of the substrate 210 a plurality of chips 230 are provided and each chip 230 has an active surface 232 and an opposite back surface 242 each chip 230 includes a plurality of contacts 234 surrounding the periphery of the active surface 232 and disposed on the active surface 232 the back surface 242 of each chip 230 is attached to the corresponding die pad 214 of the substrate 210 through an adhesive 244 each chip 230 is electrically connected to the substrate 210 through wires 280 by wire bonding one end of the wire 280 is attached to the contact 234 of the chip 230 while the other end of the wire 280 is connected to the contact 216 of the substrate 210 0025 fig3 a is a top view showing the structure in fig3 referring to fig3 and 3a an adhesive 290 is applied to attach a stiffener 250 to the substrate 210 the stiffener 250 is a cap structure including a top roof portion 252 sidewalls 254 and a flange portion 256 the top portion 252 is supported and surrounded by the surrounding sidewalls 254 an upper portion 254 a of the sidewall 252 is connected to the periphery of the top portion 252 the sidewalls 254 are declivous walls not perpendicular to the top portion 252 a space 258 formed between the slopy.