as the use of a liquid crystal thermoset monomer thermoset processing may be done without other curing agent processes 0029 fig2 a is a cross section of a package 200 during a no flow underfill process according to an embodiment the package 200 includes a solder bump 210 that is attached to a flip chip 212 electrical coupling for the flip chip 212 is accomplished through a bond pad 214 that is landed on a mounting substrate 216 0030 fig2 b is a cross section of the package 200 depicted in fig2 a after further processing an underfill mixture 222 according to an embodiment is applied either to the flip chip 212 or to the mounting substrate 216 in fig2 b the underfill mixture 222 is depicted as being deposited upon the mounting substrate 116 although it may alternatively deposited upon the flip chip 212 fig2 a underfill mixture 222 has unique formulations according to various embodiments and will be described below in greater detail 0031 fig2 c is a cross section of the package 200 depicted in fig2 b after further processing next the flip chip 212 and the mounting substrate 216 are aligned and brought together to form a flip chip assembly 220 that includes the uncured underfill mixture 222 and the not yet reflowed solder bump 210 0032 fig2 d is an elevational cross section of the flip chip assembly 220 depicted in fig2 c after further processing a curing process is carried out to achieve a chip package 224 the curing process is carried out according to specific embodiments in one embodiment curing is followed by reflowing of the solder bump 210 fig2.