made on bottom of a corresponding first bottom metal pad 341 fig3 f shows an ic chip mounted on bottom of fig3 d fig3 f shows a chip 391 mounted on bottom of fig3 d the chip 391 is electrically coupled to the first bottom metal pad 341 through a plurality of solder ball an under fill 392 can be made between the chip 391 and the first bottom metal pad 341 fig3 f u2032 shows an ic chip mounted on bottom of fig3 e fig3 f u2032 shows a chip 391 mounted on bottom of fig3 e the chip 391 is electrically coupled to the bottom protection layer 39 through a plurality of solder ball an under fill 392 can be made between the chip 391 and the bottom protection layer 39 fig3 g shows an ic package unit obtained through singulating the product of fig3 f fig3 g shows an ic package which is a package based on the molding compound supported rdl of the first embodiment according to the present invention fig3 g u2032 shows an ic package unit obtained through singulating the product of fig3 f u2032 fig3 g u2032 shows an ic package which is a package based on the molding compound supported rdl of the second embodiment according to the present invention fig2 a u02dc 2 l and 4 a u02dc 4 c shows a manufacturing process according to the present.