a diameter of 200 millimeters as represented by the arrow 406 may be about 725 micrometers plus or minus about 25 micrometers it is understood that such a thickness of the chip substrate 404 is merely an example and arrays 400 of microelectronic elements 104 on chip substrates 404 having other thicknesses may be utilized the array 400 of microelectronic elements 104 as shown in fig4 may be fabricated utilizing conventional techniques for making such devices on a chip substrate 404 as an example the array 400 of microelectronic elements 104 formed on a chip substrate 404 may be commercially obtained in an implementation an array 400 of microelectronic elements 104 formed on a chip substrate 404 having such a thickness may be selected as a starting material for utilization in the process 500 as the thick chip substrate 404 may provide good mechanical support for the array 400 of microelectronic elements 104 during the initial steps of the process 500 now discussed referring to fig6 and 7 showing fabrication of a microelectronic element array with dca pads 100 at stage 600 at step 506 a temporary support carrier 602 having perforations 604 is provided or fabricated the temporary support carrier 602 includes a bottom surface 606 having suitable dimensions selected for bonding onto the top surface 402 of the array 400 of microelectronic elements 104 the temporary support carrier further includes a top surface 608 opposite the bottom surface 606 the perforations 604 reach both the bottom and top surfaces 606 and 608.