its light plane oriented properly for y scan motion sensor output would be chosen according to the direction of scan fig3 shows the appearance of devices 22 which are located exactly in the center of their respective pockets 21 in tray 20 the devices are also shown with their sides exactly parallel to the sides of the pocket this is the appearance in the ideal case and may actually occur when the tray pockets are only marginally larger than the devices making the pockets only marginally larger than the devices is not necessarily a good practice because it may lead to damage to the fragile leads when inserting the device 22 into the pocket 21 fig4 is a cross section view of the tray 20 showing the relationship between the pockets 21 the devices 22a and 22b and the device leads 23 as is illustrated the de ices may be inserted into the tray either right side up 22a live bug or up side down 22b dead bug also shown is the region of the leads that is most critical to semiconductor quality with regard to placement of the lead tips 24 on a printed circuit board because the exact location of the lead tips 24 is very critical it is desirable to scan them at the highest possible resolution this entrails crowding as many 3 d data points as possible into the region encompassing the lead tips 24 and is the equivalent of using a high magnification when performing inspection with 2 d machine vision.