member 27 through which the chip select signal is applied to upper ic 12 at lead 22 19 no solder paste is applied lower ics 14 are placed onto the lower side of the carrier panel 52 so that the shoulder of ic leads 22 are in contact with the solder paste applied to contact members the assembly is then processed again through a reflow oven alternatively the lower side may be processed first followed by the upper side assembly process in an alternative method a holding fixture is incorporated to hold and locate the ics for either side solder paste is then applied to both sides of carrier panel 52 which is subsequently placed into the fixture with the leads of the ics in the fixture contacting one side of the carrier panel 52 the other side of the carrier panel is then populated with pick amp place techniques the entire assembly is then processed through a reflow oven creating solder connections on both upper and lower sides with one pass the resulting assembly is an array of stacked devices inter connected by the lead frame carrier individual modules 10 are then singulated from the carrier panel or frame at the place where the ends of leads 22 of upper ics 12 meet the lead frame carrier.