performed in the same manner as with the method of producing the flexible wired circuit board of the first embodiment cf fig1 a through 1 d according to this method as is shown in fig2 e a first gold plating layer 6 a is formed on the nickel plating layer 4 by electroless gold plating a thickness of the first gold plating layer 6 a is in the range of e g 0 03 0 12 u03bcm or preferably 0 05 0 1 u03bcm no particular limitation is imposed on the condition of electroless gold plating to form the first gold plating layer 6 a and for example the subject is dipped in a plating solution such as gold potassium cyanide for electroless gold plating to take place through a substitution reaction at a temperature in the range of 70 90 u00b0 c or preferably 75 88 u00b0 c for 300 600 s or preferably 300 450 s according to this method as is shown in fig2 f a second gold plating layer 6 b is formed next on the first gold plating layer 6 a by electrolytic gold plating the second gold plating layer 6 b can be formed in the same manner as the gold plating layer 5 described above and a thickness thereof is in the range of e g 0 05 1 0 u03bcm or preferably 0 05 0 15 u03bcm electrodes 7 comprising the nickel plating.