electrode 320 a while being spaced apart from the first electrode 320 a at a predetermined distance the heating layer 330 a which constitutes a heating electrode structure 340 a together with the first electrode 320 a is formed in the phase change pattern 350 on the first electrode 320 a the cooling layer 330 b which constitutes a cooling electrode structure 340 b together with the second electrode 320 b is formed in the phase change pattern 350 on the second electrode 320 b the heating layer 330 a and the cooling layer 330 b can be formed with the material described in the previous embodiment according to the pram 300 having the above structure the heating layer 330 a which constitutes a heating electrode structure 340 a and the cooling layer 330 b which constitutes a cooling electrode structure 340 b are formed in the phase change pattern 350 so that a solid state phase of the phase change pattern 350 can be efficiently converted and so that residual heat in the phase change pattern 350 can be efficiently removed reference numeral 370 represents an upper interlayer dielectric layer and reference numeral 380 represents an upper electrode contact fig7 a and 7b are sectional views illustrating a procedure for manufacturing.