v shaped groove 26 and lead receiving portion 30 0055 fig6 a and 6b are views showing the third embodiment of the present invention and fig6 a is a top view of the ic package and fig6 b is an enlarged top view of a portion f in fig6 a at which portions of a seat and a measuring pin are added a distal end of a lead 34 of an ic package 33 is cut when the distal end of the lead is worked after solder plating an end surface of the distal end is formed into a concave shape such as the v shape shown in fig6 b moreover a measuring pin 35 of the measuring arm is formed into a convex shape such as a reversed v shape so as to engage an end surface shape of the distal end of the lead 34 when the distal end of the lead 34 of the ic package 33 is set at a lead receiving portion 30 of the seat 28 the same as in the second embodiment a reversed v shaped portion of the measuring pin 35 contacts a v shaped portion formed in the end surface of the distal end of the lead 34 and is pressed to be electrically connected and electrical characteristics of the ic package 33 are measured thus by forming the end surface of the distal end of the lead 34 into a concave shape and the distal end of the measuring pin 35 into a reversed v shape a position of the lead 34 is corrected by the distal end of the measuring pin 35 even if the ic package 33 is.