TO ENABLE VERY-HIGH-DATA-RATE applications, the IEEE 802.15.3c
standards group is defining specifications for 60-GHz radios
that use only a few gigahertz of unlicensed spectrum. Typically,
those radios have been designed by assembling several monolithic
microwave integrated circuits (MMICs) in gallium-arsenide (GaAs)
semiconductor technology. Yet a recently proposed antenna, which
targets highly integrated 60-GHz radios, is specifically
designed to exhibit capacitive input impedance that complements
low-cost wirebonding packaging and assembly techniques. It was
developed by Y.P. Zhang and M. Sun from Nanyang Technological
University, K.M. Chua and L.L. Wai from Singapore Institute of
Manufacturing Technology, and Duixian Liu from the IBM T.J.
Watson Research Center. At millimeter-wave frequencies, one
challenge is the realization of a low-loss interconnection
between a radio chip and antenna using a wirebonding technique.
Although this antenna-inpackage (AiP) design may provide an
answer, it also invites the