A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I):<paragraph lvl='0'><in-line-formula>R1-X (I)</in-line-formula>wherein -X represents -OR2, -COOH, -SO3H, -CONHR2, -COR2, -SO2NHR2, -HNCONHR2, or -HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when -X is -OH, then R1 represents a group other than a hydrogen atom and an aromatic hydrocarbon group, in a range of 0.001 - 0.3 wt % based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.
Negative-working photosensitive resin composition and photosensitive resin plate using the same