations of the strain detection element, the first signal processing unit, and the second signal processing unit are different. The optical scanner according to the present embodiment is the same as the optical scanner according to the second embodiment described above except that the configuration of the strain detection element is different.
In the following description, the third embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. In FIG. 17 and FIG. 18, the same reference numerals are given to the same configurations as those of the above-described embodiment.
An optical scanner 1B shown in FIG. 17 includes strain detection elements 51B and 52B instead of the strain detection elements 51A and 52A of the second embodiment described above.
The strain detection element 51B (first strain detection element) is disposed at the end of the shaft portion 14a on the frame body portion 13 side, and detects deformation (bending deformation and torsion deformation) of the shaft portion 14a. On the other hand, the strain detection element 52B (second strain detection element) is disposed at the end of the shaft portion 14b on the frame body portion 13 side, and detects deformation (bending deformation and torsion deformation) of the shaft portion 14b.
The strain detection elements 51B and 52B are arranged so as to be symmetric with respect to the Y axis in plan view. In the following, the strain detection element 51B will be mainly described, and the strain detection element 52B is the same as the strain detection element 51B, and thus the description thereof is omitted.
The strain detection element 51B is a four-terminal piezoresistive element.
Specifically, as shown in FIG. 18, the strain detection element 51B includes a piezoresistive region 511B, a pair of input terminals 512B and 513B, and a pair of output terminals 514B disposed on the piezoresistive region 511B. 515B.
The piezoresistive region 511B is formed by doping impurities on the surface of the shaft portion 14a.
In the present embodiment, the piezoresistive region 511B has a quadrangular shape in plan view.
In this embodiment, the entire piezoresistive region 511B is provided on the shaft portion 14a. However, the piezoresistive region 511B receives tensile stress or compressive stress due to bending deformation of the shaft portion 14a and twists the shaft portion 14a. If it can receive the shear stress by a deformation | transformation, it will not be limited to the position of illustration, For example, you may provide so that the boundary part of the axial part 14a and the fixing | fixed part 15 may be straddled.
On such a piezoresistive region 511B, a pair of input terminals 512B and 513B are arranged side by side in a direction inclined with respect to the longitudinal direction of the shaft portion 14a (that is, the X-axis direction), and a pair of input terminals A pair of output terminals 514B and 515B are arranged in a direction perpendicular to the direction in which the input terminals 512B and 513B are arranged.
The pair of input terminals 512B and 513B are electrically connected to the strain detection element driving circuit 53 via a pair of terminals 84a and 84b provided in the fixed portion 15.
On the other hand, the pair of output terminals 514B and 515B are electrically connected to the first signal processing circuit 71A and the second signal processing circuit 72A via a pair of terminals 84c and 84d provided in the fixed portion 15. Yes.
In such a strain detection element 51B, the strain detection element drive circuit 53 applies a voltage at a constant voltage or a constant current between the pair of input terminals 512B and 513B. Thereby, an electric field E in a direction inclined with respect to the longitudinal direction of the shaft portion 14a is generated on the piezoresistive region 511B. When shear stress is generated in the piezoresistive region 511B in accordance with the torsional deformation of the shaft portion 14a under the electric field E, the specific resistance value of the piezoresistive region 511B is changed according to the degree of the shear stress. The potential difference between the output terminals 514B and 515B changes.
This potential difference changes according to the torsional deformation amount of the shaft portion 14a and the swing angles of the movable mirror portion 11 and the frame body portion 13 around the X axis. Therefore, the behavior around the X axis of the movable mirror unit 11 can be detected based on the potential difference.
In addition, when a tensile stress is generated in the piezoresistive region 511B along with the bending deformation of the shaft portion 14a under the electric field E, the specific resistance value of the piezoresistive region 511B changes according to the degree of the tensile stress, The potential difference between the pair of output terminals 514B and 515B changes.
This potential difference changes according to the amount of bending deformation of the shaft portion 14a and the swing angles of the movable mirror portion 11 and the frame body portion 13 around the Y axis. Therefore, the behavior around the Y axis of the movable mirror unit 11 can be detected based on the potential difference.
Therefore, the detection signal of the strain detection element 51B includes a signal based on bending deformation and torsional deformation of the shaft portion 14a.
In this embodiment, since the pair of input terminals 512B and 513B are arranged side by side in the direction inclined with respect to the X-axis direction on the piezoresistive region 511B, they are included in the signal output from the strain detection element 51B. A signal based on each of bending deformation and torsional deformation of the shaft portion 14a can be increased.
