proportion to force applied the stud bumps 36 get progressively harder to compress as they are crushed and do provide a small spring back force the stud bumps 36 adhere to metallized portions of the various surfaces metallizations are not applied where there is a desire to not have surface to bump bonding fig4 1 through 4 8 show steps of a process for making a sensor package such as that shown in fig1 first as shown in fig4 1 an isolation layer 100 is etched to form a support ring 102 springs 104 and a raft 106 then stud bumps 110 are bonded to the raft 106 and the support ring 102 using previously applied metallized pads at this point the stud bumps 110 are not compressed next as shown in fig4 2 a stop ring 114 having a hole 116 previously etched machined is compressed to the stud bumps 110 thereby causing them to compress and causing the stud bumps 110 to bond to previously applied metallizations located on the support ring 102 and raft 106 only the stud bumps 110 bonded to the support ring 102 bond to previously applied metallizations on the stop ring 114 as shown in fig4 3 the raft 106 is further compressed into the stop ring 114 causing further compression of the raft stud bumps 110 this can be done a number of ways such as flipping the assembly and applying a force only to the raft 106 or applying force to the stop ring 114 while the raft 106 makes contact with a pedestal as shown as shown in fig4 4 stud bumps 122 are added to a base substrate 120 in order to match those.