connections in the approach of the present invention and because the last metal layer can be highly corrosion resistant that the requirements of the module backing materials as far as blocking moisture can be significantly relaxed thus expensive moisture barriers such as tedlar u2122 commonly used in current module manufacturing are not required in this approach this opens new possibilities for lower cost module backing materials some protection from electrical shorting scratches and debris is needed one approach is to spread or spray liquid silicone or other appropriate polymer which will cure harden without the need for a second lamination step spreading a liquid can be done with a doctor blade approach or by spraying the material onto the back of the module if the module has a frame any polymer with low viscosity can be poured onto the back and allowed to harden this could also help hold the frame and module in place giving added strength to the module a typical practice in wafer based solar cell manufacturing is to complete the metallization on each cell and to test each cell in order to better match cells to be laminated together in a module in this way module output is maximized despite manufacturing variations in cell efficiency in the present approach the cell is completed with thick metal only after the cell is already laminated thus it may appear that pre sorting and binning of cells is not possible however there are some methods to perform a preliminary screening of cells methods know to the industry such as quasi steady state photo conductance qsspc lifetime testing for example can measure average wafer minority carrier lifetime this information.