The ratio of the signal based on the bending deformation of the shaft portion 14a and the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detecting element 51B depends on the angle α (inclination angle) of the strain detecting element 51B. Change. Here, the angle α is a straight line connecting the longitudinal direction of the shaft portion 14a (that is, the X-axis direction) and the pair of input terminals 512B and 513B (the pair of input terminals 512B and 513B are connected with the shortest distance). Direction).
Hereinafter, the detection signal of the strain detection element 51B will be described in detail by taking as an example the case where the longitudinal direction of the shaft portion 14a is the <110> direction of the crystal axis of the silicon single crystal.
When the piezoresistive region 511B is composed of a p-type silicon single crystal, as shown in FIG. 19A, the absolute value of the rate of change in resistance value regarding the tensile stress of the piezoresistive region 511B between a pair of output terminals 514B and 515B. The value increases as the angle α (offset from <110>) increases. That is, as the angle α increases, the signal based on the bending deformation of the shaft portion 14a included in the detection signal of the strain detection element 51B increases.
On the other hand, in this case, as shown in FIG. 19B, the absolute value of the resistance value change rate related to the shear stress of the piezoresistive region 511B between the pair of output terminals 514B and 515B decreases as the angle α increases. . That is, as the angle α increases, the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detection element 51B decreases. However, the change due to the angle α of the signal based on the torsional deformation is smaller than the change due to the angle α of the signal based on the bending deformation.
Further, when the piezoresistive region 511B is composed of an n-type silicon single crystal, as shown in FIG. 20A, the resistance value change rate related to the tensile stress of the piezoresistive region 511B between the pair of output terminals 514B and 515B. The absolute value of increases as the angle α increases. That is, as the angle α increases, the signal based on the bending deformation of the shaft portion 14a included in the detection signal of the strain detection element 51B increases. However, the change due to the angle α of the signal based on the bending deformation is small.
On the other hand, in this case, as shown in FIG. 20B, the absolute value of the resistance value change rate related to the shear stress of the piezoresistive region 511B between the pair of output terminals 514B and 515B decreases as the angle α increases. . That is, as the angle α increases, the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detection element 51B decreases. However, the change due to the angle α of the signal based on the torsional deformation is larger than the change due to the angle α of the signal based on the bending deformation.
Further, when the piezoresistive region 511B is composed of a p-type silicon single crystal, as shown in FIG. 21A, the rate of change in resistance value regarding the tensile stress of the piezoresistive region 511B between a pair of output terminals 514B and 515B. The ratio (R1 / R2) between the absolute value (R1) and the absolute value (R2) of the resistance value change rate related to the shear stress increases as the angle α increases. That is, as the angle α increases, the ratio of the signal based on the bending deformation to the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detection element 51B increases.
Further, even when the piezoresistive region 511B is composed of an n-type silicon single crystal, as shown in FIG. 21B, the resistance value change related to the tensile stress of the piezoresistive region 511B between the pair of output terminals 514B and 515B. The ratio (R1 / R2) between the absolute value of the rate (R1) and the absolute value (R2) of the resistance value change rate related to the shear stress increases as the angle α increases. That is, as the angle α increases, the ratio of the signal based on the bending deformation to the signal based on the torsional deformation of the shaft portion 14a included in the detection signal of the strain detection element 51B increases. However, this ratio is small irrespective of the angle α, and the change due to the angle α is also small.
For the above reasons, when the longitudinal direction of the shaft portion 14a is the <110> direction of the crystal axis of the silicon single crystal, the piezoresistive region 511B is formed of a p-type silicon single crystal, whereby the strain detection element 51B The signal based on each of the bending deformation and the torsional deformation of the shaft portion 14a included in the signal output from can be efficiently increased.
The angle α varies depending on the conductivity type and crystal axis direction of the silicon single crystal constituting the shaft portions 14a and 14b, and is not particularly limited. For example, the longitudinal direction of the shaft portions 14a and 14b is the crystal axis of the silicon single crystal. When the piezoresistive region 511B is made of p-type silicon single crystal, the angle is preferably not less than 22 ° and not more than 42 °, and more preferably not less than 38 ° and not more than 42 °. As shown in FIG. 21A, by setting the angle α to 22 ° or more and 42 ° or less, the above-described ratio (R1 / R2) can be in the range of about 10% to 90%. Further, by setting the angle α to 38 ° or more and 42 ° or less, the above-described ratio (R1 / R2) can be set in a range from about 40% to 60%.
