be attached to tab 140 by positioning a portion of substrate 160 beneath bonded area 142 of backing substrate 144 and then folding unbonded area 148 of backing substrate 144 back beneath the portion of substrate 160 in either of the applications illustrated in fig1 and 14 the substrate portion can be attached to tab 140 by known methods e g adhesive or other wise to provide a fastening tab on substrate 160 the lamination barrier technique described immediately above can employ various types of lamination barriers to prevent bonding of resin 32 with backing substrate 100 for example various printing inks including varnish overprint are suitable such overprint coatings have melt points that are substantially higher than most typical thermoplastic films which can serve as a backing substrate 100 for example printed packaging film will not thermally seal together if printing ink exists between seal layers the ink needs only to exist on one film surface to prevent a seal from occurring this anti sealing aspect of printing ink or varnish overprint prevents lamination to occur during the fastener element forming process described above this allows for the formation of discrete hook zones such hook zones can be produced by printing overprint on a.