iv an interface circuit subassembly 1300 each of these four modules or subassemblies is typically constructed on its own discrete circuit board or substrate and a variety of kinds may be used cabling can be used to interconnect the boards and in this embodiment flex or rigid flex interconnections are used fig4 shows an exploded view of the indicia reader module 1000 with the major modules and circuit subassemblies to fabricate the sensor module the sensor ic die 1040 is first cob packaged with a substrate 1042 and then integrated with the module housing 1048 and the ir cutoff filter 210 to form a hermetically sealed assembly see fig3 a and 3b a dummy lens is then added to the housing 1048 to allow direct soldering or reflowing with surface mount technology smt of any components on this substrate after soldering the real lens is inserted focused and secured into place as depicted in fig4 the sensor module 1050 and all the circuit subassemblies 1100 1300 1400 are attached e g snap fit to the frame 1014 the frame 1014 holds all the circuit boards and modules in place through the use of snap fittings which ensures cost and space efficiency it is within the scope of the invention to employ other less efficient techniques to attach the boards to the frame the frame in this embodiment also functions.