u2032 to the conductor layer 32 u is formed next an insulating layer 17 u is formed on the surface in the z direction of the insulating layer 13 and an insulating layer 17 l is formed on the surface in the u2212 z direction of the insulating layer 12 here the insulating layers 17 u and 17 l may be formed by lamination pressing through pin lamination for these insulating layers 17 u and 17 l a material similar to that used for the insulating layers 12 and 13 can be used subsequently conductor layers 35 u and 35 l are formed on the surface in the z direction of the insulating layer 17 u and on the surface in the u2212 z direction of the insulating layer 17 l respectively see fig7 b the conductor layers 35 u and 35 l are formed by pressing the conductor film 35 u and the conductor film 35 l to adhere onto the surface in the z direction of the insulating layer 17 u and the surface in the u2212 z direction of the insulating layer 17 l respectively copper foil and the like can be used as the conductor films 35 u and 35 l a conductor film with a carrier may be used to form a very thin layer of the conductor films 35 u and 35 l in such a case the conductor film with a carrier is laminated on the corresponding insulating layer and thereafter the carrier member is pealed off to leave the thin conductor film on the insulating layer here it is preferable to use a conductor film with a carrier having a conductor film thickness of about 3 u03bcm to about 9 u03bcm such as micro thin manufactured by.