on the bottom plate and memory elements are arranged and disposed on the pcb the intermediate cover is used to press peripheral regions of the printed circuit board and to expose the regions where the memory elements are formed on the printed circuit board the printed circuit board is closely attached to a surface of the bottom plate by fixing the intermediate cover the top cover is used to cover the memory elements formed on the printed circuit board after some manufacturing processes and by exerting an external force the formed memory elements are clamped down so as to protect the memory elements from being affected by the printed circuit board in the following thermal process due to the thermal stress deformation application_number US 76802307 A description the carrier for manufacturing a memory device the method using the same and the portable memory device using the manufacturing method provided by the present invention is capable of efficiently overcoming the bowing problem of the printed circuit board pcb and also efficiently solving the problems that during a surface mounted technology smt process pieces cannot be assembled successfully an integrated circuit ic to be adhered is offset or the empty soldering or short circuit problem occurs so as to greatly enhance the yield rate of the manufacturing process the carrier for manufacturing a memory device provided by the present invention is a three piece.