which second embodiment is intended for use with a porous polishing pad an example of such a porous polishing pad is disclosed in commonly owned copending application ser no 10 087 223 filed mar 1 2002 in this embodiment u201c a u201d side 28 of the fastener is affixed adhesively by adhesive layer 32 to a thermoplastic boundary layer 30 that is applied to the underside of porous polishing pad 26 similarly to fig3 the u201c b u201d side 34 is attached by an adhesive layer 36 to the platen 13 the boundary layer 30 is created by applying a thermoplastic material in a liquid state to the bottom surface of the pad during manufacture of the polishing pad the material flows into the porous matrix of the pad and bonds upon solidifying such thermoplastic materials may be polyurethane polyester nylon polyolefin acrylic polyethylene polyamide or derivatives thereof also thermoplastic based adhesives may be utilized which improve the bonding of the layer to the pad matrix such materials include adhesives of polyurethane polyester nylon polyolefin and acrylic elastomers may also be used such as epdm hyalon natural rubber silicone fluorosilicon tygon viton and adhesives derived therefrom the boundary layer 30 may be applied in numerous ways such as by applying liquid polymer.