in fig6 the sections s 1 and s 2 are identical however in the arrangement of fig6 and 18 s 2 there is a first solder 16 applied over the soldering pads 141 and a second solder 15 applied over the top metallization layer 13 although the second solder 15 is still present as a paste the first solder 16 has already undergone a reflow and a subsequent cooling and solidification process as described above with reference to fig4 and 5 optionally the structured first solder layer 16 may have an average thickness d16 of at least 100 u03bcm according to a further option which is independent from an average thickness of the first solder layer 16 there may exist a plane e2 which does not intersect the first solder 16 with the secondary condition that for each of the soldering pads 141 the distance d2 between the plane e2 and that section of the first solder 16 arranged above the respective soldering pad 141 is less than 100 gm fig1 again shows an exploded view of a circuit board system 100 as explained above from this view it can be seen that the shielding frame 18 may include a ring shaped section and a cross like section 181 arranged inside the ring shaped section the cross like section 181 may be used in a pick and place process in which the shielding frame 18 is placed on the second solder 15 as described above with reference to fig7 the cross like section 181 may include a.