ground conductive runners 46 arc shown on the surface of the capping chip 16 as electrically connecting the metal vias 28 to the metal regions 42 in order to electrically interconnect the micromachine 14 to the circuit board 38 though not shown in fig4 the bond pads or fig2 and 3 may also be present on the exposed lefthand surface of the capping chip 16 so that the device 10 can be mounted in either manner shown in fig3 and 4 fig4 also shows an optional plate 48 attached to the device chip 12 and joined with solder 50 to the circuit board 38 to provide greater stability for the device 10 the plate 48 can be formed of any suitable preferably nonconducting material and may attached to the device chip 12 by gluing solder or other suitable methods fig5 and 6 illustrate other sensing applications for a semiconductor micromachine device in accordance with this invention in fig5 a fluid handling actuator 60 is shown mounted to a circuit board 88 in which an opening 86 has been formed through which a fluid passes before entering the actuator 60 as shown the actuator 60 is structured similarly to the sensing device 10 of fig2 through 4 including device and capping chips.