resistive materials as well as the other electrically conductive materials provided some of the essential building blocks available from the industry but these were not developed beyond their intended original use as the resistive material between 2 resistor 39 s copper electrodes and definitively not to the extent defined into the embodiments illustrated in the present disclosure such as a the definition and construction of fully bi dimensional and planar structures placed and mixed with circuits onto pcb planes and protecting areas portions of circuit layers b the definition of vertical conductive paths undetectable by conventional methods which is furthermore enhanced into an integrated vertical fence which coexists with conventional pcb vertical structures c achieving the completion of a three dimensional randomly interconnected structures creating the secure package the new package concept providing anti tampering protection is more clearly specifically described with reference to fig4 and 5 of the drawings in that instance utilizing the tamper protection against the lateral fence pcb integration tamper attempts as shown in fig4 of the drawings and as also represented in the enlarged structure of the multilayer printed circuit board the interior layers incorporate various arrays of apertures in a concept of employing random locations so as to foil any attempt at tampering and determining locations as to secret circuits by an outside source tamperer this feature may also be incorporated in various secure wireable layers as indicated in further detail.