50 80 of its surrounding regions inclusion of the recessed regions in body portions 122 2 and 124 2 reduces the overall height of module 100 however other embodiments can reduce module height by removing all or part of material within the recessed regions defining holes or slots lying between contact structures 122 and 124 is intermediate contact structure 126 intermediate contact structure 126 includes a central portion 126 1 and end portions 126 2 and 126 3 central portion 126 1 is not only centered between end portions 126 2 and 126 3 but also approximately centered within lead frame 120 the exemplary embodiment forms lead frame 120 from conductive material such as olin 194 copper using conventional techniques and then silver plates the lead frame to enhance its electrical conductivity other embodiments however plate the lead frame with other conductive materials such as gold or omit plating altogether some embodiments spot plate highly conductive runs on the contact structures to reduce the amount of plated material whereas others form the entire lead frame from gold or silver still other embodiments for the conductive structure through deposition of material on 2 substrates the invention is not limited to any particular material composition or method of forming lead frames in addition to insulative structure 110 and lead frame 120 rfid module 100 includes application specific integrated circuit asic chips 130 and 140 and conductor set 150 integrated circuit chip or module 130 which is attached to rectangular recess region 122 21 using a conventional chip on board technique includes wireless communications circuitry 132 and a memory circuit 134 to implement a passive rfid read only tagging function in the exemplary embodiment the memory circuit is pre programmed with data such as a unique identification number however in other embodiments for.