574 the entire disclosure of which is incorporated herein by reference the polishing station 10 can include a rotatable platen 16 on which is placed the polishing pad 18 during a polishing step a polishing liquid 30 e g abrasive slurry can be supplied to the surface of polishing pad 18 by a slurry supply port or combined slurry rinse arm 32 the polishing liquid 30 can contain abrasive particles a ph adjuster or chemically active components the substrate 14 is held against the polishing pad 18 by a carrier head 34 the carrier head 34 is suspended from a support structure such as a carousel and is connected by a carrier drive shaft 36 to a carrier head rotation motor so that the carrier head can rotate about an axis 38 the relative motion of the polishing pad 18 and the substrate 14 in the presence of the polishing liquid 30 results in polishing of the substrate 14 referring to fig3 at least the polishing layer 22 of the polishing pad 18 is manufactured using a 3d printing process in the manufacturing process thin layers of material are progressively deposited and fused for example droplets 52 of pad precursor material can be ejected from a nozzle 54 of a droplet ejecting printer 55 to.