North End Road traffic-free market events is back. The pedestrian-friendly Spring Market will be on Sunday, April 14 from 9am to 6pm.
Councillor Andrew Jones, cabinet member for the economy and the arts said: "There will be something for all the family at our car-free event.
She will be joined by Betty Balloon creating mesmerising balloon sculptures before your eyes with Betty's own wonderful way of storytelling.
While for the music lovers, the schedule of musicians and singers includes FLO – the flute and violin duo playing classical, folk and jazz tunes.
Fulham entrepreneur Ena Barrueto is bringing a touch of Peru to the market Ena said: "It's a fantastic event for local entrepreneurs.
The North End Road Action Group (NERAG) is made up of residents, businesses, market traders and local organisations who – alongside the town hall – aim to boost North End Road as a thriving high street with its historic market at its core.
For more details, email nerag@btconnect.com or call Nicki Burgess on 020 8753 5695.


text:
Sign up to receive a text message or email when new bids are added!
Format for Printing
Bid Number: 2019-02
Bid Title: Sierra Brooks Water System Improvement Project - Phase II
Category: Public Works Projects
Bid Recipient: Sierra County Clerk Recorder
COUNTY OF SIERRA
SIERRA BROOKS, CA
SIERRA BROOKS WATER SYSTEM IMPROVEMENT PROJECT - PHASE II
ADVERTISEMENT FOR BIDS
Separate sealed Bids for the construction of the SIERRA BROOKS WATER SYSTEM IMPROVEMENT
PROJECT - PHASE II will be received by Sierra County Clerk Recorder at the Sierra
County Courthouse, Room 11, 100 Courthouse Square, Downieville, CA , until 2:00 p.m. local
time on June 25, 2019, at which time the Bids received will be publicly opened and read. The Project
consists of constructing a well, well pump station, and building, booster pump station and building,
water storage tank, distribution system pipelines, water services and meters, fire hydrants, standby
generators, electrical controls, and telemetry system.
Bids will be received for a single prime Contract. Bids shall be on a lump sum and unit price basis.
The Issuing Office for the Bidding Documents is: County of Sierra, Department of Public Works, 101
Courthouse Square, P.O. Box 98, Downieville, CA, 95936, Contact: Bryan Davey, Deputy Director, (530)
289-3201. Prospective Bidders may examine the Bidding Documents at the Issuing Office on Mondays
through Fridays between the hours of 8:00 a.m. and 5:00 p.m., and may obtain copies of the Bidding
Documents from the Issuing Office as described below. Prospective Bidders must purchase a bid
package from the Issuing Office.
Bidding Documents also may be examined at Sauers Engineering, Inc. 105 Providence Mine Road, Suite
105, Nevada City, CA, 95959 (call 530-265-8021 for appointment), Valley Builder's Exchange, 951 E. 8th
Street, Chico, CA, Shasta Builder's Exchange in Redding, Sierra Contractor's Source in Reno, on Mondays through Fridays between the hours of 8:00 a.m. and 5:00 p.m., and online at
http://www.sierracounty.ca.gov/bids.aspx.
Printed copies of the Bidding Documents may be obtained from the Issuing Office, during the hours
indicated above, upon payment of:
$50 CONTRACT DOCUMENTS and Half Size (12" x 18") Set of PLANS
$100 CONTRACT DOCUMENTS and Full Size (24" x 36") Set of PLANS
for each set. Payment is non-refundable. Checks for Bidding Documents shall be payable to County of
Sierra. Upon request and receipt of the document payment, the Issuing Office will transmit the Bidding
Documents via delivery service. The date that the Bidding Documents are transmitted by the Issuing
Office will be considered the Bidder's date of receipt of the Bidding Documents. Partial sets of Bidding
Documents will not be available from the Issuing Office. Neither Owner nor Engineer will be responsible
for full or partial sets of Bidding Documents, including Addenda if any, obtained from sources other than
the Issuing Office.
Bidders are notified that financing for this project is provided pursuant to the Consolidated Farm and
Rural Development Act (7 U.S.C. Section 1921 et seq.) and that as allowed in Public Contract Code
Section 22300, this contract does not provide for substitution of securities for any monies withheld by
the Owner to ensure performance under this contract. Bidders are further notified that this contract
does not permit retainage to be placed in escrow nor to be invested for the benefit of the contractor.
Prospective Bidders shall be licensed Contractors in the State of California and shall be skilled and
regularly engaged in the general class or type of work called for under the Contract. Each Bidder shall
have a Class A – General Engineering California Contractor's license.
This is a Public Works Project. Pursuant to CA Labor Code 1771 for contracts over $1,000.00 prevailing
wage requirements are enforced. CA Labor Code requires that all contractors and subcontractors
working on this project keep certified payroll records in accordance with Labor Code 1776. Pursuant to
SB 854 (effective June 20, 2014), all contractors must be registered with the State in order to bid or work
on a public works project.
In accordance with the provisions of section 1720 et seq. of the Labor Code, the Division of Labor
Standards and Research has determined the general prevailing rates or wages and employer payments
for health and welfare, pension, vacation, travel time, and subsistence pay as provided for in section
1773.8.
It shall be mandatory upon the Contractor herein and upon any Subcontractor to pay not less than the
said specified rates to all laborers, workers and mechanics employed by them in the execution of the
Agreement pursuant to CA Labor Code 1774, including owner operators.
Attention is directed to the provisions in section 1777.5 and sections 1777.6 of the Labor Code
concerning the requirement to employ apprentices by the Contractor or any Subcontractor under it.
Please refer to Section 230.1 of Article 10 of Subchapter One of Chapter 2 of Title 8 of the California
Code of Regulations for requirements.
This is a "public works" project as defined in California Labor Code Section 1720 through 1743. In
accordance with California Labor Code Article 1725.5, Contactor and all subcontractors are required to
be registered with California Department of Industrial Relations (DIR) in order to bid or be listed on a bid
and/or on a public works project.
A non-mandatory pre-bid conference will be held at 10:00 a.m. local time on Friday, June 14, 2019 at
the Sierra Brooks Lodge, 510 Longhorn Drive, Loyalton, CA. Attendance at the pre-bid conference is
highly encouraged but is not mandatory.
Owner: County of Sierra
By: Keith Knibb
Title: Project Engineer
+ + END OF ADVERTISEMENT FOR BIDS + +
Publication Date/Time:
Publication Information:
May 9 and 16, 2019
Closing Date/Time:
Submittal Information:
Bid Opening Information:
Addendum Date/Time:
#1, 6/13/2019 #2, 6/19/2019, #3 6/20/2019
Pre-bid Meeting:
Friday, June 14, 2019 @10:00AM
Bryan Davey
Downieville, CA 95936
Download Available:
$50 for 1/2 or $100 Full Size
Plan & Spec Available:
Bid documents must be purchased from Sierra County Public Works office for bid submission.
Plan Holders List:
Class A Contractors License
Final Technical Specifications
Final Bid and Contract Documents 4-30-19
Sierra Brooks April 2019 Final Set
SBW Phase II Planholders List
19-06-12 Addendum 1 SBW Phase II
19-06-14 Bidwalk Roster SBW Phase 2
19-06-19 Addendum 2 with Attachments SBW Phase II
19-09-25 Bid Summary SBW Phase II
Return To Main Bid Postings Page
Financial Data In OpenGov.com
Live where you play

redpajama_set_name: RedPajamaCommonCrawl


text:
Silence: The Whispered World 2 è un videogioco di tipo avventura grafica, sviluppato per Microsoft Windows, PlayStation 4 e Xbox One nel 2016 da Daedalic Entertainment. Il gioco ha un classico stile punta e clicca, con personaggi 3D integrati in sfondi 2D, musiche d'atmosfera e intermezzi animati. Per gli addetti ai lavori è un ottimo videogioco e ha riscosso pareri positivi.

Trama
La guerra infuria. Durante un raid aereo, il sedicenne Noah e la sua sorellina Renie trovano rifugio in un bunker. Lì dentro non sono soltanto protetti da bombardamenti potenzialmente letali, ma si trovano anche al crocevia di un mondo tra la vita e la morte: Silence. Quando Noah perde sua sorella a Silence, sarà costretto ad avventurarsi in questo idilliaco ma minaccioso mondo per ritrovarla.

Modalità di gioco
Le azioni si svolgono tutte con il mouse, premendo il tasto sinistro Sadwick si dirigerà dove c'è il puntatore ed eseguirà le azioni. L'occhio ci permetterà di guardare ed esaminare, la mano di raccogliere, usare, dare, spingere e tirare. Gli enigmi del gioco all'inizio sono semplici ma con il progredire dell'avventura saranno sempre più difficili. La localizzazione in italiano è presente con i sottotitoli e i vari menù di gioco, mentre il parlato è in inglese.

Personaggi principali
 Noah/Sadwick, protagonista del gioco, nonché fratello di Renie. Ha sedici anni con molta voglia di fare. Ha un carattere gentile ed è molto altruista. Spesso fa battute sarcastiche con i personaggi che incontra.
 Renie, è la sorella di Noah e sarà la prima ad avventurarsi nel mondo di Silence, costringendo suo fratello a seguirla. Proprio come suo fratello, Renie ha un carattere molto gentile e altruista.
 Spot, un bruco o larva verde, probabilmente di tipo lepidottero che accompagna Sadwick e Renie in tutta l'avventura. Ha parte rilevante in tutto il gioco grazie alle sue incredibili trasformazioni.

Note

Collegamenti esterni

redpajama_set_name: RedPajamaWikipedia


text:
Deus (estilizado dEUS) es un grupo de música, de indie rock y art rock, de Amberes, Bélgica, formado actualmente por: Tom Barman, (voz y guitarra), Klaas Janzoons (violín y teclado), Mauro Pawlowski (segunda voz y guitarra), Alan Gevaert (bajo) y Stephane Misseghers (batería).

