embodiment the circuit board 18 may be a ceramic circuit board such as an alumina circuit board including appropriate vias and interconnections the connections between the display panel 12 and the circuit board 18 may be implemented using interconnects 14 in the form of solder balls or other surface mount interconnection technologies the interconnects 14 may be affixed to the circuit board 18 and or display panel 12 using heat then the display panel 12 and circuit board 18 are brought together to physically and electrically interconnect the circuit board 18 to the display panel 12 by reflowing the solder to form the interconnects 14 at the same time solder balls between the driver circuits 20 and the circuit board 18 may be reflowed in one embodiment referring to fig2 the display panel 12 may include a matrix of row electrodes 22 a 22 b and 22 c as described previously the row electrodes 22 may be made of a metal the row electrodes 22 are deposited on top of the light emitting material which is not shown in fig2 beneath the light emitting material is an array of column electrodes 24 a and 24 b each column electrode 24 actually includes three separate lines one line for each color of the tri pixel indicated as p thus a line 25 is provided for each of the three colors of the pixel p thus the pixel p is defined by the region where row electrodes 22 and triset of column electrodes 24 overlap in one embodiment an entire row of pixels is addressed or activated at one time thus potential is applied to a given row electrode 22 every pixel along the row then has its row activated each column electrode 24 is then selectively activated to.