the slider near the leading end the bonding process creates a displacement force upon the slider to effect the shift an alternative approach reshapes a row of sliders prior to rail shaping e g by sand or bead blasting application_number US 66062996 A description according to known methods a wafer of substrate 11 such as the one shown in fig1 a is deposited with a matrix 12 of transducers the wafer surface is scribed to define a plurality of transducer bearing sliders and rows of sliders are sliced from the wafer 11 for further processing fig1 b shows a section of a row 13 sliced from the wafer of fig1 a the row includes a plurality of sliders 14 each having at least one transducer 15 deposited thereon the transducers 15 are located at the trailing ends of the sliders 14 during row processing a surface 16 of the row is lapped to form the air bearing surfaces of the sliders 14 and to attain desired transducer dimensions e g the desired throat height of an inductive head or the desired stripe thickness of a magnetoresistive mr head additional processing may be performed such as rail etching before individual sliders are separated from the row in storage devices such as magnetic disk drives a slider 21 such as the one in fig2 a is mounted to the flexible portion 26 of a suspension which.