Cambios en los miembros

De los miembros iniciales actualmente solo quedan Tom Barman y Klaas Janzoons. Rudy Trouvé dejó el grupo en agosto de 1995 después del disco In a Bar Under the Sea, según él debido al gran éxito que comenzaba a tener el grupo, que no le dejaba tiempo para realizar otras actividades. Su lugar lo reemplazó Craig Ward como segunda voz y guitarra del grupo hasta el año 2004, año en el que Craig abandonó el grupo siendo reemplazado por Mauro Pawloski. Stef Kamil Carlens dejó el grupo en 1996 poco antes de la salida al mercado del disco In a Bar Under the Sea, para dedicarse por completo a su grupo Zita Swoon, siendo sustituido en el bajo por Danny Mommens. Danny a su vez dejó dEUS en 2004 debido al éxito del otro grupo en el que toca con su novia Els Pynoo, Vive la Fete y fue sustituido por Alan Gevaert. Por último Jules dejó el grupo en 2002 y en su lugar se puso Stephane a la batería.

Discografía

dEUS ha grabado hasta el momento dos EP y cinco discos de estudio:
 ZEA, EP grabado en 1993.
 My Sister, My Clock, EP grabado en 1995 con (BANG Records).(ISLAND RECORDS) volvió a editarlo para lanzarlo internacionalmente cuando el grupo firmó con la discográfica.
 Worst Case Scenario, (1994 BANG Records). (ISLAND RECORDS) volvió a sacar el disco para lanzarlo internacionalmente.
 In a Bar, Under the Sea, (1996 BANG Records e ISLAND RECORDS)
 The Ideal Crash, (1999 ISLAND RECORDS)
 Pocket Revolution, (2005 V2 RECORDS)
 Vantage Point, (2008 V2 RECORDS)
 Keep You Close, (2011)
 The Following Sea, (2013)

Curiosidades

Tom Barman, Craig Ward y Danny Mommens tocaban juntos en el grupo tENERIFE antes de formar dEUS. Rudy Trouvé, Craig Ward y Mauro Pawlowski tocan juntos en el grupo The Lovesustitutes.

Rudy, Craig y Stef Kamil Carlens formaron además el grupo Kiss My Jazz. Rudy Trouvé aparece disfrazado de policía en el videoclip Instant Street aunque ya no formaba parte del grupo. Stef Kamil Carlens realiza la segunda voz en varias canciones del disco Pocket Revolution.

Tom Barman grabó un disco en el 2003 junto con Guy Van Nueten, Tom Barman and Guy Van Nueten Live, en el que tocan 7 temas de dEUS en versión acústica.

Enlaces externos

 Sitio web oficial
 MySpace
 W.W.W.C.S
 Página no oficial de dEUS
 dEUS podcast

Artistas de V2 Records
Artistas de PIAS Recordings
Grupos de música de Bélgica
Grupos de rock de Bélgica
Grupos de indie rock de Bélgica
Grupos de música experimental de Bélgica
Grupos de rock alternativo de Bélgica
Grupos de rock experimental de Bélgica
Grupos de música de los años 1990
Grupos de música de los años 2000
Grupos de música de los años 2010
Grupos de música de los años 2020
Grupos de música formados en 1991
Grupos de música formados en los años 1990


Looking for RV parking? Here's the one! This 4 bedroom 2 bathroom home is in a great area, has a family friendly floor plan and offers the ability to take it and make it your own. Upstairs is a nice bright living room and a freshly painted kitchen. There's 3 bedrooms and a full bathroom. In the basement you have a large rec room plus a 4th bedroom. There's also a roughed-in bathroom. This gem needs a few updates and it's raring to go!


