laser output forms smaller than conventional ir laser link blowing spot diameters because of its shorter wavelength thus permitting the implementation of greater circuit density a passivation layer positioned between the link and the substrate can be formulated to be sufficiently absorptive to uv laser energy and sufficiently thick to attenuate the laser energy to prevent it from damaging the substrate in the laser beam spot area in both the off link and link overlapped portions the uv laser output can be employed to controllably ablate a depthwise portion of the passivation layer underlying the link to facilitate complete removal of the link in addition direct ablation of the passivation layer with the uv laser output facilitates predictable and consistent link severing profiles the absorption characteristics of the passivation material also reduces the risk of damage to neighboring links or other active structures application_number US 9249098 A description the method of the present invention facilitates for link removal the use of shorter wavelengths such as wavelengths in the uv range and thereby permits a reduction in the laser beam spot size wavelengths shorter than or equal to 400 u03bcm facilitate the generation of laser beam spot sizes of less than 0 8 u03bcm the wavelength dependent absorption characteristics of several common link materials are discussed below.