material 19 such as copper gold or a conducting polymer the conducting material 19 need only be as thick as the skin depth of the high frequency rf signals sent to the rfid tag 10 such conducting material 19 may be coated on the non linear magnetic material 17 by coating processes well known in the art such as evaporation electroplating or electroless plating fig2 shows a sketch of an rfid tag 10 having a tag antenna 18 electrically and spatially separated from a non linear magnetic material 17 in the embodiment shown the non linear material is shown as a wire placed as a parasitic element to a dipole antenna 18 of the rfid tag 10 a preferred embodiment in this case also is to have the non linear material 17 coated with an electrically conducting material if the electrical resistivity of the non linear material 17 is too high fig3 shows an elevation sketch of a physical layout for the sketch of fig2 the dipole antenna 18 is connected to a silicon chip 34 containing the tag memory tag electronics and tag power supply by wires 36 and 38 the antenna 18 and the chip 34 are mounted on a dielectric material 32 the non linear material 17 is mounted on the opposite side of the dielectric material 32.