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Home / Newsroom / Press Statements, Transcripts & Photos / Oral pleading on the Straits Lights System by Mr. Rodman R. Bundy, avocat à la Cour d'appel de Paris, member of the New York Bar, Frere Cholmeley/Eversheds, Paris
Oral pleading on the Straits Lights System by Mr. Rodman R. Bundy, avocat à la Cour d'appel de Paris, member of the New York Bar, Frere Cholmeley/Eversheds, Paris
Oral pleading on the Straits Lights System by Mr. Rodman R. Bundy, avocat à la Cour d'appel de Paris, member of the New York Bar, Frere Cholmeley/Eversheds, Paris on 8 November 2007
We are ready to stop now or, if you prefer, Mr. Bundy is ready to begin his pleading on the Straits Lights System, on which Malaysia seems to be impatient to have our views.
The VICE-PRESIDENT, Acting President: How long will that take, may I ask?
Mr. PELLET: It can be stopped whenever you like. So it is really in your hands.
The VICE-PRESIDENT, Acting President: I think he could start now. Thank you.
Mr. PELLET: Thank you very much.
Mr. BUNDY: Thank you, Mr. President, Members of the Court.
THE STRAITS LIGHTS SYSTEM
1. At this stage of Singapore's first round presentation, my task is to address a further element of Malaysia's case. This is the legal significance of the Straits Lights System that was established over the years for the financing and upkeep of various lighthouses situated in the Straits of Singapore and the Straits of Malacca. My presentation is probably a total of 30 to 35 minutes, but I will find an appropriate stopping place, I hope, close to 1 o'clock, if that meets with the Court's approval.
2. Now, as part of its effort to counter the fact that Singapore has administered and controlled Pedra Branca from 1851 to the present, Malaysia's written pleadings include an extended discussion of the financial arrangements that were put in place for the administration of a number of lighthouses in the relevant area, including the lighthouse on Pedra Branca. Malaysia's purpose for introducing this material is made tolerably clear in its Counter-Memorial where Malaysia states the following: "The establishment and administration of the Straits' Lights was not regarded as determinative of the sovereignty of the underlying territory" (CMM, para. 298).
3. On one level, Malaysia's contention is unexceptional. Singapore does not suggest that the system that was put in place for the funding of lighthouse operations after 1851, after the lighthouse on Pedra Branca had been commissioned, was, in and of itself, determinative of the issue of sovereignty over Pedra Branca. As Singapore has explained, both in its written pleadings and thus far in its first round presentations, Singapore's title derives from the lawful possession of the island by Great Britain during the period from 1847 to 1851, discussed by Mr. Brownlie, and on Singapore's long-standing and continuous exercise of sovereign authority over the island ever since that date in the confirmation and maintenance of that title. And, as we have heard earlier today, Singapore has also discussed the manner in which Malaysia effectively recognized Singapore's sovereignty and carried out no competing activities on the disputed territory of its own, and how there is no evidence for this extravagant claim of an "historic title" to Pedra Branca.
4. But, nonetheless, the manner in which the Parties addressed issues relating to the establishment and upkeep of various lighthouses in the area does shed important additional light on how the Parties viewed questions of sovereignty. As I shall show in this presentation, the Parties acted very differently with respect to islands, such as Pedra Branca, where Singapore's sovereignty had been established, as opposed to islands, such as Pulau Pisang, which I mentioned earlier, where Malaysia held title. That is the real relevance of the Straits Lights System for purposes of this case: the fundamentally different way in which the Parties, particularly Malaysia, acted with respect to islands where there were lighthouses where Singapore had sovereignty, such as Pedra Branca, as opposed to islands that had lighthouses where Malaysia had sovereignty, such as Pulau Pisang.
The legal framework concerning lighthouses in the region
5. My starting point for the review of the Straits Lights System is the legal framework within which the lighthouses in question were established. To assist in this discussion, I have had placed on the screen, and in the judges' folder ⎯ I believe it will be put in the folders tomorrow morning, at tab 38 ⎯ a map depicting the various lighthouses that I shall be addressing. This is the map, you will have it in your folders in the morning.
[Slide: map showing Horsburgh lighthouse on Pedra Branca, the Pulau Pisang light, the Cape Rachado light, the One Fathom Bank light and the location of Pulau Aur]
6. Now, in considering the issue of these lighthouses, the point I would respectfully ask the Court to bear in mind is the following: when the intention of the State actors in the region was to authorize the building and management of a lighthouse by one of the parties on territory belonging to the other, they agreed to such arrangements in an express written document. In contrast, when there was no need to obtain the written permission of a local ruler, either because the lighthouse was located on the high seas or it was located on territory that did not belong to that ruler, then no such agreements and arrangements were concluded. And I will show how this principle operated in practice by addressing each of the lighthouses depicted on the map in the order in which they were established.
7. With respect to Pedra Branca ⎯ the first lighthouse constructed in the area ⎯ despite Malaysia's permission of the Ruler of Johor, Professor Pellet has shown that there was no such permission sought or obtained, or needed. None was needed because Pedra Branca did not belong to Johor and what actually took place, as discussed by Mr. Brownlie, were the official actions of the British Crown in taking lawful possession of the island in the period 1847 to 1851, followed by specific legislation, also issued by British authorities ⎯ the 1852 and 1854 Acts that I discussed earlier this morning ⎯ dealing with Pedra Branca and vesting the lighthouse and its appurtenances in the British Crown, and the unimpeded administration of the island by Singapore afterwards, right up to the present day.
8. Similarly, the second light that the British established in the region and put into operation in 1852 ⎯ this was a floating light at a location called One Fathom Bank ⎯ which had originally been called the 2½ Fathom Bank, but it was moved ⎯ that light, as well ⎯ it was not a lighthouse ⎯ was not accompanied by any permission or indenture granted by a ruler of mainland Malaysia. As I noted in my earlier intervention today, the light was situated on a submerged sandbank lying well beyond the territorial waters of the Malaysian mainland in the high seas and thus was not under the sovereignty of any Malay State, and no permission was consequently required for the British to establish the light.
9. But the situation changed dramatically when it came to the next lighthouse that was built by Great Britain in the area ⎯ the Cape Rachado lighthouse, constructed in 1860 and located on the coast of mainland Malaysia along the Straits of Malacca at a place also known as Tanjung Tuan. You can see that highlighted on the map. In this instance, since the territory where the lighthouse was situated belonged to the local Malay ruler, the Sultan of Selangore, the Governor of the Straits Settlements in Singapore sought and received written permission from the Sultan for a grant of land on which to establish the light. The relevant documents were attached in Annex 62 to the Malaysian Memorial, and tomorrow, when further judges' folders are circulated, they will be found in tab 39 of your folders. Here was a light on the Malaysian mainland, clearly under the sovereignty of the local Malaysian ruler and it was subject to an express written grant.
10. The same procedure was followed when the lighthouse on the island of Pulau Pisang was later constructed. As the Court will see from the map, Pulau Pisang is an island located off the coast of Malaysia in the Straits of Malacca: and the island, as I said earlier today, has always been regarded as belonging to Johor and, subsequently, to Malaysia.
11. In 1885, an agreement was reached between the Ruler of Johor and the Governor of the Straits Settlements in Singapore pursuant to which the former ⎯ the Ruler of Johor ⎯ granted to the Government of the Straits Settlements a plot of land on which to build and maintain a lighthouse and a roadway access to the lighthouse. The lighthouse itself was erected on Pulau Pisang in 1886 and, in accordance with the 1885 Agreement, was managed and maintained by the Government of the Straits Settlements and later by Singapore, which continues to do so up to the present. The 1885 grant by the Ruler of Johor was not reduced to writing at the time, but it was subsequently recorded in an express written indenture signed on 6 October 1900 between the Sultan of Johor and the Governor of the Colony of the Straits Settlements after the Sultan of Johor had sent a reminder to this effect to the Governor of the Straits Settlements (CMS, Ann. 24). What is striking about this event is that the Sultan never referred at the time to the need to execute a similar indenture for the lighthouse on Pedra Branca: only for the light on Pulau Pisang. And that is further striking evidence that Pedra Branca was not regarded by the Sultan as falling under Johor's sovereignty.
12. Tomorrow morning you will be able to find a copy of the 1900 indenture relating to Pulau Pisang in your judges' folders ⎯ it will be at tab 40 ⎯ and it set out in considerable detail the precise limits of the grant and the conditions under which it was accorded (MM, Ann 89). Thus, while Singapore has always managed the lighthouse on Pulau Pisang pursuant to that indenture, this has taken place on the clear understanding that the underlying territory is Malaysian territory. But there is no similar indenture for the lighthouse on Pedra Branca, because it did not appertain to Johor.
Mr. President, I think that would be an appropriate time to stop for lunch. Thank you for according me this time.
The VICE-PRESIDENT, Acting President: Thank you, Mr. Bundy. The sitting is closed for today. We will meet tomorrow at 10 o'clock.
The Court rose at 1.05 p.m.


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Facility Center
Vice Chancellor Office
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One Day Seminar
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Prime Minister Kamyab Jawan Program
Donation of Books to FATA University
Infrastructure Development at FATA University
Holding of 8th Meeting of the Syndicate
Closing Ceremony of the FATA University English Works! Program
Seminar on Right to Information Act
Prof.Dr. Muhammad Tahir Shah (T.I)
It has been a great pleasure for me to serve as the first Vice Chancellor of this newly established University in the FATA region. After assuming the charge as a Vice Chancellor, I made strong commitment that I will leave no stone unturned in paving the way to the foundation of this University on strong footing. This can only be possible if I succeed in having a team of devoted, intellectual, talented and competent faculty and staff. I would, therefore, welcome everyone who is committed to support me in this cause. I will try my best to attract and retain outstanding faculty and staff to serve this University to their best. As a vice Chancellor, I am deeply committed to provide our students with the best education and a supportive learning environment.
