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Sensor Coverage and Actors Relocation in Wireless Sensor and Actor Networks (WSAN): Optimization Models and Approximation Algorithms
by Nagilla, Praveen K., M.S. University of Missouri - Columbia. 2010: 74 pages; 13849580.
A class of staggered grid algorithms and analysis for time-domain Maxwell systems
by Charlesworth, Alexander E., M.S. Colorado School of Mines. 2016: 91 pages; 10010857.
Network Design With Facility Location: Approximation and Exact Techniques
by Rezapour, Mohsen, Dr.Nat. Technische Universitaet Berlin (Germany). 2015: 133 pages; 10701438.
Approximation of Positive Semidefinite Matrices Using the Nyström Method
by Arcolano, Nicholas Francis, Ph.D. Harvard University. 2011: 247 pages; 3462777.
Graph diffusions and matrix functions: Fast algorithms and localization results
by Kloster, Kyle, Ph.D. Purdue University. 2016: 114 pages; 10149739.
Applications of the Minimum Sobolev Norm and Associated Fast Algorithms
by Gorman, Christopher Henry, Ph.D. University of California, Santa Barbara. 2019: 220 pages; 13896728.
OOPSI: A family of optimal optical spike inference algorithms for inferring neural connectivity from population calcium imaging
by Vogelstein, Joshua T., Ph.D. The Johns Hopkins University. 2009: 184 pages; 3410190.
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Bicubic L1 Spline Fits for 3D Data Approximation
by Zaman, Muhammad Adib Uz, M.S. Northern Illinois University. 2018: 75 pages; 10751900.
Efficient algorithms for phylogenetic post-analysis
by Pattengale, Nicholas Dylan, Ph.D. The University of New Mexico. 2010: 131 pages; 3409376.
Efficient image restoration algorithms for near-circulant systems
by Pan, Ruimin, Ph.D. Auburn University. 2007: 130 pages; 3265586.
Near-optimality and robustness of greedy algorithms for Bayesian pool-based active learning
by Cuong, Nguyen Viet, Ph.D. National University of Singapore (Singapore). 2015: 124 pages; 10006066.
Efficient inference algorithms for near-deterministic systems
by Chatterjee, Shaunak, Ph.D. University of California, Berkeley. 2013: 130 pages; 3616611.
A Study of the Errors of the Fixed-Node Approximation in Diffusion Monte Carlo
by Rasch, Kevin M., Ph.D. North Carolina State University. 2012: 172 pages; 3538537.
Quantum virial coefficients via path integral Monte Carlo: Theory and development of novel algorithms
by Subramanian, Ramachandran, Ph.D. State University of New York at Buffalo. 2016: 268 pages; 10127734.
Models and Algorithms to Solve a Reliable and Congested Biomass Supply Chain Network Designing Problem under Uncertainty
by Poudel, Sushil Raj, Ph.D. Mississippi State University. 2017: 189 pages; 10267643.
Particle filtering for stochastic control and global optimization
by Zhou, Enlu, Ph.D. University of Maryland, College Park. 2009: 138 pages; 3372999.
Combinatorial problems in online advertising
by Malekian, Azarakhsh, Ph.D. University of Maryland, College Park. 2009: 110 pages; 3391381.
Optimizing task assignment for collaborative computing over heterogeneous network devices
by Kao, Yi-Hsuan, Ph.D. University of Southern California. 2016: 185 pages; 10124490.
Methods for improving the design and performance of evolutionary algorithms
by Bassett, Jeffrey K., Ph.D. George Mason University. 2012: 159 pages; 3549855.
Latent Variable Modeling for Networks and Text: Algorithms, Models and Evaluation Techniques
by Foulds, James Richard, Ph.D. University of California, Irvine. 2014: 287 pages; 3631094.
Orbital-free density functional theory at the nanoscale and beyond: Algorithms and applications
by Hung, Linda, Ph.D. Princeton University. 2011: 232 pages; 3445577.
Primal-dual interior-point algorithms for linear programs with many inequality constraints
by Winternitz, Luke Michael Blohm, Ph.D. University of Maryland, College Park. 2010: 273 pages; 3409883.
Algorithmic approaches to reducing resource costs in data centers
by Mukherjee, Koyel, Ph.D. University of Maryland, College Park. 2013: 210 pages; 3612196.
Computational Algorithms for Improved Representation of the Model Error Covariance in Weak-Constraint 4D-Var
by Shaw, Jeremy A., Ph.D. Portland State University. 2017: 122 pages; 10257789.
Novel Function Approximation Techniques for Large-scale Reinforcement Learning
by Wu, Cheng, Ph.D. Northeastern University. 2010: 130 pages; 3443846.
Algorithms for Tracking in Clutter and for Sensor Registration
by Crouse, David Frederic, Ph.D. University of Connecticut. 2011: 313 pages; 3485265.
Recovery of the local gravity field by spherical regularization wavelets approximation and its numerical implementation
by Shuler, Harrey Jeong, Ph.D. The University of Texas at Austin. 2009: 209 pages; 3615225.
Probabilistic and topological methods in computational geometry
by Dhandapani, Raghavan S., Ph.D. New York University. 2010: 122 pages; 3396723.
Planning under uncertainty: From informative path planning to partially observable semi-MDPs
by Wei, Lim Zhan, Ph.D. National University of Singapore (Singapore). 2015: 148 pages; 10006047.
A parallel offline CFD and closed-form approximation strategy for computationally efficient analysis of complex fluid flows
by Allphin, Devin, M.S. California State University, Long Beach. 2014: 166 pages; 1527872.

redpajama_set_name: RedPajamaCommonCrawl


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Can you do it? Yes. But let's start with some background info.
One thing that many people do not realize is that the S corporation is simply a tax designation that founders may make upon incorporating their business. From a state perspective, the entity is either a corporation or a limited liability company (or maybe a partnership), but from the IRS perspective, the entity is a C corporation, a partnership, or an S corp.
S corporations provide a unique blend of the benefits of C corporations and LLCs. Like LLCs, S corporations enjoy flow through taxation. This means that (like a partnership) an S corporation's shareholders are taxed at the individual level on the profits of the business, rather than paying income tax at the corporate level. Like C corporations, S corporations have shareholders and a board of directors, but unlike C corporations, they are limited to 100 shareholders, they can have only a single class of stock, and their shareholders must be individuals who are U.S. citizens or permanent residents. Therefore, partnerships, LLCs, corporations and other entities cannot be shareholders of S corporations (with a few minor exceptions).
For those that may not know, stock options provide holders the right to purchase a predetermined number of shares at a preset price during a specific window of time. They are frequently used as part of the compensation package for startup companies because a company can give an employee some upside in a tax advantaged way without giving up any voting power.
Almost all venture-backed businesses are taxed as C corporations (learn more here), and many venture-backed companies issue stock options as part of the compensation package for key employees. So most people know that C corporations can issue stock options. But before businesses are venture-backed sometimes it can be beneficial to the founders to have the company be taxed differently. So, if the founders (with the advice of their tax advisor) elect to have the company taxed as an S corp, can the company still issue stock options to key employees?
