accessed by the workstation 112 profile times and or temperatures can be stored in a first module 116 and profile modification suggestions can be stored in a second module 118 a similar type of machine and system can be used to lay up composite manufactured parts pcbs aircraft components nanotubes and other complex pick and place operations requiring fine adjustment to various parameters other similar type of machines can be used for the manufacture or candy or other baked items for human consumption where the variation of various parameters like flow temperature and time can be more optimally controlled and optimized after an initial run fig2 shows further details of the machine 100 to collect temperature information from a pcb the machine includes a series of temperature sensing elements 150 a e such as thermocouples tc to detect temperature information in one embodiment a first tc 150 a is located to be proximate a top of an ic 152 such as a bga to measure the case temperature of the bga a second tc 150 b is positioned to detect temperature at an interface between the board 154 and the bga 152 e g under the bga a third tc 150 c is positioned to detect temperature on top of the pcb adjacent to the bga 152 a fourth tc 150 d is located under the pcb 154 in alignment with the bga to detect temperature under the pcb as the bga is heated a fifth tc 150 e can be located within the u2018 oven u2019 that is used to focus heat on the bga an oven element 160 can be placed over the bga to heat the bga and solder in a controlled manner the oven element.