the pzt slab 8 after the microgrooves 10 are cut in the pzt slab 8 the pzt slab 8 then includes at least one surface having an array of microgrooves 10 the channels of which are exposed piezoelectric material the metallized ridges 22 between the microgrooves 10 remain surface layered with the metallic conductive coating the metallic conductive coating along the metallized ridges 22 serves as an electric circuit to conduct electrical pulse therealong referring now to fig4 a cross section illustrating interconnection of an ink channel 12 and microgrooves 10 of a section 11 of the pzt slab 8 is shown once the microgrooves 10 are formed in the pzt slab 8 wider cuts are made generally diagonally across the width of the pzt slab 8 to form ink channels 12 the ink channels 12 serve as ink feed conduits to the microgrooves 10 the ink channels 12 are preferably cut to approximately the same depth in the surface of the pzt slab 8 as the microgrooves 10 as previously described each ink channel 12 is fed by an ink feed 14 the ink feed 14 serves to flow ink into the ink channel 12 to feed microgrooves 10 of a particular section 11 of the pzt slab 8 after the microgrooves 10 and ink channels 12 are formed in the pzt slab 8 the pzt slab 8 is bonded to the pcb 6 for example by solder or conductive or epoxy adhesive the pzt slab 8 is preferably bonded so that the surface of the pzt slab 8 having the microgrooves 10 therein faces away from the pcb 6 this bonding arrangement allows for formation of nozzles 26 at such surface as hereinafter described so that ink is ejected from select.