a similar solder retaining arrangement or any other soldering arrangement on leg 32 or leg 32 may be extended to form a terminal for connection to order apparatus for example leg 32 may be bent at right angles to the position shown and shaped to extend through a hole in a second substrate for perpendicular mounting and soldering to the second substrate fig2 shows another arrangement with lead 10 formed generally similarly to that of fig1 but arranged to be soldered to a conductive pad 40 with the substrate on top of the lead 10 and solder bead 26 instead of forming a clip as in fig1 or 20 the lead of the invention may be directly surface mounted on a substrate by soldering the solder bearing section to a substrate as shown in fig2 the other end 10a of lead 10 may have any desired configuration as required by apparatus to which it is to be connected in some instances it may be desirable to give added security for retention of the solder on the lead in any of the above described forms of the invention this may be done as shown in fig2 which shows an edge clip similar to fig2 here the lead portion 10b extending longitudinally outward from the solder bead 26 is bent over and closely juxtaposed to the solder 26 to further prevent movement of the solder mass away from lead 10 in addition lower leg 32 of the lead 10 is bent to be close to.