point of substrate 20 and positioned over substrate 20 fig1 pins 32 are then forced into substrate 20 with fingers 48 wrapping around pins 32 as illustrated in fig1 the heat of pins 32 melts substrate 20 which then cools around tape 42 and pins 32 forming an effective mechanical bond also note that this technique could also be done on the other tab 40 b not shown in a similar fashion note that both tabs 40 a 40 b should be in place prior to this insertion still another alternative would be to weld or tack pins 32 to tape 42 52 using a suitable tool the tool presses chip 30 into surface 21 of substrate 20 a high current may be passed through pins 32 using a low voltage pulse therethrough to form the weld a lower voltage pulse is desirable so as to not apply a damaging voltage to chip 30 a modified chip 30 with a single thin foil not shown rather than multiple pins 32 may also be used for this technique this technique may be better suited for chips 30 having an aluminum thin foil rather than a copper thin foil since aluminum has a melting point temperature lower than copper thereby allowing use of a current that is lower in amperes with all of these embodiments a sealing layer not shown may also be placed onto substrate 20 and over chip 30 to hold chip 30 firmly in its desired location this sealing layer may be an epoxy but may instead be a robust plastic such as polyimide mylar or polypropylene these plastics may be attached by adhesives or by thermal welding.