which is secured within the tank 1 by the use of supports 34 which are welded to the tank 1 and to the housing 6 39 inlet openings 5 are provided in an upper wall of the housing 6 39 in order to allow the flow of solder bath 4 into chamber 6 a pumping impeller 12 is provided in the pumping chamber 6 in order to induce the flow of solder from the pumping chamber 6 through the nozzle 7 the impeller 12 is connected to an impeller shaft 13 which is driven by a motor 15 through a pulley 16 belt 20 and pulley 14 the impeller shaft 13 may be directly driven by the motor 15 if desired the nozzle 7 projects upwardly from the upper wall of the pumping chamber housing 6 39 so as to extend slightly above the solder bath surface 11 the discharge orifice 8 of the nozzle 7 can be sized so as to deliver a desired amount of solder to the coating roller 25 at the delivery pressure produced by the impeller 12 the coating roller 25 is positioned directly above the nozzle 7 and mounted on a shaft 35 which imparts rotational movement to the coating roller 25 the shaft 35 can be directly coupled to a motor not shown or driven indirectly by the use of pulleys and belts a cover or shroud 28 is provided over the.