Such a detection signal of the strain detection element 51B is input to the first signal processing circuit 71A (first signal processing unit) and the second signal processing circuit 72A (second signal processing unit). Similarly, the detection signal of the strain detection element 52B is input to the first signal processing circuit 71A and the second signal processing circuit 72A. The strain detection element 52A is electrically connected to the strain detection element drive circuit 53 via terminals 82a and 82b, and is electrically connected to the first signal processing circuit 71A and the second signal processing circuit 72A via terminals 82c and 82d. Connected.
For example, the first signal processing circuit 71A includes a differential amplifier circuit, and includes a detection signal of the strain detection element 51B as described above and a detection signal of the strain detection element 52B configured similarly to the strain detection element 51B. Amplify the difference. As a result, the torsional deformation component included in the signals from these strain detection elements 51B and 52B can be removed and the bending deformation component can be amplified.
Similarly, for example, the second signal processing circuit 72A includes a differential amplifier circuit, and the detection signal of the strain detection element 51B as described above and the detection of the strain detection element 52B configured in the same manner as the strain detection element 51B. Amplifies the sum with the signal. As a result, it is possible to remove the bending deformation component included in the signals from these strain detection elements 51B and 52B and amplify the torsional deformation component.
Even with the optical scanner 1B according to the third embodiment as described above, the behavior of the movable mirror unit 11 using the strain detection elements 51A and 52A while suppressing the influence of external heat on the strain detection elements 51B and 52B. Can be detected.
<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described.
FIG. 22 is a plan view showing an optical scanner according to the fourth embodiment of the present invention.
The optical scanner according to the present embodiment is the same as the optical scanner according to the second embodiment described above except that the installation position of the strain detection element is different.
In the following description, the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted. In FIG. 22, the same reference numerals are given to the same configurations as those in the above-described embodiment.
An optical scanner 1C illustrated in FIG. 22 includes strain detection elements 51C and 52C instead of the strain detection elements 51A and 52A of the second embodiment described above.
The strain detection element 51 </ b> C is disposed in the vicinity of the shaft portion 14 a of the frame body portion 13. In such a portion, stress is generated as the shaft portion 14a is deformed. Further, the strain detection element 52 </ b> C is disposed in the vicinity of the shaft portion 14 b of the frame body portion 13. In such a portion, stress is generated as the shaft portion 14b is deformed.
The strain detection elements 51C and 52C are two-terminal piezoresistive elements similar to the strain detection elements 51A and 52A of the second embodiment described above, respectively, and are inclined with respect to the X axis.
Similar to the detection signals of the strain detection elements 51A and 52A of the second embodiment, the detection signals of the strain detection elements 51C and 52C are signals based on the torsional deformation of the shaft portions 14a and 14b and signals based on the bending deformation. including.
Even with the optical scanner 1C according to the fourth embodiment as described above, the behavior of the movable mirror unit 11 using the strain detection elements 51C and 52C while suppressing the influence of external heat on the strain detection elements 51C and 52C. Can be detected.
<Fifth Embodiment>
Next, a fifth embodiment of the present invention will be described.
FIG. 23 is a plan view showing an optical scanner according to the fifth embodiment of the present invention.
In the following description, the fifth embodiment will be described with a focus on differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 23, the same reference numerals are given to the same configurations as those in the above-described embodiment.
An optical scanner 1D shown in FIG. 23 includes strain detection elements 51D and 52D instead of the strain detection elements 51A and 52A of the second embodiment described above.
The strain detection element 51D is disposed in the vicinity of the shaft portion 12a of the base 111. In such a portion, stress is generated as the shaft portion 12a is deformed. In addition, the strain detection element 52D is disposed in the vicinity of the shaft portion 12b of the base 111. Such a portion is stressed with the deformation of the shaft portion 12b.
Each of the strain detection elements 51D and 52D is a two-terminal piezoresistive element, similar to the strain detection elements 51A and 52A of the second embodiment described above, and is inclined with respect to the Y axis.
In order to detect the behavior of the frame body portion 13 using the detection signals of the strain detection elements 51D and 52D, the reverse relationship with the detection method described in the first embodiment may be used.
Even with the optical scanner 1D according to the fifth embodiment as described above, the behavior of the movable mirror unit 11 using the strain detection elements 51D and 52D while suppressing the influence of external heat on the strain detection elements 51D and 52D. Can be detected.
<Sixth Embodiment>
Next, a sixth embodiment of the present invention will be described.
FIG. 24 is a plan view showing an optical scanner according to the sixth embodiment of the present invention.
In the following description, the sixth embodiment will be described with a focus on differences from the above-described embodiment, and the description of the same matters will be omitted. In FIG. 24, the same reference numerals are given to the same configurations as those of the above-described embodiment.