Thankfully, the answer is yes, provided that the stock option grants do not violate (or lead the company down the path toward violating) the additional restrictions that come along with S corporation tax status. Holders of stock options are not actually shareholders until the options are exercised (they have no voting rights, they do not share in dividends, and therefore have no tax liability w/r/t the company's profits), so issuing stock options to individuals who would be unable to hold stock in an S corp does not technically violate the S corp restrictions, but it does put the company in a position to lose S corp status up on execution of the options. S corporations can issue both incentive stock options and non-qualified stock options to employees, consultants, advisors and other service providers.
Please note – the lawyers at Fourscore Business Law are experienced in business matters of many kinds, which give us the opportunity to be involved in tax discussions on a regular basis. However, we are not CPAs or "tax" lawyers. We have many great contacts and refer our clients to them when needed. Please do not take the summary set forth in this article as tax or business planning advice!
Based in the Research Triangle region of North Carolina, Fourscore Business Law serves entrepreneurs and businesses in Raleigh, Durham, Chapel Hill, Wilmington, Charlotte and throughout the Southeast. We also represent venture capital funds and other investors who invest in companies located in New York, Silicon Valley and everywhere between.The idea of delivering maximum impact in a simple and succinct manner is what we're calling the Fourscore Principle. And that is what Fourscore Business Law is based on. Our clients operate in a broad range of industries including tech, IoT, consumer products, B2B services and more. Questions? Shoot us an email or give us a call at (919) 307-5356. Your first call is on us.
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A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.
This application is a continuation of U.S. Ser. No. 12/939,574, entitled "THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION APPARATUS FACILITATING COOLING OF AN ELECTRONIC COMPONENT," filed Nov. 4, 2010, and which is hereby incorporated herein by reference in its entirety.
The present invention relates to heat transfer mechanisms, and more particularly, to cooling apparatuses, liquid-cooled electronics racks and methods of fabrication thereof for removing heat generated by one or more electronic components of the electronics rack.
The power dissipation of integrated circuit chips, and the modules containing the chips, continues to increase in order to achieve increases in processor performance. This trend poses a cooling challenge at both the module and system levels. Increased airflow rates are needed to effectively cool higher power modules and to limit the temperature of the air that is exhausted into the computer center.
In many large server applications, processors along with their associated electronics (e.g., memory, disk drives, power supplies, etc.) are packaged in removable drawer configurations stacked within a rack or frame. In other cases, the electronics may be in fixed locations within the rack or frame. Typically, the components are cooled by air moving in parallel airflow paths, usually front-to-back, impelled by one or more air moving devices (e.g., fans or blowers). In some cases it may be possible to handle increased power dissipation within a single drawer by providing greater airflow, through the use of a more powerful air moving device(s) or by increasing the rotational speed (i.e., RPMs) of an existing air moving device. However, this approach is becoming problematic at the rack level in the context of a data center.
In one aspect, a method of facilitating dissipation of heat from at least one electronic component is provided. The method includes: providing a refrigerant loop configured for refrigerant to flow therethrough, the refrigerant facilitating dissipation of heat from the at least one electronic component; coupling a compressor in fluid communication with the refrigerant loop, wherein a first portion of the refrigerant loop resides upstream of a refrigerant inlet of the compressor, and a second portion of the refrigerant loop resides downstream of a refrigerant outlet of the compressor; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop, the controllable thermoelectric array comprising at least one thermoelectric module, and being disposed with the first portion of the refrigerant loop at least partially in thermal contact with a first side of the thermoelectric array and the second portion of the refrigerant loop at least partially in thermal contact with a second side of the thermoelectric array, the controllable thermoelectric array being controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion of the refrigerant loop to refrigerant passing through the first portion of the refrigerant loop.
FIG. 8 depicts one embodiment of a computer program product incorporating one or more aspects of the present invention.
As used herein, the terms "electronics rack", "rack-mounted electronic equipment", and "rack unit" are used interchangeably, and unless otherwise specified include any housing, frame, rack, compartment, blade server system, etc., having one or more heat generating components of a computer system or electronics system, and may be, for example, a stand alone computer processor having high, mid or low end processing capability. In one embodiment, an electronics rack may comprise multiple electronic subsystems, each having one or more heat generating components disposed therein requiring cooling. "Electronic subsystem" refers to any sub-housing, blade, book, drawer, node, compartment, etc., having one or more heat generating electronic components disposed therein. Each electronic subsystem of an electronics rack may be movable or fixed relative to the electronics rack, with rack-mounted electronics drawers of a multi-drawer rack unit and blades of a blade center system being two examples of subsystems of an electronics rack to be cooled.
"Electronic component" refers to any heat generating electronic component or module of, for example, a computer system or other electronic unit requiring cooling. By way of example, an electronic component may comprise one or more integrated circuit dies and/or other electronic devices to be cooled, including one or more processor dies, memory dies and memory support dies. As a further example, the electronic component may comprise one or more bare dies or one or more packaged dies disposed on a common carrier.
As used herein, "refrigerant-to-air heat exchanger" means any heat exchange mechanism characterized as described herein through which refrigerant coolant can circulate; and includes, one or more discrete refrigerant-to-air heat exchangers coupled either in series or in parallel. A refrigerant-to-air heat exchanger may comprise, for example, one or more coolant flow paths, formed of thermally conductive tubing (such as copper or other tubing) in thermal or mechanical contact with a plurality of air-cooled cooling or condensing fins. Size, configuration and construction of the refrigerant-to-air heat exchanger can vary without departing from the scope of the invention disclosed herein.
Unless otherwise specified, "refrigerant evaporator" refers to a heat-absorbing mechanism or structure coupled to a refrigeration loop. The refrigerant evaporator is alternatively referred to as a "sub-ambient evaporator" when temperature of the refrigerant passing through the refrigerant evaporator is below the temperature of ambient air entering the electronics rack. Within the refrigerant evaporator, heat is absorbed by evaporating the refrigerant of the refrigerant loop. Still further, "data center" refers to a computer installation containing one or more electronics racks to be cooled. As a specific example, a data center may include one or more rows of rack-mounted computing units, such as server units.
As used herein, the phrase "controllable thermoelectric array" refers to an adjustable thermoelectric array which allows active control of an auxiliary heat load applied to refrigerant passing through the refrigerant loop of a cooling apparatus, in a manner as described herein. In one example, the controllable thermoelectric array comprises one or more thermoelectric modules, each comprising one or more thermoelectric elements, coupled in thermal communication with the refrigerant passing through the compressor and powered by an electrical power source.
One example of the refrigerant employed in the examples below is R134a refrigerant. However, the concepts disclosed herein are readily adapted to use with other types of refrigerant. For example, the refrigerant may alternatively comprise R245fa, R404, R12, or R22 refrigerant.
Reference is made below to the drawings, which are not drawn to scale for ease of understanding, wherein the same reference numbers used throughout different figures designate the same or similar components.
FIG. 1 depicts a raised floor layout of an air cooled data center 100 typical in the prior art, wherein multiple electronics racks 110 are disposed in one or more rows. A data center such as depicted in FIG. 1 may house several hundred, or even several thousand microprocessors. In the arrangement illustrated, chilled air enters the computer room via perforated floor tiles 160 from a supply air plenum 145 defined between the raised floor 140 and a base or sub-floor 165 of the room. Cooled air is taken in through louvered or screened doors at air inlet sides 120 of the electronics racks and expelled through the back (i.e., air outlet sides 130) of the electronics racks. Each electronics rack 110 may have one or more air moving devices (e.g., fans or blowers) to provide forced inlet-to-outlet airflow to cool the electronic components within the drawer(s) of the rack. The supply air plenum 145 provides conditioned and cooled air to the air-inlet sides of the electronics racks via perforated floor tiles 160 disposed in a "cold" aisle of the computer installation. The conditioned and cooled air is supplied to plenum 145 by one or more air conditioning units 150, also disposed within the data center 100. Room air is taken into each air conditioning unit 150 near an upper portion thereof. This room air comprises in part exhausted air from the "hot" aisles of the computer installation defined by opposing air outlet sides 130 of the electronics racks 110.
