dimensions which are for example five times as greatas the corresponding dimensions of the projected image on substrate 13 the resulting integrated circuit structure is composed of a large number ofstrip chips 22 parts of several of such chips being shown in the detail view of fig4 according to one exemplary embodiment each strip chip 22 may be a driver ic for a thermal print head the driver ic containing cmosdevices with polycrystalline silicon gates in the exemplary embodiment each group 16 formed on wafer 13 is a square measuring 15 mm on a side andeach strip chip 22 on wafer 13 measures 1 25 u00d7 7 25 mm correspondingly on reticle 11 the array of patterns 12 for a group 16 measures 75 mm on a side and each chip pattern 12 measures 6 25 u00d7 36 25 mm fig3 further depicts a wafer 13 having a diameter of 4 inches onto which thirty eight groups 16 are formed requiring 38 exposures for each photographic operation with each group 16 containing twenty two ic strip chips 22 taking into account that certain groups are not formed entirely on wafer 13 758 usable chips 22 will be formed the arrangement of chip groups according to the invention eliminates the need for a complicated exposure program and for shutter movements with the conventional shutter method shown in fig2 and even though all scribe lines can have a width of 60 u03bc the pattern on reticle 48 contains twenty strip chip regions 41 forty five exposures are needed to cover wafer 45 completely and a maximum of 754 complete usable strip chips will be produced thus the present invention allows the number of.