of the reccesses 44 46 50 54 the smooth areas 64 a 64 b 64 c 64 d have undergone the etching and polishing process as mentioned above and are not damaged during the cutting process and are therefore able to maintain bond integrity and are more resistant to bending and thermal stresses referring again to the figures generally each embodiment includes a plurality of micro posts 66 formed as part of the bottom of the glass pedestal 14 which are shown in fig4 in an enlarged bottom view the micro posts 66 protrude a few of microns in length from the bottom surface 52 of the pedestal 14 and arranged in such a way that the vapor and air is vented out from the bottom surface of the glass pedestal 14 during the bonding to the housing substrate more specifically the bottom surfaces 70 of the micro posts 66 are connected to the housing substrate by a mounting material there is venting area shown generally at 72 in between each of the posts 66 which allows for the venting of air and vapor during the die mounting process around the posts 66 and out of the venting area 72 examples of the flow path for the air or vapor are shown by the arrows 74 this ensures no voids in the mounting material are created during the bonding.