risk of damage during a label fabrication process such as a solar chip a battery a temperature sensor and the like can be incorporated into a label according to this invention the microchip 16 can be prepared for a u201c direct die attach u201d or a u201c strap attach u201d as are well known in the art as used hereinafter the term u201c microchip u201d will refer to a microchip a microprocessor a strap an interposer or a similar device adapted for attachment to an antenna referring now to fig3 and 4 the rfid label fabrication process 40 will be described fig4 illustrates a series of steps in one embodiment of the label fabrication process however certain steps can be modified or eliminated based upon a particular label configuration adhesive pattern layer configuration and the like as described hereinafter it is anticipated that the substrate material 12 will be provided as a web of material and that the following described process will be automated and conducted in a rapid sequence or concurrently on a plurality of labels however the process will be described with respect to a single label having a single microchip the process 40 is initiated by the selection 42 of a substrate material 12 having suitable properties for the intended label such as size durability color and the like the antenna 14 is then applied 44 to the substrate 12 in a preselected configuration the label adhesive layer 18 is applied 46 over the substrate 12 followed by the addition of a release layer 20 this can be followed by the printing of information or graphics on.