cleaning process in combination with the remotely generated and or rf generated plasma has been determined to provide more optimum removal of photoresist type layers in accordance with certain preferred embodiments an oscillatory or vibratory discharge of the cryogenic cleaning medium is provided in order to provide more optimum cleaning while the referenced applications described exemplary ways of implementing such an oscillatory or vibratory mechanism the embodiment illustrated in fig8 a illustrates another exemplary mechanism as illustrated in fig8 a an oscillatory vibratory nozzle cleaning system preferably dispensing cryogenic solvent or solvent combination cleaning medium s to assist the plasma cleaning and photoresist stripping removal process the oscillatory vibratory nozzle cleaning and plasma processes can be performed sequentially or simultaneously as will be described in greater detail hereinafter in the illustrated embodiment the oscillatory vibratory nozzle cleaning system includes vibration actuators 115 which are attached to nozzle manifold 113 to induce the oscillation or vibration the oscillatory vibrator nozzle cleaning system preferably is mounted on vibration isolators 116 to prevent vibration of posts 114 posts 114 preferably two are mounted on linear slide assembly 117 to allow nozzle nozzle assembly to u201c sweep u201d wafer 109 with the cryogenic cleaning medium nozzle manifold 113 preferably utilizes a pressurized plenum to ensure uniform flow through nozzle nozzle assembly 112 it should be noted that the oscillatory.