text:
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Stanford Medicine School of Medicine
Stanford team stimulates neurons to induce particular perceptions in mice's minds
Students from far and near begin medical studies at Stanford
The Power of Integration
As winter gives way to spring, I feel a heightened sense of enthusiasm for our collective vision and a renewed gratitude for the work that you—our faculty, trainees, students, and staff—do every day to improve human health. With new collaborations and increased coordination, we are continually unleashing the power of integration to help us achieve more together than we ever could alone.
Through increased synergy, we in Stanford Medicine are creating a whole that is greater than the sum of our parts—bringing together our organizations and mission areas to transform cancer care, translate biomedical breakthroughs, and lead the biomedical revolution in Precision Health. We still have a lot of work to do, but I am pleased at our progress in breaking down the barriers that stand between us and our potential.
One of the ways that Mariann Byerwalter, Christopher Dawes, and I are working toward our shared priorities is through the Integrated Clinical Strategy Committee. Focused on fostering innovation, the committee meets regularly to explore ways to enhance the preeminence of our clinical enterprise. Among the models we look to is Intermountain Healthcare, an integrated healthcare system based in Utah that is widely recognized as a leader in clinical quality improvement and efficient care delivery. Earlier this year we were pleased to formalize a collaboration agreement with Intermountain that will lead to higher quality care and improved value for patients at Stanford and Intermountain.
In addition to bringing together our constituent organizations, integration also means bridging the components of our tripartite mission. One example of this will be on display on March 23 as clinical and basic scientists gather for a symposium on frontiers in diabetes and metabolism research. It's the first in a series of events intended to give faculty, trainees, and students across Stanford Medicine an opportunity to build the relationships and make the connections that will enhance the impact of their work. The symposia are open to all members of the Stanford Medicine community.
Collectively, our efforts at enhancing collaboration and alignment took a considerable step forward last year when we developed a unifying vision to lead the biomedical revolution in Precision Health. To develop this theme, we came together: basic scientists and clinicians; hospital leaders and faculty; community physicians and clinician scientists on our campus; faculty from other schools at Stanford and our 2,105 faculty in the School of Medicine; leaders of our boards; and leaders of our university.
Our Precision Health vision is not an incremental step. It's a bold concept that promises a transformation in how we approach health. Instead of a frantic race to cure disease after the fact, we can increasingly prevent disease before it strikes. Our vision is not static, either. It's a living and evolving set of motivating goals and principles that will enable us to have a profound impact on biomedical science and human health.
Unified by a culture of relentless creativity, we are poised to lead this revolution. Our work on Precision Health has already delivered new solutions for some of medicine's toughest challenges: diagnostics that detect diseases at their earliest, most curable stages; a device that can predict a pediatric asthma attack days before it strikes; new approaches to eliminating food allergies; and partnerships with companies such as Apple to allow patients to monitor their health and share information to improve the health of others.
This is just the beginning. We in Stanford Medicine have a responsibility to see the Precision Health revolution succeed, but it won't be easy. We must come together across boundaries to devise new approaches to old problems and to rally a global community that will join us in creating healthcare focused on treating people rather than treating disease.
Though our individual parts may seem small and simple, together we can transform human health. That's the power of integration.
Lloyd Minor
Carl and Elizabeth Naumann Dean of the Stanford University School of Medicine
Professor of Otolaryngology—Head & Neck Surgery
Professor of Bioengineering and of Neurobiology, by courtesy
Dean's Updates
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text:
US20060273461A1 - Electronic device and method of manufacturing the same - Google Patents
Electronic device and method of manufacturing the same Download PDF
packaging part
Takashi Otsuka
Shinko Electric Industries Co Ltd
2005-06-03 Priority to JP2005164387A priority Critical patent/JP4533248B2/en
2006-06-02 Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
2006-06-04 Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD. reassignment SHINKO ELECTRIC INDUSTRIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OTSUKA, TAKASHI
H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K3/00—Apparatus or processes for manufacturing printed circuits
H05K3/22—Secondary treatment of printed circuits
H05K3/28—Applying non-metallic protective coatings
H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
H05K3/305—Affixing by adhesive
H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K3/341—Surface mounted components
H05K3/3431—Leadless components
H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
H05K3/3452—Solder masks
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/02—Bonding areas; Manufacturing methods related thereto
H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
H01L2224/0554—External layer
H01L2224/0556—Disposition
H01L2224/05568—Disposition the whole external layer protruding from the surface
H01L2224/05573—Single external layer
H01L2224/10—Bump connectors; Manufacturing methods related thereto
H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
H01L2224/161—Disposition
H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
H01L2224/732—Location after the connecting process
H01L2224/73201—Location after the connecting process on the same surface
H01L2224/73203—Bump and layer connectors
H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
H01L2924/19101—Disposition of discrete passive components
H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
H05K2201/09—Shape and layout
H05K2201/09818—Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
H05K2201/099—Coating over pads, e.g. solder resist partly over pads
H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
H05K2201/10621—Components characterised by their electrical contacts
H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
H05K2201/10734—Ball grid array [BGA]; Bump grid array
H05K2201/10954—Other details of electrical connections
H05K2201/10977—Encapsulated connections
H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
H05K2203/1305—Moulding and encapsulation
H05K2203/1316—Moulded encapsulation of mounted components
Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Y02P70/60—Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
Y02P70/611—Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control the product being a printed circuit board [PCB]
Y02P70/613—Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control involving the assembly of several electronic elements
Y10T29/49117—Conductor or circuit manufacturing
Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
An electronic device includes a substrate 23 on which foot patterns 24A, 24B and a solder resist 25 are provided such that the foot patterns 24A, 24B are exposed from opening portions 27A, 27B in the solder resist 25, packaging parts 20A, 20B mounted on the substrate 23 by solder 26, and a sealing resin 29 formed on the substrate 23 to seal the packaging parts 20A, 20B, wherein a part (running-on portions 26A, 26B) of the solder 26 is constructed to run on an upper surface of the solder resist 25 under the packaging parts 20A, 20B.
The present disclosure relates to an electronic device and a method of manufacturing the same. More particularly, the present disclosure relates to an electronic device having such a structure that a packaging part is mounted on a substrate by using solder, and a method of manufacturing the same.
In recent years, the demand for miniaturization of the electronic device is increasing. Accordingly, in order to mount the packaging device provided in the electronic device on the substrate, a necessity to use the surface mounting and the flip-chip mounting is increased (see JP-A-2005-109187, for example).
An example of the surface mounting will be explained with reference to FIG. 18 to FIG. 23 hereunder. FIG. 18 shows an electronic device as a first related-art example. FIG. 19 shows a substrate 3 used in the electronic device as the first related-art example. Foot patterns 4A, 4B onto which packaging parts 1A, 1B are soldered respectively are formed on a surface of the substrate 3. Also, various wiring patterns (not shown) as well as to the foot patterns 4A, 4B are formed on the surface of the substrate 3. A solder resist 5, 5A, 5B is formed on the surface of the substrate 3 to protect the wiring patterns.
The solder resist 5, 5A, 5B is a resin having an insulating performance and, as shown in FIG.2, opening portions 7A, 7B are formed in positions opposing to the foot patterns 4A, 4B. Therefore, the foot patterns 4A, 4B are exposed from the solder resist 5 in positions in which the opening portions 7A, 7B are formed.
The packaging parts 1A, 1B are surface-mounted on the foot patterns 4A, 4B, which are exposed from the opening portions 7A, 7B in the solder resist 5, with solder 6. More particularly, a packaging part electrode 2A is provided to both side portions respectively because the packaging part 1A is a ceramic chip part. Also, the packaging part 1B is an electronic element such as an oscillator, or the like, and packaging part electrodes 2B are formed on a lower surface of the packaging part 1B. Then, when these packaging parts are mounted, the solder paste is applied previously to the foot patterns 4A, 4B, and then the packaging parts 1A, 1B are mounted on the substrate 3 such that respective electrodes 2A, 2B are positioned on the foot patterns 4A, 4B to which the solder paste is applied. Then, the packaging parts 1A, 1B are surface-mounted on the substrate 3 with solder 6 by executing the reflow process under this condition.
An electronic device shown in FIG. 21 has the almost same structure as the electronic device shown in FIG. 18. However, the electronic device shown in FIG. 18 is constructed in such a manner that areas of the opening portions 7A, 7B formed in the solder resist 5 are smaller than areas of the foot patterns 4A, 4B respectively and that outer peripheral portions of the foot patterns 4A, 4B are covered with the solder resist 5. In contrast, the electronic device shown in FIG. 21 is constructed such that the areas of the opening portions 8A, 8B formed in the solder resist 5 are set larger than the areas of the foot patterns 4A, 4B respectively and thus overall areas of the foot patterns 4A, 4B are exposed from the solder resist 5 (see FIG. 22).
Meanwhile, as shown in FIG. 18 and FIG. 21, many electronic devices in the related art are constructed such that the packaging parts 1A, 1B are mounted on the substrate 3 in their exposed state, i.e., in their uncovered state. However, since other people can easily know how the packaging parts 1A, 1B and the wiring patterns are arranged and constructed, these uncovered packaging structures have the problem in terms of the know-how protection.
As the means for preventing this problem, as shown in FIG. 20 and FIG. 23, it may be considered that the packaging parts (only the packaging parts 1A is illustrated in FIG. 20 and FIG. 23) are sealed with a sealing resin 9. In electronic devices 10A, 10B constructed in this manner, the sealing resin 9 formed of an opaque resin makes it possible to prevent the arrangements and structures of the packaging parts 1A, 1B and the wiring patterns from being seen from the outside.
However, a minute clearance (indicated with an arrow Ah in respective Figures) is formed between the packaging part 1A, when mounted on the substrate 3, and the solder resist 5A, 5B. A magnitude of this clearance Δh is varied due to a size of the packaging part 1A, an applied amount of the solder 6, and the like, and is given by almost 5 to 10 μm, for example.
In this manner, when a minute clearance is formed between the packaging part 1A and the solder resist 5A (substrate 3), the sealing resin 9 cannot enter into such minute clearance when the sealing resin 9 is provided. As a result, a void in which the sealing resin 9 is not provided is generated between the packaging part 1A and the solder resist 5A.
In the case where the void is generated in the sealing resin 9, when a heating process is carried out in mounting the electronic devices 10A, 10B and the solder 6 is melted, the periphery of the solder 6 is sealed with the sealing resin 9. Therefore, it is possible that the melted solder 6 enters into the clearance and thus the short-circuit is generated between the packaging part electrodes 2A. Also, there is a possibility that an air in the clearance is expanded by the heating and thus cracks are generated in the sealing resin 9.
The disclosure below describes an electronic device capable of preventing not only generation of a short-circuit between electrode patterns during heating but also generation of cracks in a sealing resin by increasing an isolation distance between a packaging part and a substrate, and a method of manufacturing the same.
An example implementation of the invention is described below.
An electronic device, comprises:
a substrate on a surface of which electrode patterns and a solder resist are provided such that the electrode patterns are exposed from opening portions formed in the solder resist;
a packaging part mounted on the substrate, the packaging part having packaging part electrodes connected to the electrode patterns by solder; and
a sealing resin formed on the substrate to seal the packaging part;
wherein a part of the solder runs on an upper surface of the solder resist.
In the above-mentioned structure, since a part of the solder runs on an upper surface of the solder resist, an isolation distance between the packaging part and the substrate can be set large. Therefore, the sealing resin can be injected surely into spaces between the packaging part and the substrate.
Also, in the electronic device, when the substrate is viewed from a top, the solder resist may have overlapping portions that are overlapped with areas in which the packaging part electrodes and the electrode patterns oppose to each other.
In the above-mentioned structure, the overlapping portions that are overlapped with areas where the packaging part electrodes and the electrode patterns oppose to each other are provided to the solder resist. Therefore, a part of the solder can be caused easily to run on the upper surface of the solder resist (overlapping portions).
