conductive lines 60 illustrated in fig1 electrically connect a terminal 52 of the decoupling capacitor 50 a bond pad 84 on the first active surface 32 and a conductive contact 82 on the first surface 22 of the substrate 20 the bond pad 84 on the first active surface 32 is electrically coupled to the second semiconductor die 40 via a conductive line not shown and one of the topographic contacts 80 extending from a conductive bond pads 84 on the second active surface 42 to a corresponding conductive bond pad 84 on the first active surface 32 in this manner the pair of conductive lines 60 are arranged such that the decoupling capacitor may be connected across v ss and v cc pins or terminals i e the high and low voltage inputs of the first and second semiconductor dies 30 40 it is noted that a conductive line may comprise an electrically conductive lead trace bond wire etc in this manner the decoupling capacitors decouple the low voltage input from the high voltage input and serves as a power source filter or surge spike suppressor as will be appreciated by those practicing the present invention the conductive contacts which may embody printed conductive lines wires traces and combinations thereof electrically couple the various components of the printed circuit board assembly to the printed circuit board and to each other for the purposes of defining and describing the present invention when reference is made herein to electrical coupling to a substrate or other structure it is understood that the electrical coupling includes electrical coupling to a contact on a.