A new acetamide based eutectic solvent is obtained via complexation with AlCl3. The electrodeposition of aluminum is successfully achieved from AlCl3/acetamide eutectic solvent. The cyclic voltammograms on tungsten electrode indicate that Al(III) are easier to be reduced from AlCl3/acetamide eutectic solvent at a molar ratio in a range of 1.1 to 1.5. Aluminum coatings were prepared at −0.25V (vs. Al/Al3+) and different temperatures at 313K and 333K in AlCl3/acetamide eutectic solvent at molar ratio=1.3 (r=1.3). The SEM images show that thick adherent aluminum films were deposited on the copper substrate. The EDS and XRD analysis confirm that the obtained deposits are pure aluminum. The present results allowed the new and cheap AlCl3/acetamide eutectic solvent to be a potential electrolyte for aluminum electrodeposition at room temperature.