Also, in the electronic device, the solder resist may not be provided in an area in which the packaging part and the substrate oppose to each other.
In the above-mentioned structure, the packaging part opposes directly to the substrate and the solder resist is not present between them. Therefore, a height of the packaging part from the substrate can be set further large, and thus the sealing resin can be injected more surely into the spaces between the packaging part and the substrate.
Also, an electronic device, comprises:
packaging part electrode wherein a buried member is provided into the electrode patterns respectively in a state that it is buried in the solder.
In the above-mentioned structure, since the buried member buried in the solder is provided into the electrode patterns respectively, the buried member is buried in the inside of the solder when the solder is applied to the electrode patterns. Therefore, a height of the solder is increased higher than a height obtained when the buried member is not provided. As a result, an isolation distance between the packaging part and the substrate can be set large and thus the sealing resin can be injected without fail into the spaces between the packaging part and the substrate.
Also, in the electronic device, the buried member is formed of the solder resist.
In the above-mentioned structure, the buried member is formed of the solder resist. Therefore, the buried member can be formed at the same time when the solder resist is formed.
Also, in the electronic device, when the substrate is viewed from a top, the buried member is provided to areas in which the packaging part electrodes and the electrode patterns oppose to each other.
In the above-mentioned structure, the buried member is provided to the areas where the packaging part electrodes oppose to the electrode patterns. Therefore, the buried member can be provided without fail to the inside of the solder.
Also, a method of manufacturing an electronic device, comprises: steps of
applying solder to electrode patterns on a substrate on a surface of which the electrode patterns and a solder resist are provided such that the electrode patterns are exposed from opening portions formed in the solder resist;
mounting packaging part electrodes, which are provided to a packaging part, on the electrode patterns by using the solder; and
forming a sealing resin, which seals the packaging part, on the substrate;
wherein, before the mounting step is executed, a thermosetting adhesive having an activation power necessary for soldering is provided to a position corresponding to a mounting position of the substrate, on which the packaging part is mounted.
In the above-mentioned structure, since a thermosetting adhesive having an activation power necessary for the soldering is provided before the mounting step is executed, the packaging part can be secured to the substrate by using this adhesive in the mounting step. Also, since the solder is activated by the activator contained in the adhesive when the packaging part is soldered to the wiring patterns in the mounting step, the soldering can be executed without fail. In addition, since the adhesive is present between the packaging part and the substrate in the sealing step, no clearance is generated between the packaging part and the substrate when the sealing resin is formed.
Various implementations may include one or more the following advantages. For example, since an isolation distance between the packaging part and the substrate can be set large, the sealing resin can be introduced surely into the spaces between the packaging part and the substrate. Thus, even when the sealing resin is formed, no clearance is generated between the packaging part and the substrate. Therefore, it can be prevented that a short-circuit between the packaging parts patterns via the solder entered into the clearance is generated, and also it can be prevented that an air in the clearance is expanded by heating to exert a bad influence upon the sealing resin, and the like. As a result, reliability of the electronic device can be improved.
FIG. 1 is a side view showing a state before a sealing resin is provided to an electronic device as a first embodiment of the present invention.
FIG. 2 is a plan view of a substrate constituting the electronic device as the first embodiment of the present invention.
FIG. 3 is a sectional view of the electronic device as the first embodiment of the present invention.
FIG. 4 is a plan view showing a variation of a substrate constituting the electronic device as the first embodiment of the present invention.
FIG. 5 is a side view showing a state before a sealing resin is provided to an electronic device as a second embodiment of the present invention.
FIG. 6 is a plan view of a substrate constituting the electronic device as the second embodiment of the present invention.
FIG. 7 is a sectional view of the electronic device as the second embodiment of the present invention.
FIG. 8 is a sectional view of an electronic device as a third embodiment of the present invention.
FIG. 9 is a view (#1) explaining a method of manufacturing the electronic device as the third embodiment.
FIG. 10 is a view (#2) explaining the method of manufacturing the electronic device as the third embodiment.
FIG. 12 is a sectional view of an electronic device as a fourth embodiment of the present invention.
FIG. 13 is a view (#1) explaining a method of manufacturing the electronic device as the fourth embodiment.
FIG. 14 is a view (#2) explaining the method of manufacturing the electronic device as the fourth embodiment.
FIG. 16 is a view (#1) explaining a variation of a method of manufacturing the electronic device as the fourth embodiment.
FIG. 17 is a view (#2) explaining the variation of the method of manufacturing the electronic device as the fourth embodiment.
FIG. 18 is a side view showing a state before a sealing resin is provided to an electronic device as a first related-art example.
FIG. 19 is a plan view of a substrate constituting the electronic device as the first related-art example.
FIG. 20 is a sectional view of the electronic device as the first related-art example.
FIG. 21 is a side view showing a state before a sealing resin is provided to an electronic device as a second related-art example.
FIG. 22 is a plan view of a substrate constituting the electronic device as the second related-art example.
FIG. 23 is a sectional view of the electronic device as the second related-art example.
Next, the best mode for carrying out the present invention will be explained with reference to the drawings hereinafter.
FIG. 1 to FIG. 3 are views explaining an electronic device 30A as a first embodiment of the present invention. FIG. 1 is a side view showing a state before a sealing resin 29 is provided to the electronic device 30A, FIG. 2 is a plan view of a substrate 23 constituting the electronic device 30A, and FIG. 3 is a longitudinal sectional view of the electronic device 30A.
The electronic device 30A comprises packaging parts 20A, 20B, the substrate 23, the sealing resin 29, and the like. The packaging part 20A is a ceramic chip parts such as a resistor, a capacitor, or the like, for example, and packaging part electrodes 22A are formed on both sides of the packaging part 20A. Also, the packaging part 20B is an electronic element such as a SAW filter, an oscillator, or the like, for example, and packaging part electrodes 22B are formed on a lower surface of the packaging part 20B.
The substrate 23 is a printed-wiring board, for example, and foot patterns 24A, 24B are formed on a surface of the substrate 23. The foot patterns 24A are the electrode patterns used to mount the packaging part 20A, and the foot patterns 24B are the electrode patterns used to mount the packaging parts 20. Also, various wiring patterns 31 as well as the foot patterns 24A, 24B are formed on a surface of the substrate 23. In the present embodiment, the wiring patterns 31 are provided to positions that oppose to the packaging part 20B.
A solder resist 25 is formed on the surface of the substrate 23 to protect the wiring patterns 31. The solder resist 25 is provided to the surface of the substrate 23 such that, when the solder is applied, solder 26 is not deposited on conductors (e.g., the wiring patterns 31) other than the foot patterns 24A, 24B. The solder resist 25 is formed relatively easily in a desired shape by the screen printing, or the like.
As shown in FIG. 2, opening portions 27A, 27B are formed in the solder resist 25. The opening portions 27A, 27B are formed to correspond to forming positions of the foot patterns 24A, 24B formed on the substrate 23. More particularly, the opening portion 27A is formed to correspond to the foot patterns 24A on which the packaging part 20A is mounted, and also the opening portions 27B are formed to correspond to the foot patterns 24B on which the packaging part 20B is mounted.
Also, a length L1 of the opening portion 27A in the arrow X direction in FIG. 2 is set shorter than a length L2 of the packaging part 20A (in FIG. 2, its outer shape is indicated by a chain double-dashed line) in the arrow X direction in a mounted state (L2>L1). Also, two opening portions 27B are formed on the right and left sides in FIG. 2 to put a lower resist 25A of the packaging part 20B between them. In this case, a length L3 between a left end portion and a right end portion containing two opening portions 27B in FIG. 2 is set shorter than a length L4 of the packaging part 20B (in FIG. 2, its outer shape is indicated by a chain double-dashed line) in the arrow X direction in a mounted state (L4>L3).
Now, a relationship between the foot patterns 24A, 24B and the solder resist 25 will be mentioned hereunder. The present embodiment is constructed such that a part of the foot patterns 24A, 24B is covered with the solder resist 25. Suppose hereunder that a portion of the solder resist 25 for covering a part of the foot patterns 24A is referred to as an overlapping portion 32A and a portion of the solder resist 25 for covering a part of the foot patterns 24B is referred to as an overlapping portion 32B.
Respective overlapping portions 32A, 32B are provided on outer positions of the foot patterns 24A, 24B. In the present embodiment, the overlapping portion 32A (32B) is provided to extend in the arrow X direction only in FIG. 2, and a width dimension of the overlapping portion 32A is given by a width indicated by an arrow X1 (X2) in FIG. 2.
The overlapping portions 32A, 32B are constructed such that they are positioned in areas of the packaging parts 20A, 20B in their mounted state (areas indicated by a chain double-dashed line in FIG. 2). In other words, the overlapping portions 32A, 32B are constructed to oppose to the packaging parts 20A, 20B when the packaging parts 20A, 20B are mounted on the substrate 23.
Also, in the present embodiment, the solder resist 25 located between a pair of foot patterns 24A, 24A is not provided. Therefore, as shown in FIG. 1, the packaging part 20A is faced directly to the substrate 23 before it is sealed with the sealing resin 29.
In contrast to this, the wiring patterns 31 are provided between the left and right foot patterns 24B on the side where the packaging part 20B is provided. In order to protect the wiring patterns 31, the lower resist 25A is formed between the left and right foot patterns 24B on the side where the packaging part 20B is provided.
The solder paste is applied onto the foot patterns 24A, 24B to mount the packaging parts 20A, 20B on the substrate 23. At this time, the solder paste is applied onto not only upper surfaces of the foot patterns 24A, 24B but also upper surfaces of the overlapping portions 32A, 32B.
Then, the packaging parts 20A, 20B are aligned with the substrate 23 such that the electrodes 22A, 22B are positioned on the foot patterns 24A, 24B onto which the solder paste is applied, and then the packaging parts 20A, 20B are fitted onto the substrate 23. In this state, the packaging parts 20A, 20B are temporarily fitted to the substrate 23 by the solder paste.
Then, the substrate 23 to which the packaging parts 20A, 20B are temporarily fitted is put into the reflow furnace, and then the reflow process is carried out. As a result, organic components in the solder paste are evaporated and the solder is melted. Then, the packaging part electrodes 22A, 22B of the packaging parts 20A, 20B are soldered to the foot patterns 24A, 24B with the solder 26 after the melted solder 26 is cooled/solidified.
FIG. 1 shows a state that the packaging parts 20A, 20B are secured to the foot patterns 24A, 24B with the solder 26. Here, the solder 26 in the present embodiment is mentioned hereunder. In the present embodiment, a part of the solder 26 is formed to run on the upper portion of the solder resist 25 (portion of the solder 26 formed to run on the upper portion of the solder resist 25 is referred to as running-on portions 26A, 26B respectively hereinafter).
In this manner, a part of the solder 26 is formed to run on the upper portion of the solder resist 25. Therefore, the packaging part 20A is positioned higher than the upper portion of the solder resist 25 by a thickness of the running-on portion 26A (indicated by an arrow ΔH1 in FIG. 1) in its mounted state, and also the packaging part 20B is positioned higher than the upper portion of the solder resist 25 by a thickness of the running-on portion 26B (indicated by an arrow ΔH2 in FIG. 1).
The thicknesses (ΔH1, ΔH2) of the running-on portions 26A, 26B can be adjusted by areas of the overlapping portions 32A, 32B overlapped on the foot patterns 24A, 24B (in other words, exposed areas of the foot patterns 24A, 24B), an applied amount of the solder 26, and the like.
Also, in order to form the running-on portion 26A, 26B (solder 26) on the solder resist 25 that has essentially a low affinity for the solder, it is important that in fact outwardly extruded portions of the foot patterns 24A, 24B should be positioned on as inner the side as possible of the packaging areas (indicated by a chain double-dashed line in FIG. 2) of the packaging parts 20A, 20B such that they are not positioned on the outer side from the packaging areas of the packaging parts 20A, 20B. Also, it is important that, when the substrate 23 onto which the packaging parts 20A, 20B are mounted is viewed from the top, the overlapping portions 32A, 32B should be provided in areas that are overlapped with the areas where the packaging part electrodes 22A, 22B are opposed to the foot patterns 24A, 24B.
With the above configuration, the running-on portion 26A, 26B can be prevented from leaking out from outer peripheries of the packaging parts 20A, 20B to the outer side. Accordingly, the running-on portion 26A, 26B can be held between the packaging parts 20A, 20B and the substrate 23 (the foot patterns 24A, 24B, the overlapping portions 32A, 32B)
As a result, the packaging parts 20A, 20B can be isolated more largely from the substrate 23 than the related art (see FIG. 18 to FIG. 23). More concretely, on the packaging side of the packaging part 20A, the solder resist 25 under the packaging position of the packaging part 20A is not provided. Thus, an isolation distance between the substrate 23 and the packaging part 20A is given by a distance indicated by an arrow Z1 in FIG. 1.
