and further testing was deemed unnecessary the results of the performance screening are summarized below very few solutions exhibited success in cleaning both phost and novolac photoresist and the few compositions that did have this success were questionable solutions that were non ideal for use in this invention by comparison many compositions containing sulfonated polyesters exhibited much better performance dissolving phost and novolac photoresist the compositions containing sulfonated polyesters were significantly preferable to those containing any of the other polymers considered and a single composition from those containing sulfonated polyesters was chosen for future testing table 4 contains the results from a cleaning study conducted for phost resin coated as described in table 1 resin was cured for 15 minutes at 200 degrees c all cleaning compositions are comprised of 6 wt sulfopolyester 24 wt de solvent with the remaining 70 wt being comprised of two additives as noted in table 6 process temperatures for the cleaning stage were 100 degrees c 150 degrees c and 200 degrees c the data in table 4 suggest that most solutions will perform well in dissolving and removing the phost resin even at high exposure temperatures of 200 degrees c the solutions enriched with higher concentrations of acid or base additives exhibited improved results at both levels of enrichment solutions containing mea did not perform well removing phost cured at high temperatures the primary conclusion here is that phost is relatively easy to process at 60 seconds with the invention method and compositions table 5 contains the results from a cleaning study conducted for novolac resin coated as described in table 1 resin was.