that droplets are deposited in some locations but not others blanking electrodes or coil 30 are controlled by signal controller 34 signal controller 34 can be a signal processor such as a computer system the computer system allows greater control of solder droplets 14 by programming the blanking electrodes or coil 30 to turn on and off in a desired sequence so as to pattern the substrate with a desired solder pattern an alternative embodiment can include an air jet system if the electrical pulse is insufficient to remove the droplets a photo cell can be located above the air jet system in order to ensure proper timing of electrical pulses or the air pressure the third zone is the raster scan system and includes electrostatic deflection plates or magnetic coil 36 electrostatic deflection plates 36 are charged by signal controller 34 so that solder droplets 14 are deflected in either the horizontal x direction or the vertical y direction or both further the solder droplets 14 can be held in a steady position in the x y plane in order to build up the solder to a desired height since the droplet stream now scans in the x and y directions the substrate 12 can now stay stationary throughout the droplet application process signal controller 34 can be programmed to perform a variety of soldering patterns for placing solder droplets 14 on substrate 12 for example a cad cam system programmed with a desired output sends signals to blanking electrodes 30 and to electrostatic deflection.