cutting element by way of example and not limitation the term u201c chamfer u201d as used herein may refer to a single surface chamfer a dual surface chamfer a triple surface chamfer a rounded edge or any other protective structural configuration for a cutting edge in some embodiments the present invention provides apparatuses and methods for forming and or polishing a chamfer on a cutting element fig2 is a schematic figure illustrating a configuration that may be employed in such embodiments of apparatuses and methods as shown in fig2 such apparatuses and methods may be used to form and or polish a chamfer along a peripheral edge of a layer or u201c table u201d of superabrasive material 105 on a cutting element 100 a chuck 205 may be used to hold and position the cutting element 100 and at least one emitter 210 may be positioned and oriented to emit a focused beam of energy toward the peripheral edge of the layer of superabrasive material 105 as used herein the term u201c chuck u201d means any tool or device configured to temporarily hold and position a cutting element 100 as shown in fig2 in some embodiments two emitters 210 may be employed although one emitter 210 or more than two emitters 210 may be employed in other embodiments of the present invention as further shown in fig2 one or more optional gas jets 215 may be positioned and oriented to direct a stream of gas toward the peripheral edge of the layer of superabrasive material 105 for example the gas jets 215 may be positioned and oriented to direct a stream of gas toward a contact area 310 fig3 a.