individual storage module to the 1 u chassis and the effectiveness of thermal dissipation techniques used to exhaust the heat generated by the storage modules all three factors mentioned above have to be considered in deciding how may memory modules can be safely placed in a 1 u rack mountable unit further the memory capacity of each storage module i e pcb needs to be adjusted based on the factors above embodiments of the present invention provide techniques to fit up to 42 flash memory based modules into a single 1u unit this represents 2 u00d7 as many memory modules than any conventional flash memory based 1u storage unit and thus significantly increases the density of memory modules placing up to 42 memory modules in a single 1u unit is not a trivial task and no one in the art has yet been able to achieve such densities in order to achieve such huge improvement in packing density embodiments of the present invention utilize novel thermal management scheme as described above in some embodiments unique mounting techniques for the individual memory modules are used to minimize space occupied by each memory module fig5 illustrates a high level perspective view of individual memory module 500 according to an embodiment of the.