onto the surface of the implant until the deposited sacrificial material almost entirely fills the apertures the coating layer is then deposited onto the surface of the implant provided with sacrificial material and then the cylindrical holder 4 and the sacrificial material situated in the apertures 3 are removed application_number US 27964707 A description fig1 a shows a schematic section through a niti stent 1 whose wall 2 is interrupted by the apertures 3 this stent shows superelastic behavior at body temperature by cooling the stent in the martensitic state for example by using a cooling spray or liquid nitrogen the stent can be expanded and mounted on a cylindrical holder represented here by a copper tube 4 in order to ensure a secure hold the external diameter of the copper tube 4 is larger than the internal diameter of the niti stent subsequent warming of the stent to room temperature leads to form fitting contact between the mounted stent and the substrate fig1 b subsequently in a micro electroplating process a copper layer 5 is electrochemically deposited onto the copper substrate 4 as the sacrificial material the deposition is continued until the whole stent is covered with copper and the sacrificial material fills the apertures 3 fig1 c the copper 5 covering the niti stent 1 is subsequently removed this can be carried out manually with fine abrasive paper on a lathe copper is removed until the wall 2 of the niti stent in the applied cu layer 5 is laid bare and a cylinder 6 of even wall thickness has been produced fig1 d now in this case a thin niti coating layer 7 is sputter deposited on the cylinder 6 thereby produced said cylinder being formed by the stent 1 filled with cu fig1.