into the ink via region 48 may provide areas of increased susceptibility to delamination between the nozzle plate 40 and the thick film layer 26 as this area is susceptible to forming air pockets during assembly and use of the printheads however if the nozzle plate is attached to the chip 30 so that the ink flow channel 46 does not overlap via region 48 there is decreased likelihood that gaps or air pockets will develop between the nozzle plate and the thick film layer 26 in the area adjacent the ink via region 48 as an additional provision to enhance the adhesion between the nozzle plate 40 and the thick film layer 26 vent holes 50 may be formed in the nozzle plate 40 to provide release of trapped air which may cause delamination a plan view of a portion of a nozzle plate 40 viewed from the chip side thereof is illustrated in fig1 showing the preferred location of vent holes 50 which are formed through the entire thickness of the nozzle plate 40 the vent holes 50 may be formed by conventional micromachining techniques such as etching laser ablation and the like to complete the printhead chip 30 a flexible circuit or tape automated bonding tab.