second fpc 32 are connected by soldering on wiring patterns of the first fpc 31 in the other words chip components 13 are strongly joined face to face to both fpcs 31 and 32 this structure is useful for the high density assembling of many chip components without an increase in the lateral size of the whole device in this embodiment chip components 13 are assembled only on the one surface of the second fpc 32 however these components may be assembled on both surfaces of the second fpc 32 when many components must be assembled thereon furthermore in above mentioned embodiment only the second fpc 32 joins at a right angle to first fpc 31 however this configuration may be modified and several fpc 39 s may be utilized fig6 shows a fifth embodiment of the present invention tip portions bent 90 degrees of the leads 34 made of phosphor bronze are fixed on electrode patterns 20 provided on the surface of the light transparent cover 18 the back surface of the ccd chip 17 is sealed to the inside of leads 34 using an adhesive agent formed by a thermosetting resin into of an epoxy group in this type of device a ready made socket is avarable and its leads can be soldered directly on the printed circuit board fig7 shows a sixth embodiment of the present invention it is different to than the above mentioned embodiment in that the tip portions of the leads are bent in two steps as a result.