mlp device 12 and the folded heat sink 14 to form the flip chip mlp with a folded heat sink 10 as indicated by the arrow 92 compared to solder cream the use of soft solder provides an easy soldering process where the wire is melted and attached on the same machine good alignment is achieved since alignment is controlled during pick up with 2 mil placement accuracy possible and there is minimal voiding of the solder in the solder cream process however the paste needs to be printed with a printer and stencil a reflow machine is needed alignment is affected during the reflow process with a tendency to rotate the die and voiding is difficult to control during reflow since flux content is trapped during reflow the soft solder attach process avoids these problems of the solder cream attach process fig7 is a side cross sectional view of the flip chip mlp device with a folded heat sink 10 shown in fig1 a and 1b mounted on first and second solder paste regions 104 and 106 which in turn have been laid down on first and second conductive tracks 108 and 110 respectively on a pc board 112 as can be seen in fig7 the no connection lands 22 and the bottoms of the folded leads 30 are planar and rest on the solder paste region 106 fig8 is fig7 after the solder paste regions 104 and 106 have been reflowed as can be seen in fig8 the solder 110 from the solder paste region 106 forms an electrical and thermal connection between the no connection leads 22 the folded leads 30 and the.