is not adsorbed by the ceramic surface and it is readily removable because of its solubility in the isopropanol rinse in the preferred embodiment the ceramic substrate is essentially an alumina or al 2 o 3 composition however other compositions such as mullite berylium oxide magnesium or other materials having suitable thermal conductivity and dielectric properties can be employed after conditioning the upper surface of the ceramic body 80 a blanket metallization layer 86 is deposited thereon the deposition is accomplished by employing four separate sequential metal evaporations comprising chrome copper chrome copper in the preferred embodiment the metallization layer 86 comprises a lower chrome layer approximately 800 a thick an overlying copper layer approximately 80 000 a thick a top chrome layer approximately 800 a thick and a top layer of copper approximately 10 000 a thick the chrome metal is selected as a bottom layer because of its superior adhesion to both ceramic and glass surfaces the 80 000 a thick copper layer provides the primary electrical conductive path and its dimensions are mainly dictated by electrical design considerations again the top 800 a thick layer of chrome is selected because of its good adhesion to glass finally the upper top layer of copper is employed in order to provide excellent adhesion qualities for subsequently deposited copper studs also the upper layer of copper protects the underlying chrome layer during a cathode etch operation hereinafter described in greater detail this illustrates the results of a selective etching operation suitable etchants are selected to provide a personalized metallization pattern comprising a plurality of lines 88.