fig6 b illustrates a plurality of connections 608 that extend from the back panel 304 toward the front panel 306 one or more of the connection 608 are electrical connections e g connections 608 a the electrical connections 608 a extend between the circuit module 304 and the pixel structure 602 specifically the electrical connections 608 a extend from the circuit module 304 to a row electrode 312 of the pixel structure 602 in addition one or more of the connections are thermo mechanical elements e g connections 608 b that dissipate heat generated in the pixel structure 602 toward the circuit module 304 in certain exemplary embodiments the thermo mechanical elements 606 b also provide a redundant electrical connection although the thermo mechanical elements 608 b in fig6 b are shown as extending from the circuit module 304 to the row electrode 312 near the front panel 306 the thermo mechanical elements 608 b may extend to essentially any depth and may be positioned at essentially any location on the circuit module 304 for example a thermo mechanical element 607 may be positioned directly under a pixel structure those of skill in the art will recognize that the connections 608 may include conductor traces 318 and connecting pads 320 fig3 present between the circuit module 304 and the depth to which the connection 608 extends referring to fig6 a and 6b in certain exemplary embodiments an underfill encapsulant 610 encapsulates the area surrounding the components in the space defined by the circuit module 304 and the front panel 306 in an exemplary embodiment the underfill encapsulant 610 is selected based on its heat dissipation properties when positioned within the space defined by the circuit.