in a plane parallel to that of the substrate 600 note that this example embodiment shows a total of 16 vcsel array modules 606 receivers 608 and transceivers 610 those of skill in the art will recognize that any number and any combination of vcsel array modules 606 receivers 608 and transceivers 610 may be used within the scope of the present invention fig7 is a top view of an example embodiment of a vlsi circuit module including a plurality of integrated vcsel array modules according to the present invention fig7 is identical to fig6 with the exception that a plurality of terminators translators or other components are attached to the flexible connector a standard vlsi package substrate 700 constructed of a common package material such as a ceramic or organic material is shown in this example embodiment of the present invention with a single large application specific integrated circuit asic 702 attached to the substrate 700 underneath a standard heat spreader 716 the asic 702 may be any one of a number of integrated circuit devices such as a microprocessor memory cross bar cache controller fpga or any of a number of large scale integrated lsi or very large scale integrated vlsi circuits also present on the substrate are a quantity.