s termination head 140 is also mounted to the base 110 via a high viscosity epoxy 120 in one embodiment a spacer 122 attached to the base 110 may be used to reduce the thickness of epoxy 120 employed typical epoxies such as that used in prior art fig3 shrink when cured this post bond shrinkage is not a problem in the prior art fig3 since it pulls the termination head 40 closer to the awg 42 however if the epoxy of fig4 shrinks alignment of the fiber optic bundle with the awg will suffer as the termination block 140 is pulled toward the base 110 an epoxy having a silicate content of over 70 by volume has been found to reduce shrinkage additionally the high silicate content makes the epoxy very viscous allowing for manual alignment being maintained after being achieved thus alignment of the termination head 140 and the awg 142 can be achieved without significant post bond shrinkage as the epoxy is cured by heat or other methods raising the silicate content of the epoxy to up to 90 by volume reduces the post bond shrinkage even more however as the silicate content is increased the sheer strength of the bond is reduced so a balancing between post bond shrinkage and sheer strength should be performed the alignment.