An optical scanner 1E shown in FIG. 24 includes strain detection elements 51E and 52E instead of the strain detection elements 51A and 52A of the second embodiment described above.
The strain detection element 51E is disposed at the end of the shaft portion 12a on the base 111 side. Such an end portion is stressed as the shaft portion 12a is deformed. The strain detection element 52E is disposed at the end of the shaft portion 12b on the base 111 side. Such an end portion is stressed as the shaft portion 12b is deformed.
The strain detection elements 51E and 52E are two-terminal piezoresistive elements similar to the strain detection elements 51A and 52A of the second embodiment described above, respectively, and are inclined with respect to the Y axis.
In order to detect the behavior of the frame body portion 13 using such detection signals of the strain detection elements 51E and 52E, the relationship opposite to the detection method described in the first embodiment may be used.
Even with the optical scanner 1E according to the sixth embodiment as described above, the behavior of the movable mirror unit 11 using the strain detection elements 51E and 52E while suppressing the influence of external heat on the strain detection elements 51E and 52E. Can be detected.
Each of the optical scanners described above can be suitably applied to an optical scanner provided in an image display device such as an imaging display such as a projector, a head-up display (HUD), and a head-mounted display (HMD). it can. Such an image display device has excellent reliability and can display a high-quality image.
<Embodiment of Image Display Device>
FIG. 25 is a diagram schematically showing an embodiment of the image display device of the present invention, and FIG. 26 is a block diagram showing a control system of the image display device shown in FIG. In FIG. 26, the same reference numerals are given to the same components as those described above.
In the present embodiment, a case where the optical scanner 1 is used as an optical scanner of an imaging display will be described as an example of an image display device. The longitudinal direction of the screen S is referred to as "lateral direction", and the direction perpendicular to the longitudinal direction is referred to as "vertical direction". Further, the X axis is parallel to the horizontal direction of the screen S, and the Y axis is parallel to the vertical direction of the screen S.
The image display device (projector) 9 includes a light source device (light source) 91 that emits light such as a laser, a plurality of dichroic mirrors 92A, 92B, and 92C, the optical scanner 1, a light source drive circuit 94, and a light detection unit. 95, a light intensity detection circuit 96, a control unit 6A, and a trigger generation unit 73.
The trigger generation unit 73 generates a signal for generating a trigger for starting drawing in the horizontal scanning direction based on the signal output from the second signal processing circuit. The trigger generation unit 73 is, for example, a comparator.
The control unit 6A includes an image processing unit 67, a light source drive signal generation unit 68, an APC control unit 69, and a light amount target value storage unit 70.
The image processing unit 67 receives an image signal, generates a drawing signal necessary for drawing based on the image signal, and drives the light source based on the signal output from the trigger generation unit 73. The signal is output to the signal generator 68. Further, the image processing unit 67 outputs line information in the vertical scanning direction to the V target value generation unit 66.
The light source drive signal generation unit 68 generates a drive signal for driving the light source drive circuit 94 based on the drawing signal output from the image processing unit 67. The association between the drawing signal from the image processing unit 67 and the driving signal for the light source driving circuit 94 is periodically updated based on the signal from the APC control unit 69.
The APC control unit 69 outputs a signal for correcting the correspondence to the light source driving signal generation unit 68 so that the correspondence between the light emission intensity of the light source device 91 and the data of the image signal becomes the target value regardless of the environmental change. .
The light source drive circuit 94 generates a drive current that drives the light source device 91 based on the drive signal from the light source drive signal generation unit 68.
The light intensity detection circuit 96 converts the output from the light detection unit 95 such as a photodiode that detects the light emission intensity of the light source device 91 into a signal necessary for signal processing. The light intensity detection circuit 96 includes, for example, an amplifier circuit, a filter, an AD converter, and the like.
The light source device 91 includes a red light source device 911 that emits red light, a blue light source device 912 that emits blue light, and a green light source device 913 that emits green light.
The dichroic mirrors 92A, 92B, and 92C are optical elements that synthesize light emitted from the red light source device 911, the blue light source device 912, and the green light source device 913, respectively.
Such an image display device 9 is light emitted from the light source device 91 (red light source device 911, blue light source device 912, green light source device 913) based on image information (image signal) from a host computer (not shown). Are combined by dichroic mirrors 92A, 92B, and 92C, and the combined light is two-dimensionally scanned by the optical scanner 1 to form a color image on the screen S.
During the two-dimensional scanning, the light reflected by the light reflecting portion 114 due to the rotation of the movable mirror portion 11 of the optical scanner 1 around the Y axis is scanned in the horizontal direction of the screen S (main scanning). On the other hand, the light reflected by the light reflecting portion 114 by the rotation of the movable mirror portion 11 of the optical scanner 1 around the X axis is scanned (sub-scanned) in the vertical direction of the screen S.
