is used as the substrate in the igniter 21 u2032 having a different shape from the shape shown in fig4 the substrate is provided to stand on the header a portion of the substrate except for the heat generating portion is covered with insulating material such as epoxy resin and the heat generating portion comes in contact with the priming contacting surfaces of a substrate bottom surface and the header are fixed by adhesive by providing the substrate on the header vertically in this manner a space capacity for disposing the substrate can be made smaller than a case of laying the substrate so that the igniter itself can be reduced in size then since the integrated circuit and the capacitor on the portion of the substrate except for the heat generating portion do not come in contact with the priming pollution thereof or the like are prevented further in the igniter 21 shown in fig4 a glass header for supporting pins 21 a and 21 b sections vertically between the substrate and the priming and a substrate arranged with the capacitor and the integrated circuit is provided below the header vertically then the heat generating portion is disposed above the header on a surface of the header and the heat generating portion and the.