glass mold plate 14 has been heat treated at the temperatures such as from about 740 u00b0 c to about 800 u00b0 c for a predetermined period of time preferably within about 1 minute to about 20 minutes in that instance the peripheral edge 16 of the mold pit 10 in the surface 12 of the glass mold plate 14 has been radiused and shown to be in a smoother rounded off configuration thereby reducing or eliminating the sharpness of the edge so as to have a reduced tendency to adversely affect the process of injection molded soldering for which the glass mold plate 14 is employed further experiments indicate that in one useful case the borosilicate glass mold plate is heated to 760 u00b0 c and held there for 10 minutes before being allowed to cool quite evidently the heat treatment of the glass mold plate 14 will successfully increase the pit smoothing at the edge 16 thereof with no significant alteration of mold pit or cavity volume moreover utilizing suitable material for a flat or planar substrate 20 on which the glass mold plate 14 is mounted will also enable the heat treatment to be implemented without any adverse effect on the planarity and quality of the upper mold plate surface 12 other substrate materials besides quartz such as graphite plates may also be successfully employed as well as different temperature and time cycles for the heat treatment moreover a coating of materials may also be utilized such as a graphite powder and other materials which are being investigated this may provide a solution to the u201c sticking u201d problem between the mold plate and substrate which has been encountered to some extent in connection with the foregoing process best results.