516 and fig1 f a molded layer 1282 is deposited on the bottom surface of the thick metal layer 1272 to support the device structure the thickness of the molded layer 1282 maybe about 100 microns a processed interconnected wafer is formed block 516 may be followed by process 900 of fig9 fig9 is a flowchart of a process 900 to laser mark singulate test and pack battery protection packages in examples of the present disclosure block 514 of fig5 may be followed by process 900 in block 902 laser marks are added to each battery protection packages at wafer scale level block 902 may be followed by block 904 in block 904 the wafer is cut to singulate the individual marked battery protection packages block 904 may be followed by block 906 in block 906 the individual marked battery protection packages are tested each of the battery protection packages has a passed status is then packed thus forming a battery protection packages 100 and 200 of fig1 b or fig2 b fig5 b is a flowchart of a process 501 to fabricate the battery protection packages 300 and 301 of fig3 b and fig3 d the steps of blocks 502 to 512 are exactly the same as those in process 500 of fig5 a block 512 may be followed by block 513 in block.