be a solder ball a bump or a micro bump that is made of tin lead silver or gold the material of the metal ball 43 is mainly selected from those having a good electrical conductivity moreover each of the metal pads 42 of the measuring unit 40 is further connected to a metal ball 43 which is electrically connected with a pad of the flipped chip 300 other than the pad under test 301 to support the flipped chip 300 and supply a dc power to the flipped chip 300 from a outside power source as shown in fig1 to fig3 and fig6 the connection unit 50 is formed by a signal pad 51 and two ground pads 52 that are disposed at two sides of the signal pad 51 respectively the signal pad 51 and the two ground pads 52 are not contacted with each other and all expose the dielectric layer 20 both of the ground pads 52 are electrically grounded and the signal pad 51 is electrically connected with the second metal wire 32 and inputs the measurement signal from the second metal wire 32 the connection unit 50 as shown in fig1 to fig3 and fig6 is electrically arranged in the ground signal ground gsg connection way for the gsg connection way the signal pad 51 is disposed between the two grounded ground pads 52 to form a high frequency transmission line in the coplanar waveguide cpw form during high frequency signal transmissions so the characteristic impedance can be controlled effectively to ensure the quality in the high frequency signal transmissions as shown in fig4 there is shown a conducted eme measurement apparatus 200 with a semiconductor chip probe 100 the conducted eme measurement apparatus 200 comprises a semiconductor chip probe.