above and below area array connector arrangement 12 are circuit boards 14 and 16 having board surfaces 15 and 17 respectively opposed to connector array support surfaces 30 and 32 disposed on the board surfaces are sets of contact pads 34 and 36 when assembled as shown in fig2 each set of contact pads 34 of board 14 lies in electricity conductive contact with the opposed tab portion 26 of interconnect element 22 which extends through the support member 13 to electricity conductive contact between tab portion 28 and the set of contact pads 36 of the opposed circuit board 16 the pairs of sets of contact pads connected via element 22 are offset from each other and the element is configured in a manner to cause the element to move bodily in the support member as compressional force is applied to the opposed boards as shown in fig3 one embodiment of the interconnect element according to the instant invention is demonstrated in fig4 the interconnect element 50 is divided into a plurality of longitudinal sectors in this case three 52 54 and 56 the two conductive sectors 52 and 56 composed of e g cu of becu are separated by the insulative electrically predetermined sector 54 composed of e g polyiimide epoxy or phenolic fluoropolymers the tab portions 58 an 60 are designed to wipe against the contact pads of the two corresponding circuit boards as shown in fig1 3 thus forming an electrical connection in this embodiment the conductive sectors 52 and 56 connect two separate pairs of corresponding surface pads thus for example one of the conducive sectors on the element may be used.