to expose those areas 14 15 and 16 of fig1 of the underlying substrate 12 where wiring metallization is desired the wiring metallurgy 18 is deposited the wiring pattern is dependent upon the requirements for the final product but will presumably be contacting underlying metallurgy in at least one location such as is illustrated at 17 in fig1 any appropriate metallurgy can be deposited again given the constraints defined by the associated materials i e the underlying substrate or levels and first organic layer of the level presently being fabricated a useful metallurgy is a cr cu cr sandwich wherein the first and last deposited chrome provides superior adhesion to an inorganic substrate an underlying or subsequently deposited organic layer and other metallurgy the copper necessarily provides superior conductivity the method of metal deposition which is preferable is evaporation given its highly directional quality what is desired is a vertical profile and planar horizontal surfaces which are free of spikes sputtering would be an inappropriate deposition means but other known techniques would be appropriate if they provide the vertical planar profile desired wiring layer 18 will remain in areas 14 15 and 16 as part of the completed structure unlike past methods though the excess metal 18 39 which has been deposited on the surfaces of patterned polyimide will not be removed at this stage of fabrication in fact the 18 39 metal atop the polyimide will in effect act as a self alignment mask for further processing a second blanket organic layer 19 of fig2 is now deposited over the wiring layer and the metallurgy covered first polyimide pattern 13 the.