charge the stripe with hydrogen application_number US 47750383 A description referring initially to fig2 there is illustrated a hermetic package 10 containing an integrated circuit 11 for use in a microelectronic system the package is in a flat pack configuration and is shown in exaggerated size for the purpose of explanation the package includes a housing 12 that has horizontally disposed leads 13 13 passing through opposed side walls to which an internally stored integrated circuit 11 is electrically connected the upper edge of the housing is provided with a gold tin solder preform or seal 16 to which a kovar lid 17 is secured when the lid is in place the assembly is heated to a temperature sufficiently high enough to allow the solder to flow onto the lid and the housing thus creating a hermetic seal a hydrogen containing atmosphere 19 is placed within the housing which completely envelopes the microelectronic circuitry as is typical in the art the integrated circuit includes a substrate 20 upon which is placed one or more electrical components such as components 21 and 22 a thin film interconnect or stripe 23 electrically joins the components in assembly the stripe can be placed of the substrate by.