of the present invention fig9 shows module tim movement u201c pumping u201d comparison graph for pumping during accelerated thermal cycling atc lab power cycling and field use power cycling the graph shows bondline thickness blt cycling vs sealant thickness more specifically this graph shows sealant thickness of 30 microns to 200 microns between 0 and 18 micron blt cycling as shown in this graph stress significantly decreases as a function of sealant thickness more specifically this graph shows that stress on the package e g carrier decreases as the sealant becomes thicker as noted above the sealant thickness can be adjusted by using the seal shim of the present invention fig1 shows stress analysis in the carrier obtained from thermo mechanical analysis of a conventional multi chip electronic package and a multi chip electronic package in accordance with the present invention as shown the stresses imposed on the conventional multi chip electronic package 80 u03bcm tim gap 30 u03bcm sealband are much greater than that imposed on the multi chip electronic package of the present invention 30 u03bcm tim gap 80 u03bcm sealband this is due to the use of the seal shim 20 which decouples the lid 14 from the chip carrier 10 more specifically it is now possible to use a thicker sealant layer between the lid 14 and the chip carrier by using the.