solderable finish on the surface that is adjacent to layer 16 preferably this is performed by soldering with 95sn 5ag solder indicated at 24 in fig5 only the solder 24 and metalizations 16 cooperate both in effecting efficient electrical conductivity between terminal plates 11 12 and resistance film 20 and good thermal conductivity between such terminal plates 11 12 and resistor substrate 10 the same resistor shown in fig5 is shown in fig6 as being electrically and thermally connected to a circuit substrate 14 solder 26 is employed to electrically and thermally connect the bottom metalization number 18 not shown in fig6 to the upper heat sinking surface of the circuit substrate 14 in the connection shown in fig6 four leads preferably aluminum wires are connected wire bonded between circuit substrate 14 at suitable circuit terminal points thereon and the upper surfaces of the terminal plates 11 12 the upper surface of each terminal plate 11 12 has a wire bondable finish such as a nickel plate for bonding aluminum wire there are shown two leads for each terminal plate in the illustrated form two of the leads one for each terminal plate are sense leads these being numbered 27 the remaining two leads numbered 28 are.