pad 300 according to the example shown recessed area 402 overlaps conductive pad 300 but does not overlap dividing pedestal 308 indicating that either the size of the routing bit may be changed during the milling process or the lateral position of the routing bit may be shifted relative to the workpiece during the milling process one way of automating this shift is to mount the circuit board being processed on a moveable stage so that the workpiece may be positioned as desired while the milling machine supporting the routing bit remains stationary stage movements may be computer controlled allowing them to be programmed to achieve repeatability and to yield a consistent product milling features such as recessed area 402 into encapsulating layer 202 is made possible by the integrated approach to the manufacturing process as described herein with reference to fig5 7 a series of snapshots 500 shown in fig5 illustrate steps in an exemplary process sequence that incorporates machining operations together with electronics assembly operations to form a pair of integrated interconnect tabs 206 comprising individual integrated tabs 300 each cross section panel shown in fig5 corresponds to a manufacturing step in flow diagram 600 presented in fig6 attachment step 602 entails placing large pre formed electrically conductive e g metal.