the presolder formed on the first conductive pads 112 are reflowed to form a solder joint after forming the fcbga package configuration 200 the fcbga package configuration 200 is mounted on the pcb by a plurality of solder balls 228 making the fcbga package configuration 200 electrically connect to the pcb in addition according to the mechanical structure a plurality of conductive posts 128 are manufactured into the chip conductive zone 120 as shown in fig4 for increasing the connection area of the presolder and conductive pads thus according to the present invention the conductive posts 128 are formed on the first conductive pads 112 of the openings 124 for increasing the connection area of the presolder the first and second conductive pads 112 114 and the conductive posts 128 can be conductive metal such as copper nickel tin gold silver an alloy of nickel and gold an alloy of the copper and silver or an alloy of the copper and tin to sum up the present invention flip chip substrate when compared to prior art encompasses at least the following advantages 1 the present invention flip chip substrate utilizes two insulating layers to manufacture different thicknesses of the chip conductive zone and the passive component conductive zone making the whole substrate plate even and have an identical connecting with metal mask therefore the present invention obtains high quality for high i o counts and fine bump pitch of presolder printing and promotes high quality and yield of package process 2 the present invention flip chip substrate utilizing the conductive posts formed on the conductive pads can effectively increase the contact.