then plated through to provide electrical connections between the upper side 11 to the under side 18 next conductive patterns are formed on both sides of the substrate 12 by masking and etching techniques for forming conductive patterns are well known and form no part of the present invention and therefore will not be discussed in further detail herein the conductive patterns of the substrate 12 include on the upper side 11 a plurality of land areas 13 with the corresponding extensions 22 and a plurality of connection pads with the corresponding extensions 24 on the under side 18 of the substrate 12 the conductive patterns include a plurality of terminal pads 19 and 20 which are arranged in pairs around the plated through holes then a gasket tape is applied to the under side 18 of the substrate 12 subsequently light emitting diodes 15 are mounted on the land areas 13 so that their terminals on their under sides are electrically and mechanically coupled to the corresponding land areas 13 the terminals 16 on the upper sides of the light emitting diodes are then electrically connected to their corresponding connection pads 14 via bonding wires 17 after this wire.