for this adhesive layer such type of resin molded package 2 adopts an loc lead on chip structure in which the inner leads 3a are disposed above the dram 1 since the shape of the inner leads 3a can be freely determined without being restricted by the shape of the dram1 owing to the use of the resin molded package 2 in the loc structure a dram having a correspondingly larger size can be molded in other words since molding size package size can be suppressed small with the resin molded package 2 adopting loc structure even when the dram1 has a larger size for an increased storage capacity the packaging density can be increased the inner leads 3a are formed integrally with outer leads 3b at one end thereof the outer leads 3b carry prescribed signals which are to be applied thereto and numbered according to standards in fig1 a right end and frontmost terminal as viewed in the drawing is terminal no 1 and a right end and rearmost terminal is terminal no 14 a left end and rearmost terminal is terminal no 15 the terminal no is added to inner lead 3a and a left end and frontmost terminal is terminal no 28 the resin molded package 2 includes total 24 terminals such as terminals.