joining first end 54 of fourth sidewall 20 and second end 32 of first sidewall 14 package 10 of the present invention also includes a multiple step transition from the base to the sidewalls that lowers the draw ratio of the packages thereby resulting in a more uniform distribution of the packaging material in essence one embodiment of package 10 combines a chamfer with two fillet radius transitions to transition from bottom 12 of the package to the sidewalls 14 16 18 and 20 similar transition structure is provided in the corners and by reducing the surface area it subsequently reduces the amount the film must stretch in the corners and thereby results in a thicker film this configuration however reduces the total surface area of package 10 when compared to the simple fillet radius transition of the package 400 illustrated in fig8 as shown in fig2 a bottom to sidewall transition 66 a 66 b 66 c and 66 d comprises at least a first section 68 a d a second section 70 a d and a third section 72 a d second sections 70 a d are one of a chord member having a linear profile or an arc.