Hybrid Sintering Glue and Stencil Printing Process: New Generation Die Attach Method for Quad Flat No Leads Package
Quad Flat No Leads as the emerging package technology that can cater high power application due to its design capable of high frequency and better thermal dissipation. Hybrid Sintering glue was also introduced in order to meet this high thermal demand without going to lead solders. Yet, the integration of these two emerging technologies offers challenges during the package and process development. The need of consistent bond line thickness resulted to the development of Stencil printing process. This old but reliable surface mounting technology helps secure the stability of bond line thickness. The paper will discuss the different material and process design of experiments to establish the different package requirements. Material characterization focuses on parameters, such as viscosity, thixotropic index and die pad material. Lastly, process characterization defined the critical parameters to ensure that no visual mechanical issue will arise and a stable bond line thickness achieved.
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)