104 is under an ink jet type print head 108 in step 212 a drop of fluid 112 is propelled from the ink jet type head to the wafer the fluid is supplied by a reservoir 114 or by a carrier such as the carrier film used with dye sublimation system not shown if necessary the fluid is allowed to dry in step 214 skilled persons will recognize that in a dye sublimation system the fluid that is the source of the protective layer is a gas that condenses as a solid onto the work piece and thus does not need to dry the wafer is inserted into a charged particle beam vacuum chamber in step 216 in step 218 a portion of the region of interest is processed by charged particle beam processing in some embodiments rather than moving the wafer on a stage to position the region of interest under the ink jet the ink jet is moved to a position above the region of interest in other embodiments the ink jet is aligned by a combination of moving the ink jet and moving the wafer fig3 shows a work station 300 at which a simulation of a robot wafer handler 302 removes a wafer 306 from a cassette 308 and places the wafer under an ink jet head assembly 310 which includes a support 312 upon which.