contacts or completely surrounds an integrated circuit chip which contains electromagnetic structures in one exemplary embodiment of the invention the magnetic shield is formed as a glob or layer of magnetic field shielding material which is affixed to one or more surfaces of an integrated circuit chip in another exemplary embodiment an encapsulating material of the chip packaging includes magnetic field shielding material therein referring now to the drawings where like elements are designated by like reference numerals fig1 4 illustrate exemplary embodiments of the present invention fig1 depicts an integrated circuit ic package assembly 10 at an intermediate stage of processing a semiconductor chip or die 12 includes an array of input output terminals 14 and internal electromagnetic structures such as mram cells and access circuitry the chip 12 is supported by a die pad 16 fig1 which can be formed for example of a leadframe or a dielectric substrate each of the input output terminals 14 is further electrically connected with respective conductive leads 22 by wire bonds 20 or other suitable electrical connectors referring now to fig2 a magnetic shield is provided for shielding the chip 12 from external magnetic field disturbances according to a first exemplary embodiment of the present invention a glob top 33 is formed over the semiconductor die 12 including the input output terminals 14 and portions of the wire.