from other areas of the chamber during in situ target cleaning referring to fig3 of the drawings a preferred embodiment of the present invention is shown in such embodiment a housing 40 is depicted forming an evacuable processing chamber 42 the upper portion of which forms a sputtering region wherein metal is sputtered from an anode plate 44 onto the upper surface of a substrate 46 34 chamber 42 is accessible from the top and closed by the anode assembly 43 which includes the anode plate 44 which extends into the circular opening 45 formed in the top housing 40 note that the closure 43 is electrically isolated from the housing 40 by means of an insulative ring 47 and is pneumatically sealed thereto by means of resilient 0 rings 49 the sputtering region 48 is defined by the anode plate 44 a cathode forming bowl 50 having a central opening 36 formed in the bottom thereof and a substrate clamp 52 the inner periphery of which defines a plating aperture or opening 38 the anode and cathode are electrically interconnected to both a d c power supply source 101 and r f power supply source 102 with a switching means 103 included therebetween to alternate the power source between d c power and r f power disposed within chamber 42 is a substrate support member 54 and lift assembly 56 including four upstanding substrate engaging fingers 57 support member 54 is moved by an actuator 58 between a lower position as shown by the solid lines and an upper position indicated by the dashed lines 54 39 located immediately below the in place substrate 46 39 the support member 54 may be a pedestal or a heater as will be further explained below lifting assembly 56.