layer 116 from being recessed during the cmp process that is the cmp process stops on the encapsulant layer 118 such that the upper surface of the conductive material 126 is formed flush with the upper surface of the encapsulant layer 118 while the underlying passivation layer 116 is unaffected and preserved as further illustrated in fig1 the passivation layer has a preserved surface 128 that is disposed against the encapsulant layer 118 since the encapsulant layer 118 protects the passivation layer 116 from the cmp process the at least one preserved surface excludes at least one etched deformity which can result when being exposed to the cmp result the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention as used herein the singular forms u201c a u201d u201c an u201d and u201c the u201d are intended to include the plural forms as well unless the context clearly indicates otherwise it will be further understood that the terms u201c comprises u201d and or u201c comprising u201d when used in this specification specify the presence of stated features integers steps operations elements and or components but do not preclude the presence or addition of one more other features integers steps operations element components and or groups thereof the corresponding structures materials acts and equivalents of all means or step plus function.