mesh pattern designed with a specific open area percentage to provide adequate wafer clamping force while still allowing sufficient levels of infrared radiation to pass through alternatively the chuck electrode can also be made from a transparent conductive film a workpiece is disposed on one surface of the chuck and a radiative heat source is positioned on the opposite side of the chuck a reflector plate may be used to reflect the infrared radiation toward the chuck and the wafer the spacing of the radiation sources and the shape of the reflector plate may be modified to focus more radiation on a particular portion of the workpiece if desired application_number US 201213603881 A description as described above electrostatic chucks escs typically include several parts including a dielectric top layer an insulating layer and a plurality of electrodes disposed between these layers or embedded in one of the layers these electrodes may be a separate layer between the dielectric layer and the insulating layer or may be embedded in one of these layers a top view of one embodiment of the chuck 200 is shown in fig2 in this embodiment the chuck comprises six equally sized regions 201 a f of course a different number of regions may also be used these regions may be shaped as shown in fig2 or may be.