to a circuit panel 912 and includes an electrically conductive emi shield 910 the tip ends of the pins of substrate 212 are solder bonded to contact pads of circuit panel 912 the microelectronic devices 906 908 and the emi shield 910 are mounted on an upper surface 241 of the substrate 240 the emi shield 910 is ball bonded to the peripheral trace 230 a of the substrate and as such electrically connected to the spacer 212 herein the spacer 212 is further connected to ground contact pads 914 of the circuit panel 912 for example the unit including substrate 240 devices 906 and 908 and shield 910 may be mounted to panel 912 using solder bonding techniques commonly used for surface mounting microelectronic elements on circuit boards in embodiments shown in fig9 b and 9c the devices 906 and 908 are mounted on both sides of the substrates 540 and 640 respectively the substrates discussed above may be interconnected to form multi substrate structures fig9 d depicts an exemplary assembly or package 904 comprising two stacked units 640 a and 640 b each of which includes a substrate as discussed above one of the stacked units denoted using a reference numeral 640 b has a recess formed.