PROBLEM TO BE SOLVED: To obtain a negative type photoresist compsn. by incorporating a specified polyimide primer as a base, a photoinitiator and an organosilicon compd. having one or more hydroxyl groups. SOLUTION: This photoresist compsn. contains a polyimide primer contg. repeating structural units represented by forming I, a photoinitiator for polymerizing olefinic double bonds and at least one component selected from among an organosilicon compd. having one or more hydroxyl groups, a compd. represented by formula II, a compd. represented by formula III and a mixture of two or more kinds of such compds. In the formulae I-III, A1 is O, etc., R1 is a residue having a photopolymerizable olefinic double bond, each of [X] and [M] is a residue of cyclic dianhydride of tetracarboxylic acid, Y is a residue of a diamine, each of A2 and A3 is O, etc., [G] is an aliphatic group, etc., R2 is a residue of aryl and each of R3 and R0 is a residue having a photopolymerizable olefinic double bond.
NEGATIVE TYPE PHOTORESIST COMPOSITION BASED ON POLYIMIDE PRIMER