formed by the recessed region between the pseudo window 3 a and the platen window 1 a fig2 illustrates another exemplary embodiment of the present invention as shown in fig2 the polishing table 4 b includes a platen 51 and a polishing pad 53 in the exemplary embodiment illustrated in fig2 the platen 51 and the polishing pad 53 are essentially the same as the platen 1 and polishing pad 3 of fig1 however in the exemplary embodiment of fig2 the top surface level of the platen window 51 a is above the top level of the platen 51 in an exemplary embodiment this configuration may allow for easier self alignment in an exemplary embodiment the top surface level of the platen window 51 a is sufficiently higher above the top level of the platen 51 that no void v is formed in an exemplary embodiment the void v u2032 in fig2 is smaller than the void v of fig1 due to the top surface level of the platen window 51 a being above the level of the top level of the platen 51 in an exemplary embodiment the platen window 51 a protrudes from the platen 51 in a direction closer to the polishing pad to thereby reduce the size of or eliminate altogether the void v u2032 fig3 illustrates another exemplary embodiment of the present invention as illustrated in fig3 the polishing table 4 c includes a platen 61 and a polishing pad 63 in the exemplary embodiment illustrated in fig3 the polishing pad 63 is essentially the same configuration as that of the polishing pad 3 of fig1 however a transparent supporting layer 63 b is inserted in the recessed region of the polishing pad 63 in an exemplary.