US 4088828 A A printed circuit board wherein a conductor pattern
is printed on an insulating base, first solder resist layers are
formed on the surface of the conductor pattern remaining lands
which are for soldering thereon, second solder resist layers for
prevention of bridging for preventing bridging of solder are
formed at least at portions where the gap between the lands is
narrow, and thereby electronic parts such as an IC can be
reliably assembled on the printed circuit board. 1. A printed
circuit board comprising an insulating base, a conductor pattern
printed on said insulating base, a first solder resist layer
formed on the entire surface of the conductor pattern remaining
lands which are for soldering thereon, and a second solder
resist layer for prevention of bridging of interland gaps by
solder, said second solder resist layer being formed on said
first solder resist layer at least over portions thereof where
interland gaps are narrow. 2. A printed circuit board according
to claim 1, wherein said