location where they may be heated and compressed to produce fluid epoxy resin material to enter mold cavities of the mold chases during molding of each portion of the substrates 30 as mentioned above the substrates 30 are molded portion by portion and after molding are moved into the second heat tunnel 24 for post mold curing after curing they are moved into the degating station 26 to remove runner material 44 and cull 46 after degating the substrates 30 may then be stored in a stack magazine to undergo further processes for example for singulation by sawing the molding system preferably uses indexing means to move the substrates 30 along a traveling path through the various parts of the molding system 10 and to position the molding sections of the substrates 30 relative to the molding device for encapsulation the indexing means preferably extend adjacent to the molding device and is substantially parallel with the traveling path of the substrates 30 as shown in fig4 a suitable indexing means is a clamp or pin indexer 58 a clamp indexer comprises a clamping device to grip a side of a substrate 30 and moves it along the traveling path by coordinated clamping and unclamping action on the other hand a pin indexer comprises a pin to locate into a corresponding pinhole formed in the substrate 30 to push it along the traveling path either of these would be.