cmc housing through the wire gap are then tied off on an adjacent peg e g one of pegs 206 as discussed below assembly of the cmc involves ablating the wire wrapped on pegs 206 using an incident laser to remove any lacquer or insulation subsequently a solder joint is formed between the wrapped wire and a corresponding solder pad e g solder pad 220 fig2 b illustrates an example of a lower chassis element 202 together with toroids 207 which are separated by separator 224 in the view of fig2 b an exemplary peg geometry is depicted by pegs 206 which are shown without a wire wrap although pegs 206 can be differently shaped depending on implementation in certain aspects the geometry of pegs 206 is asymmetrical yet substantially round in shape asymmetrical peg geometries such as that shown in fig2 b can help improve peg resistance to shear forces experienced by the pegs in during toroid wire tie off in addition to providing a stronger peg foundation asymmetrical peg geometries also provide an improved surface on which toroid wire can be wound and ablated to remove insulation by way of example a preferred peg geometry can include a shape that is larger in the middle or center to improve peg strength additionally in some implementations a top surface of the peg is larger e g of a greater surface area compared to that of the bottom surface an increased surface area on the top side of the peg can increase exposure of the corresponding wire wrap to laser light incident on the top surface e g for removal of lacquer or insulation during the cmc manufacture process in contrast a more narrow shape e g smaller surface area on the bottom side of the peg.