312 in direction 332 it precedes the laser source 324 controller 328 coordinates and synchronizes the operation of inkjet head 320 and laser source 324 controller 328 receives the data for imaging 404 in fig4 from a digital front end not shown and provides it to the inkjet head 320 and laser source 324 the inkjet head 320 deposits conductive lines 204 on substrate 208 following the deposition of the conductive lines 204 deposition by inkjet head 320 a focused laser beam is applied by laser source 324 the thickness of sintering applied by the laser source 324 is variable and is adjusted by the spot size of the laser source 324 the laser source 324 scans lines 204 on the previously deposited lines 204 this process the laser imaging on lines 204 sinters together the nano particles of the ink deposited on lines 204 since size of the laser spot can be made significantly smaller than the deposited line the sintering process can form sintered grid lines 504 shown in fig5 which are substantially narrower that lines 204 after the laser imaging a sintered metallic conductive line 504 is formed surrounded with un sintered ink 508 the un sintered ink 508 is then removed with appropriate materials and complementary processes such as brushing with water not shown alternatively an un.