micro relay 600 and a cross section of the structure of fig6 taken along line 7 7 both in accordance with a still further embodiment of the present invention the liquid metal micro relay 600 includes a bottom substrate 602 and a top substrate 608 the top substrate 608 may be glass and includes a lower layer 609 having heater substrates 604 and 606 bonded to its top surface by sealing resins 610 and 612 respectively the sealing resins 610 and 612 may be a teflon u00ae type resin or an epoxy resin the bottom substrate 602 is bonded to the lower layer 609 of the top substrate 608 the bottom substrate 602 has a plurality of bonding pads 621 through 627 on its bottom surface the bonding pads 621 through 627 are electrically conductive and connected to via conductors 631 through 637 in and extending at least partially through the bottom substrate 602 the via conductors 633 634 and 635 form contact electrodes for the liquid metal micro relay 600 the via conductors 631 632 636 and 637 are respectively connected to countersunk regions 641 642 643 and 644 in the lower layer 609 further the lower layer 609 has countersunk regions which.