202 39 includes four wedge shaped sectors or quadrants quadrants 204 39 have a relatively rough surface as compared to quadrants 206 39 accordingly during a single rotation of pad 202 39 the wafer undergoes sequential abrasion polishing abrasion and polishing this cycle is continuously repeated with each rotation of pad 202 39 fig3 d shows a further variation of the pad shown in fig3 b and 3c in which pad 210 includes three wedge shaped sectors 212 214 and 216 each having a different degree of abrasiveness during polishing a wafer would be acted upon sequentially by a rough surface a surface having an intermediate level of abrasiveness and a fine polishing surface although the sectors and quadrants of the pads shown in fig3 a 3c are shown as being the same size some of the sectors may be larger than the others as in fig3 d the actual size and shape of each sector or quadrant is a design choice by appropriately selecting the size and levels of abrasiveness the pad can be tailored for a given application for which the pad is being used for example by designing a pad having a relatively large rough sector the pad would be useful.