squeegee 108 wipes across the stencil thereby pushing solder paste into the stencil apertures and onto the board 116 solder paste remains on the circuit board 116 in the preset pattern when the support mechanism supporting the board moves downward away from the position of the stencil or the stencil moves upward away from the board under control of the controller the surface tension between the circuit board 116 and the solder paste causes most of the solder paste to remain on the circuit board when the circuit board 116 and the stencil 106 are separated a vision inspection system then moves into position over the circuit board 116 to inspect the solder paste deposits to determine whether the solder paste has been accurately placed on the circuit board inspection aids in ensuring that the proper amount of material has been deposited and that the material has been deposited at the proper locations on the circuit board the vision inspection system can use fiducials chips board apertures chip edges or other recognizable patterns on the circuit board to determine proper alignment after inspection of the circuit board the controller controls movement of the circuit board 116 to the next location using the tractor feed mechanism where electrical components will be placed on the circuit board 116 in addition to vision inspection of the circuit board upon completion of the deposition of solder paste onto the circuit board in one embodiment of the invention the stencil is cleaned using a wiper to remove excess solder paste from the surface of the stencil prior to beginning a print cycle on a next circuit board generally in known printers the wiper used to clean the.