etching treatment thereafter the photo cured film or unexposed film on the circuit pattern may be dissolved for removing in a cellosolve solvent such as ethyl cellosolve ethyl cellosolve acetate and the like an aromatic hydrocarbon solvent such as toluene xylene and the like a ketone solvent such as methyl ethyl ketone methyl isobutyl ketone and the like acetate solvent such as ethyl acetate butyl acetate and the like chlorinated solvent such as trichloroethylene or an aqueous alkali solution such as a 3 10 aqueous caustic soda or caustic potash solution when the anionic electrodeposition coating composition is used or an aqueous acid solution when the cationic electrodeposition coating composition is used to form a printed circuit on the base plate the present invention makes it possible to obtain a printed circuit board completely free of failures in image which are caused from traces of water drops when washed with water by forming the photoresist on the copperclad laminated plate as the base plate according to a combination of an anionic or cationic electrodeposition coating as the first stage with the electroendosmosis in the aqueous solution as the second stage the reasons for the above are not accurately clarified it is assumed that the application of the electroendosmosis as the second stage results in making the film denser promoting the chelating making the photoresist which has been formed according to the electrodeposition coating as the first stage to reflow and to compensate the traces of water drops the present invention is explained more in detail by the following examples in which 34 part 34 and 34 34 represent 34 part by weight 34 and 34 by weight 34 respectively a mixture of 400 parts of methyl methacrylate 400 parts of butyl acrylate 200 pats of acrylic acid and.