larger than the former in order to permit the paste to be fed out of the nozzle as the latter retracts an important aspect of solder paste dispensing is the method used to load solder paste into the dispensing cartridge and nozzle assembly poor dispensing usually results from anomalies such as semirigid paste crust and or voids large volumes of crust or semirigid paste will clog the small openings of the dispensing nozzle moreover voids near the nozzle orifices tend to cause preferential paste flow around such voids resulting in skips i e no deposit similar to physically clogged openings fig4 schematically illustrates a method and an apparatus for loading paste into the dispenser cartridge and nozzle in accordance with an embodiment of the invention solder paste is placed in a supply container 40 where it is warmed by being mixed vigorously without introducing additional air or changing the character of the paste itself heat is applied if necessary to elevate the paste temperature to about 100 u00b0 120 u00b0 f the supply container 40 is coupled to one side of an adaptor plate 41 which in turn is located on top of a dispensing cartridge 42 to be loaded or filled with solder paste a first seal 43 is located around a neck portion 44 of the adaptor plate 41 to prevent leaks between the.