tab device 10 undergoing a process to prevent shorting of device leads 18 during attachment of the component to the circuit board 12 fig2 a illustrates a cross sectional side view of the device 10 of fig1 a d prior to installation and prior to a backside encapsulation procedure to be described hereinbelow in this state a carrier 34 is attached to the device 10 the procedure described hereinbelow can be performed either on devices 10 in carriers 34 as shown in fig2 a or on multiple devices 10 in reel format fig2 b illustrates the deposit of an encapsulating material on the backside the side opposite the polyimide material layer 30 of the leads 18 in order to protect the leads 18 during attachment of the device 10 to the circuit board 12 the backside encapsulation procedure described herein can be performed using an automatic liquid dispensing machine such machines are available from asymtek automated fluid dispensing and camelot in fig2 b a nozzle 36 of the automatic fluid dispensing machine is shown applying the encapsulation material encapsulant 38 to the device 10 on the backside of leads 18 with the inward pointing surface of the die pointing upwards the encapsulant flows up the sidewall 39 of the die.