not have a passivasion layer may be used after testing the resin with a test chip having an alternative test circuit the influence of the fillers on the passivation layer can be found by comparing the test results of the test circuit and the alternative test circuit referring to fig2 a test chip 200 of a second embodiment includes a test circuit having three transistors a u2032 b u2032 and c u2032 in contrast to the test chip of the first embodiment the test chip 200 does not include an intermediate insulating layer and a passivation layer since there are no intermediate insulating layers a gate electrode 213 of each transistor a u2032 b u2032 and c u2032 can be formed of aluminum or copper which is the same material as that of a metalized wire 205 for connecting the transistors to each other dams 211 for capturing fillers included in a resin are formed on the exposed surface of the test chip the dams 211 are formed in parallel with each other to provide a slit 212 therebetween on the test circuit so that the fillers 208 are captured in the slit 212 which located on the test circuit furthermore the dams 211 are formed perpendicular to a direction of resin flow the material of the dams 211 is the same as that used in the first embodiment further the process for forming the dams 211 is also.