method of an embodiment of the present invention was incorporated into a microelectronic manufacturing process in fig3 a the process begins with a wafer 100 having a plurality of solder bumps 120 formed thereon in fig3 b the wafer 100 is coated with an underfill material 130 which completely covers the solder bumps 120 the underfill 130 comprises a solid epoxy thermally latent curative solvent and flux solution according to table 1 the underfill composition 130 is then hardened as shown in fig3 c by removing the coating solvent with heat and slight vacuum to yield a non tacky dry coating on the die 100 which completely covered the solder bumps 120 the wafer 100 is then diced by cutting individual dies 110 as shown in fig3 d as shown in fig3 e an individual die 110 are then picked up using a heated die bonder 170 at which time the solid uncured resin 130 liquefied to yield a convex surface in fig3 f the die 110 with the low viscosity convex surface is then aligned and placed onto a heated board 140 allowing the resin 130 to wet the surface of the board 140 during the attachment process the board 140 is simultaneously heated to a temperature below that which would damage the board 140 or initiate solidification of the.