using solvents such as acetone isopropanol ethanol toluene chlorinated solvent or mixtures of these then the substrate is cleaned using a dilute solution of detergent or soap in deionized water in an ultrasonic cleaner after rinsing with deionized water the substrate material is dried in an air or nitrogen stream in one aspect of this method the step of pre cleaning includes cleaning the dried substrate material using a sprayed snow of carbon dioxide after the steps of pre cleaning described above the substrate is placed in a high vacuum sputter deposition chamber before the deposition of the coating the method preferably further includes a step of fine cleaning of the substrate by bombardment of ar ions in this deposition chamber in another preferred aspect of this invention this deposition chamber is further equipped to provide for continuous motion of the strip substrate relative to the sputter deposition sources during the deposition the strip substrate preferably is continuously unwound from a supply reel and drawn past an ion cleaning station and two sputter deposition stations to a take up reel deposition of the coating can be achieved using any of several known physical vapor deposition pvd methods commonly used pvd methods include evaporation and sputtering from a suitable source the pvd also can be achieved using cathodic arc deposition and ion beam deposition deposition of the solid thin film by simultaneous sputtering from separate mos 2 and metal targets sputtering from a single target composed of mos 2 metal and sputtering from a molybdenum metal or mos 2 target along with a metal sulfide target is within the scope of this invention the sputter deposition source can be powered by any known technique such as direct current.