parallel surfaces are substantially perpendicular to a second pair of surfaces in still another embodiment the surfaces are planarized since most integrated circuit manufacturing processes are designed to work with substrates having a pair of relatively flat or planarized parallel surfaces the use of parallel surfaces simplifies the manufacturing process for forming highly conductive path 114 of inductor 100 substrate 103 has a plurality of holes perforations or other substrate subtending paths 121 that can be filled plugged partially filed partially plugged or lined with a conducting material in fig1 a substrate subtending paths 121 are filled by the plurality of conducting segments 106 the shape of the perforations holes or other substrate subtending paths 121 is not limited to a particular shape circular square rectangular and triangular shapes are all suitable for use in connection with the present invention the plurality of holes perforations or other substrate subtending paths 121 in one embodiment are substantially parallel to each other and substantially perpendicular to substantially parallel surfaces of the substrate highly conductive path 114 is interwoven with a single layer substrate or a multilayer substrate such as substrate 103 in combination with magnetic film layers 112 and 113 to form an inductive element that is at least partially embedded in the substrate if the surface of the substrate is coated for example with magnetic film 112 then conductive path 114 is located at least partially above the coating pierces the coated substrate and is interlaced with the coated substrate highly conductive path 114 has an inductance value and is in the shape of a coil the shape of each loop of the coil interlaced with the substrate is not limited to a particular geometric.