325 by exerting an upward pressure on the bond wire 325 in addition the die attach 350 substantially reduces horizontal shifting of the bond wire 325 by providing a source of horizontal friction in addition this embodiment employs minimal die attach material which may be beneficial in several applications fig3 b illustrates another embodiment in which the height of the die attach 350 exceeds the distance between the bond wire 325 and the surface of the semiconductor die 320 but does not reach the bond wire 315 in this configuration the bond wire 325 passes through the die attach 350 consequently its movement after manufacturing is greatly restricted which significantly reduces the chances of both vertical sagging and horizontal shifting because the die attach 350 illustrated in fig3 a does not support any pass through bond wires the die attach of fig3 a can easily be formed to have a rectangular cross section or a semi circular or semi ovular cross section however the die attach illustrated in fig3 b as well as the die attaches illustrated in fig3 c and 3d includes a pass through bond wire and is therefore formed to have a semi circular or semi ovular cross section as discussed in detail below a rectangular cross section is preferably achieved using a manufacturing process that is different from the manufacturing process used to create a semi circular or.