mounting pad 42 spans at least a portion of the central region 44 the mounting pad 42 is preferably supported by tie bars 46 extending from the leadframe 40 corners as in the other examples herein cantilevered leads 48 extend from the periphery of the leadframe 40 to the central region 44 it can be seen that the cantilevered leads 48 do not connect with the mounting pad 42 a chip 50 shown in the top view of fig5 and corresponding side view of fig6 may be affixed to the leadframe 40 preferably supported at least in part by the cantilevered leads 48 in the central region 44 of the leadframe 40 additional support for the chip 50 may be provided by the mounting pad 42 it should be appreciated that a chip larger in planar area than the mounting pad may be used since it may be supported by the cantilevered leads extending into the central region of the leadframe preferably the cantilevered leads 48 include a full metal portion 52 at their outer ends and a partial metal portion 54 at their inner ends the partial metal portions 54 preferably support the chip 50 as with the embodiment described above a protective package 56 is preferably.