 A novel hierarchical structure is reported that comprises micro-channeled nickel deposited onto a copper substrate. The fabrication process is a one-step galvanostatic electrodeposition in a system containing a Cu cathode, graphite anode, and Ni2+/NH4+ electrolyte. Results were obtained by the characterization of vertically aligned micro-channels in Ni. The pore density, depth, and diameter are controlled by varying electrodeposition conditions. The addition of ammonium ions, increased current, and longer deposition time are found to promote formation of high density pores with small diameters leading to those micro-channels. The channel’s optimum diameter ranged from 8 to 10 µm with depths of 20–25 µm. Adding ammonium ions also generated streams of hydrogen bubbles that formed on the cathode surface. Those bubbles hinder the nucleation of Ni, resulting in the selective nucleation and therefore the growth of micro-channels. The novel hierarchical Ni/Cu hybrids have the potential to be used for current collectors for battery electrodes, substrates to grow nanostructured oxides, and among others.