He obtained his Ph.D. degreeat Michigan State University in 2009and B.S. degree at Tsinghua University, Beijing, China, both in Electrical Engineering. Dr. Deng has over 10 years of experience in the development of sensors and instrumentation, innovative numerical modeling for NDE and SHM. His current research focuses on novel NDE sensing and imaging systems that involves development of nondestructive and nonintrusive sensing arrays, high fidelity multi-physics modeling for understanding imaging physics, and experimental prototyping and validation. He has secured over $1.6M external research funding from USDOT,PHMSA, NIH, DOD, NSFC, ANST and private industries. Dr. Deng is a Senior Member of IEEE. He also serves as panelists for NSF, DOE, HKRGC and ad-hoc reviewers for over 20 international journals.