7790511 B2 abstract a system and method of attaching a heat sink to an integrated circuit chip includes providing a compliant material for constraining the heat sink 39 s mechanical motion while simultaneously allowing for thermal expansion of the heat sink application_number US 76123407 A description we describe an attachment method for a heat sink according to an embodiment of the present invention as will be shown the present embodiment changes the mechanical boundary conditions of the heat sink to allow slowly varying relative motion while still providing mechanical support for shock inputs this is accomplished by changing the method of heat sink attachment such that mechanical motion is limited under shock but provides compliance for thermal expansion as such this will reduce the heat sink package mechanical interaction due to the mismatch of the coefficients of thermal expansion cte for those materials a cte mismatch occurs when the heat sink material experiences thermal expansion at a different rate than that of the frame this is one of the main causes of package deformation referring now in specific detail to the drawings and particularly fig3 a there is shown a side view of a chip package assembly 300 with attached heat sink 302 according to an embodiment of the present invention pads 312 and 314 are fabricated from a highly damped elastomeric material such as those commercially.