that the resulting chips have active devices with connection terminals corresponding in position to connection terminals on a motherboard by changing the wafer cut pattern different arrays of active devices can be used to form different circuits in one application of this concept the active devices on a chip are not interconnected in other applications however there may be some interconnection while still having separate connection terminals for each active device an example of this latter feature is shown in fig9 and 10 described below in which adjacent like terminals such as sources or drains are connected together fig1 illustrates a simple form of the invention in which ail of the devices on the wafer are identical when it is desired to use different devices a wafer is made with clusters of the different devices in a repeated configuration or pattern one application where individual multiple device arrays may be used is in the construction of a gate array of large transistors for high current conduction or high power output for microwave and mm wave applications this is often provided by the connection of fets by wilkinson combiners or the equivalent to provide impedance transformation as well as to combine multiple terminal connections similar results may be achieved using a push pull amplifier circuit such as circuit 32 shown in fig2 this circuit while providing inherent benefits particularly with respect to impedance transformation over conventional multi fet parallel connected power amplifiers.