158 as is also seen in fig2 such attachment is preferably facilitated such that one of the longitudinal side surfaces 137 of each of the first and second segments 130 a 130 b extends in generally co planar relation to a respective one of the sides or peripheral edge segments defined by the top substrate 148 thus in addition to extending in generally co planar relation to respective longitudinal side surfaces 137 of the first and second segments 130 a 130 b the peripheral edge segments defined by the top substrate 148 also extend in generally co planar relation to respective ones of the peripheral edge segments defined by the bottom substrate 112 when the top substrate 148 is electrically and mechanically connected to the interposer 130 in the above described manner the electronic components 122 124 as well as the conductive wires 128 are effectively positioned between the bottom and top substrates 112 148 and more particularly the top surface 114 of the bottom substrate 112 and the bottom surface 152 of the top substrate 148 in the semiconductor package 100 the electronic components 122 124 wires 128 and portions of the first and second segments 130 a 130 b of the interposer 130 are encapsulated or covered by an encapsulant material which is.