protect electrical components as shown in fig1 a socket 10 is mounted on second printed circuit board 19 second printed circuit board 19 may include a variety of other electrical parts 21 as shown in fig1 b second printed circuit board 19 which includes among other things socket 10 runs through surface mount reflow oven which heats second printed circuit board 19 through convection and impinging radiation in the infrared spectrum and or through condensation i e vapor phase from above as referenced by heat waves 11 as shown in fig1 c electrical module 3 containing the clock module which is comprised of lithium battery 6 crystal 8 and integrated circuit 15 is then inserted into socket 10 as shown in fig1 c electrical module 3 is then effectively positioned on second printed circuit board 19 and electrically connected via socket 10 to second printed circuit board 19 as shown in fig1 d this process effectively removes electrical module 3 from the reflow process in a surface mount reflow oven this process would damage electrical module 3 because the surfaces of electrical module 3 facing the surface mount reflow oven would typically absorb heat through convection and impinging radiation in the infrared spectrum and or through condensation i e vapor phase from above as referenced by heat waves 11 fig1 is an illustration of an alternate preferred embodiment of the low profile socket module system for surface mountable applications when the electrical module 3 utilizes a cob assembly 3 with extended lip 150 of alternate cap or tub.