Also, on the packaging side of the packaging part 20B, the lower resist 25A is formed between the packaging part 20B and the substrate 23 because of the presence of the wiring patterns 31. Thus, an isolation distance between a surface of the lower resist 25A and the lower surface of the packaging part 20B is given by a distance indicated by an arrow Z2 in FIG. 1.
Both isolation distances Z1, Z2 can be increased large rather than the related art (ΔH indicated in FIG. 20 and FIG. 23). Concretely, the isolation distances Z1, Z2, although varied due to the exposed area of the foot pattern 24A, an applied amount of the solder 26, etc., can be set to 20 μm to 30 μm, for example.
As shown in FIG. 3, the sealing resin 29 is formed to seal the packaging parts 20A, 20B provided onto the substrate 23. The sealing resin 29 is made of an epoxy resin, and is formed by using the transfer molding method, for example.
In the present embodiment, since the isolation distances Z1, Z2 between the packaging parts 20A, 20B and the substrate 23 can be set large as described above, the sealing resin 29 can be introduced without fail into spaces (33A, 33B) between the packaging parts 20A, 20B and the substrate 23. In particular, on the packaging side of the packaging part 20A, the sealing resin 29 can be introduced more surely because the solder resist 25 is not present between the packaging part 20A and the substrate 23.
In this way, in the electronic device 30A according to the present embodiment, since the sealing resin 29 is introduced into the spaces between the packaging parts 20A, 20B and the substrate 23, a clearance is never generated between the packaging parts 20A, 20B and the substrate 23. Therefore, even when the heating is applied upon mounting the electronic device 30A, and the like, a short-circuit between the foot patterns 24A, 24B via the solder 26 is never generated, and also the sealing resin 29 is never badly influenced by the expansion of the air in the clearance. As a result, reliability of the electronic device 30A can be improved.
FIG. 4 shows the substrate 23 provided to an electronic device as a variation of the first embodiment of the present invention. The first embodiment shown in FIG. 2 is constructed such that the overlapping portions 32A, 32B are provided to extend in the arrow X direction in FIG. 2 only. In contrast, this variation is characterized in that the overlapping portions 32A, 32B are provided to extend not only in the arrow X direction in FIG. 4 but also in the arrow Y direction in FIG. 4.
In an example shown in FIG. 4, width dimensions of extended portions of the overlapping portions 32A, 32B in the arrow Y direction are set to widths indicated by arrows Y1, Y2 respectively. In this variation, the forming positions of the overlapping portions 32A, 32B are not limited to one side of the foot patterns 24A, 24B, and they may be formed on two sides.
Next, a second embodiment of the present invention will be explained hereunder.
FIG. 5 to FIG. 7 are views explaining an electronic device 30B as a second embodiment the present invention. In FIG. 5 to FIG. 7, the same reference symbols are affixed to the same configuration as the electronic device 30A according to the first embodiment shown in FIG. 1 to FIG. 3, and their explanation will be omitted herein.
The above electronic device 30A according to the first embodiment is characterized in that respective heights of the packaging parts 20A, 20B from the substrate 23 are increased since a part of the solder 26 is formed to run on the upper portion of the solder resist 25 to constitute the running-on portions 26A, 26B, and thus the sealing resin 29 can be introduced without fail into the spaces between the packaging parts 20A, 20B and the substrate 23.
In contrast, the electronic device 30B according to the present embodiment is characterized in that a buried member 35 is provided to the foot patterns 24A, 24B respectively. This buried member 35 is formed collectively upon forming the solder resist 25, and thus the buried member 35 is formed of the same material as the solder resist 25.
Also, as shown in FIG. 6, the forming position of the buried member 35 is selected in almost center portions of the foot patterns 24A, 24B. As described above, the solder resist 25 can be formed easily by the screen printing, or the like, and printing (application) positions can be selected flexibly.
Therefore, the buried member 35 can be formed easily in the almost center portions of the foot patterns 24A, 24B. Also, since the buried member 35 is formed simultaneously with the solder resist 25, simplification of the manufacturing steps of the electronic device 30B can be achieved.
Also, in the present embodiment, the overlapping portions 32A, 32B are not provided on the foot patterns 24A, 24B. As shown in FIG. 5 and FIG. 6, the foot patterns 24A, 24B are constructed to be exposed totally from opening portions 28A, 28B respectively.
Next, a process of mounting the packaging parts 20A, 20B on the substrate 23, which has the foot patterns 24A, 24B in which the buried member 35 is provided respectively, will be explained hereunder. In mounting the packaging parts 20A, 20B, first the solder paste is applied to the foot patterns 24A, 24B in which the buried member 35 is provided. At this time, the solder paste is applied to cover the buried member 35.
Then, the packaging parts 20A, 20B are aligned with the substrate 23 such that respective electrodes 22A, 22B are positioned on the foot patterns 24A, 24B, and then the packaging parts 20A, 20B are mounted/fitted onto the substrate 23. In this state, the packaging parts 20A, 20B are temporarily fitted to the substrate 23 by the solder paste.
Then, the substrate 23 is put into the reflow furnace, and then the reflow process is carried out. As a result, organic components in the solder paste are evaporated and the solder is melted. Then, the packaging part electrodes 22A, 22B of the packaging parts 20A, 20B are soldered to the foot patterns 24A, 24B with the solder 26 after the melted solder 26 is cooled/solidified.
Since the buried member 35 is formed in the almost center portions of the foot patterns 24A, 24B respectively, the melted solder 26 will assume the shape close to a sphere because of a surface tension when the solder 26 is melted. Therefore, even though the buried member 35 is formed of the solder resist, such buried member 35 is positioned in the inside of the solder 26. Then, the buried member 35 is buried in the solder 26 after the solder 26 is cooled in this state.
In this manner, since the buried member 35 is buried in the solder 26, a height of the solder 26 is increased higher than that of the solder 26 obtained when the buried member 35 is not provided. That is, a height of the solder 26 is increased by a height that corresponds to a volume of the buried member 35. Therefore, in the electronic device 30B according to the present embodiment, an isolation distance between the packaging parts 20A, 20B and the substrate 23 can be set large, and thus the sealing resin 29 can be introduced surely into the spaces between the packaging parts 20A, 20B and the substrate 23.
As a result, in the electronic device 30B according to the present embodiment, like the electronic device 30A according to the first embodiment, the clearance is never generated between the packaging parts 20A, 20B and the substrate 23. Therefore, even when the heating is applied upon mounting the electronic device 30B, and the like, a short-circuit between the foot patterns 24A, 24B via the solder 26 is never generated, and also the sealing resin 29 is never badly affected by the expansion of the air in the clearance. As a result, reliability of the electronic device 30B can be improved.
Next, a third embodiment of the present invention will be explained hereunder.
FIG. 8 is a sectional view of an electronic device 30C as a third embodiment of the present invention. FIG. 9 to FIG. 11 are views explaining a method of manufacturing the electronic device 30C. In FIG. 9 to FIG. 11 used to explain the present embodiment, the same reference symbols are affixed to the same configuration as the electronic device 30A according to the first embodiment shown in FIG. 1 to FIG. 3, and their explanation will be omitted herein.
The electronic device 30C according to the present embodiment is characterized in that an underfill resin 36 is provided between the packaging parts 20A, 20B and the substrate 23. This underfill resin 36 is provided in isolation spaces between the lower resists 25A, which are provided between the neighboring foot patterns 24A and the neighboring foot patterns 24B respectively, and the packaging parts 20A, 20B. For this reason, the spaces between the packaging parts 20A, 20B and the substrate 23 are filled with the underfill resin 36 in a mounted state, and thus no clearance is formed in the spaces.
Therefore, even when the heating is applied upon mounting the electronic device 30C, and the like, a short-circuit between the foot patterns 24A, 24B via the solder 26 is never generated, and also the sealing resin 29 is never badly affected by the expansion of the air in the clearance. As a result, reliability of the electronic device 30C can be improved.
Next, the method of manufacturing the electronic device 30C will be explained hereunder. In order to manufacture the electronic device 30C, the substrate 23 on which the foot patterns 24A, 24B are formed previously in predetermined patterns respectively and also the opening portions 27A, 27B are formed in predetermined patterns in the solder resist 25 is prepared. In the present embodiment, the foot patterns 24A, 24B are formed such that they are exposed totally from the opening portions 27A, 27B formed in the solder resist 25.
First, a process of applying a solder paste 37 to the substrate 23 is executed (solder applying step). In this solder applying step, the solder paste 37 is printed on the foot patterns 24A, 24B exposed from the opening portions 27A, 27B by using the screen printing method. FIG. 9 shows a state that the solder paste 37 is provided on the foot patterns 24A, 24B by using the screen printing method.
Then, the packaging parts 20A, 20B are provided onto the foot patterns 24A, 24B on which the solder paste 37 is provided. More particularly, the packaging part electrodes 22A of the packaging part 20A are aligned with the foot patterns 24A, the packaging part electrodes 22B of the packaging part 20B are aligned with the foot patterns 24B, and the packaging part electrodes 22A, 22B are pushed against the solder paste 37. As a result, the packaging parts 20A, 20B are temporarily fitted onto the substrate 23 by an adhesive strength of the solder paste 37.
Then, the substrate 23 onto which the packaging parts 20A, 20B are temporarily fitted is put into the reflow furnace and is heated. Thus, the organic components in the solder paste 37 are vaporized and the solder is melted. Then, the packaging part electrodes 22A, 22B are secured to the foot patterns 24A, 24B with the solder 26 by executing the cooling (mounting step). FIG. 10 shows a state that the packaging part electrodes 22A, 22B are mounted onto substrate 23 with the solder 26 after the mounting step is finished. In this state, a clearance is formed between the packaging part electrodes 22A, 22B and the lower resists 25A respectively.
In this case, the packaging parts 20A, 20B are not sealed with the sealing resin 29 at a time of heating by using the reflow process. Therefore, the melted solder 26 can be freely moved, but such melted solder 26 never flows out from the upper surfaces of the foot patterns 24A, 24B by a surface tension even when the solder 26 is expanded. As a result, a short-circuit is never generated between the neighboring the foot patterns 24A and the neighboring the foot patterns 24B respectively.
Then, the underfill resin 36 is filled in the spaces formed between the packaging part electrodes 22A, 22B and the substrate 23 (lower resists 25A) respectively (underfill filling step). This process of filling the underfill resin 36 can be executed by using the dispensers, for example. FIG. 11 shows the substrate 23 after the underfill filling step is finished.
Then, the sealing resin 29 for sealing the packaging part electrodes 22A, 22B is formed on the substrate 23 on which the underfill resin 36 is filled between the packaging part electrodes 22A, 22B and the lower resists 25A respectively (sealing step). This sealing resin 29 is an epoxy resin and is formed by using the transfer molding method, for example. At this time, no clearance is formed in the sealing resin 29 because the underfill resin 36 is filled between the packaging part electrodes 22A, 22B and the lower resists 25A respectively, as described above. The electronic device 30C shown in FIG. 8 can be manufactured via a series of above steps.
Next, a fourth embodiment of the present invention will be explained hereunder.
FIG. 12 is a sectional view of an electronic device 30D as a fourth embodiment of the present invention. FIG. 13 to FIG. 15 are views explaining a method of manufacturing the electronic device 30D. In FIG. 13 to FIG. 15 used to explaining the present embodiment, the same reference symbols are affixed to the same configuration as the electronic device 30A according to the first embodiment shown in FIG. 1 to FIG. 3, and their explanation will be omitted herein.
The electronic device 30D according to the present embodiment is characterized in that a fluxfill resin 38 is filled in the spaces between the packaging parts 20A, 20B and the substrate 23. This fluxfill resin 38 is a thermosetting adhesive having an activation power necessary for the soldering. More particularly, the fluxfill resin 38 can fulfill a function as the adhesive when it is cured by the heating, and also can fulfill a function as the activator to remove an oxidation film on a surface of the solder and enhance fluidity of the melted solder when it is heated.
The fluxfill resin 38 is provided in isolation spaces between the packaging parts 20A, 20B and the lower resists 25A provided between the neighboring foot patterns 24A and the neighboring foot patterns 24B respectively. Therefore, the spaces between the packaging parts 20A, 20B and the substrate 23 are filled with the fluxfill resin 38 in the mounted state, and thus the clearance is never formed therein.
Therefore, even when the heating is applied in mounting the electronic device 30D according to the present embodiment, and the like, a short-circuit between the foot patterns 24A, 24B via the solder 26 is never generated, and also the sealing resin 29 is never harmfully influenced by the expansion of the air in the clearance. As a result, reliability of the electronic device 30D can be improved.
Next, the method of manufacturing the electronic device 30D will be explained hereunder. In order to manufacture the electronic device 30D, the substrate 23 on which the foot patterns 24A, 24B are formed previously in predetermined patterns respectively and also the opening portions 27A, 27B are formed in predetermined patterns in the solder resist 25 is prepared. In the present embodiment, the foot patterns 24A, 24B are formed such that they are exposed totally from the opening portions 27A, 27B formed in the solder resist 25.
