by placement of decal corner openings 11 onto guide posts 12a slight heat application as by lamp 41 melts the tacky wax on the decal which held the sub assemblies thereto during manipulation of the decal and allowing peel away of the decal if necessary a wax coating on the surface of plate 40 may be used to hold the sub assemblies in position thereafter fig1 shows precision stacking of sub assemblies embodying components a onto the sub assemblies embodying components b by inversion and placement of decal 10b into the position shown with corner holes on posts 12a peel away of the decal is also shown in this manner a built up stack or assembly as shown at 44 in fig1 may quickly be realized note that the stack is formed with tabs of successive electrodes in the stack exposed at opposite ends of the stack no large laminating force i e to compress the stack is required because the metal electrode in each sub assembly is flush with its associated component or dielectric surface as explained above this then obviates or prevents density distortions which in the past have led to serious delamination problems fig1 and 18 also show the stacks on a setter 40 upon which drying and firing of the stacks takes place this eliminates hand loading which was previously.