cm by 1 22 cm and within the pattern of the preprint the first dielectric layer was dried at 120 u00b0 c for 10 minutes a second dielectric layer was then applied and also dried using the same conditions as shown in fig2 d copper paste ep 320 was printed over the second dielectric layer and within the area of the dielectric to form electrode pattern 230 and dried at 120 u00b0 c for 10 minutes the area of the electrode was 0 9 cm by 0 9 cm the first dielectric layer the second dielectric layer and the copper paste electrode were then co fired at 930 u00b0 c under copper thick film firing conditions the encapsulant composition as described in example 3 was printed through a 180 mesh screen over capacitors to form encapsulant layer 240 using the pattern as shown in fig2 e the encapsulant was dried at 120 u00b0 c for ten minutes a second encapsulant layer was then printed directly over the first layer using the paste prepared in example 3 with a 180 mesh screen the two layer structure was then baked for 10 min at 120 u00b0 c then cured at 1 90 u00b0 c under nitrogen for 30 minutes to yield a consolidated two layer composite encapsulant the foils were then cured in a multi zone belt furnace under nitrogen atmosphere using the following profile the final cured encapsulant thickness was approximately 10 microns a plan view of the structure is shown in fig2 f the component side of the foil was laminated to 1080 bt.