application_number US 76855191 A description other advantages and characteristics of the invention will become apparent on reading the following description of one embodiment of the invention which is given by way of illustration and is non limiting with reference to the figure of the appended drawing showing diagrammatically a device for cutting a multilayer assembly the device shown diagrammatically in the figure comprises a laser source 1 for example a gas laser source in combination with a lens based focusing system 2 which focuses the coherent light beam emitted by the laser at a point 4 a support plate 5 is arranged in such a way below the focusing system 2 that the plane upper face 6 of the plate 5 contains the focusing point 4 of the laser beam and that the face 6 is essentially perpendicular to the axis of the focused laser beam an aperture surrounding the focusing point 4 and through which the laser beam passes passes through the plate 5 this arrangement being in order to prevent the plate 5 from being attacked by the laser beam a pair 7 of rollers 7a and 7b and a pair 8 of rollers 8a and 8b are arranged on either side of the plate 5 in such a way that the axes of the rollers are parallel to one another in each pair and from one pair to the other and that the plane determined by the contact generatrix of the rollers 7a and 7b of the pair 7 and the contact generatrix of the rollers 8a and 8b of the pair 8 contains the face 6 of the.