104 106 and 108 a first target 110 is positioned between magnets 102 and 104 while a second target 120 is positioned between magnets 106 and 108 the first and second targets 110 and 120 define an electron confining region 130 a power supply 140 is connected to the magnets 102 108 and targets 110 120 so that positive charges are attracted to the second target 120 during operation particles are sputtered onto a substrate 150 which in one embodiment where the targets 110 and 120 are laterally positioned is vertically positioned relative to the lateral targets 110 and 120 the substrate 150 is arranged to be perpendicular to the planes of the targets 110 and 120 a substrate holder 152 supports the substrate 150 the targets 110 and 120 are positioned in the reactor 10 in such a manner that two rectangular shape cathode targets face each other so as to define the plasma confining region 130 therebetween magnetic fields are then generated to cover vertically the outside of the space between facing target planes by the arrangement of magnets installed in touch with the backside planes of facing targets 110 and 120 the facing targets 110 and 120 are used a cathode and the shield plates are used as an anode and the cathode anode are connected to output terminals of the direct current dc power supply 140 the vacuum vessel and the shield plates are also connected to the anode under pressure sputtering plasma is formed in the space 130 between the facing targets 110 and.