remove layers under the excess solid or both step e may be performed by any convenient technique such as rinsing the mold with solvent this invention may be used in various lithography techniques examples of such lithography techniques include but are not limited to imprint molding step and flash imprint molding solvent assisted micromolding samim microtransfer molding and micromolding in capillaries mimic this invention may be used for imprint molding in this lithography process the pcc is applied on a surface of a substrate the pcc may be heated above its phase change temperature before or after application to the surface of the substrate the patterned surface of the mold is brought into contact with the surface of the substrate on which the pcc is applied thereby distributing the pcc in the mold the pcc is then hardened to a solid and the mold is removed imprint molding may be used to prepare for example photodetectors and quantum wire quantum dot and ring transistors this invention may also be used in samim in this lithography process the pcc is applied on a surface of a substrate the pcc may be heated above its phase change temperature before or after application to the surface of the substrate a patterned surface of a mold is wetted with a solvent and is brought into contact with the surface on which the pcc is applied the choice of solvent depends on various factors including the specific mold and pcc selected the solvent should.