the two core elements 10 a and 10 b heat and pressure are applied to cause the two core members to bond together with the pyrahix lf film acting as an adhesive bond material also the fill material 28 a and 28 b in each of the openings in the two core members 10 a and 10 b will bond together as shown in fig8 to form a continuous z axis electrical connection between the circuit traces 18 a 18 b 20 a and 20 b on the core element 10 a and 10 b the lamination process also advances the cure of the conductive fill material 24 a and 24 b past 80 to the fully cured stage a specially formulated dicing tape can be used as adhesive tape 22 an example of suitable dicing tape is adwill d series tape provided by lintec corporation these tapes are comprised of a base material such as pvc poly vinyl chloride or pet polyethylene terephthalate or po polyolefin with an adhesive film that provides strong temporary adhesion alternately the adhesive could be provided on other base material such as polyimide the adhesive layer provided on the base layer is formulated so that it provides strong initial adhesion but upon exposure to uv ultraviolet radiation its adhesion is diminished and it can be peeled and released without causing damage or leaving residue on the copper traces 18 or the dielectric layer 12 in such case the backing must be transparent to uv.