corrosion sensitive regions aside from other sensors such as air mass sensors or temperature sensors semiconductor circuits which are used for example for evaluation and or adjustment purposes are conceivable as well fig1 shows a known structure of a micromechanical pressure sensor in a housing in this instance a micromechanical sensor element 120 having piezoelectric resistors 125 is connected to a substrate 110 by suitable connecting materials 115 in the conventionally used connection technique of anodic bonding the connecting layer may also be omitted the electrical component thus produced having sensor element 120 is subsequently mounted on a support element 100 for example a ceramic support or a hybrid printed circuit board with the aid of a suitable connecting layer 105 generally it should be assumed however that the sensor element of the pressure sensor can also be realized by another construction common materials for the micromechanical sensor element are moreover semiconductor materials glass or steels sensor element 120 may be equipped for example with a diaphragm and a cavity 145 lying beneath the diaphragm having a specified pressure p 2 for example if substrate 110 does not have an access hole 150 below the cavity and a vacuum is enclosed in the bonding of the substrate and sensor element for differential pressure applications however substrate 110 and support element 100 may also be provided with a duct 150 to cavity 145 or to the diaphragm such.