Research on High Precision Micro assembly Technology for Automated MEMS Thermopile Chip Die Bonding Process
The focus of this paper is to develop high precision MEMS thermopile automated die bonding system. Firstly, the working principle of MEMS thermopile chip is explained and the minimum threshold value of the die bonding precision is 200 um. Based on the solid state process of MEMS thermopile chip, the influence of die bonding precision on chip temperature measurement and chip die bonding strength is analyzed. On this basis, the mechanical composition of high precision automated die bonding system is determined, so that the hardware accuracy of the system meets the requirements. By analyzing the image characteristics of silver paste and chip, different image processing algorithms are determined to improve the recognition accuracy of the image. Using the multi factor analysis of variance method, the MEMS thermopile automated die bonding system is used as the experimental platform to determine that the pressure parameters is the primary factor of the die bonding process. And through the dispensing experiment, the optimal pressure value of the die bonding system is determined. Finally, the precision of the MEMS thermopile die bonding system was verified under the optimal pressure parameters. The results show that the MEMS thermopile automated die bonding system can achieve patch with accuracy within 25um when the pressure parameter is 0.3MPA. It meets the accuracy requirements and helps to improve the reliability and yield of MEMS thermopile chip packages.
2018 IEEE International Conference on Robotics and Biomimetics (ROBIO)