may be effectively transferred between the first heatsink 31 and the second heatsink 32 the method of manufacturing the light emitting device according to an embodiment may include etching a substrate 10 to form a cavity forming a heatsink formed of a metal material within the cavity forming first and second electrodes 41 and 42 which are electrically separated from each other on the substrate 10 and installing a light emitting device 50 on the substrate 10 to electrically connect the light emitting device 50 to the first and second electrodes 41 and 42 the etching of the substrate 10 to form the cavity may include forming at least one of a second cavity 12 in a top surface of the substrate 10 and a third cavity 13 in a bottom surface of the substrate 10 the etching of the substrate 10 to form the cavity may include forming a first cavity 11 in the top surface of the substrate 10 and forming the second cavity 12 within the first cavity 11 the heatsink may include at least one of a first heatsink 31 buried in the second cavity 12 and a second heatsink 32 buried in the third cavity 13 the first heatsink 31 and the second heatsink 32 may vertically overlap each other another embodiment.