shown in fig4 this perspective exploded view shows a segment of the corner area the module substrate 42 has a plurality of contact pads 33e which are positioned in abutting relationship with contact pads 33b on printed circuit wiring assembly 6 each of the pads 33e has a substantially flat surface contact pads 33b on the other hand have a plurality of raised contact bumps 33f the quality of the electrical connection between the abutting pads is substantially enhanced by these bumps alignment problems are reduced since even when abutting pads are misaligned to the extent where only a single bump is in contact with the upper pad the quality of electrical contact is more than adequate the detailed nature of the contact pads is illustrated in fig5 and 6 in fig5 which is a plan view of contact pad 33b four contact bumps 33f are shown this is the preferred number and arrangement although the drawing is not made to scale the outside dimension of contact pads 33b is about 0 65 mm the individual contact bumps 33f are 0 15 mm square and are separated from each other by a like dimension fig6 is a sectional view taken along the line vi vi in addition to showing contact pad 33b fig6 shows the module contact pad 33e with parts cut away contact pad 33b is fabricated on a flexible printed circuit wiring assembly comprising a substrate of flexible insulating material 80 such as kapton in the range of 0 05 mm thickness the upper surface has an etched pattern of 1 2 oz copper 81 which forms the 0 65.