An electroplated copper/tin (Cu/Sn) anode with a layered structure is described that minimizes the high-voltage irreversible capacity observed in an electroplated Sn anode at a potential over 1V. The high-voltage irreversible capacity is caused by the electrolyte decomposition at the catalytic site of the Sn anode. In the electroplated Cu/Sn anode, the upper Cu layer effectively suppresses the exposure of the newly formed Sn surfaces, resulting in the absence of the high-voltage irreversible capacity. Therefore, the electroplated Cu/Sn anode exhibits a higher cycle performance than the electroplated Sn anode.