A metering-level 3D super-depth-of-field microscopic system, which relates to the technical field of photoelectric nondestructive 3D measurement. The microscopic system comprises an optical microscopic unit, a photoelectric contour sensor unit, an x-y-z-axis electric displacement platform, a control module and a PC processor, wherein the x-y-z-axis electric displacement platform comprises an x-y-axis translation platform and a z-axis lifting module; an optical microscope is configured with an illumination light source and an image collection unit; the control module comprises an x-y-z electric control unit, a signal processor connected to the photoelectric contour sensor, and a power source module; and the image collection unit is used for collecting image information of a target measurement area and transmitting the image information to the PC processor. By implementing a corresponding measurement method by means of the metering-level 3D super-depth-of-field microscopic system, a sample can be observed in a nondestructive manner, and photographing, 3D true color imaging and 3D accurate measurement can be performed on the microscopic state of a surface material over an ultra-large area, thereby achieving metering-level measurement precision, and preserving the details and the real color of a microscopic sample.
METERING-LEVEL 3D SUPER-DEPTH-OF-FIELD MICROSCOPIC SYSTEM AND MEASUREMENT METHOD