Signing of MoU Between FATA University & Pakistan Bait-Ul-Mal
Holding of the 8th Meeting of the Syndicate
Signing of MoU between ECI and FATA University
One Day Workshop on the HEC Plagiarism Policy & the Use of Turnitin Software
MoU Signed between FATA University & CRSS
A library can be considered a store – house of knowledge. In dictionaries the word "library" has been defined as "a building or room containing a collection of books". A library renders a great service to the society.
A library plays a very important role in promoting the progress of knowledge. There are many people who love reading. But they can't afford to buy books because the prices of books are very high. So when one becomes a member of a library, he can borrow valuable books. A member can borrow two books at a time and he can keep it with him for two weeks. Libraries are particularly useful for poor children. Even those who are better off can't afford to buy all the books they require for their studies. For instance, invaluable books like Encyclopedias and large dictionaries cannot be purchased.
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What's the Point of Having a Website?
As our family traveled down an Irish country road this summer, I hankered for some traditional music. So, I flipped on the car radio, and my heart almost leapt for joy through the windshield, as the airwaves popped with talk about website marketing and personal branding. "What's the point of having your own website?" asked interviewer Richard Curran.
A sense of humor is a huge help to building to a successful business. It's hard work to keep writing great content, maintain your marketing, and run your business. Sometimes you just want to toss it all aside and cut loose with your inner goofball. Ready to throw caution to the wind? Great! Here we go.


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What is Portugal's economic system? More free market, capitalistic, socialist, etc.?
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1. Avoid the #1 workout pitfall.
2. Splurge for one session with a personal trainer.
3. Vary your workout—and not just the physical aspect.
Sounds obvious, but it bears repeating, as nothing beats the workout blahs like a new routine for a jolt of energy: "For Madonna, we don't do any particular thing twice!" exclaims Craig. "Madonna has had previous serious injuries so we also want to do therapeutic things while also supporting her work on tour. We like body weight training, Ashtanga yoga, and using resistance tubes and pilates for stability and mobility work." But don't underestimate the power of mixing up other workout time standards to reinvigorate you. "Music is a key factor in the type of energy that you get from clients, Madonna's no exception. With yoga we use more mind meditation and relaxation music, and militant energetic high BPM music for interval bursts," shares Craig. "We switch up Madonna's smoothies too so she doesn't get bored." And you'll wanna do the same with your pre- and post-workout snacks. Superfood smoothie calling, anyone?
4. Follow these moves for swoon-worthy arms.
6. Hectic week and low on workout time? It's okay.
Starting in a stationary rear lunge position, drive back knee forward and in line with hip bringing arms into a biceps curl. From here, drive into supporting heel while stabilizing on supporting leg and engage core, extend leading leg pushing heel to front of space and bring arms into a triceps pushdown. Return to starting position and repeat for required repetitions.
Tip: Complete this exercise for 30 seconds on both right and left sides. Use a set of 2.5lb to 5lb dumbbells.
From a wide plié squat position, track knees over toes keeping feet in a slight dancers turn out position, criss-cross arms down and in front of thighs contracting muscle fibers in arms. From here, engage core and drive into balls of feet while lifting heels and press dumbbells into a 'high y' contracting throughout the shoulders. Return to starting position and repeat for required repetitions.
Tip: Complete this exercise for 2-3 sets and for 15 – 20 reps.
For more fitness tips, follow Madonna's trainer Craig Smith on Twitter @CraigSmithNyc and on Instagram.


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Tag Archives: Japan Airlines
Again, the Dreamliner
By Capt. Ivan | October 11, 2013 - 9:16 PM | October 11, 2013 Aviation News from around the Web
Two Japan Airline's Boeing 787's returned to their departure airports due to technical issues
Both incidents occurred on October 9, the first event happened when the flight crew discovered a failure on the electrical system right after takeoff, the problem affected power to the galleys and lavatories, the aircraft had to return to Moscow's Domodedovo Int'l.
The other Dreamliner returned to San Diego when the on board computer detected a failure on the right engine anti-ice system. The other jet, registration JA825J, turned back to San Diego when an alert indicating a failure.
Although both aircraft returned to service after the necessary maintenance actions, both flight were considerably delayed, according to a JAL spokesperson.
JAL is one of the largest 787 operators in the world with 11 787-8s in its fleet. The Japanese carrier also has an additional 13 -8s and 20 of the larger -9 variants on order.
The carrier made the news this week when it signed a landmark deal with Airbus for 31 A350s, its first ever Airbus order. Analysts say reliability issues related to the 787 played a part in turning the loyal Boeing customer towards Airbus.
Tagged Boeing, Boeing 787, Dreamliner, Japan Airlines
Now, Japanesse are worried about Boeing retreat
By Capt. Ivan | October 10, 2013 - 11:20 AM | October 10, 2013 Aviation News from around the Web
For five decades Boeing has awarded bigger and bigger shares of its supply contracts to Japanese firms, but that could change after Japan Airlines defection to Airbus and as the plane maker seeks to win orders in China.
Boeing's carbon composite 787 is 35 percent made in Japan – as big a share as it builds in-house – but Japanese aviation insiders fear the Dreamliner could be the high water mark of the industry's partnership with the U.S. company.
The close co-operation has not only benefitted Japan's industrial giants Mitsubishi Heavy Industries , Kawasaki Heavy Industries and Fuji Heavy Industries – it has also enabled Boeing to dominate one of the world's biggest aviation markets with a share of more than 80 percent.
That status quo crumbled on Monday, when JAL signed a deal to buy 31 Airbus A350s, its first purchase of European jets.
In rejecting the rival Boeing 777X, JAL can only have increased the likelihood that the U.S. company's next project will be less Japanese.
"Negotiations for the 777X work share are ongoing, and that may be influenced by the JAL decision," a government official who helps oversee Japan's aerospace industry told Reuters on condition of anonymity because of the sensitivity of the talks.
Tokyo, he added, was looking to win a work share for Japanese suppliers greater than the 21 percent that Mitsubishi Heavy, Kawasaki Heavy and others build of the current 777.
The fear in Japan is that Boeing, which says the business it gives Japan adds up to 22,000 jobs accounting for around 40 percent of nation's aerospace workforce, may be tempted to shift more production to China, South Korea or elsewhere.
"If I was Boeing, I would hold their feet to the fire," said Lance Gatling, founder of aerospace and defense consultancy Nexial Research in Tokyo. "International competition for what they build can only increase."
Spokesmen for the Japanese suppliers involved and for Boeing in Japan declined to comment on the share out of work for the 777X, which Boeing has said it plans to officially launch later this year.
LURE OF CHINA
JAL's defection to Airbus stacks on top of other reasons why the Japanese may find it harder to win bigger chunks of business from their American partner.
Boeing, having faced criticism it overextended itself on the delayed 787 with an ambitious global supply chain, has said it will take a more conventional approach to the 777X, a re-engine more fuel efficient upgrade of its long-range, wide-body 777.
That, industry watchers say, could mean it builds the aircraft wings at home, after allowing the Dreamliner wings to be made overseas – in Japan – for the first time.
A longer-term worry for the Japanese is that their country, once Asia's biggest aircraft market, is no longer the goldmine that first drew Boeing to seek panel suppliers for its 747 there.
Both Boeing and European rival Airbus are now more focused on vying for business in burgeoning China. The entry price often imposed by the Chinese government is a share of the build.
Boeing, in its most recent 20-year market forecast that runs through 2032, predicts China will buy 6,000 new planes while the market in Northeast Asia, which includes Japan, North and South Korea and Taiwan, will be 1,360 aircraft.
"If the Japanese could put the arm on Boeing the Chinese have got the ability to put the arm on Boeing," said Nexial Research's Gatling. "The Chinese have cheap labor and a huge market."
He added that the Japanese were also looking over their shoulders at upcoming South Korean firms such as Korean Aerospace Industries, which Boeing in 2011 named supplier of the year.
Part of Japan's response to that challenge is the 70-90 seat Mitsubishi Regional Jet (MRJ), its first commercial aircraft since it lashed itself to Boeing.
Apart from being a bid to claim a share of the expanding market for smaller passenger jets, it is an both opportunity to showcase its skills to Boeing and provide a hedge against a fall in orders from Western manufacturers.
One lure that could keep Boeing heavily involved in Japan is government financial support for R&D that could end up in its jets.
According to the European Union, which is locked in an aircraft subsidy dispute with the United States, Boeing benefits from support from the Japanese government for development of the 787, including financing of up to 70 percent of development costs incurred by Japanese suppliers.
NEW BATTLE LOOMS
Attention in Japan has now turned to Boeing's battle with Airbus to supply JAL's rival ANA Holdings.
Boeing is widely seen as the favorite in that tussle, although some analysts think ANA will buy Airbus wide-body planes to hedge against delay and avoid getting left with older fleets while competitors fly new jets that consume less fuel.
Like JAL, ANA is looking to buy around 30 jets to retire its aging long-haul 777s and is considering the carbon composite A350 and the 777X as replacements.
A win for Boeing would offer a keen incentive for the U.S. company to stay deeply rooted in Japan, and industry sources expect a lobbying backlash as pressure from the aerospace industry's political backers comes to bear.
