layers 21 and 22 during the final lamination step by contrast the final lamination step for the subassembly 11 39 of fig1 b and 2b includes only the subassembly 11 39 with the rigid prepreg layers 21 39 and 22 39 already laminated thereto similar additional laminates 27 39 and 28 39 are bonded to the subassembly 11 39 and rigid prepreg layers 21 39 and 22 39 as illustrated turning now to fig4 either of the final laminate products from fig3 a or 3b may be employed in the finished rigid flex printed circuit board assembly 31 of fig4 the finished pcb 31 of fig4 includes at least one subassembly such as that indicated at 11 or 11 39 in the other figures however the pcb 31 may be formed with a plurality of such subassemblies for example to provide additional circuitry within the internal laminates thereof such techniques are of course also well known to those skilled in the art in any event following assembly of the finished pcb 31 of fig4 by the final laminating steps discussed above with respect to fig3 a and 3b other finishing steps may be performed on the pcb as necessary for example external conductive circuitry 32 and pads 33 may be formed on external surfaces of the additional laminates 27 and 28 by conventional outerlayer imaging techniques in addition through holes 34 may be drilled through the pcb 31 for appropriate register with various circuit components in addition the pcb may be subjected to desmearing plating and other conventional techniques such as application of soldermask hot air solder leveling and other fabrication techniques well known to those skilled in the art in.