9. The method of claim 1, wherein the adjusting the first thermal offset value to the second thermal offset value is for only the thermal sensor, and thermal sensors of the plurality of thermal sensors other than the thermal sensor have at least one of no adjustment to a respective thermal offset value or an individual adjustment to the thermal offset value separate from the adjusting the first thermal offset value to the second thermal offset value.
10. The method of claim 1, wherein values corresponding to the first thermal offset value and the second thermal offset are set during startup or initialization based at least in part on secure boot software.
11. The method of claim 1, wherein the IC corresponds to at least one of graphics processing unit (GPU), a central processing unit (CPU), a system on a chip (SOC), a sound chip, a network interface chip, a memory IC, a monolithic IC, a hybrid IC, a multi-chip IC, a digital IC, an analog IC, a mixed signal IC, a logic IC, an audio amplifier, an operational amplifier, a timer IC, a power management IC, an interface IC, or a combination thereof.
12. The method of claim 1, wherein values corresponding to the first thermal offset value and the second thermal offset value are determined using at least one of thermal simulations of a virtual representation of the IC or thermal observations of the IC.

### Language ###
English

### Assessment ###
Could ask about what type of devices or components this could apply to, since claim 11 provides a comprehensive list.

### Query ###
What are different types of processors or chips that can have thermal monitoring systems?
What are different types of processors or chips that can have thermal monitoring systems?