a fluorinated positive resist overlay two photopolymer compositions of essentially the same formulation but one with a fluorinated additive and the other without the additive were prepared the compositions are shown in table 4 below the bi layer plates were fabricated onto a clean 4 u2033 si wafer the wafer was first clean with an acetone rinse followed by sequential methanol and di water rinses the wafer was then dried using high pressure nitrogen gun the wafer was then placed in an oxygen plasma using a plasma preen unit for 5 minutes the bottom layer with composition a was spun coated at 3000 rpm for 90 seconds for both samples example 10 and example 11 after coating the wafers were purged for 5 minutes in a nitrogen atmosphere and flood exposed for 10 minutes using a oai 345 nm i liner also in a nitrogen atmosphere a second layer was then applied on the control sample the composition of the top layer was identical to that in the bottom layer columns 2 and 3 table 3 on sample b the composition of composition of the top layer is that of column 4 in table 3 above which only varies by the addition of 0 5 fts relative to that of the bottom layer the top layers were spun onto the crosslinked bottom layers at 3000 rpm for 90 seconds the samples were let dry in a nitrogen atmosphere for 2 minutes prior to their exposure in an i liner at 345 nm and exposed.