In high performance server systems, it has become desirable to supplement air-cooling of selected high heat flux electronic components, such as the processor modules, within the electronics rack. For example, the System z® server marketed by International Business Machines Corporation, of Armonk, N.Y., employs a vapor-compression refrigeration cooling system to facilitate cooling of the processor modules within the electronics rack. This refrigeration system employs R134a refrigerant as the coolant, which is supplied to a refrigerant evaporator coupled to one or more processor modules to be cooled. The refrigerant is provided by a modular refrigeration unit (MRU), which supplies the refrigerant at an appropriate temperature.
FIG. 2A depicts one embodiment of a modular refrigeration unit 200, which may be employed within an electronic rack, in accordance with an aspect of the present invention. As illustrated, modular refrigeration unit 200 includes refrigerant supply and exhaust hoses 201 for coupling to a refrigerant evaporator or cold plate (not shown), as well as quick connect couplings 202, which respectively connect to corresponding quick connect couplings on either side of the refrigerant evaporator, that is coupled to the electronic component(s) or module(s) (e.g., server module(s)) to be cooled. Further details of a modular refrigeration unit such as depicted in FIG. 2A are provided in commonly assigned U.S. Pat. No. 5,970,731.
FIG. 2B is a schematic of one embodiment of modular refrigeration unit 200 of FIG. 2A, coupled to a refrigerant evaporator for cooling, for example, an electronic component within an electronic subsystem of an electronics rack. The electronic component may comprise, for example, a multichip module, a processor module, or any other high heat flux electronic component (not shown) within the electronics rack. As illustrated in FIG. 2B, a refrigerant evaporator 260 is shown that is coupled to the electronic component (not shown) to be cooled and is connected to modular refrigeration unit 200 via respective quick connect couplings 202. Within modular refrigeration unit 200, a motor 221 drives a compressor 220, which is connected to a condenser 230 by means of a supply line 222. Likewise, condenser 230 is connected to evaporator 260 by means of a supply line which passes through a filter/dryer 240, which functions to trap particulate matter present in the refrigerant stream and also to remove any water which may have become entrained in the refrigerant flow. Subsequent to filter/dryer 240, refrigerant flow passes through an expansion device 250. Expansion device 250 may be an expansion valve. However, it may also comprise a capillary tube or thermostatic valve. Thus, expanded and cooled refrigerant is supplied to evaporator 260. Subsequent to the refrigerant picking up heat from the electronic component coupled to evaporator 260, the refrigerant is returned via an accumulator 210 which operates to prevent liquid from entering compressor 220. Accumulator 210 is also aided in this function by the inclusion of a smaller capacity accumulator 211, which is included to provide an extra degree of protection against the entry of liquid-phase refrigerant into compressor 220. Subsequent to accumulator 210, vapor-phase refrigerant is returned to compressor 220, where the cycle repeats. In addition, the modular refrigeration unit is provided with a hot gas bypass valve 225 in a bypass line 223 selectively passing hot refrigerant gasses from compressor 220 directly to evaporator 260. The hot gas bypass valve is controllable in response to the temperature of evaporator 260, which is provided by a module temperature sensor (not shown), such as a thermistor device affixed to the evaporator/cold plate in any convenient location. In one embodiment, the hot gas bypass valve is electronically controlled to shunt hot gas directly to the evaporator when temperature is already sufficiently low. In particular, under low temperature conditions, motor 221 runs at a lower speed in response to the reduced thermal load. At these lower speeds and loads, there is a risk of motor 221 stalling. Upon detection of such a condition, the hot gas bypass valve is opened in response to a signal supplied to it from a controller of the modular refrigeration unit.
FIG. 3 depicts an alternate embodiment of a modular refrigeration unit 300, which may be employed within an electronics rack, in accordance with an aspect of the present invention. Modular refrigeration unit 300 includes (in this example) two refrigerant loops 305, or i.e., sets of refrigerant supply and exhaust hoses, coupled to respective refrigerant evaporators (or cold plates) 360 via quick connect couplings 302. Each refrigerant evaporator 360 is in thermal communication with a respective electronic component 301 (e.g., multichip module (MCM)) for facilitating cooling thereof. Refrigerant loops 305 are independent, and shown to include a compressor 320, a respective condenser section of a shared condenser 330 (i.e., a refrigerant-to-air heat exchanger), an air-moving device 331, and an expansion (and flow control) valve 350, which is employed by a controller 340 to maintain temperature of the electronic component at a steady temperature level, e.g., 29° C. In one embodiment, the expansion valves 350 are controlled by controller 340 with reference to temperature of the respective electronic component 301 TMCM1, TMCM2. The refrigerant and coolant loops may also contain further sensors, such as sensors for condenser air temperature in T1, condenser air temperature out T2, temperature T3, T3′ of high-pressure liquid refrigerant flowing from the condenser 330 to the respective expansion valve 350, temperature T4, T4′ of high-pressure refrigerant vapor flowing from each compressor 320 to the respective condenser section 330, temperature T6, T6′ of low-pressure liquid refrigerant flowing from each expansion valve 350 into the respective evaporator 360, and temperature T7, T7′ of low-pressure vapor refrigerant flowing from the respective evaporator 360 towards the compressor 320. Note that in this implementation, the expansion valves 350 operate to actively throttle the pumped refrigerant flow rate, as well as to function as expansion orifices to reduce the temperature and pressure of refrigerant passing through it.
In situations where electronic component 301 temperature decreases (i.e., the heat load decreases), the respective expansion valve 350 is partially closed to reduce the refrigerant flow passing through the associated evaporator 360 in an attempt to control temperature of the electronic component. If temperature of the component increases (i.e., heat load increases), then the controllable expansion valve 350 is opened further to allow more refrigerant flow to pass through the associated evaporator, thus providing increased cooling to the component. In extreme conditions, there is the possibility of too much refrigerant flow being allowed to pass through the evaporator, possibly resulting in partially-evaporated fluid, (i.e., liquid-vapor mixture) being returned to the respective compressor, which can result in compressor valve failure due to excessive pressures being imposed on the compressor valve. There is also the possibility of particulate and chemical contamination over time resulting from oil break-down inside the loop accumulating within the controllable expansion valve. Accumulation of contamination within the valve can lead to both valve clogging and erratic valve behavior.
