mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems
<|reference_start|>mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems: This work presents mm-Wave and sub-THz chip-to-package transitions for communications systems. To date, reported transitions either have high loss, typically 3 to 4 dB, or require high cost packages to support very fine bump pitches and low loss materials. We analyze the impact of transitions on a high frequency, wide bandwidth communication system and present the design of a chip-to-package transition in two different commercial packaging technologies. The proposed transitions achieve <1 dB loss in both technologies, validating the design methodology.<|reference_end|>
@article{baniasadi2024mm-wave,
    title={mm-Wave and sub-THz Chip-to-Package Transitions for Communications
  Systems},
    author={Nima Baniasadi, Rami Hijab, Ali Niknejad},
    journal={arXiv preprint arXiv:2404.19263},
    year={2024},
    archivePrefix={arXiv},
    eprint={2404.19263},
    primaryClass={eess.SY cs.SY}
}