board as supplied by the burn in fixture to the power interface adapter 30 the power interface adapter 30 then distributes these supply voltages to the required device socket pins 24 of the device socket 14 per the device specification the device socket pins 24 of the device socket 14 are used to pass both supply voltages from the power interface adapter 30 and stimulus response signals from the burn in board 14 to the integrated circuit package 20 fig3 shows a top level view of the power interface adapter 30 of the present invention this power interface adapter pia is fabricated using a double sided printed circuit board however as shown in fig5 the pia 30 may also be fabricated as a multi layer pcb the additional internal voltage planes allow for distribution of multiple supply voltages as required per the device specification pcb length width and material thickness dimensions will vary with the type of device socket 14 with the length and width dimensions generally being approximately equal to the length and width of the particular device socket and the material thickness dimension to be determined based on the length of the device socket pins the pia has a central region indicated at 32 which comprises a plurality of plated.