described in embodiments in the sections below related to designs 11 14 other features of bga package 900 are similar to the corresponding features in aforementioned designs fig1 shows a bga package 1000 according to an embodiment of the present invention as shown in fig1 bga package 1000 is similar to bga package 900 shown in fig9 except that bga package includes substrate 502 which has two patterned conductive layers first and second metal layers 106 and 504 instead of one metal layer for enhanced routing flexibility substrate 502 has a punched opening or window similar to that shown in substrate 130 in fig9 other features of bga package 1000 are similar to the corresponding features in aforementioned designs fig1 shows a bga package 1100 according to an embodiment of the present invention as shown in fig1 bga package 1100 is similar to bga package 900 shown in fig9 but with an additional drop in heat slug 1102 attached to the bottom surface of stiffener 112 by adhesive 1104 adhesive 1104 is a conductive adhesive epoxy or solder heat slug 1102 allows direct conductive heat dissipation from die 114 through die attach epoxy 116 stiffener 112 adhesive 1104 and heat slug 1102 to an attached motherboard not shown other features of bga package 1100 are similar to the corresponding features in aforementioned designs fig1 shows a bga package 1200 according to an embodiment of the present invention as shown in fig1 bga package 1200 is similar to bga package 1000 shown in fig1 but with the addition of drop in heat slug 1102 heat slug 1102 allows direct conductive heat dissipation from the die 114 through die attach epoxy 116.