And at ANA, political pressure may bear more fruit. In a reversal of roles, ANA now enjoys a closer relationship with the ruling Liberal Democratic Party, a position once enjoyed by flag carrier JAL before its bankruptcy and bailout in 2010.
ANA this month won double the number of new landing slots at Tokyo's Haneda airport, prompting a rare public complaint by JAL that it had been unfairly treated.
The question remains whether ANA is willing to do something for Team Japan in return.
"Obviously it (JAL's decision) is a setback, but Boeing has been investing in Japan for decades and is not going to suddenly say from now on we don't like you," said Adam Pilarski, senior vice-president at Virginia-based aviation consultancy Avitas, on the sidelines of an aviation finance conference in Barcelona.
Tagged Airbus, Aircrafts, Boeing, Japan Airlines
After 787 Problems, JAL turns to Airbus
By Capt. Ivan | October 8, 2013 - 10:17 AM | October 8, 2013 Aviation News from around the Web
Japan Airlines is buying its first-ever jets from Airbus in a deal with a list value of 950 billion yen ($9.5 billion US). The purchase of 31 A350 planes deals a blow to U.S. rival Boeing, which had been JAL's star supplier for decades.
Airbus chief Executive and president Fabrice Bregier and Japan Airlines President Yoshiharu Ueki signed the deal Monday in Tokyo, which includes an option for JAL to buy 25 more Airbus planes. They declined to give the actual price tag on the deal.
Ueki said the decision to turn to the European manufacturer, based in Toulouse, France, for replacements for retiring Boeing 777 jets was unrelated to the problems that have plagued Boeing's rival offering, the 787 Dreamliner planes.
The 787 jets were grounded for four months earlier this year to confirm their safety after their lithium-ion batteries overheated. The batteries are now encased to prevent overheating from spreading.
The 787 development was also repeatedly delayed, frustrating JAL as well as rival All Nippon Airways, Japan's other major carrier.
"We are sorry for the troubles we have caused our customers with the 787, but the decision on the aircraft was considered separately from that issue," Ueki told reporters.
He repeatedly said the A350 was chosen because it was the "best match for our needs."
He brushed off concerns about the additional training JAL pilots will need to fly Airbus planes, which they are not used to. Even after taking such costs and risks into account, the A350 was the best choice, he said without giving specifics.
Photo Credits: AP
Tagged Airbus, Aircrafts, Boeing, Boeing 787, Japan Airlines


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« Send in the Clowns | Main | Bomb Away… »
Making a Noise Like a Turnip
From The Acquisitive Society, by R.H. Tawney (1920)
All these rights — ground-rents, monopoly profits — are "Property." The criticism most fatal to theml is not that of Socialists. It is contained in the arguments by which property is usually defended. For if the meaning of the institution is to encourage industry by securing that the workman shall receive the produce of his toil, then precisely in proportion as it is important to preserve the property which a man has in the results of his own efforts, is it important to abolish that which he has in the results of the efforts of someone else.
The considerations which justify ownership as a function are those which condemn it as a tax. Property is not theft, but a good deal of theft becomes property. The owner of royalties who, when asked why he should be paid £50,000 a year from minerals which he has neither discovered or developed nor worked but only owned, replies, "But it's property!" may feel all the awe which his language suggests. But in reality he is behaving like the snake which sinks into its background by pretending that it is the dead branch of a tree, or the lunatic who tries to catch rabbits by sitting behind a hedge and making a noise like a turnip. He is practising protective — and sometimes aggressive — mimicry. His sentiments about property are those of the simple toiler who fears that what he has sown another may reap. His claim is to be allowed to reap what another has sown…
In countries where the development of industrial organization has separated the ownership of property and the performance of work, the normal effect of private property is to transfer to functionless owners the surplus arising from the more fertile sites, the better machinery, the more elaborate organization…
It is the foundation of an inequality which is not accidental or temporary, but necessary and permanent. And on this inequality is erected the whole apparatus of class institutions, which make not only the income, but the housing, education, health and manners, indeed the very physical appearance of different classes of Englishmen almost as different from each other as though the minority were alien settlers established amid the rude civilization of race of impoverished aborigines.
Posted by Jerome Doolittle at October 24, 2011 09:47 PM
I see where I have fallen short in life is spending too much of my time sitting behind hedges making a noise like a turnip. Maybe I have acquired squatter's rights to the hedges and, thus, property?
Posted by: on October 25, 2011 5:25 PM


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I'd like to put my two cents in about this. I literally watched him and his clan get raided. He merged with me and gave me everything and I ended up getting the short end of the stick to say the least. He invited people in my tribe to pvp church gang. I ended up getting wiped because of him because I kicked them to late. I understand and got wiped because of him and his friends. It's sad... The recent Major patch for Ios/Android came in with some Huge controversy and I discuss… Is God mode/Console/Cheats A Total Rip-Off!? lol kinda get into a rant knida thing lol for Ark survival evolved IOS/Android latest update.
I am not aware of there being any Admin Commands along the lines of kicking or banning players. This is a tremendous oversight if true and I would hope that ARK will be updated soon to provide us with the commands/tools that we need to actually administrate our private servers.


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Photo: Stew Milne
Cultivating collaboration and innovation between MIT and Denmark
New MIT-Denmark program is poised to send its first students overseas for internships and research.
"Denmark has some of the best working conditions in the world. I'm eager to learn more about the customs and culture, especially as it pertains to the workplace," says sophomore Evie Mayner. Mayner will be one of the first students to travel to Denmark via the MIT International Science and Technology Initiatives (MISTI) program, thanks to the creation of a new program that connects the country with the MIT community.
The Confederation of Danish Industry (DI) has provided support to MIT to launch this new Denmark program, which sponsors students to work in Denmark on internship and research opportunities. This is part of an effort to attract international talent to Denmark in several key industries in which Denmark and Boston are mutually strong: life science, information technology (IT), and engineering.
The idea for a Denmark program first came about during a January 2018 visit from DI Chief Operating Officer Thomas Bustrup and his delegation. With support from Industriens Fond, DI was able to contribute three years of funding as a catalyst for the program. MIT-Denmark began in September 2018 and will officially launch over the summer when the first cohort of MIT students is sent overseas. "Ideally," says Mayner, "I'll be bringing back to the U.S. some of the energy, innovation, and healthy habits that characterize the Danish lifestyle."
Due to overwhelming interest, the original objective of sending 10 students to Denmark this first year had to be abandoned. Over 150 students applied to the program, while approximately 40 Danish companies and universities wanted to host at least one student. To meet the demand from both directions, the program is now sending 20 students — still far fewer than what is possible, based on interest.
Denmark has gained attention in recent years as the idea of "hygge" — a Danish word that roughly means coziness — has become a trend. Similarly, Denmark has been named the second-happiest country by the World Happiness Report and has placed in the top three for seven years in a row. Another selling point is the brand of sustainability that Denmark has embraced. In 2018, Denmark ranked third out of 180 countries on the Environmental Performance Index, having ranked fourth the previous time the assessment was made. Beyond this, Denmark has a cultural legacy of respect and consideration for the environment.
One example of Danish commitment to sustainability is MIT-Denmark host Aquaporin A/S, a global water technology company dedicated to revolutionizing water purification through the use of industrial biotechnological techniques and thinking. "In Aquaporin, we believe that innovation is driven by gathering people with different scientific background, culture, and perspective," says Mads Andersen, head of Aquaporin Academy, the company's student program. "Collaboration between industry and academia is a perfect platform to exploit this, and we are therefore extremely happy and proud of being part of the MIT-Denmark program. The hope is also that the MIT students will be inspired by the Danish way of working with a focus on sustainability and work-life balance."
Mayner is one of the first MIT interns spending the summer at Aquaporin A/S and is intrigued by what she has learned about Danish workplace culture. "I am especially excited by the idea of a high degree of worker autonomy with open communication, which I think will be valuable for my career and personal development."
While buzzwords around Denmark — clean energy, work-life balance, and hygge — make it an easy sell for students, the program is also helping tackle a concern with the Danish workforce, as companies struggle to fill vacant positions. This problem stems from a combination of factors, including a shortage of candidates with backgrounds that match Denmark's growing industries, primarily engineering, life science, and IT. Another aspect is a sheer numbers game — most people who want to work in Denmark are already working. "Danish businesses are thriving, and more and more companies find themselves in a position where they have to turn down orders due to lack of highly-skilled specialists," says Linda Duncan Wendelboe, head of DI Global Talent. "We need more young talented people to consider Denmark as their next career destination. Thanks to a long tradition of collaboration between civil society, private and public sectors, academia and entrepreneurs, we are often ranked among the most innovative in the world. At the same time, sustainability is a fully incorporated part of the business strategy in many Danish companies."
MIT-Denmark students will not only build relevant experience toward their academic and professional development, they will also get a taste of what it means to live in a modern welfare state, work in one of the best countries for business, and take new approaches to innovation and entrepreneurship the Danish way. Many host companies and universities view this as a way for students to dip their toes in Danish culture, hopeful that they will consider Denmark in their career paths not only for the strong industries in IT, life science, and sustainability, but also for the life-quality benefits. Other organizations hosting MIT students include 3Shape, Copenhagen Business School, COWI, Denmark's Technical University (DTU), Grundfos, LEO Pharma, Maersk (the first company to make a match with an MIT student), SPACE10, University of Copenhagen, Visma, and several start-ups housed within BLOXHUB, among others.
