Previous to this appointment, David was a Senior Technical Staff Member at IBM Canada’s Bromont, Quebec location within the IBM Microelectronics Division, having worked with IBM for 32 years in various aspects of semiconductor device packaging. His degrees are in Metallurgical Engineering from McGill University in Montreal, he holds 42 patents and has authored numerous technical publications. As a member of IEEE’s Electronic Packaging Society (EPS), David also serves on a number of conference and transactions committees.