above with reference to the detailed description of fig1 a base substrate 14 is provided the base substrate 14 is comprised of a group iii v material or sige fig1 shows a modified base substrate 14 a where a portion of the base substrate 14 shown in fig1 has been removed the removal of a portion of the base substrate 14 is done using lithography techniques well known in the art at least one probe pad 16 is deposited on the modified base substrate 14 a fig1 shows for example two probe pads 16 the probe pads are deposited using the same lift off technique used to deposit the at least one first electrode 8 discussed previously the probe pads 16 may be comprised of a gold germanium alloy nickel and gold deposited in that order after the probe pads 16 have been deposited on the modified base substrate 14 a the bottom electrodes 12 of the modified quartz substrate 2 a are bonded to the probe pads 16 along bonding line 17 as shown in fig1 using an au u2014 au compression bonding scheme in the au u2014 au compression bonding scheme the quartz substrate 2 the second electrodes 12 the probe pads 16 and the modified base substrate 14 a are heated to a temperature greater than 300 u00b0.