fig1 is a top view of a spiral contactor 1 to explain the first embodiment of the present invention and fig2 is a u2014 a cross sectional view of fig2 in fig1 the interval of solder balls indicating in the views is aligned with 0 4 mm pitches a spiral contactor 1 consists of a plurality of spiral probes 2 allocated to the backside of a semiconductor devices in accordance with a solder probe allocated in grid arrangement though a periphery of individual spiral probe 2 is subject to a circular shape the inner side is a spiral shaped probe besides according to a spiral contactor 1 of the present invention even the interval of a solder ball with smaller pitch can be compatible in fig2 a spiral probe 2 is a flat type spiral in non loading condition fig3 is a cross sectional view to indicate the situation that a solder ball 7 of a semiconductor device 8 under inspection is contacted with a spiral probe 2 when a solder ball 7 of a semiconductor device 8 pressed on a spiral prove 2 contact area is expanding into outside from center of a semiconductor probe 2 consequently a spiral portion is bent into concave to deform like embracing a ball a spiral probe 2 can twine around a solder ball 7 as screwing that causes a long and accurate contact as well as removing foreign matters by sliding action along a periphery of a solder probe 7 even though there are adherence of foreign matters consequently a stable current carrying contact can be secured besides a spiral probe 2 can get an accurate current carrying since the comer 2 a of a spiral probe is sliding with being pressed to a periphery.