compositions to a curing temperature normally a temperature in the range of about 100 u00b0 200 u00b0 c the invention is particularly advantageous in that it provides epoxy resin compositions having desirable properties including reasonably high glass transition temperatures and in that it provides the compositions by the use of curing agents which are less reactive than the curing agents of nischk et al the comparatively low reactivity of the curing agents makes the compositions particularly useful in making prepregs by wetting a fibrous reinforcement e g a roving or a woven or unidirectional carbon ceramic or glass fiber reinformcement etc with the epoxy resin curing agent composition and partially curing the resin the following examples are given to illustrate the invention and are not intended as a limitation thereof in these examples the epoxy resins used were b a commercial diglycidyl ether of bisphenol a having an epoxide equivalent of 189 c a commercial epoxy novolac resin having an epoxide equivalent of 178 e a commerical diglycidyl ether of bisphenol a having an epoxide equivalent of 183 detda a commercial mixture of 3 5 diethyl 2 4 diaminotoluene and 3 5 diethyl 2 6 diaminotoluene in a ratio of about 80 20 mtmpda a mixture of 1 1 3 diaminobenzene 8 2 methylthio 1 3 diaminobenzene 29 4 methylthio 1 3 diaminobenzene 47 2 4 di methylthio 1 3 diaminobenzene 8 4 6 di methylthio 1 3 diaminobenzene and 7 2 4 6 tri methylthio 1 3 diaminobenzene dm c tda a commercial mixture of 3 5 di methylthio 2 4 diaminotoluene and 3 5 di methylthio 2 6 diaminotoluene in a ratio of about 80 20 the reactivities of several curing agents were evaluated.