In FIG. 25, the light synthesized by the dichroic mirrors 92A, 92B, and 92C is scanned two-dimensionally by the optical scanner 1, and then the light is reflected by the fixed mirror 93 and then an image is formed on the screen S. However, the fixed mirror 93 may be omitted, and the screen S may be directly irradiated with light two-dimensionally scanned by the optical scanner 1.
Hereinafter, application examples of the image display apparatus will be described.
<Application Example 1 of Image Display Device>
FIG. 27 is a perspective view showing an application example 1 of the image display device of the present invention.
As shown in FIG. 27, the image display device 9 can be applied to a portable image display device 100.
The portable image display device 100 includes a casing 110 formed with dimensions that can be grasped by a hand, and an image display device 9 built in the casing 110. With this portable image display device 100, for example, a predetermined image can be displayed on a predetermined surface such as a screen or a desk.
In addition, the portable image display device 100 includes a display 120 that displays predetermined information, a keypad 130, an audio port 140, a control button 150, a card slot 160, and an AV port 170.
Note that the portable image display device 100 may have other functions such as a call function and a GSP reception function.
As shown in FIG. 28, the image display device 9 can be applied to a head-up display system 200.
In the head-up display system 200, the image display device 9 is mounted on a dashboard of an automobile so as to constitute a head-up display 210. With this head-up display 210, a predetermined image such as a guidance display to the destination can be displayed on the windshield 220, for example.
Note that the head-up display system 200 can be applied not only to automobiles but also to aircrafts, ships, and the like.
As shown in FIG. 29, the image display device 9 can be applied to a head mounted display 300.
That is, the head mounted display 300 includes glasses 310 and the image display device 9 mounted on the glasses 310. Then, the image display device 9 displays a predetermined image that is visually recognized by one eye on the display unit 320 provided in a portion that is originally a lens of the glasses 310.
The display unit 320 may be transparent or opaque. When the display unit 320 is transparent, information from the image display device 9 can be used by adding information from the real world.
Note that the head-mounted display 300 may be provided with two image display devices 9 so that images viewed with both eyes may be displayed on the two display units.
The optical scanner, the image display device, and the head mounted display of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this. For example, in the optical scanner, the image display device, and the head mounted display of the present invention, the configuration of each part can be replaced with an arbitrary configuration having the same function, and any other arbitrary configuration is added. You can also.
Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.
Further, in the above-described embodiment, the case where the moving magnet method is adopted as the driving method of the optical scanner or the actuator has been described as an example. Can be applied. Further, the present invention is not limited to an electromagnetic drive method such as a moving magnet method or a moving coil method, and can be applied to other drive methods such as a piezoelectric drive method and an electrostatic drive method.
In the above-described embodiment, the case where two first shaft portions (one pair) are provided has been described as an example. However, the present invention is not limited to this. For example, four first shaft portions (two pairs) are provided. It may be provided above.
In the above-described embodiment, the case where two second shaft portions (one pair) are provided has been described as an example. However, the present invention is not limited to this. For example, four second shaft portions (two pairs) are provided. It may be the above.
Moreover, although embodiment mentioned above demonstrated as an example the case where a light reflecting plate covered the whole 1st axial part, the whole frame part, and the whole 2nd axial part by planar view, a light reflecting plate is planar view. If at least a part of the first shaft part (the end part on the base part side of the movable mirror part) is covered, the optical device as described above can be downsized, the area of the light reflecting plate can be increased, and the light reflecting plate can be flexibly deformed. It is possible to achieve effects such as suppression of stray light and suppression of stray light by the base side end of the first shaft portion.
In the above-described embodiment, the case where the light reflecting plate and the spacer are formed by processing the SOI substrate has been described as an example. However, the present invention is not limited to this. For example, the light reflecting plate and the spacer are formed from different substrates. May be.
The spacer between the light reflecting plate and the base may be a solder ball. In this case, for example, metal films may be formed on the light reflecting plate and the spacer side surfaces of the base, and these metal films may be bonded to each other via solder balls.
Further, in the above-described embodiment, the case where the light reflecting portion is provided on the light reflecting plate has been described as an example. However, the present invention is not limited to this. A reflective part may be provided.
