are as follows with the exception of its light emitting portion one part of the periphery of the led lamp 12 is filled with a resin 17 and the exposed surface 17a of this resin 17 is processed to provide an irregular surface as a method for directly processing the surface 17a of the filled member of the resin 17 or the like there is the processing method whereby when for example the filled resin 17 is in a softened state a tape shaped cloth is applied by pressure to the surface 17a of the resin 17 after the resin 17 has hardened the mesh pattern of the cloth is transferred to the resin surface 17a by removing this cloth so that minute irregularities are provided to the surface in the resulting optical semiconductor device 20 the resin 17 having an irregular surface processed by a method of this type can obtain the same type of results as a filled member as in the previously described optical semiconductor device 10 of the first embodiment fig6 is a sectional view of a third embodiment of an optical semiconductor device of the present invention an optical semiconductor device 30 as shown in fig6 which is the third embodiment of the present invention has the following features in contrast with the optical semiconductor device 20 of the above described second embodiment by scattering a black resin 19 formed of minute granules as a second layer onto a surface 18a of a filler resin 18 directly after the resin 18 has been filled in the layer of black resin 19 produces irregularities in the resin surface 18 in this type of embodiment.