Similar to other MISTI programs, the MIT-Denmark program will send students to Denmark on internship and research opportunities ranging from three to 12 months, all cost-neutral to ensure this opportunity can be accessible to every student at MIT.
The establishment of the MIT-Denmark program comes around the same time as greater involvement of Denmark in the Boston area. In January of this year, a new Danish Innovation Center (ICDK) — which will be a work to build stronger relationships between Denmark and the Boston health and life science community, both on the commercial and research side — opened in Kendall Square. To officially open ICDK, the Danish Minister of Science, Technology, Information, and Higher Education, Tommy Ahlers, visited Boston to also get a greater feel for the technology and innovation environment in the area.
The ICDK is a combined effort from the Danish Ministry of Foreign Affairs and Ministry of Education and Research currently being led by Science Attaché Torben Orla Nielsen.
At the same time that the Danish government has a growing interest in the greater Boston area, so do Danish companies. A Danish investment firm is backing the offshore wind farm in New Bedford, while renewable energy powerhouses, such as Ørsted and Vestas, are making their mark on the implementation side. Furthermore, both larger companies and smaller Danish start-ups have opened up offices in Boston in the last couple of years. Danish household names such as Novo Nordisk, Danfoss, and LEO Pharma have a handful of staff at the Cambridge Innovation Center (CIC), with a smaller Danish biotech company, Medtrace, nearby.
MIT-Denmark Program Manager Sydney-Johanna Stevns has big dreams for the program. "There is such a wealth of opportunity and innovation in Denmark; connecting this to MIT has been naturally synergistic. In a few years, I expect we will be sending three times as many." The Program's Faculty Director, Kathleen Thelen, is excited about deepening MIT's connections to Scandinavia: "This is such an incredible opportunity for MIT students to experience a different culture but in a way that is also firmly anchored in their chosen fields of study."
MIT International Science and Technology Initiatives creates applied international learning opportunities for MIT students that increase their ability to understand and address real-world problems. MISTI collaborates with partners at MIT and beyond, serving as a vital nexus of international activity and bolstering the Institute's research mission by promoting collaborations between MIT faculty members and their counterparts abroad. MISTI programs are made possible through the generosity of individuals, corporations, and foundations.
For more information, email misti@mit.edu or contact country program managers directly. MISTI is a program in the Center for International Studies within the School of Humanities, Arts, and Social Sciences.
Topics: School of Humanities Arts and Social Sciences, Center for International Studies, International initiatives, Europe, MISTI, Classes and programs, Political science
MIT-Denmark
MIT International Science and Technology Initiatives (MISTI)
Building a more inclusive future, worldwide
Starting new conversations about identity abroad


text:
Stratford Station Map
Amtrak National Map
Marta Map Train
Travel Map Planner
Amtrak Lines Map
Marco Polo Maps
Marta Rail Map
Shirley Simmons January 13, 2021 Map
Mapmakers and GPS manufacturers all have their own system of creating maps, but most maps begin with the placement of governmental sites, like fire and police stations, schools, and similar community landmarks. Aerial images and satellite photos are then layered into the basic map, along with any important additions that may be needed, to display the GPS map seen on the device. Some GPS mapping devices can produce immediate graphics of your location and surroundings, making it possible to view a real-time map that changes as your location changes. This type of GPS map is great in emergency situations.The features of GPS maps vary. Most software includes maps of cities, along with the major highways. These maps may also include city level streets, rivers and waterways, and even less traveled side roads. Many GPS mapping systems include features that make it possible to obtain maps from your computer, making it easy and convenient to travel to any area.
There are many potential applications for an interactive US map. Many government websites use United States maps of counties to show census data (e.g. highest-income counties), geography of recession, employment gains or losses by county, map of bank failures, election results etc. Business websites use interactive maps to show branch offices, sales figures by states, driving directions, traveling route maps, or as store locator, property finder, to improve the easiness of website navigation. With an interactive U.S. map showing all states and counties, visitors can firstly click on a state (e.g. New York, Florida) from the map, see a map with counties within that state. Visitors can then simply roll the mouse cursor over a county on the map and the information about that county will show in a pop up box instantly, with text, images and hyperlinks. Then the visitor can click the links in the tool tip to get further information or redirected to a corresponding page.
A Scene of Relativity World wall maps can provide an interesting perspective on the world we live in. Not all world maps are in the standard format we are used to with the Northern Hemisphere in the top the map, with the Americas on the left (West) and China and the Indonesia on the right (East). There are some interesting world maps which are formatted in a different way. The Pacific Centred wall map Europe and the Americas on separate sides of the map. There are also upside down style maps of the world where the southern Hemisphere is now in the north of the map, and countries like Australia, Brazil and South Africa are now in the northerly part of the map. By looking on a world map at the area you live in, you can clearly see what countries and geographical features are around you which give a scene of relativity. Social Talking Point People find maps comforting as it gives them some grounding and something familiar to look at. World maps instantly draw people in to look at them. They notice where they live, where they have travelled and where they are currently. Even if they have seen a world map countless times before, there is sure to be something people see every time they look at a map. People comment on the different styles or designs of maps, colours used or the size and finish of a map.
Gone are the days when you need a compass to find your way. Gone are the days when you need to hold a map on your hand to know where you are going. Today, all you need before you leave is go check online maps that feature satellite views, driving directions, traffic report, and even see what the streets will look like on your way. Yes! Thats how advanced the web is now. Several advanced maps are available online, and known among them are Yahoo! Maps, Live Search Maps, Google Maps, and Mapquest. These online maps, share a lot of features, and like other products there will be an online map that will stand out for it has a feature not available on the rest. The ordinary street map we get used to are available on all these online maps. Oh, dont know what ordinary map I am referring to? It is the map that has full of different lines, symbols, and are in colors. You can usually buy one from a store. But since this street map is found online, the map can be customized with places you are looking for.
Rail Map Online
Maps of places give details as to the geographic location, physical characteristics, climate profile, vegetative structure, flora and fauna, soil structure, latitude and longitude, etc. Over the years, these maps were used in schools and colleges, offices and in houses for the purpose of education and/or reference. These maps used to be in paper-printed two-dimensional formats. Now three-dimensional, interactive or dynamic maps represent more accurate and up-to-date information. The art and science of map-making is called cartography. Maps are created representing political, geographical and other particular aspects. Most of the maps are drawn on a scale, say 1: 10,000, meaning that one unit of measurement on the map represents 10,000 units on the land. Maps depicting land areas are called political maps or physical maps. Political maps show land boundaries or territorial boarders between states and provinces, say those between India and China or Maharashtra and Gujarat. Physical maps depict geographical features such as terrain structure, mountains, deserts, plateaus, rivers, land under use, etc.
Mumbai as it is famous in the world is famous for all its characteristics including its enthusiasm, population, climate and even its location. Famous as the Maharashtrian capital, Mumbai is located just perfectly on the western coastline of India. Thorough information about Mumbais location can be obtained from a Mumbai map. A Mumbai map offers a close and detailed study of the dazzling and flashy city! The maps can be used as a guide as they give a precise suggestion of the various vacationer places and help us to proceed in our tour smoothly and enjoy a hitch-free tour. Lest you are new to the dream city (Mumbai), the maps will help you to find the landmarks and chief roads. It is considered expedient to carry a Mumbai map if you are planning a sightseeing tour or an outing there.
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Rare 4 Bedroom In Desirable Enclave At Sierra Vista! Well maintained home sits on a lovely cul-de-sac lot with private back yard and large trees. With a freshly painted interior and open floor plan, this home boasts granite counters, a light and bright kitchen with skylight and wood flooring throughout the home. MOVE IN READY !


The occasion and background of [Whitefield's letter to Wesley] requires a few words of explanation. From the time of his conversion in 1735, Whitefield had been profoundly conscious of man's entire depravity, his need of the new birth, and the fact that God can save and God alone. Describing an experience which occurred a few weeks after his conversion, he wrote: "About this time God was pleased to enlighten my soul, and bring me into the knowledge of His free grace . . ." Strengthened by his reading of the Scriptures, the Reformers and the Puritans, Whitefield gradually grasped the great related chain of truths revealed in the New Testament—the Father's electing love, Christ's substitutionary death on behalf of those whom the Father had given Him, and the Spirit's infallible work in bringing to salvation those for whom it was appointed. These doctrines of "free grace" were the essential theology of his ministry from the very first and consequently the theology of the movement which began under his preaching in 1737.
On Whitefield's departure from England in August 1739, Wesley immediately published this sermon. Entitled "Free Grace," it professed to be founded upon Romans 8:32, and was printed as a 12 mo. pamphlet in 24 pages. Annexed to it was a hymn by Charles Wesley on Universal Redemption. It was this sermon which occasioned Whitefield's reply here reprinted. But it is interesting to note that although Wesley's sermon was published in August 1739, Whitefield's reply is dated December 24, 1740, and was not published till early 1741. The reasons for this delay are probably as follows: (1) By the correspondence which passed between Whitefield and Wesley in 1740 it is evident that Whitefield longed to avoid an open breach and still hoped that his friend might be brought to a clearer understanding of the truth. Such sentences as the following are typical of Whitefield's attitude: "How would the cause of our common Master suffer by our raising disputes about particular points of doctrines!"