Further, the arrangement, number, shape, size, number of terminals, and the like of the first strain detection elements are not limited to the above-described embodiment as long as they can detect the bending deformation of the second shaft portion, and are known strains. The detection element can be used as the first strain detection element. For example, two two-terminal piezoresistive elements such as the strain detection element 51 of the above-described embodiment may be arranged side by side in the width direction of the second shaft portion. In this case, it is possible to cancel the torsional deformation component included in the detection signal of one piezoresistive element and the torsional deformation component included in the detection signal of the other piezoresistive element, and to output only the bending deformation component.
In addition, the arrangement, number, shape, size, number of terminals, and the like of the second strain detection elements are not limited to the above-described embodiment as long as they can detect the torsional deformation of the second shaft portion. The detection element can be used as the second strain detection element. For example, the second strain detection element may be a two-terminal piezoresistive element arranged in the width direction of the second shaft portion. In this case, it is possible to cancel the bending deformation component included in the detection signal of one piezoresistive element and the bending deformation component included in the detection signal of the other piezoresistive element, and output only the torsional deformation component.
In addition, if the installation position of the strain detection element is any one of the end of the second shaft portion on the frame body side, or the movable portion, the frame body portion, and the first shaft portion, the above-described embodiment is used. It is not limited, For example, the position away from the 1st axis part or the 2nd axis part of a frame part or a movable part may be sufficient. In this case, for example, the movable part or the frame body part is configured so as to be able to deform along with the swing around the first axis or the second axis, and based on the detection signal of the strain detection element, The behavior of the movable portion around the first axis or the second axis can be detected.
Further, the strain detection element may be arranged across the frame body portion and the second shaft portion, or the frame body portion and the first shaft portion, or the first shaft portion and the movable portion.
In addition, when a strain detection element is arranged on the first shaft portion and the behavior around the second axis of the movable portion is detected using the detection signal of the strain detection element, it is the reverse of the estimation by the observer in the above-described embodiment. What is necessary is just to perform a related estimation.
DESCRIPTION OF SYMBOLS 1 ... Optical scanner 1A ... Optical scanner 1B ... Optical scanner 4 ... Voltage application part 6 ... Control part 6A ... Control part 9 ... Image display device 11 ... Movable mirror part 12a ... Shaft part 12b ... ... Shaft 13 ... Frame 14a ... Shaft 14b ... Shaft 15 ... Fixed part 21 ... Permanent magnet 31 ... Coil 32 ... Magnetic core 41 ... Voltage generator 42 ... Voltage generator 43 Voltage superposition unit 43a Adder 51 Strain detection element 51A Strain detection element 51B Strain detection element 52 Strain detection element 52A Strain detection element 52B Strain detection element 53 Strain Detection element driving circuit 61... H detection section 62... V detection section 63... H control section 64... V control section 65... H target value storage section 66. 68 ... Light source drive signal generator 69 ... APC Control unit 70 ... Light quantity target value storage unit 71 ... First signal processing circuit 71A ... First signal processing circuit 72 ... Second signal processing circuit 72A ... Second signal processing circuit 73 ... Trigger generation unit 81a ... Terminal 81b ... Terminal 82a ... Terminal 82b ... Terminal 82c ... Terminal 82d ... Terminal 83a ... Terminal 83b ... Terminal 84a ... Terminal 84b ... Terminal 84c ... Terminal 84d ... Terminal 91 ... Light source Equipment 92A ... Dichroic mirror 92B ... Dichroic mirror 92C ... Dichroic mirror 93 ... Fixed mirror 94 ... Light source drive circuit 95 ... Light detector 96 ... Light intensity detection circuit 100 ... Portable image display device 110 ... Casing 111 Base 112 Spacer 113 Light reflector 114 Light reflector 115 Hard layer 120 Display 130 ... keypad 131 ... rib 140 ... audio port 150 ... control button 160 ... card slot 170 ... port 200 ... head-up display system 210 ... head-up display 220 ... windshield 300 ... head Mount display 310 ... Glasses 320 ... Display section 511 ... Piezoresistive area 511A ... Piezoresistive area 511B ... Piezoresistive area 512 ... Terminal 512A ... Terminal 512B ... Input terminal 513 ... Terminal 513A ... Terminal 513B ... Input terminal 514B ... Output terminal 515B ... Output terminal 521 ... Piezoresistive area 522 ... Input terminal 523 ... Input terminal 524 ... Output terminal 525 ... Output terminal 711 ... Resistance element 712 ... Resistive element 713 ‥‥ resistive element 714 ‥‥ processor 911 ‥‥ red light source device 912 ‥‥ blue light source device 913 ‥‥ green light source device E ‥‥ field S ‥‥ screen alpha ‥‥ angle theta ‥‥ inclination angle V 1 ‥ ··· First voltage V 2 ··· Second voltage
A movable part provided with a light reflecting part having light reflectivity and swingable about a first axis;
An optical scanner comprising: a second signal processing unit that receives a detection signal of the second strain detection element and outputs a signal based on torsional deformation of the second shaft portion.
