in the invention some embodiments may employ more than one flex the entire flex circuit may be flexible or as those of skill in the art will recognize a pcb structure made flexible in certain areas to allow conformability in some areas and rigid in other areas for planarity along contact surfaces may be employed as an alternative flex circuit in the present invention for example structures known as rigid flex may be employed support elements 14 and 16 are preferably fixed to upper surface 18 of base element 12 by adhesive 25 which is shown as a tape adhesive but may be a liquid adhesive or may be placed in discrete locations across the package preferably adhesive 25 is thermally conductive adhesives that include a flux may be used to advantage in assembly of module 10 layer 25 may also be a thermally conductive medium to encourage heat flow between the elements of module 10 alternatively a mechanical clamp or clamps may be used to hold the base and support elements together differing embodiments of the invention will place one or more support elements in a stacked disposition relative to a base element the contacts for the module itself may be closer to either the base element or the support element s of the module although more typically and preferably the module contacts will be closer to the base element the support elements may also extend over the edges of the base element or may be disposed within the perimeter of the base element flex circuit 30 is in a preferred embodiment a multi layer flexible circuit structure that has at.