into the protrusion 16 to cover the at least one semiconductor light emitting die 13 moreover the at least one semiconductor light emitting die 13 has inner electrodes which electrically coupled to the outer electrodes 17 on the top surface 111 via wires in the embodiment the inner electrodes of the at least one semiconductor light emitting die 13 is connected to the outer electrodes 17 in series however the connection of the electrodes can be parallel connection to reach the goal of the invention a heat conductive paste 15 is disposed between the first surface 121 of the sub mount 12 and the bottom of the first recess 1111 to combine the first substrate 11 and the sub mount 12 please refer to fig3 which shows a sectional view of a semiconductor light emitting device package structure of an embodiment of the invention as shown in fig3 the second surface 122 of the flat sub mount 12 is parallel to the bottom surface 112 of the substrate 11 furthermore the heat conductive paste 15 is coated under the second surface 122 of the flat sub mount 12 so as to allow the second surface 122 of the sub mount 12 and the bottom surface 112 of the substrate 11 to constitute into a plane please refer to fig4 which shows a sectional view of a semiconductor light emitting device package structure of an embodiment of the invention as shown in fig4 the second surface 122 of the flat sub mount 12 is parallel to the bottom surface 112 of the substrate 11 furthermore an heat conductive paste 15 is coated under the bottom surface 112 of the substrate 11 so as to allow the second surface 122 of the sub mount 12 and the.