c create centroid step 220 assigns quadrants and calculates compositions less work than case b create bga matrix step 222 for all cases a b and c starting with a full bga matrix creates a line of data with its x position y position slope from center of package and quadrant an alphanumeric matrix specifies the alpha numeric location of the ball punch out depops data for balls that are not supposed to be there from input the resulting data set is separated into four separate quadrants this step randomly assigns a type for each bga pad in a quadrant to a signal ground or voltage for case a and b chip to bga routing 224 separates chip centroid data into four matrices based on quadrant the closest slope search routine starts on east side takes the quadrant dividing slope step 214 for this die pad position determines the slope to all bgas in the quadrant and then finds the slope that is the closest to the quadrant dividing slope and that slope defines the routing for this chip pad signal but not ground and voltage lines are thus routed the selected bga pad is then designated u201c used u201d and not available for subsequent pad selection this process is repeated for die pads in order in this quadrant the new maximum slope is that defined by the routing of the previous pad step 226 calculates the runs the power levels wire bond fingers needed and outputs to a file step 228 uses cramer 39 s rule to solve for the intersection of all possible line combinations within the quadrant to see if the intersection falls within the space between a.