surfaces of the stacked piezoelectric element 1 are shown in fig3 in order to secure the smoothness and to obtain a constant thickness there is required a processing allowance shown in fig3 in case the first layer is formed with a thickness of 0 089 mm as in a sample c of a piezoelectric element shown in fig3 the thickness from the upper surface of the element to the interface between the first and second layers becomes 0 0275 mm which is significantly smaller than in samples a and b in the present embodiment the through hole electrode 4 2 of the second layer is so positioned as to be projected in the same position as the through hole electrode 4 1 of the first layer so that the residual stress present in the layers on the through hole electrode 4 3 of the third layer can be dispersed and there can be provided a stacked piezoelectric element of excellent reliability without dropping of the piezoelectric ceramic resulting from the difference in the shrinkage rate between the green sheet and the conductive paste fig4 5 a and 5 b illustrate a second embodiment the outer and inner diameters in the present embodiment are same as those in the first embodiment and will not be.