clamp which more effectively removes built up charge from a substrate prior to and during removal is disclosed currently the lift pins and ground pins are the only mechanisms used to remove charge from the substrate after implantation the present discloses describes a clamp having one of more additional low resistance paths to ground these additional conduits allow built up charge to be dissipated prior to and during the removal of the substrate from the clamp by providing sufficient charge drainage from the backside surface of the substrate 114 the problem whereby the substrate sticks to the clamp can be reduced this results in a corresponding reduction in substrate breakage application_number US 75999010 A description in the present disclosure several embodiments of an apparatus and a method for handling a processed substrate are introduced for purpose of clarity and simplicity the present disclosure will focus on an apparatus and a method for handling a substrate that is processed by a beam line ion implanter those skilled in the art however may recognize that the present disclosure is equally applicable to other types of processing systems including for example a plasma immersion ion implantation u201c piii u201d system a plasma doping u201c plad u201d system an etching system an optical based processing system and a chemical vapor deposition cvd system as such the present disclosure is not to.