A low heat release, low density, fiber-reinforced composite comprises a matrix comprising a thermoplastic polymer selected from polyarylsulfone, polyethersulfone, polyetheretherketone, polyetherketoneketone, a copolycarbonate of 4,4'-thiodiphenol and at least one of bisphenol A, 9,9-bis(4-hydroxyphenyl) fluorene, and 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane, a copolycarbonate of bisphenol A and 9,9-bis(4-hydroxyphenyl) fluorene, 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane polycarbonate, bisphenol A polycarbonate, and polyetherimide, and having from 10 to 70 percent by weight of the composite of randomly oriented reinforcing fibers, less than 12.75 mm (0.5 inch) in length, distributed throughout the matrix. The matrix has a void volume of from 20 to 90 percent by volume and the composite has a thermoplastic skin layer on each of the major surfaces thereof.
Low heat release polymeric composites.