composition the powdery composition is kneaded for 10 min at 100 u00b0 c cooled and ground to give epoxy resin molding materials physical properties of the resulting resin composition are measured with the following methods the results are listed on table 2 1 spiral flow measured at 175 u00b0 c of molding temperature and 70 kg f cm 2 of molding pressure with a mold prepared according to emmi standard 3 e kg f mm 2 measured with utm according to astm d 190 4 thermal expansion coefficient u03b1 u00b0 c 1 measured according to astm d 696 5 moisture content measured the saturated moisture content after standing the molded article for 48 hrs in 121 u00b0 c 2 atm vapor 6 resistant to cracking measured from the crack numbers generated in the 2 000 times thermal impact test on the molded chip under the test conditions having one cycle of 55 u00b0 c 30 min and 150 u00b0 c 30 min the same constitutional components as examples 1 to 4 are used to prepare a resin composition except that the imide epoxy resin of the present invention is not used physical properties thereof are listed in table 2 table 1______________________________________ unit by weight compar example ativecomponents 1 2 3 4 example______________________________________cresol novolak type epoxy 13 57 11 57 9 07 4 07 15 07resinimide.