an insert part or the guide element 7 is alternatively fixed to the printed circuit board 3 for example by means of adhesive bonding the method according to the invention can be carried out in such a way that firstly the two mold halves 11 12 are closed and then the first and second molding material 21 22 is supplied to the cavity 13 alternatively at the same time as the start of the closing operation of the two mold halves 11 12 the two pistons 18 19 can also be moved and thus a start can be made on supplying the first and second molding material 21 22 to the cavity 13 at the same time as the start of the closing operation of the mold 10 in the case of the latter alternative care merely has to be taken that the molding material already supplied before the complete closure of the mold does not emerge over the boundaries of the cavity an electronic component and a method for the production thereof according to a second exemplary embodiment of the invention will be described below with reference to fig3 to 6 identical or functionally identical parts being designated by the same designations as in the first exemplary embodiment the second exemplary embodiment shows an electronic assembly and a method in which a third molding material 23 is additionally used.