. . . "For Christ's sake, let us not be divided amongst ourselves" . . . "Avoid all disputation. Do not oblige me to preach against you; I had rather die . . ." (2) It is evident that while on his second visit to America, Whitefield developed stronger views on the issues which this controversy involved. Before he left England in August 1739, he had been satisfied to counsel "silence" on these doctrines and they were not at that time conspicuous in his preaching. As late as March 1740, he wrote to Wesley: "Provoke me to it as much as you please, I intend not to enter the lists of controversy with you on the points wherein we differ . . ." But before the year had ended Whitefield went back on this decision, the reason apparently being that he had come to see the seriousness of these questions in a new light. He could thus remain silent no longer. On September 25, 1740, he wrote to Wesley: "What a fond conceit is it to cry up perfection, and yet cry down the doctrine of final perseverance. But this, and many other absurdities, you will run into, because you will not own election. . . . O that you would study the covenant of grace! . . . O that you would not be too rash and precipitant! If you go on thus, honoured sir, how can I concur with you? It is impossible. I must speak what I know. . . ." On February 1, 1741, he says; further:"I must preach the gospel of Christ, and that I cannot now do, without speaking of election. . . . "


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Cycle: Explicit silence
Exhibition program
The title of this season's programme refers to a way of understanding silence that subverts the semantics of the term to turn it into a clamour. It also points to the deliberate, positive gesture that dissociates silence from abstraction to transform it into an action or a fact that is very close to renunciation but without giving in to it, that seeks to denote its presence and is content to watch itself from its own abyss. Thus conceived, silence functions as a metaphor for the paradigm shift, escaping from the often limiting meanings given to it by tradition and by cultural behaviour. It is a silence that adjoins words but does not oppose them, in the same way as it does not oppose sound, action, light or movement.
Silence is a phenomenon whose openly contradictory nature turns it into the paradox par excellence and into that slippery term regarding which Bataille wrote: "Of all words, it is the most poetic and the most perverse: it is itself the proof of its own death." As a consequence of this condition, silence is a chameleon-like concept, essentially polysemous and non-absolute, that transcends the merely physical or acoustic, and whose meaning varies radically depending on its context.
The search for silence, for "the furthest extension of that reluctance to communicate" that Susan Sontag wrote of, has been a constant premise in contemporary art ever since it focused on exploring its own limits. From Kasimir Malevich, Marcel Duchamp and Yves Klein to James Lee Byars, Michael Asher, Robert Barry and Juan Muñoz, contemporary artists have postulated silence, reduction, nothingness, pause, absence, disappearance, invisibility, emptiness, non-action or renunciation, without having exhausted them. In art, silence is still today a frontier, an absolutely free territory, hardly explored and yet to be mapped.
bodies of Light
Losing all sense of exclusion. Being at the centre.John BergerMayte Vieta (Blanes, Catalonia, 1971) has photographed the surface of the sea on numberless occasions, always with a particular sensitivity to the use of light.
about "bodies of Light"
It's Embarrassing, But For Some Time Now I?ve Only Had Title Ideas in English
Mario García Torres (Monclova, Mexico, 1975) is a Mexican artist living in Los Angeles who is interested in revisiting the history of Conceptual Art.
about "It's Embarrassing, But For Some Time Now I?ve Only Had Title Ideas in English"
Architectures of Silence
The Czech-born artist Tom Kotik (1969), who lives in New York, will be presenting Architectures of Silence, a series of works dealing with both the physical aspects of silence and the materials that allow it to be constructed, as well as with the socio-political implications suggested by the concept of silence itself.
about "Architectures of Silence"
Excess of Yang
Sophie Whettnall (Brussels, 1973) is presenting a sound video-installation with her latest self-portrait, designed specifically for Explicit Silence and titled Excess of Yang.
about "Excess of Yang"
Born in the small Iranian town of Kerman, Sirous Namazi (1970) was forced to flee his country after the 1979 Revolution, settling with his family in Sweden at the age of 13.
about "Interior"


Deposition Author(s): Bunkoczi, G., Elkins, J., Salah, E., Burgess-Brown, N., Papagrigoriou, E., Pike, A.C.W., Turnbull, A., Gileadi, O., von Delft, F., Arrowsmith, C.H., Edwards, A., Sundstrom, M., Weigelt, J., Doyle, D.
Unusual binding interactions in PDZ domain crystal structures help explain binding mechanisms.
Elkins, J.M., Gileadi, C., Shrestha, L., Phillips, C., Wang, J., Muniz, J.R., Doyle, D.A.
PDZ domains most commonly bind the C-terminus of their protein targets. Typically the C-terminal four residues of the protein target are considered as the binding motif, particularly the C-terminal residue (P0) and third-last residue (P-2) that form the major contacts with the PDZ domain's "binding groove". We solved crystal structures of seven human PDZ domains, including five of the seven PDLIM family members. The structures of GRASP, PDLIM2, PDLIM5, and PDLIM7 show a binding mode with only the C-terminal P0 residue bound in the binding groove. Importantly, in some cases, the P-2 residue formed interactions outside of the binding groove, providing insight into the influence of residues remote from the binding groove on selectivity. In the GRASP structure, we observed both canonical and noncanonical binding in the two molecules present in the asymmetric unit making a direct comparison of these binding modes possible. In addition, structures of the PDZ domains from PDLIM1 and PDLIM4 also presented here allow comparison with canonical binding for the PDLIM PDZ domain family. Although influenced by crystal packing arrangements, the structures nevertheless show that changes in the positions of PDZ domain side-chains and the alpha B helix allow noncanonical binding interactions. These interactions may be indicative of intermediate states between unbound and fully bound PDZ domain and target protein. The noncanonical "perpendicular" binding observed potentially represents the general form of a kinetic intermediate. Comparison with canonical binding suggests that the rearrangement during binding involves both the PDZ domain and its ligand.
Structural Genomics Consortium, Oxford University, Oxford, OX3 7DQ, United Kingdom.


Kinect with Kinect Adventures is back down to £99.99 since the price wars that happened during February 2011.
Currently the cheapest price online and back down to around the lowest price it has been to date.
The popular Xbox 360 accessory has been selling extremely with 10 million worldwide sales since being released towards the end of 2010.
See the Kinect prices page for the latest offers and deals.
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How Breast Milk Promotes Healthy Brain Growth May Have Finally Been Explained
Preemie babies in particular benefits from breast milk when it comes to their brain development.
by Rachel Perez . May 19, 2019
Breast milk has already been proven as the best first nutrition a baby needs and acts as his primary immunization due to the antibodies it contains. Many studies have shown the positive effects of breast milk on a child's brain, and this new study could explain the link between the two.
Research-clinicians observed babies who had very low birth weight, about less than 3.3 pounds, and were born at only 32 weeks of gestation or earlier. They were admitted at the neonatal intensive care unit (NICU) in their first week of life at Children's National Health System in Washington D.C.
Pumped Breast Milk Has Lower Levels of Good Bacteria, Study Says
A New Device Can Help Dads 'Breastfeed' Their Baby!
To see the how milk could affect a baby's brain, the researchers used proton magnetic resonance spectroscopy, a non-invasive imaging technique that describes the chemical composition of specific brain structures that allowed them to measure metabolites essential for growth.
Here are their observations between babies who were fed breast milk and those who were fed formula:
Cerebral white matter spectra showed significantly higher levels of inositol — a molecule similar to glucose, which is essential for normal activity, growth and development — for babies fed breast milk, compared with babies fed formula.
Cerebellar spectra had significantly higher creatine levels for breastfed babies compared with infants fed formula. Creatine is a substance that helps muscles produce energy during to function as they should.
The percentage of days infants were fed breast milk was associated with significantly higher levels of both creatine and choline, a water-soluble nutrient that's essential for metabolism.
"Key metabolite levels ramp up during the times babies' brains experience exponential growth," says study lead author Katherine M. Ottolini via a press release. Infants who were fed breast milk had higher metabolites essential to trigger the body's chemical reactions for optimum brain growth and development.
DOH, PhilHealth to Launch Benefit Packages for Low-birth-weight and Premature Babies in 2017
Your Premature Baby: The Care He Needs From You and His Doctor
The new technology, the proton magnetic resonance spectroscopy, is a massive step to understanding infant brain development and implementing early interventions, if and when necessary. The researchers only included preemie babies, but breast milk could have a similar effect in full-term babies as well.
The study may have compared breast milk and formula milk, but nowhere did the researchers note that the latter doesn't contribute to developing babies' brain.
Your takeaway? Aside from having more information to decide how you want to feed your baby, donate breast milk if you can. The Philippines is one of the top 10 countries with the highest premature births, according to the World Health Organization. For many premature babies, breast milk is what they need to survive.
20 Questions to Ask Your Preschooler Instead of 'How Was School?'
Alwyn Uytingco Honors Wife Jennica Amidst Backlash on Formula Milk Endorsement
Pregnant? You May Want to Get Tested for Group B Strep, Which Can Be Fatal for Newborns
Sitti Opens Up About What Helped Her Overcome Postpartum Blues
preemie babies
Pregnancy Symptoms Week 41 and Week 42: You Might Be Induced if You Haven't Given Birth Yet!
This Mom Shares How She Manages to Breastfeed Despite Grueling Hours as a Medical Intern
11 Beauty Queens Turned Moms Whom Filipinos Will Always Love With or without the crown, these beauty queens reign supreme, especially in their children's hearts.


Richard was telling me that he doesn't care what his customers think.
Instead, he writes and creates for himself. If his customers like it, fine. If not, fine.
This is the gutsy statement of an artist. I pointed out to him that he's had a long line of successful books, conferences and consulting gigs. "I don't care what they think," he said with a bit of contempt.
