formed circuit patterns fig2 and 3 show its top view and sectional view in these figures a plurality of chips c to which the dicing before grinding method has been conducted is attached using an adhesive sheet s which is provided on the lower surface side of a ring frame f a circuit pattern is formed on the surface the upper surface in fig1 of the chips c for which ultra thin chips with a thickness of 30 u03bcm to 150 u03bcm are applicable and a protective sheet s 1 is attached the protective sheet s 1 which is attached to the chips c is peeled by a protective sheet peeling apparatus 20 shown in fig5 the protective sheet peeling apparatus 20 is provided with a base 21 a chip retention rotating mechanism 22 movable in the direction of arrow a 1 a tape supply portion 23 a peel head portion 24 and a heater cutter portion 25 the chip retention rotating mechanism 22 includes a table 27 and the table 27 is provided so that the attachment body m including the ring frame that fixes the chips c using the adhesive sheet s can be held in place in the.