package body 104 on a perimeter 216 of the packaged integrated circuit locking mechanism 212 may take other shapes for example in accordance with the current embodiment if locking mechanism 212 were to replace an additional leadframe lead 208 locking mechanism 212 would comprise three prongs forming an m shape while the present embodiment shows locking mechanism 212 having a shape with prongs different forms are also possible that achieve the same result referring now to fig3 a diagram illustrates a top view of a pwb 318 having mounted thereon a packaged integrated circuit 300 according to an embodiment of the present invention leadframe leads 308 of packaged integrated circuit 300 are soldered to corresponding traces 320 on pwb 318 traces 320 are routed on a top surface of pwb 318 from a connector 324 to leadframe leads 308 high speed traces 322 may be routed on the top surface of pwb 318 from connector 324 through a large pitch beneath packaged integrated circuit 300 to additional leads 306 on an underside of packaged integrated circuit 300 critical signals may be routed through high speed traces 322 on the top surface of pwb 318 while less critical signals may be routed through leadframe leads 308 or in lower layers of pwb 318 for example lower speed data and control signals may be carried by leadframe leads 308 and traces 320 while additional.