8 another mass analyzer 5 is coupled to the cryopump 3 which analyzer measures partial pressures of various gasses in the cryopump 3 the mass analyzer 5 has the structure similar to the mass analyzer 4 and the gain of its secondary electron multiplier is also controlled by the mass analyzer controller 8 signals corresponding to gas partial pressures measured with the mass analyzers 4 and 5 are supplied to the mass analyzer controller 8 a controller 13 for the sputtering apparatus adjusts a process gas flow by controlling the flow control valve 16 and sends various signals to be described later to the mass analyzer controller 8 a bar code reader 10 reads a bar code 12 attached to a wafer carrier 11 which stores a plurality of wafers the read bar code being supplied to the mass analyzer controller 8 a storage device 14 has a storage area corresponding to the bar code attached to each wafer carrier 11 the mass analyzer controller 8 stores gas partial pressure information received from the mass analyzers 4 and 5 in the storage area corresponding to the bar code of the wafer carrier 11 under process the gas partial pressure information is also sent to a host computer 9 which performs concentrated management of the gas partial pressure information fig2 is a plan view showing the outline of the sputtering apparatus shown in fig1 two process chambers 1a and 1b are coupled via gate valves to a transport chamber 20 also coupled via gate valves to the transport chamber 20 are a preliminary heating chamber 21 a cooling chamber 22 a load lock chamber 23 and an unload lock chamber 24 a robot arm 25 is installed in the transport chamber 20 to transport.