tunnel for freezing the wafer cone and the semi frozen confection and a dipping area including more than one pin less socket apparatus for accepting the wafer cone and moving the wafer cone through a dipping bin within the system the coating filling cooling and dipping areas may be on the same or separate assembly loops including the socket apparatus within one or more of such assembly loops application_number US 13635805 A description fig1 a is a perspective view of a pin less socket 10 in accordance with a first embodiment of the present invention the pin less socket 10 is shown with a wafer cone 100 inserted therein the pin less socket 10 includes a socket 11 in the form of a truncated section that is conical and hollow the socket is smooth and shaped to accept the bottom half of the wafer cone 100 it should be understood that wafer cones are fabricated in standard sizes that deviate very little cone to cone accordingly the bottom half of wafer cone 100 may snugly fit into the socket 11 even with minor cone variations the wafer cone 100 is held in place via a hook 13 that includes a hinge 14 an o ring 12 located within a groove 12 a surrounds the outside of the socket 11 to cause compression of the hook 13 compression of the hook 13 causes one or more teeth shown.