illustrate an isometric view of one embodiment of a u shaped z axis compressible conductor 40 the conductor 40 comprises a base 401 which can be soldered or otherwise bonded to a substrate while contact surface 400 is pressed against a pad on an opposite substrate fig4 a shows the conductor 40 in the uncompressed state while fig4 b shows the conductor in the compressed state in the illustrated embodiment the contact surface 400 is formed by an s shaped portion having a curved surface the curved surface assures that the conductor 40 presents a surface parallel to the circuit board above the contact 40 0057 fig5 a and 5b illustrate an isometric view of another embodiment of the z axis compressible conductor 50 this embodiment has improved reduced connection inductance compared to the embodiment illustrated in fig4 a and 4b the conductor has a base or first shaft portion 502 having a first end 504 and a second end 506 distal from the first end 504 the base 502 is generally soldered to a substrate contact a u shaped bend portion 508 is coupled to the first shaft portion 502 the u shaped bend portion 508 includes a first end 510 adjacent and coupled to the first shaft portion second end 506 and a second end 512 a second shaft portion 514 is coupled to the u shaped bend portion 508 the second shaft portion includes a first end 516 adjacent and coupled to the u shaped portion second end 512 second shaft portion is adjacent and coupled to a second u shaped bend portion 520 the second u shaped bend portion comprises a first end.