a wide variety of acid etching solutions or plasma gases and provide effective protection for the resist coated areas of the substrate later the remaining areas of the photoresist coating may be removed from the etched substrate surface by conventional photoresist stripping operations the present invention is further described in detail by means of the following examples all parts and percentages are by weight unless explicitly stated otherwise 3 52 grams of xanthene 9 carboxylic acid were mixed with a solution comprising 15 00 grams mixed 45 m and 55 p cresol formaldehyde novolac resin weight average m w of about 4929 and 51 84 grams of ethyl lactate the bottle was then rolled for 12 hours at room temperature until all the solids were dissolved the resulting resist solution was then filtered through a 0 2 micron pore size filter using a millipore microfiltration system a 100 ml barrel and a 47 mm disk were used the filtration was conducted in a nitrogen atmosphere under a gauge pressure of 10 pounds per square inch approximately three mls of the filtered resist composition in example 1 was spin coated with a model 5110 c single head spinner manufactured by solitec inc santa clara calif onto a thermally grown silicon silicon dioxide coated wafer of four.