for the first set of conducting transmission lines similarly outputs from the switch matrix are provided at a second layer for the second set of conducting transmission lines the first element is coupled to the second element which is then coupled to a secondary substrate sl 2 such as a ceramic or flexible flip chip substrate the inputs and outputs of the switch matrix are coupled to pads on a printed circuit board by a ball grid array each active element of the first element is coupled to one of the first set of conducting transmission lines and one of the second set of conducting transmission lines through taps or a through via hole each tap modifies the impedance characteristics of a conducting transmission line i e the impedance of a transmission line the tap therefore includes a capacitance and inductance in one embodiment each of the transmission lines has a pre determined width however near the junction of the transmission lines each transmission line is narrowed to a second pre determined width smaller than the first pre determined width as such each tap approximately coupled to the junction of the transmission lines provides additional thickness to each transmission line but provides negligible impedance to each transmission line thus the impedance of a particular transmission line is largely constant along its length in one embodiment such as that illustrated in fig3 a one or more switch matrices are coupled together for instance outputs of a first switch matrix are coupled to inputs of a second switch matrix and outputs of the second switch matrix.