is formed in the gap between the two dice 33 and the gaps between either of the two dice 33 and any other die not shown by a screen printing method it is noted that the fixing protective layers 34 can also be formed over the surface not shown of the two dice 33 referring to fig1 a plurality of vias 351 and a plurality of openings 352 are trenched in the substrate 31 and the gluing layer 32 respectively by laser drilling the vias 351 and the openings 352 are aligned with the i o ports 331 of the two dice 33 respectively referring to fig1 a plurality of metallic conductive portions 36 is formed in the aforesaid vias 351 the openings 352 and part of the surface of the substrate 31 being electrical connecting to the i o ports 331 of the two dice 33 then a water resisting layer 37 is formed over a surface of the substrate 33 by a sol gel method wherein the surface is remote from the two dice 33 the water resisting layer 33 may cover the metallic conductive portions 36 formed on part of the surface of the substrate 31 after the water resisting layer 37 is formed the water resisting layer 37 is etched to form a desired pattern by employing the widely adopted technique such as dry etching or wet etching as such a plurality of projections 371 is formed as shown in fig1 referring to fig1 a step of solder ball implant proceeds in which a plurality of solder balls 38 is implanted into the gaps between the projections 371 consequently an electronic device package is formed by employing a manufacturing method for packaging electronic devices according to the second preferred embodiment.