coated with an electrically conducting material if the electrical resistivity of the non linear material 17 is too high fig3 shows an elevation sketch of a physical layout for the sketch of fig2 the dipole antenna 18 is connected to a silicon chip 34 containing the tag memory tag electronics and tag power supply by wires 36 and 38 the antenna 18 and the chip 34 are mounted on a dielectric material 32 the non linear material 17 is mounted on the opposite side of the dielectric material 32 to the antenna 18 and chip 34 in this embodiment the non linear material 17 may once again be coated with a good electrical conductor fig4 shows an alternative arrangement of fig2 the silicon chip 34 the antenna 18 and the non linear material 17 are all mounted on the same side of a supporting structure made of dielectric 32 in this embodiment the non linear material 17 may once again preferrably be coated with a good electrical conductor fig5 shows perspective sketch of a preferred alternative antenna arrangement for an rfid tag a silicon chip 34 is electrically attached to an electrically conducting patch antenna 50 the silicon chip is also electrically attached to an electrically conducting ground plane 52 which is spatially separated from the patch antenna 50 by a dielectric material not shown in the.