US 4694378 A A boiling type cooling structure for cooling
semiconductor chips mounted on printed circuit cards, with a
heat conductive stud being attached to the surface of each chip.
Cooling plates with fins, arranged so as to surround the
circumference of each heat conductive stud, are placed between
the printed circuit cards in order to condense the vapor bubbles
produced near the heat conductive studs. 1. In a cooling
apparatus cooling, by a boiling action of a dielectric liquid,
integrated circuit chips mounted on printed circuit cards, each
printed circuit card being submerged longitudinally in the
dielectric liquid with a space provided therebetween, the
cooling apparatus comprising stud means formed of a heat
conductive material attached to a surface of respective
integrated circuit chips promoting a boiling action to enhance a
heat transfer efficiency to the dielectric liquid; cooling plate
means arranged adjacent printed circuit cards in the cooling
apparatus, the cooling plate means being cooled by