MEMS are intelligent, miniaturized 3D devices consisting of
microelectronic components (integrated circuits) and
micromechanical, optical, chemical, biochemical, or micro-
optical components. MEMS technology is a rapidly emerging field
with a high growth rate. Motion sensors, micro mirrors,
microphones, gyroscopes, and accelerometers are just a few of
the MEMS devices that are found in consumer applications such as
cell phones, television sets, digital cameras, gaming devices
and laptops. Many MEMS devices require silicon wafer bonding to
create a first level package - for example silicon or glass
bonding - as a method to hermetically seal and encapsulate the
device. The EVG wafer bonding systems are designed for volume
manufacturing of MEMS and perform all wafer bonding techniques
utilizing EVG's unique process separation principle. Various
wafer sizes and materials with modular configurations for easy
transfer of R&D processes to production are supported. EVG's
wafer bonding equipment achieves the highest yi