effective contact angle of at least ninety 90 degrees with a drop of water and preferably more than one hundred fifty 150 degrees a thickness d 1 fig1 a of the hydrophobic coating 26 may be in a range from two 2 angstroms to seventy five 75 microns to minimize an obstruction to the cooling fluid 30 traveling through the enclosure 34 the hydrophobic coating 26 may prevent the cooling fluid 30 from contacting the at least one semiconductor die 20 a 20 c the electrical contact elements 24 a 24 c and the substrate 22 also in some embodiments utilizing a solution based coating application the hydrophobic coating 26 also may be relatively inexpensive to apply as opposed to more expensive embodiments utilizing for example a vapor deposition process and or an evaporative deposition process in this manner the hydrophobic coating 26 may be used as part of the electrical device 10 to enable efficient cooling of the semiconductor die 20 a 20 c by the cooling fluid 30 while avoiding cross talk and electrical shorts related to contact of the cooling fluid 30 with the electrical contact elements 24 a 24 c the hydrophobic coating 26 may provide several benefits first the hydrophobic coating 26 may form a physical barrier to prevent the cooling fluid 30 from contacting the at least one semiconductor die 20 a 20 c the electrical contact elements 24 a 24 c and the substrate 22 secondly the hydrophobic coating 26 may increase the efficiency of heat transfer for example by conducting heat from the inner surface 28 a to the outer surface 28 b to the cooling fluid 30 thirdly the hydrophobic coating 26 may be applied using various methods including a relatively low cost solution based application instead of more.