manner while leaving expansion gaps 16 such that it is possible to cover the base body toward the hot side the size of the segments can be adapted on one hand to a desired maximum thermal stress within a segment 12 and on the other hand to the type of connection between the segment 12 and the base body thus for example in the case of an adhesive connection the base surface of the segments 12 should advantageously not be chosen too large in order that it is possible to ensure an even thickness of the adhesive layer on account of the segmentation each segment 12 is exposed in operation to only relatively low thermal gradients in its expansion direction such that the total expansion and thus the resulting thermal stresses within the individual segment 12 can be kept low the segments 12 serve as a thermal barrier and to shield the base body from hot gases for that reason according to the exemplary embodiment shown the segments 12 are advantageously made of ceramics or ceramic systems which are resistant to high temperatures and to thermal shock and which have particularly low thermal conductivity they protect regions situated behind them in particular the base body by means of the added segments 12 the base body is subjected to substantially lower thermal stresses and for this reason can have larger dimensions along the represented outer edges of the heat shield tile 10 than conventional heat shield tiles the base body serves for the mechanical integrity and stability of the heat shield tile 10 in addition on.