b illustrates another embodiment of a semiconductor package in accordance with an embodiment of the present invention in this embodiment the coating material 4 has a front end 5 that has meniscus like shape 18 fig2 c shows another embodiment of a semiconductor package in accordance with an embodiment of the present invention in this embodiment a gap 19 extends in a direction perpendicular to the side wall 3 and is filled by a portion of the coating material 4 in this embodiment the gap 19 in the side wall 3 arises due to reduced lateral extension of the glue 16 fig2 d illustrates another embodiment of a semiconductor package in accordance with an embodiment of the present invention in this embodiment the coating material 4 wraps around a lateral end 20 of the front side 1 and or back side 2 covering less than 20 of the area of the front side 1 and or back side 2 the coating of the edges may serve for their protection against mechanical impact and or wear fig2 e shows another embodiment of a semiconductor package in accordance with an embodiment of the present invention in this embodiment a front end 5 of the coating material 4 is covered by a lateral extension 21 of the front side 1 material a alternatively a front end 5 of the coating material 4 may be covered by a lateral extension 21 of the back side 2 material b fig3 illustrates in its diagrams a to e schematic top views of steps of manufacturing a semiconductor package in accordance with an example of the invention and fig4 in its diagrams a to d schematic sectional views of the respective steps in fig3 a and 4 a.