used for substrate 14 u2033 is not limited to copper but can be another metal such as aluminum or stainless steel the size of the metal substrate 14 u2033 is typically 18 u00d7 24 inches but the size of the metal substrate 14 u2033 is not limited to these dimensions the invention uses the build up multilayer bum technology a printed circuit board technology in combination with thin film deposition technology a technology used for the creation of flat panels it must be noted from fig2 that the metal substrate 14 u2033 and the contact balls 10 u2033 are mounted on opposite sites of the interconnect substrate 12 u2033 while the metal substrate 14 u2033 and the contact balls 10 u2033 are also aligned with each other the metal substrate 14 u2033 is located above the contact balls 10 u2033 the ic 16 u2033 is mounted in an opening 28 u2033 created in the metal substrate 14 u2033 the opening 28 u2033 into which the flip chip 16 u2033 is mounted is a cavity that is created by masking and etching of the second side 26 u2033 of the metal substrate 14 u2033 a dielectric layer not shown is first deposited over the metal substrate 14 u2033 on the first side 24 u2033.