i e steps which do not form part of the present invention and which are accordingly not described in any detail here this starting point is denoted by the block having reference numeral 10 in the diagram of fig1 the product is now subjected to a known planar material removing i e thinning process at its second main surface lower side in a process step referenced 13 for example through grinding lapping or etching the sequence comprising this step subsequent to the starting position 10 is indicated with an arrow 51 according to the invention this sequence is modified such that in a first step after the starting point 10 a double sided adhesive foil is laminated onto the upper side 2 of the product 1 in a process step 11 which foil has reference numeral 3 in fig2 b this double sided adhesive foil 3 forms an adhesive material on which a first carrier element is provided in process step 12 which follows process step 11 this first carrier element has reference numeral 4 in fig2 c according to the invention the thinning process in step 13 of fig1 is now carried out on the product 1 provided on the first carrier element 4 in process step 13 the result of this process step is diagrammatically shown in fig2 d after the product 1 has been made thinner at its lower side the next process step 14 comprises the lamination of a second adhesive material for example again in the form of a two sided adhesive foil onto the second main surface lower surface of the product 1 this second two sided adhesive foil has reference numeral 5 in fig2 e then a carrier.