Provided is a negative photosensitive resin composition contains a polyimide precursor, a photo polymerization initiator, and a solvent. The polyimide precursor has a repeating unit represented by formula (1), has a structure represented by '(A)l-L1-*' on at least one of the terminals, and a weight-average molecular weight not exceeding 50000. In formula (1), X represents a divalent organic group, Y represents a tetravalent organic group, and R1 and R2 each independently represent nonpolymerizable organic groups. In the abovementioned structure, A represents a polymerizable group, L1 represents a single bond or an l+1-valent organic group, l represents an integer from 1 to 10, and * represents a binding site with another site.
Negative photosensitive resin composition, cured film, method for producing cured film, semiconductor device, method for producing laminate, method for producing semiconductor device, and polyimide precursor