back and forth the circuit within the die 108 can be tested with the electric tester 40 once the circuit is tested the test chuck 32 is moved vertically downward so as to disengage the terminal 110 from the contacts 36 the test chuck 2 is then moved in x and y directions to align terminals of another one of the dies 108 with the contacts 36 whereafter the test chuck 32 is moved vertically upward so as to engage the terminals of the other die 108 with the contacts 38 it may also be possible to test more of the dies 108 at once once the circuits in all the dies 108 are tested the test chuck 32 is moved in an x direction so that each one of the substrates 56 a c is aligned with a respective one of the slots 50 d f as shown in fig1 the test chuck 32 is then moved in a direction 108 so that the substrates 56 a c are located in the slots 50 d f respectively the vacuum on the test chuck is then released so that the substrates 56 a c are released from the test chuck 32 the test chuck 32 is then dropped so that the substrates 56 a c drop into supports of the slots 50 d f as shown in fig1 and 18 the substrate removal apparatus 42 includes a retracting tool 110 a conveyor system 112 and a removal cassette 114 the retracting tool 110 is first used to move the.