embodiment the package 42 is attached to a printed circuit board 70 by attachment of the solder ball array 52 to pc board pads 72 a solder reflow process well known in the packaging industry is used to attach the package 42 to the printed circuit board pads 72 fig8 a illustrates a first step in a method of making the package 42 with the polymeric layer 44 in fig8 a the passivation layer 62 is applied to the redistribution layer 50 forming the windows 64 over the fan out pads 58 in one embodiment of the method the passivation layer 62 is applied to the redistribution layer 50 using a screen printing process both the material used for the passivation layer 62 and the screen printing technique are commonly known in the packaging industry however other techniques for applying the passivation layer 62 or any technique for shielding the redistribution layer 50 during solder dispensing steps is considered within the scope of the invention fig8 b illustrates a next step in a method of making the package 42 with the polymeric layer 44 in this step the solder balls 54 of the ball grid array 52 are deposited on the fan out pads 58 through the windows 64 of fig8 a using any one of a number of techniques well known in the industry in one embodiment the solder balls 54 of the array 52 are dispensed from a needle fig8 c illustrates a next step in a method of making the.