Fortunately for Richard, there's a high correlation between what he likes and what the market likes. The power of his conviction, though, is that instead of being joyful when he runs into a customer who thinks the way he does (and annoyed at those that don't), he's comfortable enough with his sense of art and craft and quality that it's enough. He does it for himself. He actively ignores the market.
If you're strong enough to do that, more power to you. If you do your art and the market rejects you, though, you need to make a choice. If your art has no market, it's still art. It just might not be a living.


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2005-07-14 First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26785954&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1112550(A4) "Global patent litigation dataset" by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
This application claims the benefit of U.S. Provisional Application Nos. 60/092923 and 60/092701, filed on July 15, 1998.
The manufacturers of semiconductors have made vast improvements in end product quality, speed and performance as well as in manufacturing process quality, speed and performance. However, there continues to be demand for faster, more reliable and higher performing semiconductors. One process that has evolved over the past decade or so is the semiconductor inspection process. The merit in inspecting semiconductors throughout the manufacturing process is obvious in that bad wafers may be removed at the various steps rather than processed to completion only to find out a defect exists either by end inspection or by failure during use. A typical example of the semiconductor manufacture process is summarized as follows. Bare whole wafers are manufactured. Thereafter, circuitry is created on the bare whole wafers. The whole wafer with circuitry is then sawn into smaller pieces known in the industry as die. Thereafter, the die are processed, as is well known in the art, typically as die in waffle and/or gel packs or on substrates.
During the deposition of layers, that is the circuit building, on the whole wafer, one or more first optical inspections may occur. First (1st) optical inspection is "in process" inspection of wafers during circuitry creation. This 18t inspection may be after each layer is deposited, at certain less often intervals, or only once during or after all deposits. This 1st optical inspection is usually a sub-micron level inspection in the range of 0.1 micron to < 1 micron. This process is used to check for mask alignment or defects such as extra metal, missing metal, contaminants, etc. This 1st inspection occurs during circuitry development on the wafer. Once the whole wafers are at least fully deposited on, that is all of the circuitry is created thereon, a post 1st (or 1.5) inspection occurs on the fully processed whole wafers. Generally, this is prior to the deposit of a passivation layer although it need not be. In addition, this post 1st inspection is generally prior to electrical testing or probing of the whole wafers. This inspection is typically a 0.5 micron to 1 micron optical inspection.
However, none of these systems address the particular and unique constraints of 2nd optical and this area has been largely ignored. In actual application, 2nd optical inspection has been marginally performed by manual inspection using humans and microscopic equipment. This manual process is inaccurate due to various factors including stress, eye fatigue and boredom of the operator as well as different perceptions by different operators as to the significance of a finding. In addition, smaller circuit geometry and higher throughput requirements are increasing the demands on semiconductor inspection at this 2nd optical level, all of which further results in operator stress, eye fatigue, and sometimes lower quality.
It is a further objective of the present invention to provide a new, state of the art 2nd optical inspection system. It is further an objective of the present invention to provide an automated defect inspection system of patterned wafers, whole wafers, sawn wafers, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc.
It is further an objective of the present invention to provide an automated defect inspection system that eliminates or significantly reduces the need for manual microscopic inspecting of every die in every wafer. It is further an objective of the present invention to provide an automated defect inspection system that views the ever-smaller circuit geometry in an accurate and rapid manner.
It is further an objective of the present invention to provide an automated defect inspection system that provides for multi-dimensional alignment of each wafer, substrate or other device having die thereon to be inspected such that every die is uniformly positioned. It is further an objective of the present invention to provide an automated defect inspection system that provides for x, y and theta (θ) alignment of each wafer, substrate or other device having die thereon to be inspected such that every die is uniformly positioned.
It is further an objective of the present invention to provide an automated defect inspection system that provides "good die" modeling by viewing multiple good dies and developing a model therefrom. It is further an objective of the present invention to provide an automated defect inspection system that provides for defect inspection using an imaging head or camera to view static and properly aligned die.
It is further an objective of the present invention to provide an automated defect inspection system that provides for review of the system detected defects whereby the user need not look at all die or all parts of die and instead only views the marked or noted defects. It is further an objective of the present invention to provide an automated defect inspection system that provides means for accounting for drifting or non-regularity of die positioning or spacing.
It is further an objective of the present invention to provide an automated defect inspection system that provides a method to inspect the quality of gold bumps, solder bumps, interconnects or the like, or the probe marks on bond pads. It is further an objective of the present invention to provide an automated defect inspection system that provides a method to detect defects on bond pads, bumps or interconnects.
Accordingly, the present invention satisfies these and other objectives as it relates to automated inspection equipment, systems and processes. Specifically, the present invention is an automated method of inspecting a semiconductor wafer in any form including whole patterned wafers, sawn wafers, broken wafers, partial wafers, and wafers of any kind on film frames, dies, die in gel paks, die in waffle paks, multi-chip modules often called MCMs, JEDEC trays, Auer boats, and other wafer and die package configurations for defects, the method comprising (1) training a model as to parameters of a good wafer via optical viewing of multiple known good wafers, and (2) inspecting unknown quality wafers using the model.
Fig. 19 is a side view of the wafer handling station; Fig. 20 is a partial view of the darkfield option of the present invention; and Fig. 21 is an enlarged view of the darkfield lasers of the darkfield option.
JEDEC trays, Auer boats, and other wafer and die package configurations (although hereinafter all of these uses shall be referred to generally as inspection of wafers W). The system inspects for many types of defects including, but not limited to, the following: metalization defects (such as scratches, voids, corrosion, bridging, etc.), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, probe or bond area defects (such as missing probe marks, discoloration, missing metal and probe bridging), diffusion faults, vapox, etc. The system may also be additionally or alternatively used to inspect interconnects or bumps, such as gold or solder bumps, for defects or other characteristics such as size and shape.
The system and process encompasses, in general, a multiple step process as shown in Fig. 2 of training (step A) the system, creating (step B) an inspection recipe, inspecting (step C) die or wafers based upon this training and recipe, defect review (step D) if desired, and defect reporting (step E) if desired. The system 10 for performing this process includes, -in general, a wafer test plate 12, means for providing a wafer to the test plate referred to as 14, a wafer alignment device 16 (x-y-θ or x-y-z-θ aligner) for aligning each and every wafer at the same x, y, and θ location or x, y, z, and θ location, a focusing mechanism 18, a camera 20 or other visual inspection device for visual inputting of good die during training and for visual inspection of other unknown quality die during inspection, a parameter input device 22 for inputting parameters and other constraints or information such as sensitivity parameters, geometries, die size, die shape, die pitch, number of rows, number of columns, etc., a display 24 for displaying the view being seen by the camera presently or at any previous saved period, a computer system 26 or other computer-like device having processing and memory capabilities for saving the inputted good die, developing a model therefrom, and comparing or analyzing other die in comparison to the model, a marking head 28, a frame 30, a hood 32, a control panel 34, and a system parameters display 36.
In more detail the system 10 and associated process are as follows. Training (step A) as initially displayed in Fig. 2 and shown in more detail in Fig. 3 involves (1) defining and/or training alignment features and parameters (and storing) in the computer system 26 for use during training where all of this is shown as step A1 , (2) defining (and inputting into the computer system) the wafer and/or die geometries, the wafer and/or die sizes, the die pitch, the number of rows, the number of columns, etc. and storing all such information in the computer system 26 for use during training and/or inspecting where all of this is shown as step A2, (3) training the system as to what a "good die" comprises by aligning via device 16 and viewing via camera 20 a plurality of known good die and forming a model within computer system 26 to define what an ideal die should look like based upon the common characteristics viewed where all of this is shown as step A3, (4) setting inspection parameters which are values that indicate to the computer system 26 how close an unknown quality die must match the good die model to be considered a good die (that is, what differences from the exact model are tolerable to still be considered a good die) where all of this is shown as step A4, and (5) saving this training model and its features, parameters, etc. to the computer system 26 as shown by step A5. Creating (step B) an inspection recipe involves creating a new recipe (if a previously defined recipe is to be used, then the creating step of B is skipped). Creating a new recipe involves (1) defining how wafers W are selected from cassettes or other storage receptacles where all of this is shown as step B1 , (2) defining how the dies on each wafer W are to be selected for defect inspection where all of this is shown as step B2 (often dies are merely inspected in sequential or similar order; however, any other order may be defined), (3) defining how defect inspection map files are imported and exported where this is shown as step B3, and (4) save this recipe where this is step B4.
C1 , (2) selecting a recipe that was defined in step B where this selecting is step C2, (3) selecting and inputting a product setup which is step C3, (4) loading a wafer onto the wafer test plate 12 using the wafer providing means 14 where loading is step C4, (5) aligning the wafer on the wafer test plate 12 using the wafer alignment device 16 for aligning each and every wafer at the same x, y, and θ location or x, y, z, and θ location and using the defined and/or trained alignment features and parameters of step A1 , all of which is shown as step C5, (6) focusing the camera 20 onto the wafer W if needed, all of which is shown as step C6 (7) collecting an image of the wafer W using the camera 20 by moving the plate 12 to align the camera with a first die or other portion thereof, viewing and recording that die or portion thereof by opening the shutter and allowing the camera to view and record the image, moving the plate 12 to align the camera with another die or portion thereof, viewing and recording this another die or portion thereof, and repeating these steps until all of the die or portions thereof on the wafer that are desired to be viewed have been viewed and recorded, all of which is shown as step C7, (8) simultaneously during step C7, determining where defects are located on the given die being viewed based upon the "good die" model of step A3 and the tolerances of step A4, all of which is step C8, and (9) creating a defect map of the wafer W which is a collection of all of the images of all of the die including all of the defects found thereon, all of which is step C9.
