Publisher Summary This chapter discusses the thin-film technologies. The deposition of ceramic materials is described with the generally accepted subdivision into physical and chemical methods. Physical methods may be characterized by an adsorption and condensation process of the atoms or molecules at the substrate surface, and generally, by a locally well-defined particle source and a free flight in vacuum to the substrate. For chemical methods, a chemical reaction is involved and the so-called precursor molecules dissociate at the hot substrate surface and release the atoms of interest. Some basic characteristics of the methods are summarized; however, the characterization is sometimes not very specific as the parameters depend strongly on the properties of the material of actual interest. One can restrict the discussion on the different methods as there are very detailed review articles and textbooks for all the deposition methods. This chapter focuses on electroceramic thin films necessary for the deposition of oxide films.