the bonding part 15 may be filled with the underfill material for example the underfill material may include an epoxy resin but the present disclosure is not limited thereto the underfill material may support the first second and third solder bumps 83 84 and 85 that is the first second and third solder bumps 83 84 and 85 not only electrically connect the semiconductor chip 100 and the bonding part 15 but also support the semiconductor chip 100 and the underfill material may strengthen the support of the semiconductor chip 100 by the first second and third solder bumps 83 84 and 85 also the underfill material may surround the first second and third solder bumps 83 84 and 85 and may thus insulate the first second and third solder bumps 83 84 and 85 from one another that is the underfill material which includes an insulating material may prevent the first second and third solder bumps 83 84 and 85 from being short circuited the second trenches 60 the third trenches 90 and the fourth trenches 91 may also be filled with the underfill material that fills the space 70 if a semiconductor package were to include no trenches e g no second trenches 60 of fig2 a in a bonding part thereof during melting of solder bumps in a reflow process so as to connect the semiconductor chip and the bonding part the molten solder would have flown over the top surface of the bonding part as molten solder obtained from a reflow process has properties of a liquid until it is cooled down to a predetermined temperature in response to the molten solder flowing over the top surface of the bonding part the position of the.