First, a process of applying the solder paste 37 to the substrate 23 is executed (solder applying step). In this solder applying step, the solder paste 37 is printed on the foot patterns 24A, 24B exposed from the opening portions 27A, 27B by using the screen printing method. Also, in the present embodiment, the substrate 23 on which the solder paste 37 is applied onto the foot patterns 24A, 24B is put into the reflow furnace and the heating process is executed, and thus the organic components in the solder paste 37 are vaporized and the solder 26 is formed on the foot patterns 24A, 24B (solder applying step). FIG. 13 shows the substrate 23 on which the solder 26 is formed on the foot patterns 24A, 24B.
Then, the fluxfill resin 38 is provided the position that lies under the packaging part 20A when mounted (between the neighboring foot patterns 24A) and the position that lies under the packaging part 20B when mounted (between the neighboring foot patterns 24B) (fluxfill resin providing step). In the present embodiment, a film-like fluxfill resin is used as the fluxfill resin 38. Also, in the present embodiment, the film-like fluxfill resin 38 is arranged in the predetermined positions.
FIG. 14 shows a state that the film-like fluxfill resin 38 is arranged on the substrate 23. As shown in FIG. 14, the fluxfill resin 38 is arranged to cover upper areas of the solder 26 formed on the foot patterns 24A, 24B.
In this case, the fluxfill resin 38 is not limited to the film-like fluxfill resin. The liquid fluxfill resin 38 may be coated on the predetermined positions by a potting, or the like.
Then, the packaging parts 20A, 20B are arranged on the substrate 23 on which the fluxfill resin 38 is provided. More particularly, the packaging part electrodes 22A of the packaging parts 20A are aligned with the foot patterns 24A, the packaging part electrodes 22B of the packaging parts 20B are aligned with the foot patterns 24B, and the packaging part electrodes 22A, 22B are pushed against the fluxfill resin 38.
As a result, the packaging parts 20A, 20B are temporarily fitted onto the substrate 23 by an adhesive strength of the fluxfill resin 38. Also, the packaging part electrodes 22A, 22B of the packaging parts 20A, 20B come into contact with the solder 26. FIG. 15 shows a state that the packaging parts 20A, 20B are temporarily fitted onto the substrate 23.
Then, the substrate 23 onto which the packaging parts 20A, 20B are temporarily fitted is put into the reflow furnace and is heated. Accordingly, the solder 26 is melted again. Then, the packaging part electrodes 22A, 22B are secured to the foot patterns 24A, 24B with the solder 26 by executing the cooling (mounting step).
At this time, the fluxfill resin 38 is thermally cured by the heating and the packaging parts 20A, 20B are adhered to the substrate 23. The packaging parts 20A, 20B are secured to the substrate 23 by an adhesive strength of the fluxfill resin 38 in addition to a jointing strength of the solder 26. For this reason, the packaging parts 20A, 20B are secured without fail to the substrate 23 and thus mechanical reliability of the electronic device 30D can be enhanced.
Also, since the fluxfill resin 38 contains the activator, an oxidation film formed on the surface of the solder 26 is removed and also the fluidity of the melted solder 26 can be increased when the solder 26 is melted by the heating. Hence, the packaging part electrodes 22A, 22B and the foot patterns 24A, 24B are connected more surely by the solder 26, and also reliability of the electronic device 30D can be enhanced in an electric aspect.
In the present embodiment, the packaging parts 20A, 20B are not sealed by the sealing resin 29. Therefore, a short-circuit is never generated between the neighboring the foot patterns 24A and the neighboring the foot patterns 24B respectively at a time of heating executed by the reflow process.
Then, the sealing resin 29 for sealing the packaging part electrodes 22A, 22B is formed on the substrate 23 on which the fluxfill resin 38 is interposed between the packaging part electrodes 22A, 22B and the lower resists 25A respectively (sealing step). This sealing resin 29 is an epoxy resin and is formed by using the transfer molding method, for example. At this time, no clearance is formed in the sealing resin 29 since the fluxfill resin 38 is filled between the packaging part electrodes 22A, 22B and the lower resists 25A respectively, as described above. The electronic device 30D shown in FIG. 12 can be manufactured via a series of above steps.
FIG. 16 and FIG. 17 are views explaining a variation of a method of manufacturing the electronic device 30D as the fourth embodiment. In the method of manufacturing the electronic device 30D, the solder paste 37 is printed on the foot patterns 24A, 24B on the substrate 23, and then the fluxfill resin 38 and the packaging parts 20A, 20B are provided after the solder paste 37 is changed into the solder 26 by the heating.
In contrast, in the present variation, as shown in FIG. 16, the solder paste 37 is printed on the foot patterns 24A, 24B by the screen printing, and then the fluxfill resin 38 is coated on the upper surfaces of the lower resists 25A. In this case, the printing of the solder paste 37 on the substrate 23 and the coating of the fluxfill resin 38 onto the lower resists 25A can be reversed in order.
After the solder paste 37 and the fluxfill resin 38 are provided to the substrate 23 as described above, the packaging parts 20A, 20B are aligned with the substrate 23 and then mounted thereon, like the above embodiments, as shown in FIG. 17. Therefore, the packaging parts 20A, 20B are temporarily fitted to the substrate 23 by the solder paste 37 and the adhesive agent in the fluxfill resin 38.
Then, the substrate 23 to which the packaging parts 20A, 20B are temporarily fitted is put into the reflow furnace, and then the heating process is carried out. Accordingly, the packaging part electrodes 22A, 22B are soldered onto the foot patterns 24A, 24B with the solder 26, and also the packaging parts 20A, 20B are adhered/secured to the substrate 23 by the fluxfill resin 38. As a result, the electronic device 30D shown in FIG. 12 can be manufactured.
a sealing resin formed on the substrate to seal the packaging part,
2. An electronic device according to claim 1, wherein, when the substrate is viewed from a top, the solder resist has overlapping portions that are overlapped with areas in which the packaging part electrodes and the electrode patterns oppose to each other.
3. An electronic device according to claim 1, wherein the solder resist is not provided in an area in which the packaging part and the substrate oppose to each other.
wherein a buried member is provided into the electrode patterns respectively in a state that it is buried in the solder.
5. An electronic device according to claim 4, wherein the buried member is formed of the solder resist.
6. An electronic device according to claim 4, wherein, when the substrate is viewed from a top, the buried member is provided to areas in which the packaging part electrodes and the electrode patterns oppose to each other.
7. A method of manufacturing an electronic device, comprising: steps of
forming a sealing resin, which seals the packaging parts, on the substrate,
US11/421,942 2005-06-03 2006-06-02 Electronic device and method of manufacturing the same Abandoned US20060273461A1 (en)
JP2005164387A JP4533248B2 (en) 2005-06-03 2005-06-03 The electronic device
US11/421,942 Abandoned US20060273461A1 (en) 2005-06-03 2006-06-02 Electronic device and method of manufacturing the same
KR (1) KR20060126368A (en)
CN (1) CN1873970A (en)
US20100014262A1 (en) * 2005-10-18 2010-01-21 Panasonic Corporation Module with embedded electronic components
US20100089628A1 (en) * 2008-10-15 2010-04-15 Panasonic Corporation Component built-in circuit substrate and method of producing the same
US20100155965A1 (en) * 2008-12-24 2010-06-24 Shinko Electric Industries Co., Ltd. Semiconductor device
US20130223017A1 (en) * 2010-11-04 2013-08-29 Alps Electric Co., Ltd. Electronic component module
US9439288B2 (en) 2012-11-30 2016-09-06 Tdk Corporation Mounting structure of chip component and electronic module using the same
US9723731B2 (en) 2013-04-19 2017-08-01 Denso Corporation Electronic device for vehicle
CN107222981A (en) * 2013-05-20 2017-09-29 日月光半导体制造股份有限公司 Manufacturing method of electronic module
JP2008218528A (en) * 2007-02-28 2008-09-18 Fujitsu Ltd Method for mounting electronic part and production device
JP4962217B2 (en) 2007-08-28 2012-06-27 富士通株式会社 Printed circuit board and an electronic device manufacturing method
JP5278608B2 (en) * 2010-05-26 2013-09-04 株式会社村田製作所 Component built-in substrate
JP5824679B2 (en) * 2011-04-14 2015-11-25 パナソニックIpマネジメント株式会社 Mounting structure
WO2014103541A1 (en) * 2012-12-27 2014-07-03 日本碍子株式会社 Electronic component and method for manufacturing same
JP2017183597A (en) * 2016-03-31 2017-10-05 Fdk株式会社 Printed wiring board
US5559372A (en) * 1994-12-19 1996-09-24 Goldstar Electron Co., Ltd. Thin soldered semiconductor package
US20020070443A1 (en) * 2000-12-08 2002-06-13 Xiao-Chun Mu Microelectronic package having an integrated heat sink and build-up layers
US20040056341A1 (en) * 2002-09-19 2004-03-25 Kabushiki Kaisha Toshiba Semiconductor device, semiconductor package member, and semiconductor device manufacturing method
US20040190273A1 (en) * 2003-03-31 2004-09-30 Siliconware Precision Industries Chip carrier and method for testing electrical performance of passive component
US20050103516A1 (en) * 2003-09-30 2005-05-19 Tdk Corporation Flip-chip mounting circuit board, manufacturing method thereof and integrated circuit device
US7378745B2 (en) * 2004-08-31 2008-05-27 Nec Electronics Corporation Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns
JPH1098075A (en) * 1996-09-20 1998-04-14 Toshiba Corp Semiconductor mounting method, semiconductor mounting device and semiconductor mounting structure
JP2861965B2 (en) * 1996-09-20 1999-02-24 日本電気株式会社 The method of forming the protruding electrodes
JP4489411B2 (en) * 2003-01-23 2010-06-23 新光電気工業株式会社 A method of manufacturing an electronic component mounting structure
JP2006351565A (en) * 2005-06-13 2006-12-28 Shinko Electric Ind Co Ltd Stacked semiconductor package
2006-05-30 KR KR1020060048964A patent/KR20060126368A/en not_active Application Discontinuation
2006-06-02 CN CNA2006100833491A patent/CN1873970A/en not_active Application Discontinuation
US7876570B2 (en) * 2005-10-18 2011-01-25 Panasonic Corporation Module with embedded electronic components
US8499998B2 (en) 2008-10-15 2013-08-06 Panasonic Corporation Component built-in circuit substrate and method of producing the same
US8169083B2 (en) * 2008-12-24 2012-05-01 Shinko Electric Industries Co., Ltd. Semiconductor device
KR100588295B1 (en) 2006-06-09 Printed Circuit Board and Method of Producing the Same
JP3651413B2 (en) 2005-05-25 The semiconductor device using the tape carrier and it semiconductor device, a manufacturing method of a method of manufacturing a semiconductor device and a tape carrier semiconductor device
US7125748B2 (en) 2006-10-24 Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask
US7161371B2 (en) 2007-01-09 Module part
US6815815B2 (en) 2004-11-09 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
US6998532B2 (en) 2006-02-14 Electronic component-built-in module
US5808873A (en) 1998-09-15 Electronic component assembly having an encapsulation material and method of forming the same
KR100452903B1 (en) 2004-10-15 Tape for chip on film and semiconductor therewith
AU713920B2 (en) 1999-12-16 High-density mounting method and structure for electronic circuit board
US6794739B2 (en) 2004-09-21 Semiconductor device, process for production thereof, and electronic equipment
US5461197A (en) 1995-10-24 Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board
JP6173753B2 (en) 2017-08-02 Package-on-package electronic device and a manufacturing method thereof comprising a sealing film
EP0860871B1 (en) 2011-05-25 Method of manufacturing a semiconductor device
JP4971769B2 (en) 2012-07-11 Method of manufacturing a flip-chip mounting structure and a flip-chip mounting structure
US20030089521A1 (en) 2003-05-15 Bonding pad(s) for a printed circuit board and a method for forming bonding pad(s)
KR100368698B1 (en) 2003-04-08 And a semiconductor package using the semiconductor device and a method of manufacturing it,
US20120086111A1 (en) 2012-04-12 Semiconductor device
CN100349292C (en) 2007-11-14 Semiconductor device and its producing method, electronic device and electronic instrument
US7198984B2 (en) 2007-04-03 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
JP4424449B2 (en) 2010-03-03 Component built-in module and a manufacturing method thereof
KR100771754B1 (en) 2007-10-30 Method of manufacturing electronic device and electronic device and method of filling resin
JP4357817B2 (en) 2009-11-04 Circuit component built-in module
EP0530840B1 (en) 1996-01-10 Electric circuit board module and method for producing electric circuit board module
US6057597A (en) 2000-05-02 Semiconductor package with pre-fabricated cover
KR100938408B1 (en) 2010-01-22 Wiring board and semiconductor device
Owner name: SHINKO ELECTRIC INDUSTRIES CO., LTD., JAPAN
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The Hibs Club at Sunnyside is a meeting place for Hibs supporters branches from across Edinburgh and beyond.
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With two large function rooms, a newly refurbished games room and a popular member's lounge, The Hibs Club has something for everyone.
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We show all major sporting events – on Sky Sports and BT Sport – and our darts and dominoes teams play in local leagues throughout the year.
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On home match days The Hibs Club plays host to Hibs fans from across Scotland and beyond, sharing a pre match pint and their post-match verdicts.
Our kitchen offers a range of snacks before and after home games.
Most Saturday evenings see the Famous Five Suite host entertainment, including a range of free shows and our fabulous monthly cabarets.
A faithful crowd get together on other nights for a friendly wee game of bingo each Sunday and Thursday, our darts team play on Mondays and on Tuesdays our doms team can be seen strutting their stuff.
One of the biggest nights of The Hibs Club year is our Player of the Year dinner. Each year we honour the top performing Hibs player, young player and most memorable moment – as chosen by our members.
Featuring guest speakers and appearances from Hibs players, coaches and directors it's always a special night.
New memberships are currently not available while the renewal process for 2019 is completed with current members.
If you have an event, or need some info, we'll be pleased to help!
Top entertainment, live sport, four bars and great prices for members and guests. Get along to The Hibs Club today.
Edinburgh's top meeting place for Hibs fans and the home of great live shows in Leith.


