other embodiments of a package 500 the package in one embodiment is similar to package 400 described in fig4 a c as such common features may not be described or described in detail referring to fig5 a c the semiconductor assembly includes an encapsulant 580 which encapsulates package 400 comprising the dies 120 and 220 and interposer 130 for example the encapsulant material may be an epoxy resin silicone or plastic other types of encapsulants may also be useful for example the encapsulant may be a molding compound the encapsulant provides protection against the environment as shown the encapsulant covers the top of the second die in other embodiments the encapsulant may have a coplanar top surface with the surface of top die not shown for example the inactive surface of the top die is exposed fig6 a d show an embodiment of a process 600 for forming a semiconductor assembly 100 the process includes providing an interposer 130 having for example top and bottom surfaces 131 and 132 a first die attach region 137 is defined on the top surface on which a first die is mounted in one embodiment the interposer is provided as part of an interposer substrate 630 prepared with a plurality of interposers 130 1 n for illustrative purposes the substrate includes 3 interposers 130 1 3 e g n 3 however it is understood that the interposer substrate may be prepared with other number of interposers the number of interposers may depend on the size of the interposer substrate the interposer substrate for example may be a semiconductor wafer such as a silicon wafer other types of substrates may also be useful the top and bottom surfaces of the interposer are prepared with interposer.