high pillars 300 is 5 u03bcm referring still to fig3 a 5 u03bcm thick layer 302 of a high thermal conductive material such as copper is deposited on the top of the resistive layer 301 through the holes in the metal mask 304 by evaporation the function of layer 302 is to help the cathode material here diamond dissipate the heat generated by the emission current in fig3 diamond thin film 303 is deposited by room temperature deposition technology such as laser ablation through the holes in the metal mask 304 the thickness of the diamond 303 is about 1 micron or smaller the low temperature restriction here is only required for a low cost display which uses regular glass as the substrate fig4 is the completed cross section view of the diamond cathode for display applications another way to deposit diamond thin film 303 is to use selective diamond cvd deposition technology after fabricating the pillar 300 the thin layer of molybdenum 100 u00e5 is coated on the top surface of the pillar 300 using metal mask deposition technology then the diamond thin film 303 is only deposited on the molybdenum surface by selective cvd the next step is to fabricate the anode plate 500 see fig5 with an indium tin oxide.