to be taken in a limiting sense and the scope of the present invention is defined only by the appended claims 0021 fig1 a is a cutaway view of some embodiments of inductor 100 of the present invention inductor 100 includes substrate 103 a plurality of conductive segments 106 a plurality of conductive segments 109 and magnetic film layers 112 and 113 the plurality of conductive segments 109 interconnect the plurality of conductive segments 106 to form highly conductive path 114 interwoven with substrate 103 magnetic film layers 112 and 113 are formed on substrate 103 in core area 115 of highly conductive path 114 substrate 103 provides the structure in which highly conductive path 114 that constitutes an inductive coil is interwoven substrate 103 in one embodiment is fabricated from a crystalline material in another embodiment substrate 103 is fabricated from a single element doped or undoped semiconductor material such as silicon or germanium alternatively substrate 103 is fabricated from gallium arsenide silicon carbide or a partially magnetic material having a crystalline or amorphous structure substrate 103 is not limited to a single layer substrate multiple layer substrates coated or partially coated substrates and substrates having a plurality of coated surfaces are all suitable for use in connection with the present invention the coatings include insulators ferromagnetic materials and magnetic oxides insulators protect the inductive coil and separate the electrically conductive inductive coil from other conductors such as signal carrying circuit lines coatings and films of ferromagnetic materials such as magnetic metals alloys and.