uv light curable adhesive between the mounting place and the rear surface of the ic chips the adhesive is cured under a pressure of 3 kg by exposing it to uv light of 365 nm at 150 u00b0 c for 3 minutes the 34 l 34 shaped patterns are provided independently for the respective chips and therefore the connection and the performance of the ic chips can be checked independently if the check indicates some trouble the ic chip is removed and the mounting step is repeated if necessary with a substitute chip after the checking of the electrical performance the curved portions of the patterns are covered with insulating films 10 of 40 to 50 microns thickness as illustrated in fig3 c the insulating films are formed from epoxy resin by screen press printing and thermal annealed at 180 u00b0 c for 30 minutes the check of the ic chip connection and performance may be done at this stage finally the fragmented buslines 7 are coupled by forming parallel electrode 11 in alignment with the buslines 7 over the insulating films 10 the lines 11 are formed of a copper paste by screen press printing and thermal annealed at 180 u00b0 c for 20 minutes the patterns thus completed are covered with a protective film another glass substrate is provided with patterns in the same manner the patterns include y electrodes which form a matrix electrode arrangement with the x electrodes when the two glass substrates are joined with spacers therebetween the.