of positioning pins 33 and the like with intervention of an anisotropically electroconductive elastic connector sheet 50 between the contacting shoes 42 of the lead frame 40 and the electrode terminals 21 on the circuit board accordingly the socket has a simple structure consisting of a small number of parts and can be assembled without necessitating soldering or other troublesome means and further through holes or other openworks need not be formed in the circuit board 20 so as to afford a large freedom in the design of the circuit board 20 in conducting inspection of a semiconductor package 10 by using the socket of the invention the semiconductor package 10 is mounted on the mounting seat 31 of the socket body 30 by exact positioning so that the electrode terminals or leads 12 of the semiconductor package 10 are brought into electric conduction by contacting with the contacting shoes 42 of the lead frame 40 while the contacting shoes 42 are electrically connected to the electrode terminals 21 on the circuit board 20 through the elastic connector sheet 50 namely each electrode terminal 12 of the semiconductor package 10 is in contact with the contacting shoe 42 of the lead frame 40 with resilience to cause arch wise bending of the contacting shoe 42.