A 3D model analysis method includes: projecting, by a processing circuit, multiple sample points in a 3-dimensional model of a scene to one or more 2-dimensional planes in order to obtain one or more2-dimensional images corresponding to the 3-dimensional model of the scene; performing, by the processing circuit, an object segmentation and classification based on the one or more 2-dimensional images to obtain 2-dimensional sematic information on the one or more 2-dimensional planes; and projecting, by the processing circuit, the 2-dimensional sematic information to the 3-dimensional model of the scene to identify one or more target objects in the scene. Therefore, dimensionality reduction can be achieved by two-dimensional and three-dimensional mutual projection to speed up the analysis process and reduce the computational complexity and required computation time, and bring a smoother user experience.
3D MODEL ANALYSIS METHOD, ELECTRONIC DECIVE, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM