w which is presently preferred for connection between the read element within head 13 and chip 54 fig2 via trace arrangements 5560 s or 7540 s thus either trace arrangements 5560 s or 7540 s can be used in conjunction with passive conductor traces 74 a 74 b 76 a and 76 b to provide substantially uniform inductance along interconnect structure 60 and segment 62 as also shown in fig1 the inductance of conventional trace arrangement 20030 is substantially unchanged with respect to the inductance of trace arrangements 10030 w or 10030 s fig1 illustrates the capacitance for the trace arrangements 4030 w 10030 w 20030 as well the capacitance for trace arrangements 10030 s 7540 s and 5560 s incorporating the passive electrical conductor traces 74 a 74 b 76 a and 76 b if trace arrangement 4030 w is employed on interconnect structure 60 then either trace arrangements 7540 s or 5560 s can be employed on trace film segment 62 to substantially match the capacitance between interconnect structure 60 and trace film segment 62 additionally if trace arrangement 10030 w is employed on interconnect structure 60 then trace arrangement 10030 s can be employed on trace film segment 62 to again substantially match the capacitance between interconnect structure 60 and trace film segment 62.