made to the electrodes of the device 18 in the embodiment shown the lead 30 is electrically coupled to the electrode s on the upper surface of the device 18 through bond pads 56 on the upper substrate 12 and also bonded to the lower substrate 14 through electrically isolated bond pads 50 on the lower substrate 14 and the lead 32 is electrically coupled to the electrode s on the lower surface of the device 18 through bond pads 52 on the lower substrate 14 and also bonded to the upper substrate 12 through electrically isolated bond pads 54 on the upper substrate 12 the pads 50 52 54 and 56 can be patterned from the same conductive layers as the areas 36 and 40 on the substrates 12 and 14 the leads 30 and 32 are preferably soldered to their bond pads 50 52 54 and 56 in view of the above construction the component 10 conducts current and uniformly extracts current across its entire face instead of wire bond connection sites and therefore has the ability to carry higher currents with less temperature rise than conventional wire bonded and ribbon bonded devices also by avoiding wire and ribbon bonding techniques the component 10 can be readily adapted to enclose various types and configurations of devices the component 10 also has the advantage of being able to dissipate heat in two directions namely up through the upper substrate 12 and or down through the lower substrate 14 if both substrates 12 and 14 are used to.