Alternatively, step C7 may be replaced by the step of collecting an image of the wafer W using the camera 20 by continuously moving the plate 12 so as to scan over all of the die on the wafer whereby the wafer is illuminated by a strobe light at a sequence correlating to the speed of the moving plate so that each die is strobed at the precise time it is under the camera 20. This allows for the continuous collecting of images without necessitating the stop and go procedure of aligning the camera with a first die, viewing and recording that die, moving the plate 12 to align the camera with another die, viewing and recording this another die, and repeating these steps until ail of the die on the wafer have been viewed and recorded, etc.
Defect review D if and when it is desired (which is generally at the conclusion of defect inspection on a given wafer W since it is at this point that defect classification is often desired) involves (1) loading the defect map created in step C9, this reloading referred to as step D1 , (2) selecting a defect to review (or alternatively reviewing all of the defects on the wafer in order) as step D2, (3) moving the plate 12 so as to position the wafer W such that the particular die with defect thereon is properly positioned under the camera 26, all of which is step D3, (4) user viewing and classifying of the defect such that user of the system 10 views and classifies the viewed defect, all of which is referred to as step D4, (5) repeating of steps D2-D4 until all of the defects that the user desires to review have been reviewed and classified as step D5, and (6) saving of classified defect map as step D6 as well as alternatively or additionally saving the defect information in any of a number of other formats for database or other management and review.
The wafer test plate 12 is a rotary stage that is equipped with a universal interface platform with vacuum, all of which provides a flexible interface for wafer and die package fixturing. It is defined such that it 5 quickly mounts and inspects whole wafers, sawn wafers on film frame, die in gel pak, die in waffle-pak, MCM, JEDEC trays, Auer boats, and other wafer and die package arrangements and configurations.
15 inspection, the robotic arm pivots the wafer W from the second position at the test plate 12 back to the first position where the wafer W is placed back in or on the magazine or cassette.
•30 hydraulics, push rods, vacuums, or other mechanical or electrical equipment for moving the rotary stage either linearly or angularly to a precise desired location.
40 z and thus assuring the wafer is in focus. Basically, the course alignment uses a pattern located at the approximate wafer center which it has been trained to know and expect x and y location on thereby allowing it to find this pattern and x and y (2-D linear) orient the wafer as such to at least course align it. This orientation is performed using the stage 12. Thereafter, fine alignment is performed by using a pattern near the perimeter of the wafer which it has been trained to know to get the θ (rotational) alignment correct.
This is also performed using the stage 12. In both cases, the camera finds the pattern and the alignment mechanism moves the wafer until it is aligned.
One example of camera system 20 that is contemplated by the present invention is a two (2) camera system where one camera is an inspection camera and the other is a viewing camera. The inspection camera is a high resolution CCD camera that provides high resolution grayscale images for inspection. The viewing camera is a high fidelity color image camera for visual review of found defects in, for example, 758 x 582 pixel resolution or alternatively 1008 x 1018 pixel resolution or other known pixel sizes. In addition, the viewing camera provides high quality color images for operator defect review. 5 Computer controlled optics are provided that use long working distance microscopic objectives so as to provide for low distortion images that are required for accurate defect detection. Multiple magnifications may be automatically selected based on the user defined inspection recipes as described below.
15 must occur simultaneously or substantially simultaneously with the camera shuttering which is in one example a high speed electronic shuttering mechanism; alternatively in a non-strobing environment, the illumination is typically continuous or as needed.
20 intensity lights, lasers, fluorescent lights, arc discharge lamps, incandescent lamps, etc. The angle of the illumination may be of a brightfield only, darkfield only, or both brightfield and darkfield variety.
• 30 light is reflected generally back to the camera. In contrast, 3-d objects on the substrate will angularly reflect the light causing the light to be angled away from the camera. As a result, flat objects appear bright to the camera while 3-d objects appear dark.
40 angle, while reflecting light at a low angle along the periphery opposite the light introduction where the object is flat. Darkfield light thus brightly illuminates 3-d objects while not illuminating flat objects very well.
The system 10 with a darkfield option as shown best in Figs. 20-21 to include a plurality of illuminators spaced about the periphery. In one example four illuminators are used and each is equally spaced from the other at a 90° separation. In another example (Figs. 20-21 where one pair are shown), eight illuminators are used at a 45° separation, and in an alternative associated therewith and shown in the drawings, the illuminators are teamed up in pairs at 90° separation to double the capacity of the illuminators at a given angle. The user, where the system is equipped with both brightfield and darkfield illumination, has the option of using one or the other or both. This provides significant options. For instance, if the inspection is being performed on die that tend to only have flat objects thereon, brightfield illuminates these objects well and is more than sufficient for this type of inspection. Alternatively, if the inspection is being performed on die that tend to have 3-d objects, then darkfield may be sufficient. However, as in many cases, such as with gold bumps which are generally very flat but very rough and tend to include 3-d nodules protruding therefrom, a combination of the two is often beneficial. In this example, the brightfield illumination indicates the presence of any defects such as scratches, etc. and the presence of the bump while the darkfield illumination shows the nodules and rough surface on the bump. Without the darkfield, the bump shows up as a dark image. Once darkfield is introduced, the nodules are located as white spots on the bump. Darkfield also assists in defect classification because brightfield light does not differentiate between a particle or defect that extends from the surface versus one that is embedded or scratched into the surface. Darkfield illumination does differentiate these extending versus embedded defects. In one embodiment, the system 10 includes a brightfield illumination system that is physically located adjacent to or incorporated physically into the camera so as to provide brightfield illumination from above the objects illuminated. In another embodiment, the system 10 includes a darkfield illumination system that is located peripherally around the wafer top plate 12 at low angles of difference from the top plate, angles such as 1° to 10°. In an even further embodiment, both brightfield illumination from above the object and darkfield illumination from around the periphery of the object are provided. As indicated above, the illumination as provided by the brightfield and darkfield illumination systems may be provided by any known illumination source such as a white light source such as incandescent, fluorescent, or other similar gas envelope or similar electrical lights, or by lasers or similar devices.
The overall training step A is described below in more detail. The step A1 is defining and/or training alignment features and parameters (and storing) in the computer system 26 for use during training. This alignment technique, when performed in step A3 and C5 as described below to define a good die and to inspect, is a two function process, namely a physical alignment and an image alignment. At this point we define what parameters are to be used during the physical and image alignment. These parameters include defining markers as are needed during physical alignment, and distinct elements and buffers as are needed during image alignment. The actual physical and image alignment steps occur during step A3 and C5 as described below.
The alignment may involve either physical alignment or image alignment, or both. Physical alignment basically involves inputting specific location markers on or around each wafer, die or sub-section of die which are used as location points from which the wafer and die are located and aligned. At step A1 , these markers were defined.
Physical alignment involves the wafer test plate 12 via the wafer alignment device 16 aligning each and every wafer, die, etc. in the same x, y, and θ location by looking for and aligning with these location markers. In use, the system takes an overall picture or image of the wafer, die or subsection thereof and looks for the specific location markers. The system uses a hunting method to find the markers. Once one or more specific location markers are identified, and it is found that the markers are in some other location or orientation than expected, then the wafer test plate 12 spins, turns, adjusts or otherwise moves in a translational or rotational manner in the x, y, and θ directions the wafer, die or sub-section.
The system also may perform image alignment. During step A1 , distinct elements and buffers, as are needed in image alignment, were defined.
With smart alignment, a buffer is defined into the image. This buffer allows for "wiggle", that is movement or twisting in the image. This buffer is typically an x amount and a y amount of movement that is expected. This buffer is then used to define the area around the expected location of the distinct element to be searched for the distinct element. Once the distinct element is found, then the x and y distance that the distinct element is off from the expected distinct element location is the distance the entire image is moved in the x and y direction to align the image. The viewing encompasses collecting an image of the wafer W, a known good wafer, using the camera 20 by moving the plate 12 to align the camera with a first image which may be the whole wafer, a part of the wafer, a die, or a part of a die and then viewing and recording that image. Thereafter moving the plate 12 to align the camera with another image, viewing and recording this another image, and repeating these steps until all of the images on the wafer have been viewed and recorded. An alternative step C8 involves continuous motion and strobe illumination as is described below. In either case, this is then repeated for a plurality of known good die or wafers as viewing of a pool of wafers is necessary to form a model of a good die.
The actual defect inspection algorithm is calculated from the collection of images of the set of "good die". An image or images are taken of each good die in a set of good die. Each image is composed of pixels such as for example an approximately one thousand by one thousand (1000 x 1000) array or grid of pixels, although any number may be used. For each same pixel on all of the good die images, that is for each common x,y coordinate, which is a pixel, a mean and standard deviation is calculated of the pixel value, that is the gray-scale value of that given pixel. So in a grouping of 30 good die, as used as an example above, where each die is an array of 1000 x 1000 spots (1 million total spots) each referred to as a pixel, a mean and a standard deviation of the gray-scale number for each pixel at x,y coordinate 1 x 1 , 1 x 2, 1 x 3 and so on all the way to 1000 x 1000 is calculated; that is a mean and standard deviation is calculated for pixel 1 x 1 using the gray scale measurement for pixel 1 x 1 on all 30 die, and so on for each of the 1 million die. In one embodiment, the gray scale numbers for each pixel, are used to calculate the mean and standard deviation, and these are in a range. One example is a 256 scale scheme, where one end, such as 0 in the 256 scale scheme, represents a dark or black colored or shaded image and the other end, such as 255 in the same 256 scale scheme, represents a white colored or shaded image.
