cleaning fluid composition may be in the range 0 001 to 0 30 such as in the range 0 01 to 0 2 and preferably in the range 0 05 to 0 15 such as in the range 0 05 0 1 the first cleaning fluid composition may be applied to the surface of said material by standard methods such as spraying rolling brushing dipping polished or by other conventional application methods once applied to said surface of said material said cleaning fluid may in accordance with preferred of the present invention be polished into the whole surface of said e g by circular motions and may be allowed to dry for a couple of minutes after drying the second cleaning composition is preferably polished away this procedure may be repeated several times preferably until a film spreading effect is observed after the last treatment by said first cleaning fluid composition the surface of said material may preferably be washed by water so as to obtain a clean and more hydrophilic surface of said material a particularly preferred embodiment of the present invention involves polishing said second fluid composition into the surface using a cloth or wipe said wipe may in some applications also constitute the method for applying said first cleaning fluid composition to said surface of said material it.