260 is positioned on the redistribution pads 231 for connecting the solder balls 250 additionally the ball base 260 is substantially circular and disposed on the second dielectric layer 240 and the ball base 260 is connected to the first redistribution pad 231 a through the third opening 241 a the ball base 260 is also extended to the top of the second opening 221 b for adjusting the position of the solder ball 251 in which the area 253 of the solder ball covers the second opening 221 b and at least a portion of the second bonding pad 211 b the second embodiment of the present invention discloses another redistribution connecting structure for solder balls as shown in fig6 a redistribution connecting structure 300 for solder balls is provided the redistribution connecting structure 300 includes at least a bonding pad 311 disposed on a substrate 310 of an integrated circuit chip the substrate 310 includes a first dielectric layer 320 composed of phosphosilicate glass psg silicon nitride silicon dioxide or polyimide thereon and an opening 321 for exposing the bonding pad 311 a redistribution conductive layer 330 composed of copper aluminum alloy thereof or other composite metals is formed on the first dielectric layer 320 the redistribution conductive layer 330 includes at least a redistribution pad 331 disposed adjacent to the bonding pad 311.