cure temperatures depend on the type of epoxy used preferably once cured the epoxy is able to withstand elevated temperatures typically associated with many semiconductor processing steps that is a temperature up to 250 u00b0 c without additional shrinkage or substantial degradation further the adhesive should have a limited amount of cure shrinkage so as to minimize the possibility of inducing cracking or stress fractures in composite structure 200 the phrase u201c cure shrinkage u201d refers to a change in volume of a thermosetting adhesive during the cure cycle due to the reaction generally an out gassing product or rearrangement of the polymer itself cure shrinkage can cause considerable pressure to develop along the length of the bond during processing an additional component closely associated with cure shrinkage is the adhesive 39 s cte at the cure temperature and at the operating temperature generally organic adhesives will have a higher cte than any other material present in the mem component this means that the adhesive will expand at a higher rate than will other material as the ambient temperature increases although an inorganic filler material may be added to the adhesive to reduce the cte such fillers are not recommended in this application since such inorganic filler material cannot be etched using oxygen plasma during the structural releasing step substrate 102 may also be selected for a desired cte the.