and die cover 50 for attachment and disassembly purposes in yet a further embodiment of the present invention shown in fig5 a die support member such as a thin small outline package tsop 70 includes a heating circuit 72 integral with a base 74 of the tsop 70 extending therearound without any gap therein to be used to seal the base 74 to a die cover 80 a bare semiconductor die 76 is attached to a die attach area 78 of the base 74 using well known die attach methods the heating circuit 72 attaches and seals a die cover 80 to the base 74 by heating and curing an attachment material 82 on the surface of the base 74 in response to being energized by a supply voltage v s or current supply if a thermoplastic type adhesive is used the heating circuit 72 can also be used to detach the die cover 80 from the base 74 for purposes of testing reworking or replacing the bare semiconductor die 76 suitable adhesives may be used to hermetically seal the die cover 80 to the base 74 again the heating circuit 72 merely locally heats up the base 74 and die cover 80 for attachment and disassembly purposes as shown in fig6 the tsop 40 of fig4 can be incorporated into a memory device 60 of an electronic system 62 such as a computer system that.