u00b0 c preferably at least 45 u00b0 c preferably no greater than 95 u00b0 c preferably no greater than 85 u00b0 c preferably no greater than 80 u00b0 c preferably no greater than 75 u00b0 c at these temperatures polymerization does not occur or occurs only to a very limited extent preferably water is removed from the mixture of aqueous resin dispersion and fiber during the mixing process e g in a twin screw extruder preferably the residual water level in the resin fiber mixture is less than 5 wt preferably less than 2 wt preferably less than 0 5 wt catalyst and or hardener for the resin may be added before or after removal of water preferably after removal of water the final resin fiber mixture is extruded after extrusion the final resin fiber mixture may be molded into any form e g pellet log sheet briquette etc the molded resin fiber mixture is cured by heating as described above an aqueous dispersion of the epoxy resin blend is prepared as described in table 1 at a temperature between 100 and 150 u00b0 c then cooled to ambient temperature d e r u2122 6508 and d e n 438 are epoxy resins produced by the dow chemical company d e r 6508 is a bisphenol.