u201d applicant 39 s case 12132q and published as us 2012 0295049 which is hereby incorporated by reference embodiments of the present disclosure can be used with embodiments for co injection processes as disclosed in u s patent application ser no 13 774 692 filed feb 22 2013 entitled u201c high thermal conductivity co injection molding system u201d applicant 39 s case 12361 and published as us 2013 0221572 which is hereby incorporated by reference embodiments of the present disclosure can be used with embodiments for molding with simplified cooling systems as disclosed in u s patent application ser no 13 765 428 filed feb 12 2013 entitled u201c injection mold having a simplified evaporative cooling system or a simplified cooling system with exotic cooling fluids u201d applicant 39 s case 12453m now u s pat no 8 591 219 which is hereby incorporated by reference embodiments of the present disclosure can be used with embodiments for molding thinwall parts as disclosed in u s patent application ser no 13 601 514 filed aug 31 2012 entitled u201c method and apparatus for substantially constant pressure injection molding of thinwall parts u201d applicant 39 s case 12487d now u s pat no 8 828 291 which is hereby incorporated by reference embodiments of the present disclosure can be used.