remove oxygen to the low ppmv levels the process of item 10 shows a process where two different purification technologies located apart from each other provides the most economical purification strategy the membrane will remove nitrogen and oxygen in loop b while the tsa will remove water in loop d in item 13 the gas specification is less than 2 air and 10 air was admitted into loop a when the parts were placed in to the csf chamber the csf process would start with loop a and loop b while loop c would not start until the gas specification is reached as measured by oxygen analyzer 66 if oxygen analyzer 66 signals an acceptable level of oxygen then loop c starts up and loop b would continue to increase the helium purity fig2 provides a schematic of the systems of this invention and the process therefore the csf process involves applying a coating to a part inside csf chamber 30 the chamber geometry will partly depend on size and geometry in an embodiment of this invention the part is loaded into the csf chamber one at a time and one nozzle is used to coat the part the opening of the enclosure removes the coated part and releases about 8 cubic feet cf of helium and allows 8 cf of air to enter the enclosure furthermore loop a contains about 80 cf of gas at start up fan 42 will draw on csf chamber 30 and pull gas through duct 32 valve 34 particulate removal 38 and ducts 36 and 40 fan 42 will discharge into duct 44 at slightly more than 15.