these four glass connectors 50 or 52 are separated by cutting the glass plate 68 along lines d d u2032 and e e u2032 three conductive lines 82 are provided in each glass connector 50 or 52 and a connecting bump 74 is provided in each conductive line 82 fig1 illustrates a process of adhering the glass connector 50 or 52 to the lower glass substrate 42 referring to fig1 the anisotropic conductive film 62 is formed over the signal input wiring 56 and the output wiring electrode on the lower glass substrate 42 then the glass connector 50 or 52 is vacuum adhered to the bottom surface of a bonding tool 84 in such a manner that the bumps 74 are directed downwardly to this end an air exhausting hole 86 is formed in the center of the bonding tool 84 air is upwardly exhausted through the air exhausting hole 86 to vacuum adhere the glass connector 50 or 52 onto the lower surface of the bonding tool 84 subsequently the anisotropic conductive film 62 allows the anisotropic film to be pressed onto the glass connector 50 or 52 and the lower glass substrate 42 by lowering the bonding tool 84 while irradiating infrared rays 88 onto the bottom surface of the lower glass substrate 42 the anisotropic conductive film 62 is pressed into the glass connector 50 or 52 and the lower glass substrate 42 in this manner thereby adhering the glass connector 50 or 52 to the lower glass substrate 42 at this time the bumps 74 are electrically connected.