11b 12b were separated from the surface roughened film 13a as shown in fig6 the single sided metal clad laminates 11a 12a and 12a 12b were stacked via a prepreg 12c and the stack was placed between heating press plates via tools 15 and cushions 16 and the prepreg was hardened as described above to form a multilayer board note that although the above mentioned example represents a model for the manufacture of a multilayer board in practice in the manufacture of a multilayer printed circuit board as shown in fig7 a and 7b one or more internal layer circuit boards are stacked between the single sided metal clad laminates the single sided metal clad laminate and the multilayer board prepared as above were evaluated as follows the peel strength kg 15 mm between the single sided metal clad laminate and the surface roughened film and the peel strength kg 15 mm between the hardened epoxy resin 12a of the single sided metal clad laminate and the hardened resin 12c converted from the epoxy prepreg were measured by using an peeling test equipment instron type universal tester made by instron company in u s a under a peeling speed of 200 mm min the procedure of example 1 was repeated except that a roll with the surface roughness of 2 micrometers was used the results are set forth in the table the procedure of example 1 was repeated except that a roll having a surface roughness of 7 micrometers was used the results are set forth in the table the procedure of the example 1 was repeated except.