332 each of the traces 332 comprises a trace body 3321 a bond pad 3322 extending to the periphery of the die pad 333 and a trace end 3323 opposite to the bond pad 3322 and connected to a corresponding one of the contact pad areas 302 the metal pads 34 correspond in position to the die mounting area 301 and the contact pad areas 302 respectively thereafter the first resist layer 32 a and the second resist layer 32 b are removed the metal layer 33 and the metal pads 34 can be formed by an electroplating process and can be made of one or more selected from the group consisting of au pd and ni for example au pd ni pd the fabrication method of the present invention is not limited by the sequence in which the metal layer and the metal pads are formed because it is feasible to form the metal layer and the metal pads concurrently by an electroplating process despite the variable sequence in which the first resist layer and the second resist layer are formed referring to fig3 e u2032 the contact pad areas 302 are arranged in array to surround the die mounting.