and holes within window areas receive metal layer 32 pattern plating therefore adds conductive material 32 after imaging of photoresist 28 converse to pattern plating panel plating adds conductive material 32 across the entire surface before imaging pattern plating generally involves fewer steps and less etching of conductive material 32 additionally pattern plating minimizes undercut at the etch boundaries to achieve greater circuit density a comparison of panel plating versus pattern plating is generally described in combs printed circuit handbook mcgraw hill inc 1988 pp 12 11 12 13 referring now to fig5 a development stage subsequent to that shown in fig4 is illustrated a second photoresist layer 34 is placed upon the entire topography after image and develop second photoresist layer 34 remains on first photoresist layer 28 and a central portion of conductive material 32 similar to first photoresist 28 second photoresist 34 is placed using a dry or liquid based material or a screened process second photoresist 34 is imaged using a mask which is the same mask previously used to image first photoresist 28 ored with a negative shrink of that mask fig5 illustrates after image and develop a portion of second photoresist 34 denoted as 34a residing within window 30 and partially over second conductive material 32 photoresist 34a is centrally disposed within window 30 and extends laterally an equal distance from a midline 36 midline 36 extends along a central axis through second conductive material 32 and perpendicular to the cross sectional plane of fig5 as well as all other cross sectional views herein photoresist 34a is spaced above midline 36 and extends laterally from midline 36 prior to it reaching the edges of second conductive material 32 thus photoresist 34a is spaced from photoresist 34 to cause an opening into which an etch.