and thermal stability of non modified soy protein adhesives u spi adhesive was prepared as described in example 1 a sample of the u spi adhesive and a sample of a non modified soy protein adhesive food grade spi available from adm were tested on a rapid viscosity analyzer rav the results shown in fig1 indicate that the u spi adhesive has a lower viscosity and is more stable thermally than the non modified soy protein adhesives this means that the adhesives of the invention may be applied more easily and have a longer working life with greater thermal stability compared to non modified soy protein adhesives u spi adhesives having a 16 solids content were prepared following the procedure described in example 1 but varying the quantities of urea to achieve adhesives having concentrations of 2m 4m 6m and 8m of urea the thermal transitions of the modified adhesives were measured with a differential scanning calorimeter dsc these transitions were compared to the thermal transitions of non modified soy protein adhesives having a 16 solids content food grade spi available from adm the calorimeter used was a perkin elmer dsc 7 instrument perkin elmer norwalk conn calibrated with indium and zinc the dsc temperature scan range was from 20 u00b0 c to 180.