a with terminals 102 and an opposite second surface 101 b the thickness is given by sidewall 103 a first portion of the thickness is designated 103 a and the remaining second portion is designated 103 b in the next process step illustrated in fig3 the chips 101 are inserted in the recesses of the plate so that first surface 101 a faces away from the recess and the second surface 101 b touches the recess in this fashion the first thickness portion 103 a is inside the recess and the remaining second thickness portion 103 b projects from the opening 302 in the next process step shown in fig4 a substantially flat metal leadframe 401 is laid on plate 301 a preferred leadframe metal is a copper alloy alternatively the leadframe may be made of aluminum the leadframe is substantially flat because it has been fabricated by etching or stamping from a sheet of metal any steps to form specific leads or straps from the sheet are of secondary importance the leadframe includes a plurality of leads or segments 110 which are near the openings 302 at a distance 111 from the inserted chip 101 leads 110 lay flat on plate 301 and are held in place by the frame not shown in fig4 leads 110 include a surface 113 a with a metallurgical composition for example a gold layer suitable for wire bonding.