Minimum defect contrasting involves user defined absolute limits on the upper and lower limits defined from the mean and standard deviation.
Minimum defect sensitivity is also described below in more detail in step C7.
The step C2 is selecting a recipe that was defined in step B. The step C3 is selecting a product setup if one is desired. The step C4 is loading a wafer onto the wafer test plate 12 using the wafer providing means 14. Loading onto the wafer test plate may be either by manual loading or using an automatic system where wafer with die thereon are automatically transferred from a cassette or magazine into the inspection area. The automatic system allows for elimination of all manual handling.
The step C5 is aligning the wafer on the wafer test plate 12 using the wafer alignment device 16 for aligning each and every wafer at the same x, y, z, and θ location and using the defined and/or trained alignment features and parameters of step A1. This has been described above in detail as the same process of physical alignment and image alignment is used here as was used to align the known good wafers to form the good die model.
It is often also necessary to focus the camera 20 onto the wafer W if it is not already focused. This occurs, if needed, during or after step C5 and is the z orienting of the wafer which is defined by a height map. The step C6 is collecting an image of the wafer W using the camera 20 by moving the plate 12 to align the camera with a first image which may be the whole wafer, a part of the wafer, a die, or a part of a die and then viewing and recording that image, and thereafter moving the plate 12 to align the camera with another image, viewing and recording this another image, and repeating these steps until all of the images on the wafer have been viewed and recorded. An alternative step C6 involves continuous motion and strobe illumination as is described below.
Such statistical or data filtering includes area filtering, size filtering, region of interest filtering, and interactive defect classification filtering. Area filtering discards blobs of a pre-set area or smaller. Size filtering discards blobs of a pre-set x or y size or smaller. Region of interest filtering allows the user to define locations on the die that are not of as much or any importance and as such any defects thereon would be irrelevant. Finally, interactive defect classification involves clustering of close but not touching identified pixels where the distance defining close is user defined. Basically, the unknown quality die are inspected by viewing the image and comparing each pixel with its mean and standard deviation via the upper and lower limit values. Sensitivity and filtering also allows for compensation for factors that are deemed by the user to be more or less critical. In sum, if any one of the given viewed pixels in the unknown quality die is outside of the upper and lower limit values as sensitized and filtered, then the die is defective and as described below, that defective spot is inked or otherwise noted.
As an alternative to the above described inspection steps, the alternative step C6 which is the step of collecting an image of the wafer W using the camera 20 by continuously moving the plate 12 so as to scan over all of the die on the wafer whereby the wafer is illuminated by a strobe light at a sequence correlating to the speed of the moving plate so that each die is strobed at the precise time it is under the camera 20. Basically a short illumination pulse of light on the moving plate effectively "freezes" the image. This allows for the continuous collecting of images without necessitating the stop and go procedure of aligning the camera with a first die, viewing and recording that die, moving the plate 12 to align the camera with another die, viewing and recording this another die, and repeating these steps until all of the die on the wafer have been viewed and recorded, etc.
D2 is selecting a defect to review (or alternatively reviewing all of the defects on the wafer in order). The step D3 is moving the plate 12 so as to position the wafer W such that the particular defect is properly positioned under the camera 26. The step D4 is user viewing and classifying of the defect such that user of the system 10 views and classifies the viewed defect. Any number of classifications are available and the classifications are user defined. The step D5 is repeating of steps D2 -D4 until all of the defects have been reviewed and classified. The step D6 is saving of classified defect map as well as alternatively or additionally saving the defect information in any of a number of other formats for database or other management and review.
The system 10 is based upon standard computer technology such as Pentium® Pro or similar computer platforms which allow for many different communication options of for example both a serial and network format. For instance, the system includes TCP/IP configuration and may alternatively include SEC-ll/GEM or other computer industry standard protocols.
In one embodiment, a frame grid is created for the purpose of defining the expected location of each die. It is known to stretch the film sawn wafers are transported on so as to allow easier picking up of each die without damaging neighbor die. This stretching however is typically not uniform resulting in disoriented die. The drift map predicts the stretched location of each die using the starting point of the die which was known due to the rigidity before sawing, and the pitch. To create a drift map, a mark or dummy die is placed on the wafer at every nth location, such as every 10th. Using machine vision, the system 10 looks for the mark at its expected location and then looks therearound if not found. Once the actual location is found, the machine vision proceeds to the expected location of the next mark and reiterates through the process. Once all of the marks have been found, a pitch is calculated assuming consistent behavior in between marks. Using this pitch and knowing the original location of each die prior to sawing, a drift map is created which accurately predicts the location of the die.
The plate 12 is then moved to align the camera with another selected area, which may be the next adjacent area or not, to take an image thereof (the second die position) on the wafer adjacent to the first image. Basically, the plate is indexed under the inspection camera to the next die position.
This second die position is then viewed and recorded. These steps are repeated until all of the images on the wafer have been viewed and recorded. Simultaneous with these image viewing steps, defect sensitivity and filtering are used in conjunction with the "good die" model viewing to determine if initial anomalies or differences between the "good die" model and the image are actual defects or if they should be filtered out. A defect map of the wafer W is then created in the computer system from the collection of all of the defect of all of the die including all of the defects found thereon. In another embodiment, rather than move the plate in incremental steps, the plate is continuously moved during strobe illumination thereof. The sections of the wafer are then scanned by synchronizing the camera with a strobe illumination so that when the camera is properly positioned over each section of the moving substrate, the strobe illumination occurs simultaneous with the image collection via the camera.
That wafer is then removed and another wafer is loaded for inspection. This removal and loading of a new is either manually performed or may be automatically performed . Accordingly, the invention as described above and understood by one of skill in the art is simplified, provides an effective, safe, inexpensive, and efficient device, system and process which achieves all the enumerated objectives, provides for eliminating difficulties encountered with prior devices, systems and processes, and solves problems and obtains new results in the art. In the foregoing description, certain terms have been used for brevity, clearness and understanding; but no unnecessary limitations are to be implied therefrom beyond the requirement of the prior art, because such terms are used for descriptive purposes and are intended to be broadly construed. Moreover, the invention's description and illustration is by way of example, and the invention's scope is not limited to the exact details shown or described.
1. An automated method of inspecting a semiconductor wafer in any form including whole patterned wafers, sawn wafers, broken wafers, partial wafers, and wafers of any kind on film frames, dies, die in gel paks, die in waffle paks, multi-chip modules often called MCMs, JEDEC trays, Auer boats, and other wafer and die package configurations for defects, the method comprising: training a model as to parameters of a good wafer via optical viewing of multiple known good wafers; and inspecting unknown quality wafers using the model.
2. The automated inspection method of claim 1 wherein the training a model step includes aligning and viewing via a camera the multiple known good wafers.
3. The automated inspection method of claim 2 wherein the training model step further includes taking a gray scale measurement of each pixel in a grid of pixels on each of the multiple known good wafers.
4. The automated inspection method of claim 3 wherein the training model step further includes taking the gray scale measurement of each pixel on a 0 to 255 gray scale.
5. The automated inspection method of claim 3 wherein the training model step further includes calculating a mean and standard deviation of all of the gray scale measurements for each pixel on the multiple known good wafers.
6. The automated inspection method of claim 5 wherein the calculating the mean and standard deviation of all of the gray scale measurements for each pixel on the multiple known good wafers provides an upper and lower limit in between which a gray scale measurement on an equivalent pixel on an unknown quality wafer is deemed good while a gray scale measurement on an equivalent pixel on an unknown quality wafer outside of the upper and lower limits is deemed of at least questionable integrity as so noted.
7. The automated inspection method of claim 6 further comprising training a system as to inspection parameters which are values that indicate how many standard deviations away from the mean are acceptable in defining the upper and lower limits.
8. The automated inspection method of claim 1 further comprising training a system as to alignment features and parameters of wafers.
9. The automated inspection method of claim 1 further comprising training a system as to at least one of the following: wafer geometry, wafer size, die geometry on a wafer, die size on a wafer, number of rows of die on a wafer, and number of columns of die on a wafer.
10. The automated inspection method of claim 1 further comprising training a system as to inspection parameters.
11. The automated inspection method of claim 1 further comprising creating an inspection recipe that is used during inspecting to perform at least one of the following: defining how substrates are selected from storage receptacles, defining how dies on a wafer are selected for defect inspection, and defining how an inspection map is imported or exported, if needed.
12. The method of claim 1 further comprising defect reviewing following the completion of inspecting whereby only die failing to meet the good wafer model are reviewed.
18. The automated system of claim 13 further comprising a display for displaying the view being seen by the visual inspection device at present or at any previous saved period.
19. The automated system of claim 13 further including a marking head for placing a mark on or adjacent a pixel on a wafer that is outside of the model.
20. The automated system of claim 13 further including a frame on which the wafer test plate, the wafer alignment device, the visual inspection device, and the computer system are attached, and a hood for enclosing an inspection area over the test plate.


Readymix white powder specially designed for low costing aqueous film coating.Color has to incorporate by customer as per requirement.
» Add PROCOAT in a fine stream.If require increase speed to maintain vortex.
» After complete addition of PROCOAT continue stirring for 45 minutes.
» Filter the solution through 100# bolting cloth.