technique required this means that a single type of the substrate 50 that is used for mounting an element and an external terminal can be adopted for various types of the ic element 51 because the substrate can accommodate various layouts of the pad terminals of the ic element in this way it is possible to reduce the manufacturing cost of the semiconductor device moreover according to the first embodiment even after the ic element 51 is fixed on the upper faces of the posts 40 and is sealed with the mold resin 61 each column of the posts 40 can be recognized by using the mark 43 and each row of the posts can be recognized by using the mark 44 from the lower face side of the mold resin 61 thereby a fiducial point used for deciding a dicing line can be made clear even though the posts 40 have the same figure and size in the substrate 50 in this way it is possible to increase accuracy and efficiency in the dicing process in the first embodiment the post 40 exemplarily corresponds to a u201c metal post u201d the mark 43 exemplarily corresponds to a u201c first mark u201d and the mark 44 exemplarily corresponds to a u201c second mark u201d in the invention defined by the claims laid out herein moreover the gold wire 53 exemplarily corresponds to a u201c conductive part u201d and the mold resin 61 exemplarily corresponds to u201c resin u201d though the photomask m 2 shown in fig1 a is used in the above described first embodiment a photomask m 2 u2032 shown in fig1 b can be used instead and the resist pattern 31 for example see fig7 can be formed on the upper face of the.