heat conductive layer and the cooling element is made in a particularly advantageous manner which is easily and securely effected during assembly the cooling element in this embodiment example is the housing 40 of the control device components which are identical to those in the previously described embodiment example are designated with the same reference numbers the printed circuit board 10 is of rectangular design and carries on its front face 30 a plug strip 31 for contacting the electronic circuit the upper side 12 of the printed circuit board 10 has the layer 13 of material with good thermal conductivity applied to it this layer 13 is arranged on the edge regions 32 to 34 in the form of a copper cladding the layer thickness of this copper cladding or deposit of copper is preferably between 300 u03bcm and 400 u03bcm in the embodiment example shown here the heat conductive layer 13 is extended to form a continuous surface on the three free front faces 35 to 37 of the printed circuit board the width of the heat conductive layer 13 at right angles to the outer edge of the printed circuit board is dependent on the power components 11 to be cooled or the dimensions of these the power components to be cooled wiring components or smd surface mounted devices are placed on this heat conductive layer 13 such that they are at a certain distance from the front.