3D System Design: A Case for Building Customized Modular Systems in 3D
<|reference_start|>3D System Design: A Case for Building Customized Modular Systems in 3D: 3D promises a new dimension in composing systems by aggregating chips. Literally. While the most common uses are still tightly connected with its early forms as a packaging technology, new application domains have been emerging. As the underlying technology continues to evolve, the unique leverages of 3D have become increasingly appealing to a larger range of applications: from embedded mobile applications to servers and memory systems. In this paper we focus on the system-level implications of 3D technology, trying to differentiate the unique advantages that it provides to different market segments and applications.<|reference_end|>
@article{emma20243d,
    title={3D System Design: A Case for Building Customized Modular Systems in 3D},
    author={Philip Emma, Eren Kurshan},
    journal={In Proceedings of 2010 IEEE International Interconnect Technology
  Conference. IEEE, 2010. p. 1-3},
    year={2024},
    archivePrefix={arXiv},
    eprint={2409.09068},
    primaryClass={cs.DC cs.ET}
}