Generally stated, disclosed herein is a thermoelectric-enhanced, vapor-compression refrigeration apparatus for facilitating dissipation of heat from one or more electronic components of, for example, an electronics rack. In one embodiment, one or more refrigerant evaporator(s) of the refrigeration system are conduction-coupled to the one or more electronic components to be cooled, with the heat load applied by the electronic component(s) to the refrigerant being variable, such that at design conditions, superheated vapor flows from the evaporator to the compressor, yet at lower loads, a liquid-vapor mixture might exit the refrigerant evaporator. In such a case, a controllable thermoelectric-enhanced, fluid-to-fluid heat exchange assembly is employed to add auxiliary heat to the refrigerant, and thereby ensure a superheated vapor flow to the refrigerant inlet of the compressor. Advantageously, the thermoelectric array draws heat from the compressed vapor exiting the compressor which further aids in the rejection of heat to take place in the condenser. The thermoelectric-enhanced, fluid-to-fluid heat exchange assembly is controlled by a controller which monitors the temperature and pressure of the refrigerant and adjusts the auxiliary heat load accordingly.
FIG. 4 illustrates a cooled electronic system 400, which includes an electronics rack 401 comprising one or more electronic components 405 to be cooled. By way of example only, one or more of electronic components 405 to be cooled by the cooling apparatus may be a multichip module (MCM), such as a processor-based MCM. Note also that in the embodiment of FIG. 4, a single-loop, cooled electronic system is depicted by way of example only. Those skilled in the art should note that the vapor-compression refrigeration apparatus illustrated in FIG. 4 and described below can be readily configured for cooling multiple electronic components (either with or without employing a shared condenser, as in the example of FIG. 7 (described below)).
In the implementation of FIG. 4, the cooling apparatus is a vapor-compression refrigeration apparatus with a refrigerant heat load QMCM applied by the electronic component(s). Refrigerant evaporator 410 is associated with the respective electronic component(s) 405 to be cooled, and a refrigerant loop 420 is coupled in fluid communication with refrigerant evaporator 410, to allow for the ingress and egress of refrigerant through the structure. Quick connect couplings 402 are provided, which facilitate coupling of refrigerant evaporator 410 to the remainder of the cooling apparatus. Refrigerant loop 420 is in fluid communication with a compressor 440, a condenser 450 and a filter/dryer (not shown). An air-moving device 451 facilitates airflow across condenser 450. In the embodiment of FIG. 4, refrigerant loop 420 also includes a fixed orifice expansion valve 411 associated with the refrigerant evaporator 410 and disposed, for example, at a refrigerant inlet to at least one channel 412 accommodating flow of refrigerant through the refrigerant evaporator 410.
By way of enhancement, FIG. 4 further illustrates incorporation of a thermoelectric-enhanced, liquid-to-liquid heat exchange assembly 430 in fluid communication with refrigerant loop 420. The thermoelectric-enhanced, liquid-to-liquid heat exchange assembly comprises a controllable thermoelectric array 431 disposed between a first heat exchange element 432 and a second heat exchange element 433. Thermoelectric-enhanced, fluid-to-fluid heat exchange assembly 430 is positioned and configured to controllably pump heat from the high-pressure gas refrigerant exiting compressor 440 to the refrigerant in the refrigerant loop about to enter the refrigerant inlet of compressor 440 to ensure that the refrigerant entering the compressor is in a superheated thermodynamic state. The use of thermoelectric elements to electronically transfer heat is known in the art, as represented by U.S. Pat. No. 6,557,354 B1, wherein the use of thermoelectric elements to facilitate the transfer of heat from, for example, a coolant, such as a water stream, to a warmer air stream, is described.
Thermoelectric control of the auxiliary heating applied to the refrigerant provides a number of advantages. For example, the thermoelectric module heat pumping capability is readily adjustable up or down by varying the electric current passing through the thermoelectric array. In general, a thermoelectric array's maximum heat pumping capability is proportional to the number of thermoelectric couples used, so the array can be readily scaled and modularized from small to large, depending upon the heat transfer rate desired. Since thermoelectric arrays operate electrically with no moving parts, they are essentially maintenance-free, and offer high reliability. Although reliability may be somewhat application-dependent, the life span of a typical thermoelectric element is greater than 200,000 hours. Unlike other heat dissipation approaches, a thermoelectric module generates virtually no electrical noise and is acoustically silent. Thermoelectric devices are also "friendly" to the environment, since they do not require the use of refrigerants or other gases.
FIG. 5 is a cross-sectional elevational view of one embodiment of a thermoelectric-enhanced, fluid-to-fluid heat exchange assembly 430, in accordance with an aspect of the present invention. In this example, first heat exchange element 432 is, as one example, a liquid-cooled cold plate, and second heat exchange element 433 is a second liquid-cooled cold plate, wherein refrigerant through first and second portions of the refrigerant loop (upstream and downstream, respectively, of the compressor) ingresses and egresses through the respective cold plate. Thermoelectric array 431 comprises, in this example, a plurality of thermoelectric modules 500, each of which comprises individual thermoelectric elements 501.
The use of large thermoelectric cooling elements is known. These elements operate electronically to produce a cooling effect. By passing a direct current through the legs of a thermoelectric device, a heat flow is produced across the device which may be contrary to that which would be expected from Fourier's law.
At one junction of the thermoelectric element, both holes and electrons move away, towards the other junction, as a consequence of the current flow through the junction. Holes move through the p-type material and electrons through the n-type material. To compensate for this loss of charge carriers, additional electrons are raised from the valence band to the conduction band to create new pairs of electrons and holes. Since energy is required to do this, heat is absorbed at this junction. Conversely, as an electron drops into a hole at the other junction, its surplus energy is released in the form of heat. This transfer of thermal energy from the cold junction to the hot junction is known as the Peltier effect.
Use of the Peltier effect permits the surfaces attached to a heat source to be maintained at a temperature below that of a surface attached to a heat sink. What these thermoelectric modules provide is the ability to operate the cold side below the ambient temperature of the cooling medium (e.g., air or water). When direct current is passed through the thermoelectric modules, a temperature difference is produced with the result that one side is relatively cooler than the other side. These thermoelectric modules are therefore seen to possess a hot side and a cold side, and provide a mechanism for facilitating the transfer of thermal energy from the cold side of the thermoelectric module to the hot side of the thermoelectric module.
By way of specific example, thermoelectric modules 500 may comprise TEC CP-2-127-06L modules, offered by Melcor Laird, of Cleveland, Ohio.
Note that the thermoelectric array may comprise any number of thermoelectric modules, including one or more modules, and is dependent (in part) on the size of the electronic modules, as well as the amount of heat to be transferred from refrigerant flowing through second heat exchange element 433, to refrigerant flowing through first heat exchange element 432. Also note that an insulative material (not shown) may be provided over one or more of the exposed surfaces of first heat exchange element 432 or second heat exchange element 433. As noted above, refrigerant within first heat exchange element 432 is selectively further heated to ensure that refrigerant entering compressor 440 (FIG. 4) is in the superheated thermodynamic state.
The thermoelectric (TE) array may comprise a planar thermoelectric array with modules arranged in a square or rectangular array. Although the wiring is not shown, each thermoelectric module in a column may be wired and supplied electric current (I) in series and the columns of thermoelectric modules may be electrically wired in parallel so that the total current supplied would be I×sqrt(M) for a square array comprising M thermoelectric modules, providing an appreciation of the inherent scalability of the array. In this way, if a single thermoelectric module should fail, only one column is effected, and electric current to the remaining columns may be increased to compensate for the failure.
Table 1 provides an example of the scalability provided by a planar thermoelectric heat exchanger configuration such as described herein.
