during the testing process also allowing test probes 144 access to both the top and bottom surfaces 150 152 of substrate 112 may allow easier access to each individual die 122 132 and 138 note that when multiple die are used within a package the number of pads 116 required for test may be significantly higher fig2 illustrates one embodiment of package device 100 wherein an encapsulation material 146 has been deposited overlying die 138 die 132 and bond fingers 114 note that in alternate embodiments of the present invention encapsulating material 146 may be deposited over a larger portion of substrate 112 for example in some embodiments of the present invention encapsulating material 146 may be deposited overlying pads 116 as well regardless of whether pads 116 are encapsulated by encapsulating material 146 pads 116 may be used to electrically couple discrete devices to one or more of die 122 132 and 138 note that encapsulating material 146 may be any type of appropriate material for integrated circuits such as for example a molded plastic or a liquid deposited glob material fig2 illustrates one embodiment of package device 100 in which conductive interconnects 148 have been placed overlying pads 116 at surface 150 in one embodiment of the present invention conductive interconnects 148 may be solder balls however in alternative embodiments of the present invention conductive interconnect 148 may be any type of electrically conductive material formed in any manner note that conductive interconnects 148 are optional in some embodiments of the.