of the invention furthermore there is no intention to be bound by any theory presented in the preceding background of the invention or the following detailed description of the invention referring to fig1 there is shown an array 1 of silicon fingers 2 positioned on a substrate 3 the fingers in this representation do not include a coating the array is a structure that may be included in an hia the fingers 2 are generally elongate structures with a high aspect ratio the structure of fig1 represents fingers in an ideal setting the fingers are parallel in orientation and do not display any contact between them referring now to fig2 there is shown an array 1 of fingers 2 under less than ideal conditions again the fingers 2 are uncoated in fig2 some fingers 2 of the array are in contact due to stiction forces have warped and bent the fingers as a result adjacent fingers have come into contact with each other at one point this contact can degrade the capacitance that would otherwise between the fingers and thus affects performance of the accelerometer to which the fingers are attached it has now been discovered that a tungsten coating can be selectively deposited on silicon fingers the tungsten coated fingers display improved resistance to stiction further the tungsten coated fingers display improved sensitivity over non coated fingers the tungsten coated fingers thus display improved performance as triggering sensors in a highly integrated accelerometer a method of fabricating the tungsten coated silicon fingers is now described referring to fig3 there is shown one embodiment of a structure from which the coated silicon fingers may be constructed the structure comprises a first layer of silicon 11 such as monosilicon above the.