pad 224 configuring the adjacent inspection pad portion 22 through the wire on the outer periphery of the ic1 basically the same applies to the other inspection bump portions 22 23 and 24 fig2 is a top view of a pattern 3 which is the ic connection portion of a flexible substrate 5 in the flexible substrate 5 on a polyimide film of 25 u03bcm a seed layer is deposited in order to improve the adhesiveness cu is deposited by about 2000 u03bc a base material to which an electrolytic cu plating of about 8 u03bcm is patterned and a pure sn layer of 0 2 u03bcm is formed by an electroless sn plating inspection patterns 31 32 33 and 34 are disposed respectively so as to be opposed to each inspection pad of the ic1 each inspection pattern is provided with four pads as shown in the drawing two pads arranged on the x axis side are electrically connected and two pads arranged on the y axis side are electrically connected according to the present embodiment two pads on the y axis side configuring the inspection pattern 31 are not electrically connected but they are used as an inspection land 4 the ic1 and the flexible substrate 5 which are configured in this way are connected to each other through the au.