metal sacrifice layer is deposited on the surface of a substrate a photoresist layer is then defined on the surface of the sacrifice layer afterwards a metal conductive circuit is formed above the metal sacrifice layer by electroforming a first photosensitive polymer layer is coated on the metal conductive circuit after exposing the first photosensitive polymer layer using an appropriate light source and through a mask orifices and through holes are exposed from the lead end of the metal conductive circuit are defined as shown in fig8 a second photosensitive polymer layer 141 is formed on the surface 140 of the defined first photosensitive polymer layer 140 an appropriate mask 200 is used to expose the second photosensitive polymer layer 141 to define the ink chamber and channel structures as shown in fig9 the patterns on the second photosensitive polymer layer 141 and the first photosensitive polymer layer 140 are developed to form the structures of the orifices through holes ink chamber and channel as shown in fig1 the photoresist layer for the metal sacrifice layer 110 and electroforming the metal is removed so that the metal conductive circuit 130 the first photosensitive polymer layer 140 and the second photosensitive polymer layer 141 are all separated from the substrate 100 to form a soft circuit board with orifices ink chambers and channels as shown in fig1 one can also turn the soft circuit board over to form a passivation layer 151 on the surface of the metal conductive circuit 130 before removing the photoresist layer the photoresist is removed when developing the passivation layer 151 the passivation layer 151 is formed on the.