would be connected to the electromagnetic sensor connecting terminals by means of conductive paste or by direct soldering of the chip connecting points to the electromagnetic sensor terminals fig1 describes without any limiting purpose two examples of preferred embodiments of capacitors with the application of space filling curves to their shape in a parallel plate capacitor 1 the two parallel conducting surfaces have been shaped following a space filling curve the capacitance of the element depends on the thickness of the insulating layer between the parallel plates the kind of dielectric between the plates and the effective area of the plates each of the two connecting terminals of the element 4 is connected to one of the plates this capacitor can be manufactured among other techniques by means of any of the current printed circuit fabrication techniques by means of conductive ink printed on a dielectric sheet shaped substrate etc taking always into account that two conductive layers separated by an insulating layer of a determined thickness are required the final element would be encapsulated with some dielectric material in order to prevent damaging of the parallel plates while leaving the connection terminals out of the encapsulation in a coplanar capacitor 2 and taking into account that the capacitance value is determined mainly by the length and the width of the gap between the coplanar conductive surfaces 5 the gap has been shaped following a space filling curve thus maximizing the length of the gap without increasing the total area of the component this capacitor can be manufactured among other techniques by means.