There is provided an electroencephalogram (EEG) sensing assembly. The EEG sensing assembly includes a support layer having an outer side and an opposite inner side for facing a head of a user and at least one sensing electrode. The at least one sensing electrode includes an electrically conductive layer positioned against the inner side of the support layer, a resilient member positioned between the support layer and the electrically conductive layer, and a pair of cooperating snap rings including a first snap ring positioned against the conductive layer and including prongs for engaging through the electrically conductive layer, the resilient member, and the support layer and a second snap ring positioned against the outer side of the support layer and including a socket for snap-fitting the prongs of the first snap ring for retaining together the electrically conductive layer, the resilient member and the support layer.
ELECTROENCEPHALOGRAPHY (EGG) SENSING ASSEMBLY