the interposer of prior art is omitted the overall thickness of the stacked semiconductor package of the present invention is reduced and the manufacturing procedure is simplified application_number US 74419607 A description please refer to fig2 illustrating a cross sectional view of a first embodiment of the stacked semiconductor package having flexible circuit board therein of the present invention the stacked semiconductor package 2 of the embodiment includes a substrate 21 and a chip assembly 22 the substrate 21 has an upper surface 211 and a lower surface 212 the chip assembly 22 includes a first chip 221 a second chip 222 and a flexible circuit board 223 the first chip 221 has an upper surface 2211 and a lower surface 2212 the second chip 222 has an upper surface 2221 and a lower surface 2222 the second chip 222 is disposed above the first chip 221 and is electrically connected to the first chip 221 through the flexible circuit board 223 the flexible circuit board 223 has a plurality of parallel wires whose ends may be connected to the corresponding solder pads on the chips in this embodiment the flexible circuit board 223 connects the upper surface 2221 of the second chip 222 and the lower surface 2212 of the first chip 221 and the lower surface 2212 of the first chip 221 is attached to the upper surface 211 of the substrate 21 by way of flip chip so that the.