led and the connecting interface for thermal fin the carrier substrate 10 is packaged as the common circuit so the detailed package process is omitted now please referring to fig3 a and fig3 b those are the top view and the sectional view of the transparent carrier substrate used in the led package structure in the present invention as shown in fig3 a a plurality of standalone metal layers with equal size are disposed on the transparent substrate 30 32 the method of forming the metal layer is forming a metal layer on the transparent carrier substrate 30 32 coating a photoresist layer on the metal layer and exposed by a patterning mask removing a portion of the metal layer by eroding method after removing a portion of the photoresist layer a plurality of standalone metal layers with equal size are formed on the transparent carrier substrate 30 32 in addition the size of the metal layer is little bigger than the led 20 besides the step of forming the metal layers 300 on the transparent carrier substrate 30 32 includes coating the photoresist layer on the transparent carrier substrate 30 32 forming a concave or channel on the photoresist layer after exposing and developing by a patterning mask filling the metal material in the concave or channel and removing the photoresist layer to form the metal layer 300 on the transparent carrier.