2. The optical scanner according to claim 1, wherein the first strain detection element is disposed at an end of the second shaft portion on the frame body side and detects deformation of the second shaft portion.
The first strain detecting element includes a piezoresistive region having a longitudinal shape extending in a direction along a longitudinal direction of the second shaft portion, and a direction along the longitudinal direction of the second shaft portion on the piezoresistive region. The optical scanner according to claim 2, further comprising a pair of terminals arranged side by side.
4. The optical scanner according to claim 1, wherein a behavior of the movable unit around the first axis is detected based on a signal output from the first signal processing unit. 5.
The optical scanner according to claim 4, wherein the behavior of the movable part around the first axis is estimated based on a signal output from the first signal processing unit using an observer.
Using the ratio of the amplitude at the resonance frequency related to the oscillation of the movable part around the first axis to the amplitude at the resonance frequency related to the oscillation of the frame part around the first axis, the first signal The optical scanner according to claim 4, wherein the behavior of the movable unit around the first axis is estimated based on a signal output from the processing unit.
The light according to any one of claims 1 to 6, wherein the second strain detection element is disposed at an end of the second shaft portion on the frame body side and detects deformation of the second shaft portion. scanner.
The optical scanner according to claim 7, wherein a behavior of the movable portion around the second axis is detected based on a signal output from the second signal processing portion.
An optical scanner comprising: a second signal processing unit that receives a detection signal of the strain detection element and outputs a signal based on torsional deformation of the second shaft portion.
The strain detection element includes: a piezoresistive region; and a pair of terminals arranged on the piezoresistive region in a direction inclined with respect to a longitudinal direction of the second shaft portion. Light scanner.
The second shaft portion is provided in a pair with the frame portion interposed therebetween,
The optical scanner according to claim 9, wherein the strain detection element is disposed on each of the pair of second shaft portions.
An optical scanner according to any one of claims 1 to 11,
An image display device characterized in that light emitted from the light source is reflected by the light reflecting portion to display an image.
A head-mounted display, wherein light emitted from the light source is reflected by the light reflecting portion and an image is displayed as a virtual image.
JP2013055730A 2013-03-18 2013-03-18 Optical scanner, image display device, and head-mounted display Pending JP2014182227A (en)
JP2013055730A JP2014182227A (en) 2013-03-18 2013-03-18 Optical scanner, image display device, and head-mounted display
CN201410095268.8A CN104062756A (en) 2013-03-18 2014-03-14 Optical Scanner, Image Display Apparatus, And Head Mounted Display
EP14159822.7A EP2781949A1 (en) 2013-03-18 2014-03-14 Optical scanner, image display apparatus, and head mounted display
US14/215,607 US20140268266A1 (en) 2013-03-18 2014-03-17 Optical scanner, image display apparatus, and head mounted display
JP2014182227A5 JP2014182227A5 (en) 2016-04-28
JP2013055730A Pending JP2014182227A (en) 2013-03-18 2013-03-18 Optical scanner, image display device, and head-mounted display
WO2016194514A1 (en) * 2015-05-29 2016-12-08 ミツミ電機株式会社 Optical scanning device, method for manufacturing same, and optical scanning control device
JP6565459B2 (en) * 2015-08-06 2019-08-28 セイコーエプソン株式会社 Optical scanner, image display device, and head mounted display
JP2018132611A (en) 2017-02-14 2018-08-23 ミツミ電機株式会社 Optical scanner and optical scanning method
JPH0996552A (en) * 1995-09-29 1997-04-08 Omron Corp Sensor device
JP2002023097A (en) * 2000-07-10 2002-01-23 Olympus Optical Co Ltd Torsional oscillator
JP2003207737A (en) * 2002-01-15 2003-07-25 Nissan Motor Co Ltd Two-dimensional optical scanner
JP2008168423A (en) * 2007-01-15 2008-07-24 Samsung Electro Mech Co Ltd Rotating mems device
DE102007033000A1 (en) * 2007-07-16 2009-01-22 Robert Bosch Gmbh Micromechanical component with a position detection component for position determination and amplitude determination of a vibratable element
