assuring electrical connection by a thin film forming method such as sputtering as the electrically conductive adhesive 74 an epoxy based adhesive cured at room temperature admixed with electrically conductive materials such as carbon particles for example is used then resist materials 202 203 shaped similarly to the ink pressurizing chamber 71 c and the dilution liquid pressurizing chamber 71 h are formed on the piezoelectric material 75 as shown in fig1 b as these resist materials 202 203 a resist for sandblasting such as bf 405 or bf 403 trade names sold by tokyo oka or a powder beam etching resist may be used by using these resist materials the resolution of the order of 50 u03bcm in terms of the minimum line width may be realized then using a sand blasting device or a powder beam etching device a solid gaseous two phase jet stream containing diamond particles 5 to 30 u03bcm in size is sprayed onto the piezoelectric material 75 carrying the resist materials 202 203 for processing the piezoelectric material 75 to a shape corresponding to that of the resist materials 202 203 to produce first and second piezoelectric device 76 77 as shown in fig1 c by using fine diamond particles of the order of.