of the copper plated layers 7 formed on the surfaces of the additional metal layers 6 were peeled off simultaneously together with the additional metal layers 6 leaving behind part of a copper plated layer 7 only on the inner wall surface of bhv a peeling strength of the additional metal layers at this time was a value of 80 6 g cm low enough to peel off each layer with ease because of addition of a load corresponding to a bending stress in the copper plated layer 7 and the peeling off was performed without leaving residue of a nickel component on the surfaces of the copper clad laminate a process after peeling off of the additional metal layers 6 such as that the laminate was washed with water and dried and dry films of an ultraviolet curing type were laminated followed by exposure developing and circuit etching was similar to that of the first example therefore description thereof here is omitted in such a way as described above manufacture of the printed wiring board was enabled by using a manufacturing process for a printed wiring board relating to the present invention laser drilling which was said to be difficult in application has been enabled in a process that carbon laser light is employed to remove a copper foil and resin as a substrate material simultaneously thereby forming a hole by using a manufacturing process for a printed wiring board relating to the present invention no necessity arises for removal of a copper foil in a portion in which laser.