For a fixed electric current and temperature difference across the thermoelectric modules, the heat pumped by the thermoelectric array will scale with the number of thermoelectric modules in the platform area. Thus, the heat load capability of a 650 mm×650 mm thermoelectric heat exchanger will be 1.23 times that of a 585 mm×585 mm thermoelectric heat exchanger, and that of an 845 mm×845 mm will be 2.09 times greater. Note that the size of the liquid-to-air heat exchanger may need to grow to accommodate the increased heat load. If the space available for the thermoelectric heat exchanger is constrained in the X×Y dimensions, then the heat pumping capabilities can still be scaled upwards by growing in the Z dimension. This can be done by utilizing multiple layers of thermoelectric modules between multiple heat exchange elements, with alternating hot and cold sides, as described in the above-referenced U.S. Pat. No. 6,557,354 B1.
Continuing with FIG. 4, a controller 460 is provided coupled in communication with one or more temperature sensor(s) T and one or more pressure sensor(s) P. Temperature sensor(s) T and pressure sensor(s) P are disposed to sense the temperature and pressure of refrigerant upstream of the refrigerant inlet to compressor 440. Using this information, controller 460 controls the electric current supplied by a DC power supply 470 to thermoelectric array 431. FIG. 6 depicts, by way of example, one embodiment of a control process which may be employed in connection with the thermoelectric-enhanced, vapor-compression refrigeration apparatus of FIGS. 4 & 5.
In the control process of FIG. 6, measurements of refrigerant temperature and refrigerant pressure at the inlet of the compressor are used to control the amount of heat load (or power) delivered by the controllable thermoelectric array. This auxiliary heat load is advantageously tailored to ensure that superheated vapor is received into the compressor, which in turn advantageously results in the elimination of the use of any adjustable expansion valve(s), which might otherwise be used, and be susceptible to fouling.
Referring to FIG. 6, a superheated thermodynamic state is ensured by first setting the heat load applied to the refrigerant by the controllable thermoelectric array (QTE) equal to an initial (or nominal) heat load value (QINIITAL) 600. The temperature of refrigerant (TR) and pressure of refrigerant (PR) at the inlet of the compressor are collected to determine the current thermodynamic state of the refrigerant 610. Processing then determines whether refrigerant entering the compressor is in a superheated state by less than or equal to a specified temperature difference (δTSPEC) from the absolute value of refrigerant temperature at superheated condition 620. In one example, δTSPEC may be 2° C. This determination can be performed, by way of example, using a table look-up based on known thermodynamic properties of the refrigerant. By way of specific example, pressure (P)—enthalpy (H) diagrams for R134a refrigerant are available in the literature which indicate the regions in which the refrigerant is sub-cooled, saturated and superheated. These diagrams or functions utilize variables such as pressure and temperature (enthalpy if the quality of a two-phase mixture needs to be known). Thus, the thermodynamic state of the refrigerant can be determined using pressure and temperature data and subsequently controlled using the addition of the auxiliary heat load, if required. The pressure and temperature values measured can be input into a refrigerant-dependent algorithm (defined by the P-H diagram and properties of the refrigerant) that determines if the refrigerant is superheated (or is saturated or is in liquid phase). It is desired that the coolant entering the compressor be slightly superheated, that is, with no liquid content. The extent of superheat can be characterized using a δTSPEC value, which is predetermined. It is undesirable to have a very high extent of refrigerant superheat, because this would mean that a substantial heat load has been added to the refrigerant, even after the refrigerant has completely changed from liquid to gas phase. This is considered unnecessary for compressor reliability, and would lead to highly inefficient refrigeration loop operation. It is desired to add only as much auxiliary heat load as needed to maintain a small degree of superheat for the refrigerant entering the compressor to ensure reliable compressor operation. Therefore, if the refrigerant entering the compressor is superheated by less than a specified temperature difference (δTSPEC), then the heat load applied by the controllable refrigerant heater is increased by a specified amount (δQ) 630. Alternatively, if the refrigerant entering the compressor is superheated by greater than the specified temperature difference (δTSPEC), then the heat load applied by the controllable refrigerant heater is decreased by the specified amount (e.g., δQ) 640. After adjusting the heater heat load, processing waits a defined time (t) 635 before repeating the process by again collecting current thermodynamic state data for the refrigerant, that is, refrigerant temperature (TR) and refrigerant pressure (PR) at, for example, the inlet to the compressor 610.
Referring collectively to FIGS. 4-6, in operation, high-pressure liquid refrigerant exits the condenser and flows through an orifice (or capillary tube), experiencing a substantial pressure drop. The low-pressure refrigerant then evaporates at a temperature dictated by the pressure in the evaporator, with the orifice and its associated pressure characteristic having been designed to achieve a desired temperature at the electronic component being cooled. If the electronic component is dissipating its maximum amount of heat, then the refrigerant exiting the refrigerant evaporator is superheated vapor, but if the electronic component is dissipating less than its maximum heat load, then the refrigerant exiting the evaporator may be a mixture of liquid and vapor. The refrigerant then passes through a first portion of the refrigerant loop, that is, the first heat exchange element of the thermoelectric-enhanced, fluid-to-fluid heat exchange assembly, and if liquid and vapor refrigerant are present, the controller applies a differential voltage to the thermoelectric device to add an auxiliary heat load to the refrigerant stream, such that the temperature and pressure of refrigerant entering the compressor is ensured to be superheated to a predetermined amount above saturation temperature. The compressor impels and pressurizes the refrigerant vapor, which then passes through the second portion of the refrigerant loop, which includes the second heat exchange element of the thermoelectric-enhanced, fluid-to-fluid heat exchange assembly. If auxiliary heat load is being added to the refrigerant upstream of the compressor, i.e., in the first heat exchange element, heat will be removed from the pressurized vapor in the second heat exchange element, via the thermoelectric array of the thermoelectric-enhanced, fluid-to-fluid heat exchange assembly.
The pressurized gas then passes through the condenser, where the refrigerant stream condenses to a high-pressure liquid and heat is expelled to the surroundings. The thermoelectric-enhanced, fluid-to-fluid heat exchange assembly functions to ensure superheated vapor is present at the compressor inlet, while advantageously removing heat from the refrigerant stream at the compressor outlet to aid the condenser. The heat pumping accomplished by the thermoelectric array is variable, dependent on the electrical current supplied to the thermoelectric array. Thus, the variable expansion valve can be eliminated. Advantageously, the apparatus presented herein pumps (in one embodiment) only enough heat from the high pressure vapor to the compressor inlet stream to ensure that no liquid refrigerant enters the compressor. The quantity of heat required to fully vaporize the inlet stream is the sum of the power required to operate the thermoelectric heat exchanger and the heat pumped by the thermoelectric heat exchanger. The power required to operate the apparatus presented herein is therefore always less than the heat required to vaporize the refrigerant upstream of the compressor (by the amount of heat pumped from the high pressure vapor to the compressor suction side). Furthermore, the load on the condenser is reduced compared to an approach which uses, for example, a heater to ensure superheated vapor at the compressor inlet, since the only addition to the heat load of the refrigeration cycle by the apparatus disclosed herein is the heat dissipated by the thermoelectric modules rather than the total amount of heat required to fully vaporize the compressor inlet stream.
