the connective device to the substrate enables optional coupling of optical signals from the optical fiber to optoelectronic chips mounted over holes of the substrate application_number US 8868793 A description the drawings of fig1 and 2 are not necessarily to scale and certain details have been simplified to aid in clarity of the description shown in fig1 is an arrangement for interconnecting an optical fiber such as 120 and 130 to a multichip module substrate 100 the substrate 100 may include a plurality optoelectronic flip chips such as 110 and 111 that are solder bump bonded to wire path 101 the optoelectronic chips 110 and 111 connect via the various wire paths 101 to implement the desired circuit function the importance of z axis positioning of the optical fibers can be seen by a comparison between the mounting of optical fiber 120 and optical fiber 130 optical fiber 120 is mounted to substrate 100 such that the optical fiber end does not come in contact with the optoelectronic chip 110 this is desirable because the edge of the optical fiber may be jagged and if it contacts optoelectronic chip 110 can cause damage to the chip 110 this is illustrated by optical fiber 130 which is shown to make contact with optoelectronic chip 111 the jagged edge of optical fiber 130 can gouge optoelectronic chip 111 causing it to malfunction the ability to accurately align optical fibers 110 and 111 in the z axis with substrate 100 remains as a problem with reference to fig2 d there is illustrated a method of mounting the optical fiber connective device of the present invention including a support plate 201 and.