clockwise to accomplish the polishing of the wafers 160 as shown by directional arrow a in fig6 each station 130 140 150 includes a polishing arm 131 141 151 which holds the wafers 160 during the polishing process each polishing arm 131 141 151 includes a u shaped member for holding vacuum chucks 132 142 152 each polishing arm 131 141 151 includes one such vacuum chuck 132 142 152 the vacuum chucks 132 142 152 are coupled to u shaped members through plastic bearings 100 described above the bearings 100 allow the vacuum chucks 132 142 152 to rotate with respect to the respective polishing arms 131 141 151 the vacuum chucks 132 142 512 operate to hold the wafers 160 during the polishing process each of the vacuum chucks 132 142 152 includes an upper end 133 143 153 which may be coupled to a vacuum device not shown to provide a vacuum to the vacuum chucks the polishing apparatus 110 also includes a slurry dispenser 170 which produces slurry which is dispensed onto a top surface 121 of the polishing pad 120 the polishing apparatus 110 described above substantially limits the u201c lock up u201d problems experienced by conventional apparatus e g apparatus 10 shown in fig1 for example the.