the polymide layer 804 exposing the copper layer 806 during assembly when the load beam and the ils are assembled the load beam will be in surface contact with the stainless steel layer of the ils and the dimple is placed in the via 812 and pressed into contact with the copper layer 806 this will create a grounding path between the stainless steel layer 802 of the ils and the copper layer 806 fig8 illustrates another embodiment of the present invention a punch 900 is used to punch a hole through all three layers of the ils the copper layer 906 and the stainless steel layer 902 are harder that the polymide layer 904 material and will smear through the polymide layer as illustrated by 908 this will create a grounding path 908 between the copper layer 906 and the stainless steel layer 902 the above methods illustrates how to create a grounding path between the stainless steel layer and the copper layer of the ils the copper layer and in turn the stainless steel layer can be grounded to a controlled ground via a dedicated grounding path etched in the copper layer to a grounding terminal the above methods can also be altered to provide methods of creating grounding paths between multiple layers of copper and stainless steel the top most conductive layer that is to be connected to the grounding path in a two or more layer structure is herein referred to as the top grounded layer there may be one or more conductive layers.