barrel 96 to pass therethrough the collar 98 threadingly engages the holder 95 via threads 91 on both the collar 98 and the holder 95 supply barrel 96 is connected to the receiving chamber 92 on one end and passes through the center of collar 98 the supply barrel 96 includes a liquid discharge opening 100 that discharges the developer material to a photoresist material layer 104 disposed on a substrate 106 a volume of developer material is received in the receiving chamber 92 depending on the setting of the volume control valve 94 the chamber 92 and the tip 100 cooperate to deposit developer material at a controlled flow rate onto the photoresist material layer 104 a second control valve 93 can be placed between the receiving chamber 92 and the liquid discharge opening 100 for selectively controlling the developer material flow rate from the receiving chamber to the photoresist material layer 104 in an alternate embodiment a first volume control valve supplies the developer supply line 46 or 76 with the developer material and a second volume control valve supplies the washing solution material to the washing solution supply line 52 or 82 these first and second volume control valves can also be used to control the volume flow of the developer material and the washing solution material respectively fig9 is a flow diagram illustrating one particular methodology for carrying out the present invention in step 120 a wafer is spun to a washing solution material application speed in step 130 a combination developer material and washing solution material material nozzle is moved to the center of a photoresist material layer disposed on the wafer in step 140 a washing solution material is applied until the photoresist material layer is covered with a film layer of.