4 the continuous groove section 4 refers to a groove continuously formed in the shape of a stripe the statement u201c formed to reach side faces 5 of the adhesive layer 3 u201d means a state in which the continuous groove section 4 is formed to reach the side faces 5 of the adhesive layer 3 and is open at the side faces 5 so that the groove section 4 can be seen at the side faces 5 see fig1 in the embossed adhesive film 1 a thickness t 2 of the base material layer 2 is typically 50 200 u03bcm and in at least one embodiment is 125 u03bcm and a thickness t 3 of the adhesive layer 3 is typically 15 100 u03bcm and in at least one embodiment is 40 u03bcm see fig1 the material for the base material layer 2 of the embossed adhesive film 1 is not limited insofar as the material exhibits heat resistance the statement u201c the material exhibits heat resistance u201d means that the material exhibits heat resistance even at a temperature higher than 200 u00b0 c encountered in a solder reflow step or the like a preferable material for the base material layer is a resin material such as polyimide or glass epoxy or a metal material such as copper stainless steel or aluminum the adhesive layer 3 of the embossed adhesive film 1 is formed by a reactive adhesive in a b stage such as an epoxy adhesive which is a thermo setting adhesive the.