20 is electroplated in accordance with the present invention as follows 1 the rotor 20 is inserted into the shield hollow 18 as shown in fig5 and 10 2 the shield slots 14 are visually aligned with the rotor valleys 24 3 the alignment screws 17 are gently tightened against the bottom of the rotor valleys 24 to temporarily hold the shield 10 in precise alignment with the rotor 20 see fig6 4 the rotor 20 and shield are placed in a suitable support tool fig1 and 12 that firmly holds the rotor and shield in the aligned position 5 the alignment screws 17 are removed exposing additional portions of the rotor valleys 24 through the apertures 16 6 support tool the rotor 20 and the shield are immersed in the electrolyte bath adjacent to the anodes and 7 the rotor 20 is electrically connected as a cathode and plating is begun the shield 10 and shield slots 14 compensate for the variation in distance between the anodes and the rotor crests 22 and rotor valleys 24 with the shield of fig3 it has also been found desirable to double dip the rotor 20 without the shield 10 in order to build up the crests some more as needed to achieve the desired plating thickness however this additional electroplating step may be.