the narrowest point of the passage forms the orifice this orifice faces the air bearing gap in fig3 a and 3b the numeral 6 designates an etched stop layer on 100 silicon and 8 designates an etched stop layer on 110 silicon respectively such layers for instance bordered surface layers can stop the anisotropic etching precisely defined nozzles can be placed subsequently into the remaining membrane by photolithographic masking and subsequent etching in fig4 a 4c and 4d 4f the numeral 10 designates a micro nozzle in 100 silicon and 12 designates a micro nozzle in 110 silicon by disposing a plurality of micromechanically fabricated nozzles upon a silicon chip supporting elements can be formed which have a large support or carrying power capability and stiffness the elements must be applied on a support structure through which each individual nozzle is supplied with air in fig5 the numeral 22 designates an air bearing element which is supported or carried by a self adjusting support construction the air bearing element 22 provided with a plurality of micronozzles is connected to the support member 18 of glass for instance by anodic bonding feed channels 20 for air are formed in the support member by means photolithography and an etching process so that every nozzle is fed with air the support member 18.