spacing of the module and is preferably 0 0277 inches upon insertion into the module the bends deform into contact with the plated through holes of the boards defining contact sections 8 it is important to note that the pin does not undergo plastic deformation in the insertion process and the contact sections are urged into conformity with the holes through the resilience of the pin material turning to fig1 b the pin 10 is shown inserted into a stack of circuit boards the circuit boards have plated through holes as shown at 8 and 9 to permit electrical interconnection with the board individual boards such as 14 and 15 are connected by the deformed pin which provides contact sections 17 and 18 the boards 14 and 15 are separated by a spacer 16 in some applications it may be important that the spacer not contact the pin 10 since contact would reduce the force exhibited by the contact section the relatively large distance between contact sections allows this form of pin to tolerate a relatively large amount of misalignment of the through plated holes this is of practical value since there is some misalignment of the boards within the module as shown in fig1 b.