cases where the base substrate is formed from multiple layers of green tape ceramic tungsten as in the prior art assembly of a ceramic glass ic package the cerquad package embodying the present invention as shown in fig3 and 4 embeds the lead frame 8 in the glass material 4 which has been screen printed onto the base substrate 2 in one or more layers when embedded the lead frame 8 is separated from the ground plane 30 by glass material 4 one or more of the leads 10 of the lead frame 8 of the inventive ceramic glass ic package is electrically coupled to the ground plane 30 in the embodiment illustrated in fig4 the leads 10 are electrically connected to the ground plane by small wires 34 which are down bonded to the die attach pad portion 14 of the ground plane 30 through the die attach cavity 6 fig5 illustrates in cross section the base substrate 2 of an alternate embodiment of the invention wherein a lead 10 of the lead frame 8 and the ground plane 30 are electrically coupled by a solder ball 36 specifically in this embodiment a small hole is drilled or otherwise placed through the.