limit the invention rather the scope of the invention is defined by the appended claims it would be apparent to one skilled in the art that the present invention as described below may be implemented in many different embodiments of hardware software firmware and or the entities illustrated in the drawings any actual software code with the specialized controlled hardware to implement the present invention is not limiting of the present invention thus the operation and behavior of the present invention will be described with the understanding that modifications and variations of the embodiments are possible given the level of detail presented herein fig1 is an illustration of an integrated circuit ic substrate 100 using a traditional substrate packaging technique with an increasing number of input outputs i os and higher data rate signal transfers in semiconductors there is an increased requirement for larger package sizes more i o on package pin outs multiple layers for plane isolation and different power consumption capabilities in order to fulfill the increased requirements very high end substrates e g over 6 to 8 layers and very expensive substrates have traditionally been used fig1 is an example of one of these traditional approaches the structure of fig1 includes a number of high speed differential circuits in fig1 all differential pair circuits 102 are routed on an m1 layer 104 with power and gnd balls next to the pairs this structure employs standard signal ground and power signal substrate layering techniques in fig1 an expanded view 105 is provided in the expanded view 105 connections 106 shown are the differential pair circuits vdd connections 108 and gnd connections 110 are indicated as shown this approach will not ensure sufficient.