herein various reinforcements such as woven nonconducting fibers such as glass cloth such circuit boards may be single sided as well as double sided or multilayer films or coatings of the polymeric compositions described herein can be formed by solution techniques such as spraying spin coating or casting with spin coating being preferred preferred solvents are 2 ethoxyethyl ether cyclohexanone cyclopentanone toluene xylene chlorobenzene n methylpyrrolidinone n n dimethylformamide n n dimethylacetamide methyl isobutyl ketone 2 methoxyethyl ether 5 methyl 2 hexanone u03b3 butyrolactone and mixtures thereof typically the coating thickness is between about 0 1 to about 200 microns as a dielectric interlayer adhesion promoters can also be used to adhere the polymeric compositions described herein to the appropriate substrates such promoters are typified by hexamethyldisilazane which can be used to interact with available hydroxyl functionality that may be present on a surface such as silicon dioxide which has been exposed to moisture or humidity that creates such hydroxyl functionality the following examples illustrate the polymeric compositions described herein are not intended to limit it in any way in the following examples unless otherwise specified area percent gas chromatography gc analysis was conducted using a 25 m long with a 0 17 micron film thickness hp 5 column with the exception of tear strength the test results in tables 1 and 2 for the physical properties of the polymeric coatings were obtained using the astm d 412 standard at a pull rate of 2 inches minute the tear strength was obtained using the astm d 624 standard the glass transition temperature for the various polymeric compositions was measured by differential scanning calorimetry dsc using astm.