with an endcapper such as a monofunctional anhydride or a mono functional amine a preferred endcapper is phthalic anhydride other endcappers include but are not limited to maleic anhydride phenylethynyl anhydride ethynyl anhydride nadic anhydride vinylic anhydride allylic anhydride benzocyclobutane anhydride phenylethynyl amine ethynylaniline vinylaniline and allylaniline the endcapper may be added to the polyimide at an amount ranging from about 2 mole percent to about 10 mole percent depending on the desired properties of the polyimide to form the polyimide the poly amic acid precursor is heated to a temperature high enough to form the polyimide and to drive off the solvent in one embodiment the polyamic acid precursor is heated to about 200 u00b0 c the temperature may vary depending on the anhydrides and diamines being used and the ratio of thf to nmp the poly amic acid precursor may be applied to a substrate followed by heating to form the polyimide and drive off the solvent the techniques for applying poly amic acid precursor to substrates are well known to those skilled in the art substrates may include but are not limited to metals plastics glass and the like polyimide laminates may be produced by casting the poly amic acid precursor onto a metal.