carrying out the method application_number US 61273106 A description in a first embodiment example a disk 1 which in this case is a sapphire wafer which is outfitted with components on one side and has a thickness of 90 u03bcm and a diameter of 2 u2033 is separated into individual parts chips e g with an edge length of 280 u03bcm u00d7 280 u03bcm this means that the grid of planned severing lines has two groups of straight severing lines arranged in the trenches as they are called and extending at a distance of only 280 u03bcm relative to one another these groups being arranged so as to be rotated by 90 u00b0 relative to one another before the sapphire wafer 1 is placed on a supporting surface 2 of a workpiece holder 3 it is glued to a stretch foil 4 by its component side the stretch foil 4 serves to hold together the chips that have been singularized after the severing process before they are spatially separated from one another by stretching the stretch foil 4 and subsequently removed after the stretch foil 4 which is glued to the sapphire wafer is placed on the supporting surface 2 of the workpiece.