text:
Bible > NLT > 2 Chronicles 9
◄ 2 Chronicles 9 ►
New Living Translation Par ▾
Visit of the Queen of Sheba
1When the queen of Sheba heard of Solomon's fame, she came to Jerusalem to test him with hard questions. She arrived with a large group of attendants and a great caravan of camels loaded with spices, large quantities of gold, and precious jewels. When she met with Solomon, she talked with him about everything she had on her mind. 2Solomon had answers for all her questions; nothing was too hard for him to explain to her. 3When the queen of Sheba realized how wise Solomon was, and when she saw the palace he had built, 4she was overwhelmed. She was also amazed at the food on his tables, the organization of his officials and their splendid clothing, the cup-bearers and their robes, and the burnt offeringsa Solomon made at the Temple of the LORD.
5She exclaimed to the king, "Everything I heard in my country about your achievementsb and wisdom is true! 6I didn't believe what was said until I arrived here and saw it with my own eyes. In fact, I had not heard the half of your great wisdom! It is far beyond what I was told. 7How happy your people must be! What a privilege for your officials to stand here day after day, listening to your wisdom! 8Praise the LORD your God, who delights in you and has placed you on the throne as king to rule for him. Because God loves Israel and desires this kingdom to last forever, he has made you king over them so you can rule with justice and righteousness."
9Then she gave the king a gift of 9,000 poundsc of gold, great quantities of spices, and precious jewels. Never before had there been spices as fine as those the queen of Sheba gave to King Solomon.
10(In addition, the crews of Hiram and Solomon brought gold from Ophir, and they also brought red sandalwoodd and precious jewels. 11The king used the sandalwood to make stepse for the Temple of the LORD and the royal palace, and to construct lyres and harps for the musicians. Never before had such beautiful things been seen in Judah.)
12King Solomon gave the queen of Sheba whatever she asked for—gifts of greater value than the gifts she had given him. Then she and all her attendants returned to their own land.
Solomon's Wealth and Splendor
13Each year Solomon received about 25 tonsf of gold. 14This did not include the additional revenue he received from merchants and traders. All the kings of Arabia and the governors of the provinces also brought gold and silver to Solomon.
15King Solomon made 200 large shields of hammered gold, each weighing more than 15 pounds.g 16He also made 300 smaller shields of hammered gold, each weighing more than 7 1/2 pounds.h The king placed these shields in the Palace of the Forest of Lebanon.
17Then the king made a huge throne, decorated with ivory and overlaid with pure gold. 18The throne had six steps, with a footstool of gold. There were armrests on both sides of the seat, and the figure of a lion stood on each side of the throne. 19There were also twelve other lions, one standing on each end of the six steps. No other throne in all the world could be compared with it!
20All of King Solomon's drinking cups were solid gold, as were all the utensils in the Palace of the Forest of Lebanon. They were not made of silver, for silver was considered worthless in Solomon's day!
21The king had a fleet of trading ships of Tarshish manned by the sailors sent by Hiram.i Once every three years the ships returned, loaded with gold, silver, ivory, apes, and peacocks.j
22So King Solomon became richer and wiser than any other king on earth. 23Kings from every nation came to consult him and to hear the wisdom God had given him. 24Year after year everyone who visited brought him gifts of silver and gold, clothing, weapons, spices, horses, and mules.
25Solomon had 4,000 stalls for his horses and chariots, and he had 12,000 horses.k He stationed some of them in the chariot cities, and some near him in Jerusalem. 26He ruled over all the kings from the Euphrates Riverl in the north to the land of the Philistines and the border of Egypt in the south. 27The king made silver as plentiful in Jerusalem as stone. And valuable cedar timber was as common as the sycamore-fig trees that grow in the foothills of Judah.m 28Solomon's horses were imported from Egyptn and many other countries.
Summary of Solomon's Reign
29The rest of the events of Solomon's reign, from beginning to end, are recorded in The Record of Nathan the Prophet, and The Prophecy of Ahijah from Shiloh, and also in The Visions of Iddo the Seer, concerning Jeroboam son of Nebat. 30Solomon ruled in Jerusalem over all Israel for forty years. 31When he died, he was buried in the City of David, named for his father. Then his son Rehoboam became the next king.
a9:4 As in Greek and Syriac versions (see also 1 Kgs 10:5); Hebrew reads and the ascent.
b9:5 Hebrew your words.
c9:9 Hebrew 120 talents [4,000 kilograms].
d9:10 Hebrew algum wood (also in 9:11); perhaps a variant spelling of almug. Compare parallel text at 1 Kgs 10:11-12.
e9:11 Or gateways. The meaning of the Hebrew is uncertain.
f9:13 Hebrew 666 talents [23 metric tons].
g9:15 Hebrew 600 [shekels] of hammered gold [6.8 kilograms].
h9:16 Hebrew 300 [shekels] of gold [3.4 kilograms].
i9:21a Hebrew Huram, a variant spelling of Hiram.
j9:21b Or and baboons.
k9:25 Or 12,000 charioteers.
l9:26 Hebrew the river.
m9:27 Hebrew the Shephelah.
n9:28 Possibly Muzur, a district near Cilicia.
Holy Bible, New Living Translation, copyright © 1996, 2004, 2015 by Tyndale House Foundation. Used by permission of Tyndale House Publishers, Inc., Carol Stream, Illinois 60188. All rights reserved.


