<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition which excels in properties such as adhesive force, heat resistance, insulation, flatness and chemical resistance and is suitable for use as a material of an interlayer organic insulation film because it exhibits excellent sensitivity, residual film ratio and UV transmittance particularly in formation of an organic insulation film of a liquid crystal display device, and which is used as a resist resin for an overcoat, for a black matrix, for columnar spacers or for a color filter and enhances sensitivity and residual film ratio. <P>SOLUTION: The negative photosensitive resin composition comprises (a) an acrylic copolymer obtained by copolymerizing (i) an allyl acrylic compound, (ii) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride or a mixture of these, (iii) an epoxy group-containing unsaturated compound and (iv) an olefinically unsaturated compound, (b) a photoinitiator, (c) a polyfunctional monomer having an ethylenically unsaturated bond, (d) a silicon compound containing an epoxy group or an amine group, and (e) a solvent. <P>COPYRIGHT: (C)2007,JPO&INPIT 
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION