dies the application of the water soluble or organic solvent soluble chemistry into the dicing lines and over the circuits is done to prevent the ingress of a later applied wafer back side coating suitable water soluble materials include hydrophilic polymers such as ionomers polyvinyl alcohol water soluble cellulosics gelatin starches and polysaccharides polyethylene oxides polyvinyl pyrollidone sulfonated polystyrenes and polymers derived from ethylenically unsaturated monomers containing hydrophilic groups suitable organic solvent soluble materials include waxes fluorinated waxes solid hydrogenated oils polyolefins acrylate methacrylate and styrenic polymers and silicone materials such as oils waxes and polymers these compounds are dissolved in the appropriate solvent water or organic solvent and applied by any effective method for example by spin coating screen or stencil printing or preferably by spray or jet printing the concentration of the solution can be high as possible but to a level that will allow successful application the water or solvent is then evaporated off before proceeding to the next steps the lamination of a protection layer onto the top side of the wafer is done to protect the circuits during the subsequent processing steps and to hold the circuits in place after the wafer is singulated the protection layer is typically in the form of a tape and in a particular embodiment in the form of a.