In accordance with another aspect of the present invention, FIG. 7 depicts an alternate implementation of a cooled electronic system which does not require a mechanical flow control and an adjustable expansion valve within the refrigerant loop, such as described above in connection with the modular refrigeration unit of FIG. 3, and which ensures that refrigerant enters the compressor of the vapor-compressor refrigeration subsystem in a superheated thermodynamic state. In the embodiment of FIG. 7, a dual-loop, cooled electronic system is depicted by way of example. Those skilled in the art should note that the cooling apparatus depicted therein and described below can be readily configured for cooling a single electronic component, or a plurality of electronic components (either with or without employing a shared condenser, as in the example of FIG. 7).
As shown in FIG. 7, cooled electronic system 700 includes an electronics rack 701 which comprises multiple electronic components 705 to be cooled. By way of specific example, each electronic component 705 to be cooled by the cooling apparatus may be a multichip module (MCM), such as a processor MCM. In the illustrated implementation, the apparatus is a coolant-buffered, thermoelectric-enhanced, vapor-compression refrigeration apparatus, with a controlled refrigerant state at the compressor inlet. Coolant buffering is achieved by associating a coolant-cooled structure 710 with a respective electronic component 705 to be cooled. A coolant loop 720 is coupled in fluid communication with coolant-cooled structure 710 to allow for the ingress and egress of coolant through the structure, and quick connect couplings 702 facilitate coupling of coolant-cooled structure 710 to the balance of the respective cooling apparatus. Each coolant loop 720 is also in fluid communication with a coolant reservoir 721, a coolant pump 722 (which may be adjustable, depending on the implementation), and a coolant-to-refrigerant heat exchanger 730. In one example, coolant flowing through coolant loop 720 is water, however, other coolants may alternatively be employed. If a dielectric coolant is employed, then liquid-cooled structure 710 may comprise a sealable housing, which facilitates immersion-cooling of electronic component 705.
Each respective vapor-compression refrigeration subsystem of the cooling apparatus includes a refrigerant loop 740 in fluid communication with coolant-to-refrigerant heat exchanger 730, a compressor 741, a condenser section passing through a shared condenser 750, a filter/dryer 742, and a fixed orifice valve 743. As illustrated, an air-moving device 751 facilitates airflow across shared condenser 750. Note that, in an alternate implementation, each vapor-compression refrigeration subsystem of the cooling apparatus could incorporate its own condenser and air-moving device.
A thermoelectric-enhanced, liquid-to-liquid heat exchange assembly 780 is coupled between first and second portions of the respective refrigerant loop 740, disposed upstream and downstream of compressor 741. As described above, thermoelectric-enhanced, liquid-to-liquid heat exchange assembly 780 includes a first heat exchange element 782 and a second heat exchange element 783, each of which is in fluid communication with a respective first and second portion of the refrigerant loop. The thermoelectric array 781 comprises, in one embodiment, multiple thermoelectric modules disposed between the first and second portions of the refrigerant loop, with the first heat exchange element 782 of the first portion of the refrigerant loop in thermal contact with a first side thereof, and the second heat exchange element 783 of the second portion of the refrigerant loop in thermal contact with a second side thereof. As with the embodiment of FIG. 4, heat exchange assembly 780 operates to transfer heat from the high-pressure refrigerant downstream of compressor 741 to refrigerant within refrigerant loop 740 upstream of compressor 741. Temperature sensor(s) T and pressure sensor(s) P are disposed and associated with the first portion of refrigerant loop 740 (i.e., the upstream portion) to monitor the temperature and pressure of refrigerant. Controller 760 uses the monitored temperature and pressure information to control a DC power supply 770 powering the thermoelectric modules 781 of the respective thermoelectric-enhanced, liquid-to-liquid heat exchange assembly 780 to control the amount of heat being pumped to the refrigerant at the refrigerant inlet side of compressor 741 to ensure that the refrigerant at the inlet is in a superheated thermodynamic state, for example, in a manner such as described above in connection with FIG. 6.
In operation, each electronic component 705 applies a heat load (QMCM) to coolant passing through liquid-cooled structure 710. Coolant pump 722 circulates coolant through coolant loop 720. Refrigerant loop 740 absorbs the heat from the coolant passing through heat exchanger 730 and rejects this heat to an air stream via an air-cooled condenser 750. Advantageously, by ensuring that refrigerant passing into compressor 741 of the refrigerant loop is in a superheated thermodynamic state, compressor 741 can work at a fixed speed, and a fixed orifice 743 can be used within refrigerant loop 740 as an expansion valve for the vapor-compression refrigeration loop. The application of an adjustable, auxiliary heat load to the refrigerant by the thermoelectric-enhanced, liquid-to-liquid heat exchange assembly 780 means that the desired refrigerant state can be maintained at the refrigerant inlet of the compressor, allowing for a reliable design of the vapor-compression refrigeration subsystem.
As will be appreciated by one skilled in the art, aspects of the present invention may be embodied as a system, method or computer program product. Accordingly, aspects of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, micro-code, etc.) or an embodiment combining software and hardware aspects that may all generally be referred to herein as a "circuit," "module" or "system". Furthermore, aspects of the present invention may take the form of a computer program product embodied in one or more computer readable medium(s) having computer readable program code embodied thereon.
Any combination of one or more computer readable medium(s) may be utilized. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical or any suitable combination thereof. A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus or device.
A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain or store a program for use by or in connection with an instruction execution system, apparatus, or device.
Referring now to FIG. 8, in one example, a computer program product 800 includes, for instance, one or more computer readable storage media 802 to store computer readable program code means or logic 804 thereon to provide and facilitate one or more aspects of the present invention.
Computer program code for carrying out operations for aspects of the present invention may be written in any combination of one or more programming languages, including an object oriented programming language, such as Java, Smalltalk, C++ or the like, and conventional procedural programming languages, such as the "C" programming language, assembler or similar programming languages. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet Service Provider).
Although various embodiments are described above, these are only examples. For example, computing environments of other architectures can incorporate and use one or more aspects of the present invention. Additionally, the network of nodes can include additional nodes, and the nodes can be the same or different from those described herein. Also, many types of communications interfaces may be used. Further, other types of programs and/or other optimization programs may benefit from one or more aspects of the present invention, and other resource assignment tasks may be represented. Resource assignment tasks include the assignment of physical resources. Moreover, although in one example, the partitioning minimizes communication costs and convergence time, in other embodiments, the cost and/or convergence time may be otherwise reduced, lessened, or decreased.
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below, if any, are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiment with various modifications as are suited to the particular use contemplated.
wherein the controllable thermoelectric array is controlled to apply an auxiliary heat load to refrigerant passing through the first portion of the refrigerant loop to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state, and wherein the method further comprises providing a controller coupled to the controllable thermoelectric array for automatically controlling the auxiliary heat load applied by the thermoelectric array to refrigerant passing through the first portion, and a refrigerant temperature sensor and a refrigerant pressure sensor for monitoring a temperature and a pressure of refrigerant, respectively, within the refrigerant loop, and wherein the controller automatically adjusts the auxiliary heat load applied by the controllable thermoelectric array with reference to the monitored temperature of refrigerant and pressure of refrigerant within the refrigerant loop, and wherein the auxiliary heat load applied by the controllable thermoelectric array is automatically, incrementally increased responsive to refrigerant entering the compressor being superheated by less than a specified δT temperature threshold, and is automatically, incrementally decreased responsive to refrigerant entering the compressor being superheated by greater than a specified δT temperature threshold.
