the probe 24 a by means of the alignment means the electrical properties of each chip of the wafer w are successively inspected by means of the probe 24 a in the inspection of each chip the probing apparatus 10 is actuated in accordance with programs for the probing method of the invention read from the second storage means 13 by means of the cpu 133 the first one of the integrated circuits on the wafer w to be measured is settled the cpu 133 subjects the main chuck 17 to index feed whereupon the integrated circuits on the wafer w are inspected in succession in the inspection of each integrated circuit the main chuck 17 is overdriven after it ascends to a position where the wafer w and the probe 24 a are in contact with each other during the overdrive operation the pressure sensor 31 measures load needle pressure between the probe 24 a and the wafer w the overdrive is monitored in accordance with the measured load when a preset load value is measured by means of the pressure sensor 31 the controller 13 stops the operation of the drive mechanism 26 thereby stopping the main chuck.