of the wafer w it does not need to be withdrawn after vacuum evacuation in the above described embodiments a substrate to be processed is not limited to a wafer for a semiconductor device but may be various substrates used for lcds liquid crystal displays or fpds flat panel displays photomasks cd substrates print boards or the like further characteristic configurations of the above embodiments e g structure and material of a foreign substance adsorption layer and an out gases adsorption layer included in the protection member an application of a cooling unit and a charging unit an application of violation to the wafer w by ultrasonic wave or by light irradiation at the regeneration heating process of the protection member or the like may be applied independently or in a combination of two or more thereof moreover in accordance with another aspect of the present invention there is provided a storage medium storing program codes of software capable of implementing functions of each of the above mentioned embodiments which is supplied to a system or device whose computer or cpu mpu etc may read and executes the program codes stored in the storage medium in this case the program codes themselves which are read from the storage medium realize the functions of each of the above described embodiments and the program codes and the storage medium storing the program codes fall within a scope of the present invention further the storage medium storing program codes may include for example floppy registered trademark discs hard discs magneto optical discs optical discs such as cd roms cd rs.