at 450 u00b0 c in air for 8 minutes to attain a copper oxide layer 7 preoxidation of the second copper board for example copper board 4 39 with a thickness of 0 3 mm at 450 u00b0 c in air for 8 minutes 8 insertion of preoxidized copper bodies 8 into one opening 6 each 9 placement of preoxidized copper board 4 39 on ceramic layer 2 10 heating of the ceramic layer with the copper boards in a nitrogen atmosphere with an o 2 content of 5 ppm to 1072 u00b0 c within 18 minutes 11 holding the process temperature of 1072 u00b0 c for roughly 2 minutes the result of this process was a substrate with complete through connection 5 i e with a complete uniform copper connection or bond both in the area of the through connection and also at the transition between the copper and ceramic in this example instead of the round plate shaped copper body copper body 8 39 in the form of a sphere with a diameter of 0 8 mm was used process steps 1 5 in this example correspond to process steps 1 5 of example 1 preoxidation of copper body 8 39 formed as a sphere taking place in the 6th process step again.