schematic representation of a conditioned pulse reversal current wherein the cathodic pulse is u201c conditioned u201d by a stepped reduction or increase of pulse height of width u201c c u201d and the anodic current is conditioned by a stepped increase in pulse height of width u201c d u201d direct current plating produces minimal oxide formation in co u2014 fe u2014 m and co u2014 fe alloys pulse plating shown in fig3 b deposits co u2014 fe u2014 m alloy during cathodic current current value u201c x u201d in figure and oxidizes element m when said current is reduced to zero pulse reversal plating shown in fig3 c is similar to pulse plating except that the brief anodic current pulses of magnitude u201c y u201d enhances the oxidation of element m the conditioned cathodic pulse shown in fig3 d of step height u201c u u201d or u201c v u201d increases the content of element m in the alloy the conditioned anodic pulse of height u201c z u201d shown on the same graph favors oxide formation the magnitude of the cathodic pulse height depends on the reduction potential of element m for elements with low reduction potential such as ni mo and rh a conditioning current u201c u u201d that is less than u201c x u201d is favored for w and cr whose reduction potential is higher than the co u2014 fe system a higher current u201c v u201d is preferred table 1 below summarizes the working range of.