loops and in step 340 implementation details such as for example where to place the active guard ring are presented to the designer for the purposes of the present example assume the implementation details state place the active guard ring around receiving device 310 see fig3 0030 fig5 a illustrates a modified low noise design produced by the present invention as applied to the exemplary preliminary design illustrated in fig3 fig5 a is similar to fig3 except noise suppression device 345 has been added to the integrated circuit design a distance d 2 from sending device 305 noise suppression device 345 is an active guard ring device as described supra in step 330 of fig4 and includes a capacitive trench 350 surrounding receiving device 310 and an amplifier 355 connected trench 350 to ground 0031 fig5 b illustrates the noise level between the elements of the modified low noise design illustrated in fig5 a in fig5 b substrate noise level is plotted versus distance the distance scale of fig5 b is approximately the same as the distance scale in fig5 a a noise constraint level 360 is also plotted in fig5 b as can be seen from distance 0 to d 2 the noise level is above constraint level 360 and from distance d 2 to d 1 the noise level is below the constraint level 0032 fig6 is a schematic diagram of a second example of the application of the present invention to low noise design in fig6 an i o circuit 400 includes a bond pad 405 surrounded by.