now be described by way of example only with reference to the accompanying drawings as shown in fig1 and 2 a first preferred embodiment of the present invention comprises an electronic component 1 a heat sink 2 a housing 3 and fluid 4 the electronic component 1 is a light emitting diode a power transistor or other electronic component which will generate thermal energy the electronic component 1 is provided with a heat conductor 11 or integrally formed with a circuit basal plate the heat sink 2 is attached to one surface of the electronic component 1 the heat sink 2 is made of metal carbon fiber composite material or the like which conducts heat efficiently so as to efficiently conduct and dissipate thermal energy from the electronic component 1 the heat sink 2 comprises a heat conducting member 21 and a plurality of cooling posts 22 or cooling fins the heat conducting member 21 is attached to the heat conductor 11 or the circuit basal plate for transferring thermal energy the cooling posts 22 are disposed on an inner surface of the heat conducting member 21 for increasing the surface area to dissipate heat and transferring the heat energy to the surrounding the housing 3 is made of glass plastics synthetic resin ceramic composite material or the like which is insulating and capable of heat conduction the housing 3 is hollow inside and has a first notch for coupling.