various voltage regulator components coupled to both the primary and secondary sides of circuit board 20 the primary side components include hf capacitors 44 within vcc plane 23 secondary side components include hf capacitors 43 which as shown are located between vcc plane 23 and ground plane 22 placement of the hf capacitors within the pin field may improve performance by lowering the capacitors 39 parasitic loadline similarly output inductors 47 one of which is shown for illustration in fig3 may be located such that a pwm side inductor pad 46 a is located just outside of the pin field while the vcc side inductor pad 46 b sits within the pin field and more specifically within vcc area 23 note pads 46 a and b are shown coupled to a top inductor in fig3 thus by placing key vr components on the motherboard 39 s secondary side vr components may be located substantially underneath an ic device as a result the loadline length may be significantly shorter resulting in a substantial drop in loadline impedance from the vr to the ic device this reduction may result in better current and voltage transients better power delivery efficiency and lower vr temperatures it may also help enable higher current levels e g approximately 150 amperes and more in certain embodiments also in systems where form factor is important vr component placement in accordance with an embodiment of the present invention may free up more motherboard space due to the movement of key vr components to the secondary side and underneath.