of the process chamber after the wafer handlers have moved away from the process chamber the outer walls of the process chamber close this action not only secures the wafers but also encloses the process chemicals in to the process chamber the additional vents and ports allow the process chamber to be filled completely to the required level and maintain the same level throughout the process in any case the top of the vent ports may be outside of the liquid such that an electrically connecting path outside of the inner bath is avoided this embodiment is shown in fig7 b the embodiments of design a and design b can be combined into a hybrid utilizing the loading mechanism from design a and the sealing mechanism from design b in this hybrid design the bottom section of the chamber remains in the outer bath the wafers are pre loaded into the top and side portion of the chamber which acts both as a handling mechanism and a partial chamber the preloaded wafers are then immersed in the outer bath until the wafers make contact with the lower portion of the chamber the chamber walls are then closed tight with an actuator mechanism ensuring a leak proof chamber the batch porous silicon equipment design embodiments described above can be used to form either single layer or multi.