2. The method of claim 1, wherein the coupling comprises disposing the compressor in series fluid communication between the first portion and the second portion of the refrigerant loop, and wherein the method further comprises providing a condenser in fluid communication with the refrigerant loop, wherein the second portion of the refrigerant loop is disposed in fluid communication with, and between, the compressor and the condenser.
3. The method of claim 2, further comprising providing a refrigerant evaporator in thermal communication with the at least one electronic component, the refrigerant evaporator comprising at least one channel therein for accommodating flow of refrigerant therethrough, and wherein the refrigerant loop is coupled in fluid communication with the at least one channel of the refrigerant evaporator for facilitating flow of refrigerant therethrough, and wherein the method further comprises providing a fixed expansion orifice in fluid communication with the refrigerant loop for expanding refrigerant passing therethrough, the fixed expansion orifice being disposed at a refrigerant inlet to the refrigerant evaporator.
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Home > Counties > Uasin Gishu plans to install 9004 LED street lights
Uasin Gishu plans to install 9004 LED street lights
KNA1 November 26, 2021 Counties, Editor's Pick, Social, Uasin Gishu	0
The County government of Uasin Gishu plans to install 9004 LED street lights in urban areas and upcoming trading centre across the county to encourage a 24-hour economy by the end of 2022.
The county's 2018-2022 Integrated Development Plan (CIDP) envisions that the lighting project will enable businesses to operate in a secure environment.
Uasin Gishu Governor Jackson Mandago said the county has surpassed the lighting connectivity target both in rural and urban areas by over 1, 400 LED Street Lights this year.
According to the governor, 6,404 LED Street Lights have been installed, 30 High Mast and 32 15m floodlights have also been installed. In addition, 256 solar lights have also been installed across the county.
"The street lighting programme will be a major boost to businesses as it enables traders to work 24 hours and this will increase incomes and enhance the quality of life apart from improving security," said the governor.
Speaking while commissioning the street lights program at Kuinet centre Mandago who was accompanied by Kuinet Ward Member of County Assembly (MCA) Gilbert Bett, said most of the townships can now safely operate on a 24hour basis under a secure environment.
"Most of the townships are now safe and people living where this project has successfully been implemented need to utilize these lights in growing their economy," said Mandago.
He challenged the youth in the county to take advantage of the newly established markets and other townships' security lights programme to engage in income-generating activities to better themselves economically.
By Kiptanui Cherono
9004 LED street lights
Sh55 million Emgwen Technical College Commissioned
Mariba takes over as Nyandarua's new Commissioner
Registrar Cautions Parents Against Giving False Details
Nakuru Referral Hospital to get new oxygen plant
Kiswahili Councils to be set up in East Africa


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On a journey toward excellent health.
The Yukon-Kuskokwim Health Corporation, commonly referred to as YKHC, is a Tribal Organization that administers a comprehensive healthcare delivery system for 58 rural communities in southwest Alaska.
Each of the communities in our service area is home to a federally-recognized Tribe, whose governing council has authorized YKHC to provide health services on behalf of the federal Indian Health Service (IHS).
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Last week, YKHC senior leadership recognized several outstanding Employees of the Quarter. These employees exemplify a commitment to our mission -- Working Together to Achieve Excellent Health.
Pictured: (back row, from left) Gerald Gallagher, Jackie Larson, Deanna Latham, VP of Support Services, Patricia Smith, Patient Care Services Administrator, Kyle Larson, Jeremy Mute, Dr. Joseph Klejka, VP of Quality, Fred Watson, Shailee Nelson, Compliance Administrator, Rahnia Boyer, VP of Village Health, Jim Sweeney, VP of Hospital Services and Dan Winkelman, President & CEO.
(front row, from left) Chris Schroeder, Hosea Jones, John Morris, Jamie Hoffman and Bonnie Hunt.
Kris Manke, Robery Guy, Tom Bosco, Bao Tran, William Hoffman and Patrick Ayres were also recognized as Employees of the Quarter but unable to attend the celebration.


FULOKOJA Fees 2019/2020: FULOKOJA School Fees Schedule For 2019/2020 academic session – The Federal University, Lokoja, Kogi State, FULOKOJA new (freshers) and returning students fees structure for the 2019/2020 academic year has been released.
FULOKOJA school fees 2019/2020, FULOKOJA undergraduate school fees 2019/2020, FULOKOJA acceptance fees 2019/2020, FULOKOJA postgraduate school fees 2019/2020, FULOKOJA tuition and fees structure 2019/2020, FULOKOJA hostel accommodation fees 2019/2020… details below.
The management of the Federal University, Lokoja, Kogi State (FULOKOJA) has released the School Fees Structure to be paid by each undergraduate, postgraduate, Degree, Doctorate, Remedial, Direct entry, Full time, part time, Basic Certificate, PhD, Masters, Diploma, Certificate, Short Course and Non-Degree self and government sponsor students respectively for the 2019/2020 academic session.
The following policies and procedures are applicable to all students who officially register for programmes at the FULOKOJA. The Institute reserves the right to change fees without prior notice. However, fee changes are subject to approval by the Governing Council and we will update it ASAP.
SING has published the FULOKOJA Fees Structure below as released on the official website.
Federal University, Lokoja, Kogi State School Fees Structure is successfully uploaded online for Undergraduate Programmes.
FULOKOJA school fees schedule for each programme have been uploaded on the university official portal.
For more information and inquiries, you can contact the Federal University, Lokoja, Kogi State (FULOKOJA) by visiting the institution's official website or campus.


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Mr. Victorino is a special counsel in the Government Contracts, Investigations & International Trade Practice Group in the firm's Washington, D.C. office.
Mr. Victorino's practice involves both counseling and litigation in the Public Contract Law field, representing domestic and foreign concerns that sell products, construction or services to Federal, State, or local government agencies. In his 40 year career, he has litigated in excess of thirty matters before the Court of Federal Claims, the Boards of Contract Appeals, the Comptroller General, and various Federal District Courts.
Mr. Victorino writes and speaks extensively on government contracts matters including Thompson Reuters/Federal Publication's flagship course on Rights in Technical Data and Computer Software.
He is recognized as a Washington, D.C. Super Lawyer.
Currently representing Aerospace and Defense company in a Contract Dispute before the Armed Services Board of Contract Appeals defending the company's claims of commercial and government purpose rights licenses in technical data and software related to aircraft purchased by the United States Air Force.
Currently representing satellite company in negotiating long term hosted payload government contract with FAA.
Led a 10 person team of attorneys, legal assistants, and damages and scheduling consultants in the development of claims valued in excess of $270,000,000 under an information technology government contract. Assisted the client in successfully structuring a settlement without resort to litigation.
Assisted a major Aerospace and Defense client in evaluating data rights claims by critical subcontractor and assisted in developing a litigation strategy to defend against claims including involvement of antitrust and FAA counsel in effort. Settled short of litigation following exchange of position statements.
Served as government contracts issues counsel in federal district court litigation between a prime contractor and subcontractor related to multiple cross accusations of misappropriation of trade secrets, improper recruiting of employees, antitrust violations, and Procurement Integrity Act violations. Matter settled after extensive discovery and motions.
Assisted in the defense of a termination for default of a contract for the installation of a major software/information technology upgrade at a federal agency. Assisted in the development of affirmative constructive change claims in excess of $6,000,000 and breach of contract damages claim of $29,000,000. Termination damages in excess of $40,000,000 were asserted by the government. Successfully settled after four years of litigation in the United States Court of Federal Claims.
