20 and the conducting lid 50 the conducting lid 50 and the substrate 20 are electrically coupled to each other through the contact between the protrusion 55 of the conducting lid 50 and the ground layer 23 of the substrate 20 on the other hand if the conductive adhesive is used between the substrate 20 and the conducting lid 50 the electrical connection especially in ground connection between the conducting lid 50 and the substrate 20 can be ensured by the contact between the protrusion 55 of the conducting lid 50 and the ground layer 23 of the substrate 20 besides the protrusion 55 of the conducting lid 50 can be electrically coupled to the ground layer 23 of the substrate 20 through a conductive adhesive for ensuring the electrical connection between the protrusion 55 and the ground layer 23 when compared with the conducting member such as the conductive sliver glue or the elastic sheet of the prior art design the mems microphone module 10 of the present invention has a relatively simpler structure adopting the cooperation of the ground layer 23 of the substrate 20 and the protrusion 55 of the conducting lid 50 to offer the desired emi shielding effect further as stated above the conductive adhesive can be used between the ground layer 23 of the substrate 20 and the protrusion 55 of the conducting lid 50 if the protrusion 55 is not long enough to touch the ground layer 23 accordingly the mems microphone module 10 of the present invention has the advantage of.