end with a top layer connection thereby creating two conductive snakes u2014 one comprising all the even numbered rows 9 and the other comprising all the odd numbered rows 10 by doing so one can test the device by probing the two ends of each snake and checking for continuity this will enable instantaneously checking the all the rows for any breaks with just four probe points also shorts between rows can be identified simultaneously by checking for any continuity between the two snakes the columns would be simultaneously checked in an identical fashion also in the same way and at the same time the device can be checked for shorts between the top columns and bottom rows taking care to select one range of voltage levels for the rows and another range of voltage levels for the columns such that the diodes are reverse biased by combining this test technique with the multiple stacked rectifying towers design if a device passes this instantaneous test one can be highly confident of having a working device after identifying any defective devices which if the devices are manufactured inexpensively enough would most likely just be marked to be discarded these top layer connections are etched away to separate the lines or the edges of the chips where the interconnections are found could be cut back just enough to remove those edges and their interconnections this process is initiated by depositing layers on an insulating substrate such as plastic or glass but it should be noted that this insulating substrate does not have to be limited to plastic or glass as has been shown in the prior art this process could be performed on top of a normally fabricated semiconductor device such as a.