ribbon referring to fig8 an opto electronic package 400 similar to the opto electronic package 300 of fig7 is provided however the lens plate 366 is replaced with a complementary metal oxide semiconductor device with integrated laser diode drivers or trans impedance amplifier circuits cmos ldd tia chip 406 and an opening 408 in the cmos device cmos ldd tia chip 406 is fabricated to accommodate a dual sided lens array dual sided lens plate 474 of the dual sided lens pair of 472 and 474 therefore the cmos ldd tia chip 406 is provided with an opening 408 for the dual sided lens array 474 to be inserted wiring is patterned along with pads e g c4s as interconnects 364 in order to mount a vcsel or pd array 384 in a substrate 480 and to mount the cmos ldd tia 406 the substrate 480 can contain the next level of interconnects such as a ball grid array or a land grid array bga lga 362 referring to fig9 an opto electronic package 500 with an integrated lens plate similar to that of fig7 is provided i e integrated lens plate 366 having dual sided lens 368 however the fiber ferrule i e ferrule with the multi core fiber 370 with the dual sided lens plate 372 see fig7 is replaced with an optical connector i e low profile lensed fiber connector 552 for the multi core optical fiber 554 containing dual sided lens arrays 550 and a turning mirror 548 to bend the.