detail below has integrated pcbs and is connected directly to the sensor array referring to fig5 a a side view 500 of an exemplary pcb substrate 502 is shown located on one side of pcb substrate 502 are various components 504 related to the functionality of pcb substrate 502 optionally various components 504 are of variable size shape and or height electric pads 506 are provided on the side opposite various components 504 in accordance with an exemplary embodiment of the invention as described in the u201c background of the invention u201d section application of a conductive adhesive to this structure would most likely result in creating lateral conduction therefore in an exemplary embodiment of the invention non conductive spacers 508 are provided to pcb substrate 502 in order to avoid creating lateral conduction between electric pads 506 when a conductive adhesive is added and subsequently subjected to pressure in an exemplary embodiment of the invention non conductive spacers 508 are provided 402 on pcb substrate 502 in sufficient quantity to prevent lateral conduction by resisting the application of pressure to the conductive epoxy which would cause sufficient lateral flow of the epoxy to cause shorts between the pads this would happen in the absence.