resin in the pattern formation region a to perform the oxygen plasma treatment on the pattern formation region a the pattern formation region a the first substrate 110 and layers thereon may be processed in a process chamber for performing the oxygen plasma treatment a chamber pressure within the process chamber may be maintained at about 0 4 millibar mbar while about 100 watts w of power is used and oxygen gas is supplied at about 5 standard cubic centimeters per minute sccm into the chamber the oxygen plasma treatment is performed for about 60 seconds to perform the uv ozone treatment on the pattern formation region a a uv lamp is used to irradiate a uv light with a wavelength of about 254 nm and an intensity of about 28 000 microwatts per square centimeter u03bcw cm 2 for about 90 seconds such as to the pattern formation region a the first substrate 110 and layers thereon within a process chamber for performing the uv ozone treatment the uv light reacts with oxygen in the process chamber and thus ozone and oxygen atoms providing relatively strong oxidation are generated the oxygen atoms essentially clean a surface of the transfer substrate exposed at the pattern formation region a to increase the adhesive force thereof relative to other material layers hereinafter for convenience of explanation a region modified by the oxygen plasma treatment or the uv ozone treatment may also be referred to as the adhesion promoting layer 130 referring to fig1 c the mask 120 is removed from the first substrate 110 in removing the mask 120 from the first substrate 110.