may be placed in cavity 120 to cool in substrate voltage regulator 112 in this aspect thermoelectric cooler 122 is positioned between integrated heat spreader 106 and in substrate voltage regulator 112 by for example connecting thermoelectric cooler 122 to a surface of integrated heat spreader 106 and then inserting integrated heat spreader 106 within cavity 120 similar to the embodiment of fig1 thermal interface material 130 may be provided to promote adhesion and heat transfer between thermoelectric cooler 122 in substrate voltage regulator 112 and integrated heat spreader 106 power may be delivered directly to thermoelectric cooler 122 by contacts 124 and 126 of socket body 102 connected to thermoelectric cooler 122 on one end and printed circuit board 118 on another end through solder balls 128 and 129 respectively as described in reference to fig1 although only contacts 124 and 126 are shown connected to thermoelectric cooler 122 it is contemplated that any number of contacts 104 deemed desirable may be connected to one or more of thermoelectric cooler 122 alternatively power may be delivered to thermoelectric cooler 122 through heat spreader 106 or a heat sink as described in reference to fig1 an additional cooling component 302 may be connected to integrated heat spreader 106 by any suitable technique when further cooling is deemed desirable in some embodiments cooling component 302 may be a heat sink a heat pipe or a cold plate of a microchannel liquid cooler fig4 shows an exploded view of a thermoelectric cooler to cool an in substrate voltage regulator in accordance with one embodiment in accordance with the illustrated embodiment in substrate voltage regulator 112 thermoelectric.