255 of the electronic component 250 can make electrical contact to the traces 220 by drilling a hole into the pcb and creating a u2018 via u2019 280 vias 280 can be formed along the grid to accept the pins vias 280 formed at the crossing of grid members can better support and electrically connect the components high frequency traces 225 can be routed in the void area between the grid members to take advantage of the low loss property of air dielectric material the second embodiment utilizes air as a dielectric in electrical connectors for making connections between pcb 39 s referring to fig3 a connector 300 is shown consisting of a hollow plastic shell with three thin dielectric slices 310 320 at each end and a center piece 330 of low loss material e g teflon integrated within a hollow plastic housing 340 and suspending at least one small wire 350 internal to the housing referring to fig5 and 6 the thin dielectric slice at each end 310 320 as well as the center 330 can be provided in the form of a rectangular disk or circular washer 410 although not limited by shape wherein at least one small hole 420 is formed within the disk or washer to hold the wire not.