4 because the bumps 5 are made of au not solder which is melted at the bonding step for transferring the bumps to the electrodes the above described steps i e the first placement step fig1 a and the first bonding step fig1 b are repeated for each lsi chip 9 until a prescribed number of lsi chips 9 are placed on the bump substrate 4 the bump substrate 4 is then transported to the x y table 22 for subsequent steps thus according to the method of this example the lsi chip 9 is not moved to a chip tray to be held thereon after the first bonding step as in the conventional method described earlier but is directly transported while being held on the bump substrate 4 fig1 c shows a transfer step a second placement step and a second bonding step the bump substrate 4 holding a plurality of lsi chaps 9 thereon is transported to be placed on the x y table 22 in the transfer step each of the lsi chips 9 is lifted up by sucking it with a vacuum collet 11 from the bump substrate 4 by this sucking the bumps 5 are removed from the bump substrate 4 and transferred to the electrodes 7 of the lsi chip 9 the lsi chip 9 lifted up by the vacuum collet 11 is then placed on the wiring board 15 and bonded therewith fig2 a and 2b illustrate the transfer step the second.