the key additionally an ic package employing the leadframe to plastic lock is disclosed application_number US 25221702 A description in general the invention provides an ic package leadframe mold lock and methods for making the same representatively illustrated in fig1 is a top view of an example of a leadframe 10 according to a preferred embodiment of the invention the leadframe 10 has a die pad 12 and numerous lead fingers 14 according to this exemplary embodiment both the die pad 12 and each of the lead fingers 14 have perforating apertures 16 it should be understood that the invention may alternatively be implemented with various combinations of apertures 16 in either the die pad 12 some or all of the lead fingers 14 or both as further described as may be seen in fig2 c which is a sectional view of the portion of the lead frame 10 of fig1 taken along line c u2014 c the apertures 16 are located within the leadframe material and neither at the top 18 nor at the bottom 20 surfaces of the leadframe 10 preferably the apertures are formed by partially etching opposed niches 22 24 in the leadframe surfaces 18 20 from either side understanding of the leadframe 10 shown in fig1 and fig2 c and methods of manufacturing the leadframe lock of the invention will be enhanced with further reference to fig2.