
{"publication_number": "US-2001000915-A1", "abstract": "a surface mount area - array integrated circuit package is disclosed . the package consists of a package substrate having conductive vias and internal and external conductive traces , a semiconductor die electrically and mechanically connected to the top surface of package substrate , an area - array of conductive surface mount terminations electrically and mechanically connected to the bottom of the package substrate , and at least one adhesive mass . the at least one adhesive mass is located on the bottom of the package substrate and replaces the conductive terminations in the area where the joint strain energy density is calculated to be the greatest . when mounted on a substrate , the at least one adhesive mass adheres the package to the substrate . increased mechanical and electrical reliability is thus achieved .", "application_number": "US-74942200-A", "description": "26 . this invention employs an adhesive mass to mechanically connect a surface mount area - array package and substrate in the locations where the joint strain energy density , if joints were present , would be greatest . joint strain energy density w gi of a concentric ring of surface mount area - array joints is governed by the equation : w gi = k i { dnp i ( \u03b1 s \u2212 \u03b1 pkg ) i \u03b4t i 