the first surface 401 note that the potential of the metal plates vary depending on the voltage gradient on the top surface of the pcb 400 the dielectric 44 is used as insulation between the plates the thickness of the insulation between the metallic plates and solder points to reduce partial discharges on the connection point and at diode leads is less and thereby results in a compact package for high power rectifier pcb the heat generated at the connection point 46 and at the diode 42 are distributed by conduction to the metallic plates 51 in the pcb 400 it should be noted that in one embodiment the metallic plates 45 51 are configured having rounded edges to minimize the field concentration at the edges further in one embodiment the dielectric 44 may be constructed or formed of an epoxy material and the metallic plates 51 may be constructed of copper however other materials may be used as the dielectric 44 and or metallic plate 51 as desired or needed for example the dielectric may be insulating oil or any solidified or solid insulating material fig3 is a side elevation view of a pcb 410 in an x ray.