u201c clamp shell arrangement u201d on the printed circuit board device 12 as described below it is thus possible to arrange for the signal connection points 18 which jointly use a multiple access signal line 14 to be situated opposite one another in one preferred embodiment the signal connection points of the semiconductor apparatus 16 can likewise be used mirror image symmetrically with respect to the transverse central axis sa 2 of the semiconductor apparatus 16 the printed circuit board device 12 comprises at least one multiple access signal line 14 which is a signal line which is connected to a respective signal connection point of the at least two semiconductor apparatuses 16 for signalling purposes that is to say that the multiple access signal line 14 is connected to the two semiconductor apparatuses 16 from fig1 for signalling purposes the multiple access signal line 14 is preferably designed such that the propagation time delays of the signals from the two semiconductor apparatuses 16 which are sent via the multiple access signal line 14 are as short as possible preferably less than 100 ps usually preferably less than 50 ps the higher the operating frequency of the printed circuit board system 10 the smaller should be the propagation time difference for the signals from the two semiconductor apparatuses 16 which are sent via the multiple access signal line 14 by way of example at an operating frequency of 200 mhz a propagation time difference of approximately 100 ps can still be permissible whereas at an operating frequency of 300 400 mhz the propagation time difference should not exceed 50 ps this can preferably be achieved by providing the multiple access signal line 14 in a central.