atmosphere is disclosed the solder paste includes a solder powder and an alcohol binder the reducing atmosphere serves as a flux thereby eliminating flux residues and the problems associated therewith solder splattering is reduced by using a polyhydric alcoholic binder which vaporizes or decomposes before the solder liquifies during heating the use of such a solder paste in a reducing atmosphere results in no hazardous chemical by products and because the solder is handled in the form of a paste is compatible with electrical components requiring precise dimensional tolerances application_number US 34624189 A description according to the invention solder pasts including a solder powder and a binder comprising alcohol will now be described because the solder is in the form of a paste as opposed to a solder preform the tight dimensional tolerances sometimes required for the joining of electrical components are of minimal consequence furthermore such a solder paste may be used in a reducing atmosphere such as hydrogen or carbon monoxide liquid flux and the disadvantages associated therewith i e the costs and complications of removing flux residues are eliminated because the reducing atmosphere acts as a flux in addition the only by products from using the invention in a reducing atmosphere are gases and hydrocarbons which can be readily removed by burning off with excess hydrogen to form carbon dioxide and water vapor many suitable materials exist for both the solder powder and the binder tin bismuth cadmium antimony indium lead silver gold or any similar materials are suitable for inclusion in a solder powder for electrical component applications solder powders are generally a mixture of at.