g while in this application a heat dissipation device comprises a composite base plate and stamped aluminum fins where the composite base plate is made of carbon fiber reinforced aluminum matrix composite with high thermal conductivity as depicted in fig4 the thermal resistance of this composite based heat dissipation device is 0 333 u25a1 w and the weight is only 192 g much lighter than the conventional copper based heat sink as shown in table 2 this result proves that the heat dissipation device comprised the composite materials of the invention not only have good thermal performance but also has light weight compared to the copper based heat sink as the power dissipation of cpus over 120 w certain thermal modules integrating a copper base plate heat pipe and fins as shown in fig5 are also designed to improve the thermal performance in this invention a heat dissipation device comprises a composite base plate heat pipe and stamped fins are assembled where the composite base plate is made of carbon fiber or graphite foam reinforced aluminum matrix composite the composite material is coated with ni or cu and soldered to the heat pipes as shown in fig6 table 3 lists the thermal resistance of the application the base plate.