US 4878152 A A mounting that forms a heat sink for printed
circuit boards comprising a graphite core oriented by
compression to obtain very high lateral thermal conductivity and
relatively low density is disclosed. This core is held by two
outer skins made up of folds of carbon fibers embedded in an
epoxy resin matrix. A metallic frame made of invar makes the
mounting rigid, thus giving mountings that conduct heat very
well while at the same time being light. 1. A mounting for
printed circuits, said mounting forming a heat sink having low
heat expansion characteristics, comprising: (i) a central
graphite layer made of compressed graphite sheets having a
lateral thermal conductivity greater than 200 W/m. lower than
1.4; said sheets consisting essentially of particles highly
oriented in the plane of each sheet; and (ii) two outer layers,
each made of carbon fibers bound together by a resin matrix,
said outer layers displaying a high Young'modulus and
sandwiching the central graphite layer. 2. A mounting accordi