as shown in fig2 or shorter strain relief elements may be soldered to pads on the circuit surface once the leads 26 on the adapter substrate are soldered to the circuit board surface 30 the user may insert the qfp adapter 14 with a device 10 soldered to it to change devices e g for the purpose of experimentation upgrading or repair the qfp adapter board may be removed 5 from chimney connector 22 and replaced with another adapter board carrying another device referring now to fig3 an adapter is presented which is configured to receive a device 10 in a socket 38 quad flat pack sockets as shown are available from sources such as amp or 3m in this embodiment the socket 38 includes pins 40 which may be inserted in receptacles 36 in the socket adapter 34 the socket adapter 34 is made up of a socket adapter circuit board 37 which includes pins 20 which are connected to the receptacles 36 by traces in the socket adapter circuit board pins 20 are adapted to engage the terminals 24 in the chimney connector 22 referring to fig4 once the adapter leads 26 on the adapter substrate 28 are soldered to the circuit board surface 30 the user may insert the socket adapter 34 into the chimney connector 22 a device 10 may then be inserted into the socket 38 to change devices the device 10 may be removed from socket 38 and replaced with another device it should be noted that the socket adapter 34 can be made to have.