of an imaging device 300 configured to image conductive material on substrate 208 the substrate 208 in this arrangement is mounted on a rotating cylinder 304 the imaging device 300 contains a carriage 312 the carriage is adapted to move substantially in parallel to cylinder 304 guided by an advancement screw 316 an inkjet imaging head 320 is mounted on carriage 312 along with a laser source 324 the inkjet imaging head 320 is positioned on carriage 312 in such a manner that during scanning of carriage 312 in direction 332 it precedes the laser source 324 controller 328 coordinates and synchronizes the operation of inkjet head 320 and laser source 324 controller 328 receives the data for imaging 404 in fig4 from a digital front end not shown and provides it to the inkjet head 320 and laser source 324 the inkjet head 320 deposits conductive lines 204 on substrate 208 following the deposition of the conductive lines 204 deposition by inkjet head 320 a focused laser beam is applied by laser source 324 the thickness of sintering applied by the laser source 324 is variable and is adjusted by the spot size of the laser source 324 the laser source.