Led a team of attorneys and consultants in the defense of False Claims Act qui tam action filed in connection with the operation of a Department of Defense National Laboratory. Matter settled for nominal amount after extensive discovery and the filing of successful motions to dismiss and for partial summary judgment that eliminated key portions of the complaint or otherwise limited any potential damages.
Litigated at the Armed Services Board of Contract Appeals $3 million in constructive change claims under a contract to design and develop software designed to maintain Minuteman Missiles. The U.S. Air Force had defaulted the contract and demanded return of $4.2 million in progress payments.
Litigated at the Armed Services Board of Contract Appeals, resolved through an alternative disputes resolution process, a dispute regarding rights to software designed and developed to improve the administration of design, manufacturing, and procurement changes under the NASA Shuttle Program.
Represented multiple companies in lawsuits in state and federal courts against competitors' misappropriation and misuse of technical data and software.
The identification, development and negotiation of $25 million in constructive change claims arising under a Navy contract for the construction of two guided missile patrol craft.
The identification, development and litigation at the U.S. Court of Federal Claims of $8 million in constructive change claims arising under a contract for infrared decoy flares.
Assisted in the evaluation of data rights held by cutting edge technology acquisition target associated with a major, current government program. Assisted in the development of a strategy to "quiet title" to the intellectual property and thereby enable the client to move forward with the acquisition.
Advised underwriter's counsel in initial public offering of telecommunications company whose primary assets were patents related to inventions made during the course of Government contracts. Identified remedial actions necessary to resolve patent ownership issues.
Assisted Fortune 100 hi-tech commercial company in its initial entry into federal contracting market including advice regarding risk levels of various contract vehicles and procurement clauses. Assisted the companies in understanding obligations under various socio-economic clauses and programs and assisted in establishing policies and procedures to enable compliance. Provided advice regarding corporate structure to minimize or insulate various risks.
Assist clients in dealing with cost and accounting and management systems audits including responding to adverse findings under DCAA and civilian agency incurred cost audits. Advised on a broad spectrum of accounting and cost allowability and allocability issues including issues related to IR&D costs, Pension costs, Executive Compensation costs, Environmental costs, and Management and Accounting System Deficiencies.
Assisted numerous contractors in negotiation of patent and data rights with the Government including designers/developers of simulation software, designer/developer of computer hardware and software, first response software, developers of chemical, biological, radiological, nuclear and explosive detection products, satellite communication software and hardware, designers/developers of aircraft components, patentable fuze technology, patentable weapon laser technology, and patentable air refueling technology.
Assisted foreign based and traditional commercial companies become involved in federal government contracting including advice regarding corporate structure, protection of intellectual property rights, and special risks associated with the federal government market.
Developed and assisted in negotiating teaming agreements for multiple companies involved in classified research and development programs, for suppliers of military aircraft components, and developer suppliers of communications and information technology products and services.
Provided advice regarding a potential organizational conflict of interest ("OCI") and assisted the software development client in developing a mitigation plan to enable it to bid on future work notwithstanding the potential OCI.
Assisted foreign owned or controlled companies in the acquisition of domestic national defense companies, including preparing and filing requisite notices and documentation necessary to novate existing contracts.
"The Patent Rights and Technical Data Rights Clauses," Chapter 1, Rights in Technical Data and Patents Under Government Contracts," Federal Publications Inc. 1986-12 eds.
"Business Practices Required to Protect Proprietary Property," Contracts Conference, Fortune 200 Aerospace Defense Contractor, October 5, 2011.
"Government Contract Novation Agreements," Contracts Conference, Fortune 200 Aerospace Defense Contractor, October 19, 2010.
"Enforcing Data Rights," Briefing Papers, No. 91-10 (September 1991), 9 BPC 471.
"More Contract Clauses (The Inspection, Warranty, and Termination Clauses)," Chapter 6, Fundamentals of Government Contracting, Federal Publications Inc. 1982-05 eds.
"Commercial Item Exemptions To The Truth In Negotiations Act And Cost Accounting Standards Under FASA And The Clinger-Cohen Act," Third Annual Federal Procurement Institute, American Bar Association, Public Contract Law Section, Feb. 27 & 28, 1997.
"Multiple Award Task & Delivery Order Contracts" Briefing Papers, No. 96-10 (September 1996).
"Competing for Professional Services Contracts," Briefing Papers, No. 94-10 (September 1994).
"Antitrust Implications of Defense Industry Business Combinations," Briefing Papers, No. 93-7 (June 1993).
"Government Failure To Disclose," Briefing Papers, No. 92-10 (September 1992).
"Payment Delay Claims," Proving and Pricing Construction Claims (John Wiley & Sons 1990).
"Non-Recurring Cost Recoupment," Briefing Papers, No. 90-10 (September 1990), 9 BPC 205.
"Qui Tam Lawsuits," Briefing Papers, No. 89-10 (September 1989), 8 BPC 427.
"The Inspection Clause," Briefing Papers, No. 88-10 (September 1988), 8 BPC 199.
"The IR&D/B&P/Selling Costs Dilemma," Briefing Papers, No. 87-10 (September 1987), 7 BPC 625.
"Compliance Programs," Briefing Papers, No. 86-11 (October 1986), 7 BPC 387.
"Acquisitions and Mergers," Briefing Papers, No. 85-9 (September 1985), 6 BPC 351.
"Personal Compensation Costs," Briefing Papers, No. 84-6 (June 1984), 6 BPC 351.
"Post-Termination Costs/Edition II," Briefing Papers, No. 83-6 (June 1983), 6 BPC 171.
"Bid Protest Suits In Federal Courts," Briefing Papers, No. 83-4 (April 1983), 6 BPC 141.
"The Inspection Clause," Chapter 1, Inspection, Acceptance and Warranties (Federal Publications, Inc. 1988-99 eds.).
"U.S. Defence Contracting and FAR Compliance in Europe," C5's Forum Conference, June 26-27, 2013, London, UK.
"Evaluating Data Rights in DoD Source Selections and IP Valuation," 2013 Data Rights Forum, Aerospace Industries Association, June 19, 2013, Arlington, VA.
"The Patent and Technical Data Rights Clauses," Rights in Technical Data and Patent Rights Under Government Contracts, Federal Publications Seminars, 1986 - 2012.
"The FAR Mandatory Disclosure Rule," Federal Publications Seminars, 2010 - 2012 (with Jonathan S. Aronie).
"Protecting Your Client's Technology: Intellectual Property Under Federal Government Contract- A Primer," 18th Annual IP Fall CLE Seminar, The Intellectual Property Section of the Virginia State Bar.
"Advanced Subcontracting & Teaming Agreements," Federal Publications Seminars, 2004-2010 (with John Chierichella).
"Tales from the Dark Side - Government Contractors Horror Stories and Lessons We Can Learn From Them," Security Institute program - The Government Security Market, April 25, 2006, Washington, D.C.
"The Inspection, Warranty, and Terminations Clauses," Fundamentals of Government Contracting, Federal Publications Seminars, 1982-2005.
"The Inspection Clause," Inspection, Acceptance, and Warranties, Federal Publications Seminars, 1988-Present.
"Technical Data Rights: Legislative and Administrative Developments," The Government Contracts Year In Review, Federal Publications Seminars, 1992-2000.