includes metallic and nonmetallic areas and to which an upper metallic electroplated layer can be applied upon their completion the layers yield the micromechanical component with layers that adhere to one another or layers which can be partially detached from one another application_number US 26994999 A description fig1 shows the basis for producing a micromechanical component e g a substrate 1 as the carrier layer for additional layers to be applied the substrate can be metal silicon ceramic or glass in the embodiment described below it is made of glass the usual thicknesses of this substrate range from 500 u03bcm to 2 mm and metallic start layers with good adhesion characteristics must be applied in order to use in particular electroplating processes with the application of external current in the beginning substrate 1 is provided in a conventional manner with conductive areas 2 and non conductive areas 3 for this purpose the substrate is coated with a resist such as a polyimide az resist or solid resist by spin coating spraying or lamination the resist is exposed and developed with the desired pattern metal is then electrodeposited in the open regions in the resist conductive areas 2 in the lower electroplated layer are made of a metallic material such as copper or nickel and non conductive areas 3 are made of the resist fig2 shows a cross section of areas 2 and 3 the subsequent production steps are explained on.