wiring board 20 consequently the dummy protruding electrodes 14 b and the dummy electrode pads 22 b can be formed in desired positions on the wiring board 10 without being limited to positions or arrangements determined for the purpose of electrical connection between the semiconductor chip 10 and the wiring board 20 this can improve the freedom of design of the wiring board and positioning of the electronic component the present invention is not limited to the foregoing embodiments and various modifications including design changes may be made thereto based on the knowledge of those skilled in the art all such modified embodiments are also intended to fall within the scope of the present invention for example in the foregoing embodiments the protruding electrodes 14 are arranged in a line along each of the four sides of the semiconductor chip 10 however the protruding electrodes 14 are not limited to this arrangement as shown in fig6 the protruding electrodes 14 a may be arranged in an array in the peripheral areas of the semiconductor chip 10 while the protruding electrodes 14 b are formed in the center area of the semiconductor chip 10 with a spacing greater than that of the protruding electrodes 14 a in this case.