linkages 250 252 form torsional restoring forces acting against movement and will bring the plates to their initial position once externally applied acoustic force is zero undesired in plane movements can be limited by introducing in plane bump stops 340 at locations where undesired movement rotation has a high amplitude e g furthest away from linkages 250 252 the in plane bump stops 340 can be defined and manufactured on the second plate 150 or the device layer 100 a 100 b or the first plate 140 142 or any combination of these in an embodiment protruding tabs that form rotational bump stops 350 are provided to limit the rotation of the first 140 142 and second plates 150 by proper design the rotational bump stops 350 may eliminate need for reduction or turning off the potential difference between first and second plates 140 142 and 150 and the electrode 170 shown in fig2 a and 2b for recovery from a tip in or out of range condition fig2 a and 2b show the cross section of the torsional microphone 200 a and 200 b with integrated back cavity 130 along 2 a 2 a and 2 b 2 b in fig1 a and b respectively in an embodiment integrated back cavity 130 is formed by a fusion bond 220 between the second substrate 120 and the device layer 100 a and 100 b which is further bonded to the first substrate 110 by conductive alloy.