of titanium a second layer nickel and a third layer of gold capacitive filter 50 an inner solder joint preform corresponding to element 55 of the figures and contact pad 60 are placed on or in the brazed feedthrough assembly whereupon the so combined feedthrough assembly is heated to a temperature less than about 500 degrees celsius most preferably in accordance with the methods and parameters described hereinabove respective soldering in another method of the present invention capacitive filter 50 and an outer solder joint preform corresponding to element 45 are placed on or in the brazed feedthrough assembly whereupon the so combined feedthrough assembly is heated to a temperature less than about 500 degrees celsius most preferably in accordance with the methods and parameters described hereinabove respective soldering a suitable electrically conductive adhesive may be applied in third aperture 35 which upon subsequent curing forms inner adhesive joint 55 depending upon the structural configuration selected the same or a different suitable electrically conductive adhesive may also be applied between outer braze joint 40 and outer surface 80 of capacitor 50 which upon subsequent curing forms outer adhesive joint 45 in another method of the present invention the same or a different suitable electrically conductive adhesive may be applied between intermediate braze joint 15 and outer surface 80 of capacitor 50 which upon subsequent curing forms outer adhesive joint 45 the foregoing components adhesives and brazed assembly are heated to an appropriate temperature typically less than or equal to about 200 degrees celsius in an adhesive curing step in the present invention.