such the embedded materials 70 are a uniquely effective means for extending the service life of the integrated circuit by better protecting it from these adverse physical phenomena in an alternative embodiment depicted in fig3 the embedded materials 70 39 are made up of active isolating materials such active materials can provide capabilities such as sensor feedback thermoelectric cooling or thermoelectric heating as such the active embedded materials 70 in this alternative embodiment are made of piezoelectric crystals it should be appreciated that other active materials could be employed such as piezoelectric polymers if active isolating embedded materials 70 39 are selected for use as is illustrated in fig3 an embedded materials interconnect layer 80 is required the embedded material interconnect layer 80 lies above the sensor layers 22 and below the lowermost intermediate signal interconnect layers 24a more particularly the embedded materials interconnect layers 80 include an embedded materials metallization layer 82 bonded to an embedded materials flexible dielectric layer 84 by a nonstructural adhesive 86 furthermore the embedded materials interconnect layer 80 is bonded above to the intermediate signal interconnect layer 24a and below to the sensor layers 22 by way of non structural adhesives 88 56 respectively and further is interconnected to the integrated circuit 26 and other layers 22 24a b by way of the multi layer flex interconnect via 30 the active embedded materials 70 39 are disposed in a pocket between the embedded materials interconnect layer 80 and the sensor layers 22 in operation the embedded materials either passive 70 or active 70 39 effectively isolate the integrated circuit from being unduly subjected to the adverse physical phenomena experienced by the structure while still allowing the sensor layers 22 to effectively.