each of the linear motors of the first stage 99 and the second stage 92 with a method as described in the previous embodiments scanning instability for both of the stages is substantially reduced in a scanning exposure system scanning instability directly causes a distortion of the transferring pattern therefore the exposure system of this embodiment permits the accuracy of pattern transfer to be improved rapidly an embodiment of a method of producing devices utilizing the above described exposure system will now be described fig1 is a flowchart showing the steps in a method of manufacturing fine devices such as a semiconductor chip for an integrated circuit ic and a large scale integrated circuit lsi a liquid crystal panel a charge coupled device ccd a thin film magnetic head and a micromachine etc in step 1 circuit design a circuit for the semiconductor device is designed in step 2 wafer manufacture a mask on which a circuit pattern is formed is manufactured on the other hand in step 3 wafer manufacture a wafer is manufactured using a material such as a silicon step 4 is called a pre process in which the circuit is actually formed on the wafer by lithographic technology using the above prepared mask and wafer the next step 5 assembly process is called a post process which is a procedure for transforming devices into semiconductor chips using the wafer manufactured in step 4 and which includes procedures such as an assembly procedure dicing and bonding and a packaging procedure.