support leg member 22 having an l shaped cross section while fig7 b shows use of a support leg member 22 39 having a t shaped cross section further fig7 c shows use of a support leg member 22 34 that has a rectangular cross section any of these support leg members can be used for supporting the package body 21 of the present embodiment upright on the surface of the substrate fig8 a shows the semiconductor package 20 of the first embodiment in the perspective view wherein a single package body 21 is held on the support leg 22 while fig8 b shows a second embodiment of the present invention wherein a number of the package bodies 21 are held commonly on a support leg 22 in the illustrated example the support leg 22 has an l shaped cross section in correspondence to the example of fig7 a and extends with a substantial length such that a number of package bodies 21 are held thereon with a reduced mutual separation by configuring the semiconductor assembly as such it is possible to support the package bodies upright on the substrate such as printed circuit board with an improved mechanical stability as compared with the embodiment of fig8 a fig9 shows a third embodiment of the present invention wherein a number of package bodies 31 1 31 3 are held adjacent to and parallel with each other with a reduced mutual separation there each package body such as the package body 31 1 has a construction substantially identical with the package body 21 except that the package body 31 1.