space may be coplanar with the horizontal support surface 113 in the meanwhile the outer surface of the housing 100 is configured to be slopped rearwards with respect to the electrode pads 212 and 222 reference numerals 133 134 135 136 137 138 and 139 refer to the surfaces slopped rearwards it can be seen from the slopped surfaces of the housing 100 illustrated in fig1 that the housing 100 is slopingly formed to be symmetric with respect to the upper and lower axis and left and right axis this slopped structure allows the housing 100 to be easily released from the injection mold after being injection molded in the meanwhile the housing 100 according to the exemplary embodiment has a horizontal support portion 140 on its bottom surface which is parallel with the horizontal support surface 113 the horizontal support portion 140 provided near the slopped surface 113 has a thickness t which increases as the horizontal support portion 140 goes rearwards moreover the horizontal support portion 140 has a width which decreases as the horizontal support portion 140 goes rearwards w 2 lt w 1 the conventional led package has a problem of being tilted due to the slopped surface 133 provided at the bottom surface of the housing when being mounted on the pcb however such a problem may be solved in the exemplary embodiment since the horizontal support portion 140 is horizontally extended from the horizontal support surface 113 and formed on the slopped surface 133 to be able to horizontally support the led package fig3 is a side view of the led package shown in fig1 and it can be seen in fig3 that the horizontal support portion 140 may prevent a rearward tilting of the led package due.