interconnected with each other each of the key elements 12 has a gap 120 engaging with the metal peg 50 and a pair of protuberances 121 respectively extending from opposing edges of the key element 12 and interfering with the insulative housing 10 20 for ensuring the key element 12 to be retained firmly within the elongated slot 100 200 the two opposing ends of the metal peg 50 inserted in the openings 1010 2010 respectively engages with the gap 120 of key elements 12 an inserting force generates and is mainly exerted on the first insulative housing 10 when the upper memory card is being inserted into the first elongated slot 100 since the first insulative housing 10 and second insulative housing 20 are interconnected together by the metal peg 50 the integral intensity of the electrical connector assembly 1 is enhanced and the force exerted on the first insulative housing 10 is partially displaced into the second insulative housing 20 and thus the soldering relation between the first terminals 30 and the pcb is effectively prevented from being broken in the other hand the electrical connector assembly 1 is prevented from being broken especially in the case of a big inserting force generating from the upper memory card referring to fig2 to fig3 a pair of metal nails 60 are provided to further enhance the integral intensity of electrical connector assembly 1 especially to prevent the relative rotation between the first insulative housing.