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text:
Q: Webservice convert from string to System.Data.SqlClient.SqlCommand I'm trying to get an list of items from some table of SQL Server. I'm doing it with Visual Studio 2010.
That's my code:
static string filter = "25";

DataSet Datos = new DataSet();
SqlConnection MyConnection = default(SqlConnection);
SqlDataAdapter MyDataAdapter = default(SqlDataAdapter);
MyConnection = new SqlConnection("Initial Catalog=MyDataBase;Data Source=MyServer;Integrated Security=false;User ID=SQLUser;Password=SQLPass;");
MyDataAdapter = new SqlDataAdapter("SELECT Comment FROM MyTable WHERE [No_] = "+filter+" , MyConnection);
MyDataAdapter.SelectCommand.CommandType = CommandType.Text;
MyDataAdapter.Fill(Datos);
MyDataAdapter.Dispose();
MyConnection.Close();

I'm getting this error:

Argument 1: cannot convert from 'string' to 'System.Data.SqlClient.SqlCommand'

On this line:
MyDataAdapter = new SqlDataAdapter("SELECT Comment FROM MyTable WHERE [No_] = "+filter+" , MyConnection);

So, how can I put the string into my SqlConnection?
Thanks in advance.

A: This works for me:
string filter = "10";

DataSet Datos = new DataSet();
string connectionString = "<your connection string here>";
string selectCommand =
  "SELECT * FROM myTable WHERE Id = " + filter;
using (var MyConnection = new SqlConnection(connectionString))
using (var MyDataAdapter = new SqlDataAdapter(selectCommand, MyConnection))
{
   MyDataAdapter.SelectCommand.CommandType = CommandType.Text;
   MyDataAdapter.Fill(Datos);
}

This is basically your code, with the using syntax. Give this a try and post if you still have problems. Good luck!

redpajama_set_name: RedPajamaStackExchange


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Trend is bearish in 1 hour time frame. The intraday resistance could be seen at the price level of 1236.83 price level. Yesterday, the price of XAU/USD tried to rise and then fall which looks like start of a weak bearish trend. As long as the flow of market remains down, I am interested to take selling trading opportunities. If bullish candlestick closes above 1236.83 critical resistance level then down trend is going to end. Hence, I might like to quit trading XAU/USD and redo the 1 hour chart analysis.
The EURUSD had a bearish momentum yesterday, broke below the range area and 1.1270 key support as you can see on my hourly chart below, bottomed at 1.1182. The bias is bearish in nearest term testing 1.1100 area. Immediate resistance is seen around 1.1240. A clear break above that area could lead price to neutral zone in nearest term testing 1.1270 or higher but overall I still prefer a bearish scenario at this phase with sell on rallies strategy.
The GBPUSD failed to continue its bullish momentum yesterday and now struggling around the lower line of the bullish channel as you can see on my hourly chart below. The bias is bearish in nearest term testing 1.5380 key support. A clear break below that area could trigger further bearish pressure testing 1.5300. Immediate resistance is seen around 1.5450. A clear break above that area could lead price to neutral zone in nearest term but would keep the bullish scenario remains intact retesting 1.5480 or higher.
The USDJPY had a bullish momentum yesterday topped at 119.49 but unable to stay consistently above 119.40 so far. The bias is bullish in nearest term especially if price able to make a clear break above 119.40 testing 119.80 – 120.00 area. Immediate support is seen around 119.15. A clear break below that area could lead price to neutral zone in nearest term testing 118.65 but key support remains around 118.30. The best intraday trading strategy for now remains to sell around 119.40 or buy around 118.30 with a tight stop loss.
The USDCHF had a moderate bullish momentum yesterday topped at 0.9545 but traded lower earlier today hit 0.9500. The bias is neutral in nearest term. Immediate support is seen around 0.9450. A clear break below that area could trigger further bearish pressure testing 0.9400 area. Overall I still prefer a bullish scenario at this phase with nearest bullish target seen around 0.9600.
Two hours after the release of a mixed set of numbers we find acrpss the board strength for the greenback. Euro has broken lower of its consolidation for the month, Cable is developing a daily engulfing candle to possibly define the swing highs, and the commodity set is in retreat. One might ask why is this happening given the mixed numbers.
Consider what we saw, core inflation metrics actually rose, perhaps the one data that the FOMC needs to see picking up to seriously consider raising rates. And while one data does not a trend make it creates a possible inflection point. We could even argue that the weakness in the headline CPI at -0.7% could be the finalimpact of the drop in oil prices finally reaching the broader economy. With its effect likely to peter out going forward.
And then there is Durable Goods, true the core data came out weaker than expected at 0.3% against the consensus forecast of 0.5% yet the headline figure came out a whopping 2.8% against the 1.7% consensus forecast suggesting new sales on ships, trains, and aircraft which will imply more manufacturing jobs and an improved outlook in next weeks NFP.
All these building the argument for a tightening.
The EURUSD had another indecisive movement yesterday. The bias remains neutral in nearest term. Immediate resistance is seen around 1.1450. A clear break above that area could trigger further bullish pressure testing 1.1530 key resistance. Immediate support is seen around 1.1335. A clear break below that area could trigger further bearish pressure testing 1.1270 key support.
The GBPUSD had a bullish momentum yesterday and hit 1.5551 earlier today. The bias is bullish in nearest term testing 1.1.5580 – 1.5620 area. Immediate support is seen around 1.5480. A clear break below that area could lead price to neutral zone in nearest term but any downside pullback now is normal and as long as stays inside the bullish channel I still prefer a bullish scenario at this phase.


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USA airlines like Southwest, Delta and JetBlue were forced to cancel or delay hundreds of flights on Monday because of an issue with Aerodata, a system used to monitor a plane's weight and balance, according to the Washington Post. "Mainline operations are affected to varying degrees".
The technical glitch grounded all Southwest flights and sent other airlines spiraling into a domino effect of delays.
A Southwest Airlines flight takes off from Ronald Reagan Washington National Airport in Arlington, Virginia, on March 11, 2019.
Last week, several airlines reported problems after Sabre, a company airlines use for printing tickets and making reservations, had technical issues. Airlines say travelers should check online for the latest updates on flights.
The FAA said five airlines were having trouble with a flight planning weight and balance program called Aerodata.
Alaska Airlines said it was working with the vendor to get the system back up. The airline doesn't anticipate flight cancellation.
American Airlines said in an email, "Earlier this morning, AeroData had a technical issue that impacted a few of our regional carriers".
By midday, 3,400 USA flights had been delayed, according to tracking service FlightAware, but it was unclear how many were related to the technical issue.