shown on the bottom surfaces of the dice 28 if quick curing has disrupted these interconnections then the assembly 32 proceeds to the rework station where the connections between the bumps and the dots 26 can be repaired the repaired assembly 32 is then retested and if it passes it proceeds to encapsulation or some other form of sealing and ultimately is shipped to customers along with those assemblies 32 that passed this testing step the first time through of course it should be understood that this invention may be implemented with only one test stage for u201c wet u201d epoxy assemblies although two stages are preferable when the conductive epoxy dots 26 are made from a u201c dry u201d epoxy e g a thermoplastic epoxy then the pcb 22 is indexed and inserted into the in line test socket 24 or connected to the probes 25 as described above but the dice 28 are attached to the pcb 22 using heat before the assembly 32 proceeds to testing testing typically takes place while the pcb 22 is singulated from its carrier not shown during testing if the assembly 32 fails then it proceeds to a rework station where the bumps on the bottom of the dice 28 the dice 28 themselves or the interconnection between the bumps and the conductive epoxy dots 26 can be repaired the repaired assembly 32 then proceeds to encapsulation or some other form of sealing and eventually is shipped to customers along with those assemblies 32 that passed the testing the first time through thus this invention provides a repair method for flip chip semiconductor assemblies that is less expensive than the previously described known good die kgd based rework process because it does not.