to fig1 after its removal is replaced with a further layer of the printed circuit board to be produced already similarly as in the illustration according to fig4 said further layer being for instance again formed by an rcc foil so as to provide for a further conductive or conducting layer 20 in particular copper layer via an interposed insulating layer 19 for contacting the contacts or pads of the electronic components 1 2 and 3 to be integrated which are again denoted by 7 a multi layer structure 21 is employed in the embodiment according to fig7 using a pretreated double sided core which in addition to an insulating intermediate layer 22 comprises electrically conductive layers or elements 23 or 24 respectively on either side the patterning of which is coordinated with the positioning of individual junctions or contacts 7 of the electronic components 1 2 and 3 to be embedded in order to fill clearances or interspaces between the individual components 1 2 and 3 to be integrated as well as in the region of the contacts or junctions 7 an insulating material is again used as indicated in fig2 after having fixed both the double sided core 21 and the additional layers 19 and 20 patterning e g by laser drilling is again effected as in the illustration according to fig3 such that the contacts 7 of the components 1 2 and 3 to be integrated are.