this embodiment tab bonding is used to connect the circuit layer 84 39 to the chip 52 through windows 92 39 in the nozzle plate 54 and adhesive 64 the circuit layer 84 39 may be bonded to the chip carrier 10 by means of adhesive 67 39 as described above in all other respects the assembly of the circuit layer 84 39 nozzle plate 80 39 and chip 52 are generally as described above with reference to fig3 a referring now to fig4 a and 4b the chip carrier 100 is attached to an ink cartridge body or cartridge holder 102 which contains an ink supply source for feed of ink to chips in the wells 118 120 and 122 of the carrier 100 in order to precisely control the location of the ink drop placement on a printed media the carrier 100 should be mounted on the ink cartridge or cartridge holder body 102 within a tolerance of from about 5 to about 25 microns accordingly the carrier 100 is provided with alignment slots or holes 104 which correspond to alignment tabs 106 pending from the cartridge body 102 at least one alignment device 104 containing a hole or slot is positioned on each of opposing side walls of the carrier 100 preferably toward the lower end of the side walls 108 and 110 opposite the end of the side walls attached to the top surface 112 of the carrier 100 in fig4 a carrier 100 contains two alignment devices 104 on.