the one or more gas ports likewise the spin mechanism can further comprise a spin cup for encircling a semiconductor wafer secured to the spin chuck wherein one or more gas ports are affixed to the spin cup according to various embodiments the apparatus can comprise one two three or four gas ports still in other embodiments five or more gas ports are used the apparatus can further comprise means for delivering pressurized gas such as pressurized nitrogen gas to the gas ports alternatively pressurized air is delivered to the gas ports further disclosed is an apparatus for drying solvent from the backside of a spin coated semiconductor wafer comprising a spin mechanism for use in spin coating a semiconductor wafer the spin mechanism having a wafer chuck for securing the wafer and a spin cup for encircling the wafer one or more gas ports adapted to deliver one or more pressurized gas jets to the backside of a semiconductor wafer secured to the spin chuck for evaporatively drying solvent from the backside of the semiconductor wafer and means for delivering pressurized gas to the one or more gas ports the apparatus can further comprise one or more nozzles coupled to the one or more gas ports as well as one or more gas ports affixed to the spin cup the number of gas ports can vary from according to various embodiments and may range from one two three or four gas ports still in other embodiments five or more gas ports are used the.