the semiconductor device 14 by wire bond 22 and a lead connection not shown at a distal end for electrically connecting the completed ic package the lead fingers are electrically connected as described hereinbefore to the bond pads 38 of the semiconductor device 14 by a wire bond 22 in the second embodiment of the present invention the modified lead frame 12 includes a die paddle 40 to support the semiconductor device 14 the semiconductor device 14 may be adhesively attached to the die paddle 40 by means of thermosetting or thermoplastic adhesive or epoxy paste the v cc lead 42 extends along the length a side or first side of the semiconductor device 14 rather than terminating at a proximal end as the other lead fingers 18 and extends substantially perpendicular with respect to a portion of the lead fingers 18 and at an angle with respect to other lead fingers 18 similarly the v ss lead 44 also extends along the opposite length another side or second side of the semiconductor device 14 in the same manner as v cc lead 42 as shown the v cc and v ss leads 42 44 respectively extend substantially parallel to each other and to the two of the sides of the semiconductor device 14 unlike the first embodiment of the present invention the v cc and v ss leads 42 44 in the present embodiment do.