the melt or softening e g glass transition temperature of i were required to remove iii or else if a chemical agent were used to remove iii said chemical agent can not also attack i in a preferred embodiment a thermosetting tmm molding compound i is used which cures around 340 u00b0 f the adhesive iii is larc thermoplastic polyimide which has a glass transition temperature higher than this temperature and so does not yield under the pressure of molding then the molded part is postbaked which further cures the thermosetting resin to a very highly crosslinked degree next a hot concentrated alkali caustic solution is used to chemically attack the larc adhesive but which cannot attack the highly crosslinked hydrocarbon thermoset material i however the preferred tmm thermosetting compound is an unusual plastic material it will be appreciated that crosslinked epoxy or crosslinked polyimide and most high temperature thermoplastics would not withstand the exposure to hot caustic solution with the preferred system one may actually be able to remove the flexible substrate by heating above the larc glass transition temperature and peeling most thermosetting plastic molding materials would not be capable of this in addition to the curved three dimensional object depicted in fig1 it will be appreciated that the present invention contemplates the manufacture of substantially more complex shapes for example multilayer curved circuitry may be made using previously produced circuit inserts in subsequent molding steps in this way integral conical antenna radomes wherein.