The effects of Cu substrate morphology and ageing on the cycle performance of a Sn-anode electroplated on a smooth, a pyramid and a nodule-type Cu substrate and aged at 200°C for 0, 1, 5, 20h in a vacuum were examined. The Sn-anode electroplated on the nodule-type Cu substrate and aged for 1h exhibited the highest reversible capacity (up to ∼600mAhg−1) and a stable cycle performance, which resulted from the enhancement in adhesion and electrical contact properties between the Sn layer and the Cu substrate by the mechanical interlocking effect of the nodule-type Cu substrate and also by the buffering effects of an intermetallic compound formed by the ageing process. However, when aged for longer than 1h at 200°C, the reversible capacity of the Sn-anode decreased significantly due to the formation of an inactive Cu3Sn phase, irrespective of the morphology of the Cu substrate.