Preparation method of porous copper full impregnated film of three dimensional network structure
The invention relates to a preparation method of a porous copper full impregnated film of a three dimensional network structure. The method comprises the following steps that (1) a basic plating solution is prepared, wherein the basic plating solution comprises 1.0mol/L of H2SO4 and 0.2mol/L of CuSO4; (2) electrochemical deposition is carried out, wherein in a depositing cell, a graphite sheet serves as a positive electrode, aluminum foil serves as a negative electrode, the basic plating solution serves as electrolytes, and an electrochemistry working station is used for carrying out constant current density electrolytic deposition to form the porous copper film on the aluminum foil; (3) vacuum annealing treatment is carried out on the porous copper film on the aluminum foil; (4) an aluminum substrate is removed, wherein aluminum foil obtained after vacuum annealing treatment is placed in alkali liquor to have a reaction, the aluminum foil is removed, and the porous copper full impregnated film of the three dimensional network structure is obtained. Compared with the prior art, the porous copper full impregnated film of the three dimensional network structure is even in bore diameter and stable in structure and has the good filtering separation function, and meanwhile due to the large specific area, and the good toughness, the film can be used as a good catalyst carrier.