WO2010021215A1 (en) * 2008-08-18 2010-02-25 コニカミノルタオプト株式会社 Image projection device
JP2011013270A (en) * 2009-06-30 2011-01-20 Nippon Signal Co Ltd:The Planar type actuator and optical scanning apparatus
JP2011107505A (en) * 2009-11-19 2011-06-02 Konica Minolta Opto Inc Two-dimensional optical scanner driving device
JP2012237788A (en) * 2011-05-10 2012-12-06 Konica Minolta Advanced Layers Inc Optical scanner and image projection device equipped with the same
US5488862A (en) * 1993-10-18 1996-02-06 Armand P. Neukermans Monolithic silicon rate-gyro with integrated sensors
US6467345B1 (en) * 1993-10-18 2002-10-22 Xros, Inc. Method of operating micromachined members coupled for relative rotation
DE19709913C2 (en) * 1997-03-11 1999-05-06 Cms Mikrosysteme Gmbh Chemnitz Arrangement for measuring and controlling or regulating the deflection of the micromechanical mirror arrays
US6625341B1 (en) * 2000-06-12 2003-09-23 Vlad J. Novotny Optical cross connect switching array system with electrical and optical position sensitive detection
JP2002116403A (en) * 2000-10-10 2002-04-19 Nissan Motor Co Ltd Optical scanner
JP5582518B2 (en) * 2006-09-27 2014-09-03 独立行政法人産業技術総合研究所 Optical scanning device
JP2008170565A (en) * 2007-01-10 2008-07-24 Canon Inc Oscillating body apparatus and image forming apparatus using the same
DE102008001465A1 (en) * 2008-04-30 2009-11-05 Robert Bosch Gmbh Micromechanical component, method for operating a micromechanical component and production method for a micromechanical component
US8559086B2 (en) * 2010-02-17 2013-10-15 Microvision, Inc. Piezoresistive sensors for MEMS device having rejection of undesired motion
JP5447115B2 (en) * 2010-04-08 2014-03-19 セイコーエプソン株式会社 Image forming apparatus
DE102011006337A1 (en) * 2011-03-29 2012-10-04 Robert Bosch Gmbh Microspigel system and associated control method
2014-03-14 CN CN201410095268.8A patent/CN104062756A/en not_active Application Discontinuation
2014-03-14 EP EP14159822.7A patent/EP2781949A1/en not_active Withdrawn
US10473924B2 (en) 2015-05-29 2019-11-12 Mitsumi Electric Co., Ltd. Optical scanning device, manufacturing method of optical scanning device, and optical scanning control device
JP4092283B2 (en) 2008-05-28 Two-dimensional optical scanner and optical device
US20080143451A1 (en) 2008-06-19 Driving a MEMS oscillator through a secondary set of support arms
Bernstein et al. 2004 Electromagnetically actuated mirror arrays for use in 3-D optical switching applications
JP2004034256A (en) 2004-02-05 Microstructure and method for manufacturing the same
CN101726852B (en) 2013-06-12 Optical unit with shake correcting function and shake correction control method therefor
JP2010197994A (en) 2010-09-09 Deflecting mirror, optical scanning device, image forming apparatus and image projecting apparatus
JP5735154B2 (en) 2015-06-17 Optical unit with shake correction function and optical equipment
JP5913726B2 (en) 2016-04-27 Gimbal scanning mirror array
US7148591B2 (en) 2006-12-12 Oscillating device
US10371928B2 (en) 2019-08-06 Auto focus and optical image stabilization in a compact folded camera
US8508826B2 (en) 2013-08-13 Meandering oscillator, optical reflecting element using meandering oscillator, and image projection device using meandering oscillator
TW201015197A (en) 2010-04-16 Optical scan unit, image projector including the same, vehicle head-up display device, and mobile phone
JP5736766B2 (en) 2015-06-17 Optical scanning device
US20150279114A1 (en) 2015-10-01 Virtual image display device and head-mounted display
JP2011018026A (en) 2011-01-27 Optical deflector, optical scanner, image forming device, and image projector
US20140320944A1 (en) 2014-10-30 Gimbaled scanning micro-mirror apparatus
JP6069946B2 (en) 2017-02-01 Image display device and head-mounted image display device
JP3733383B2 (en) 2006-01-11 2D optical scanner
JP2007322466A (en) 2007-12-13 Optical deflector and optical equipment using the same
CN100411294C (en) 2008-08-13 Actuator
JP2007316443A (en) 2007-12-06 Light deflector and optical equipment using the same
US20140368896A1 (en) 2014-12-18 Optical reflecting element and actuator
JP3974068B2 (en) 2007-09-12 Planar type electromagnetic actuator
JP4984117B2 (en) 2012-07-25 Two-dimensional optical scanner, optical device using the same, and method for manufacturing two-dimensional optical scanner
JP5190528B2 (en) 2013-04-24 Anti-seismic device for lens module