100 in an alternate embodiment if the pin is slightly larger than the long hole that it is being inserted into the pin can also establish a seal by an interference fit over the long length such a pin need not have flutes then to further assure the integrity of the seal epoxy 140 is deposited and cured in the recesses 180 181 at the base of the header in a preferred embodiment a one part epoxy pre form such as a dc 003 uni form can be used dc 003 uni form is available from multi seals inc in one embodiment shown in fig7 and fig8 the gap between the pins is filled with an inert material 175 to fill the gap an inert potting material 175 is applied around the heads of the pins 20 21 on the header 100 one choice for inert potting material is a2 with activator e which was made by armstrong which is a division of morton international specialty chemicals group of warsaw ind it is available from resin technology 28 norfolk avenue south easton mass 02375 the inert potting material is then cured the pin head side of header 100 is then lapped to remove the potting material covering the heads of the pins 20 21 the lapping operation will also remove any gold plating on the heads of the pins 20 21 in an alternate embodiment the gap between the pins can be filled before applying the.