now be made of an embodiment of a method of manufacturing a semiconductive device which utilizes the above described exposing apparatus fig1 shows the flow of the manufacture of a semiconductive device a semiconductor chip such as ic or lsi a liquid crystal panel a ccd a thin film magnetic head a micromachine or the like at a step s11 the design of a circuit the design of the circuit of a semiconductive device is effected at a step s12 the production of a mask a mask formed with the designed circuit pattern is produced on the other hand at a step s13 the production of a wafer a wafer which is a substrate is produced by the use of a material such as silicon a step s14 wafer process is called a pre process in which by the use of the above mentioned prepared mask and wafer an actual circuit is formed on the wafer by the lithography technique the next step s15 assembling is called a post process which is a process for making a semiconductor chip by the use of the wafer produced at the step s14 and it includes steps such as the assembling step dicing and bonding and the packaging step enveloping the chip at a step s16 inspection inspections such as a operation confirmation test and a durability test of the semiconductive device produced at the step s15 are effected by way of such steps the semiconductive device is completed and is forwarded step s17 fig1 shows the detailed flow of the above described.