Effects of hollow microspheres on the thermal insulation of polysiloxane foam
Polysiloxane foam (SIF) was prepared through foaming and crosslinking processes and reinforced with modified hollow microspheres (HMs) The HM filler was modified with vinyl trimethoxysilane to improve the compatibility between the vinyl trimethoxysilane modified hollow microsphere (VMS HM) and the matrix. The treated HMs were characterized through Fourier transform infrared spectroscopy, environmental scanning electron microscopy, and energy spectroscopy. The thermal stability and insulation of the composites were investigated through differential scanning calorimetry, thermogravimetric analysis, and thermal conductivity. SIF with 5% VMS HMs yielded a minimum thermal conductivity of 0.078 W/mK. The thermal stability was improved by the addition of HM, and the mechanical properties were significantly enhanced. (c) 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2017, 133, 44778.