Stacked neuromorphic devices and neuromorphic computing systems are provided. A stacked neuromorphic device includes a logic die including a control circuit and configured to communicate with a host, and core dies stacked on the logic die and connected to the logic die via through silicon vias (TSVs) extending through the core dies. The core dies include a neuromorphic core die including a synapse array connected to row lines and column lines. The synapse array includes synapses configured to store weights and perform a calculation based on the weights and input data. The weights are included in layers of a neural network system. The control circuit provides the weights to the neuromorphic core die through the TSVs and controls data transmission by the neuromorphic core die.
Stacked neuromorphic devices and neuromorphic computing systems