layer and layering the prepreg on the printed wiring board for an inner layer which forms conductive patterns on the surface in accordance with yet another embodiment of the present invention there are provided methods for improving adhesion of low halogen phosphorus containing flame retardant filled triazine based formulations to a substrate said method comprising adding to said formulation an amount of an additional resin effective to improve the adhesion thereof to said substrate upon cure in accordance with yet another embodiment of the present invention there are provided methods of adhering low halogen phosphorus containing flame retardant filled triazine based formulations to a substrate said method comprising applying an invention composition as described herein to a suitable substrate and curing said composition in accordance with yet another embodiment of the present invention there are provided methods for improving low dielectric loss factor of low halogen phosphorus containing flame retardant filled triazine based formulations said method comprising adding to said formulation an amount of an additional resin effective to improve the low dielectric loss factor thereof upon cure in accordance with yet another embodiment of the present invention there are provided methods for improving adhesion of filled low halogen phosphorus containing flame retardant triazine based formulations to a substrate said method comprising replacing at least a portion of said filler with an amount of a different particulate filler effective to improve the adhesion thereof to said substrate upon cure in accordance with yet another embodiment of the present invention there are provided methods for improving low dielectric loss factor of low halogen phosphorus containing flame retardant triazine based formulations said method comprising adding to said formulation an amount of a particulate filler effective.