hydrocarbon or a silicone based material for example the material may be applied in any one of several conventional ways such as spin coating spraying dipping or vapor deposition the material may be applied with a thickness for example of 40 u00e5 to 50 microns but 700 u00e5 has been shown to work very well in fig3 heat 26 represented by the arrows is applied to the layer 22 of low surface energy polymeric material to remove the solvents even though the material is thermally stable with a high t g heating baking the material above t g approximately 160 u00b0 c to 300 u00b0 c for a short duration e g baking for 3 minutes at 180 u00b0 c will remove solvents within the material referring to fig4 a cutaway view is shown of the mask 18 in contact with the integrated circuit 10 as mentioned above transparent material 28 is interspersed within the base 20 radiation 32 represented by the arrows is applied to the surface 30 of the base 20 being absorbed and reflected by the base 20 but passing through transparent material 28 and low surface energy polymeric material of layer 22 to strike the resist of layer 16 creating a pattern then the mask 18 is removed without substantially any.