the strap 120 and the substrate 130 with the covering sheets 140 the rfid tag 400 thus manufactured has the ic chip 11 housed in the concave section 133 provided on the substrate 130 that is rendered thinner and flatter the fifth manufacturing method described above is a short time manufacturing method of a small number of steps because the strap 120 and the substrate 130 are fixed to each other by the pins lastly a sixth manufacturing method of the rfid tag will be described the sixth manufacturing method is performed through the same steps as the first manufacturing method of the rfid tag up to the step of fig6 b therefore the subsequent steps after the step shown in fig6 b will be described fig1 a through 12c are process drawings showing the sixth manufacturing method of an rfid tag according to the sixth manufacturing method an ultrasonic vibration in a lateral direction of the drawing is applied from the strap 120 side to the strap 120 and the substrate 130 fig1 a in the same state as the state shown in fig6 b by an ultrasonic head 41 fig1 b a tip of the ultrasonic head 41 is sticking to and holding the strap 120 as.