|Mechanical Behavior of Indium Nanostructures| Indium is a key
material in lead-free solder applications for microelectronics
due to its excellent wetting properties, extended ductility, and
high electrical conductivity. With the size of electronic
devices continuing to shrink and the promise of indium-based
nanotechnologies, it is important to develop a fundamental
understanding of this material's small-scale mechanical
properties and reliability. Researchers from the University of
Waterloo, California Institute of Technology, and Los Alamos
National Laboratory have collaborated with a team at ALS
Beamline 12.3.2 to investigate the small-scale mechanics of
indium nanostructures. Scanning x-ray microdiffraction (μSXRD)
studies revealed that the indium microstructure is typical of a
well-annealed metal, containing very few initial dislocations
and showing close-to-theoretical strength. Metallic nanopillars
suitable for mechanical testing were fabricated by lithographic
patterning of a polymethylmethacrylate (P