14 d alternatively solder paste drops 207 can be deposited in the same step as solder paste drops 205 the size of solder paste drops 207 is set at the correct level in relationship to the size of solder paste drops 20 l and 203 to provide the desired thicknesses of the upper and lower solder layers in the finished package fig1 a shows an alternative pattern of solder paste drops 208 that may be placed on the backside of die 14 as shown in fig1 b the diameter of each of solder paste drops 208 is 1 4 mm and the height of each of solder paste drops 208 is 0 45 mm yielding a volume of 0 00068 cc since there are a total of four drops 208 on the backside of die 14 the combined volume of the solder paste drops 208 is about 0 0027 cc when the process is completed as described below this produces an upper solder layer having a thickness of 0 8 mil as shown in fig1 g upper lead frame 10 is placed on top of solder paste drops 205 and 207 with feet 106 in contact with solder paste drops 205 next a second reflow process is carried out in the second reflow process solder paste drops 205 and 207 melt causing upper lead frame 10 initially to settle towards die 14 as the solder continues to melt however the surface tension of the resulting liquid solder tends to pull die 14 upward towards upper lead frame 10 this lifts die 14 away from lower lead frame 12 as a result the solder between die 14 and source contact 126 is drawn out of the valleys between mesas 121 and onto the top surfaces of the mesas.