with respect to fig9 however unlike in fig9 the post plating anneal here is carried out to distribute the alloying element in the alloy 322 throughout the copper disposed in the feature 308 in essence a copper alloy bronze metallization interconnect 334 is created wherein the alloying element is diffused substantially uniformly throughout the copper fill as noted above the doping elements used to create the copper alloy may include any transition or noble metal that assists in reducing electromigration such metals are listed above in addition to those metals listed above the alloying elements could include any bronze forming element or combination thereof in this regard in order to effectively plate a bronze film it is necessary to co plate the copper with another element also in some embodiments of the present disclosure two or more elements are co plated with the copper complexes of the doping elements are needed in most situations but not all for effective plating to occur typical examples of such chemistry for cuco bronze utilizes co and cu ethylenediamine complexes such complexes are known to those skilled in the art also the ph level and concentrations of plating solution are adjusted appropriately in order to facilitate controlling the co plating of the elements to form the desired bronze interconnect after annealing has been completed so that the alloying element is diffused throughout the feature 308 in step 330 next in step 332 cmp procedures are used to remove the copper overburden as well as all layers above the dielectric 306 so that the top surface 336.