there is a dramatic increase in the efficiency of aluminum corrosion inhibition and a more gradual but sustained increase in copper corrosion inhibition this example determined copper etch rates for a semi aqueous dilute base having the general formulation of example 1 using 4 weight percent benzoic acid as the corrosion inhibitor and additionally including varying weight percentages of n n u2032 dimethylacetamide dmac were conducted at 75 u00b0 c the results are shown in fig2 and table iii it i noted from the resulting data that as the amount of dmac increases in the stripping cleaning compositions the copper etch rate also increases this unexpected phenomenon is likely due to the chelation product having a higher affinity for the solution resulting in a reduction in the corrosion inhibition efficiency a series of experimental runs were conducted to evaluate the corrosion inhibitor efficiency for aluminum and copper films of the present invention versus the known and prior art inhibitor to a stripping composition matrix comprising 64 n n u2032 dimethylacetamide 30 deionized water and 6 45 choline hydroxide were added various inhibitors the solutions were agitated with a magnetic stirrer until the inhibitors were in solution all test wafers contained 1200 u00e5 u00b0 of thermal oxide underneath the metal film and were dipped into the various solutions maintained at 50 u00b0 c and agitated with a magnetic stirrer for 30 minutes followed by a 3 minute rinse with deionized water and then dried with nitrogen gas metal etch rates were determined using.