The present invention relates to a negative photosensitive resin composition which responses to long wavelength UV, and specifically to a negative photosensitive resin composition including (a) a single or mixed copolymer among (i) an acryl-based copolymer, (ii) a polyimide-based copolymer, and (iii) a siloxane-based copolymer; (b) a photoinitiator; and (c) an acridine-based photosensitizer of a specific structure. The negative photosensitive resin composition according to the present invention is superior in the resolution, the transparency, the thermochromic resistance, and the adhesion power, and particularly superior in the sensitivity to long wavelength UV of 405 to 435nm, and suitable to be used in a light exposure device for GH-line or a next generation digital light exposure.
Negative photosensitive resin composition