201 a wafer 202 disposed on the rotating table 201 a rotation device 203 to drive the rotation table 201 and a nozzle 204 connected to the cleaning solvent or stripper outlets not shown in the figure and has been set at the top of the wafer 202 to spray cleaning solvent or stripper on the surface of the wafer 202 the curved slab portion further includes a holder 301 that is moveable or stationary to support a curved slab 302 and a resistance wall 205 located surrounding the rotation portion and the curved slab portion 10 to resist the spun out cleaning solvent that pollutes the cleaning room during the cleaning process a liquid outlet 206 is used to drain the waste cleaning solvent a simplified top view of the present invention 39 s cleaning apparatus 200 is shown in fig3 wherein only the wafer 202 the nozzle 204 and the curved slab 302 are shown for conciseness in this embodiment the curved slab 302 the nozzle 204 and a rotating wafer 202 deposited on the rotation table 201 are preferably used to remove unwanted fragments generated during the different processes the cleaning nozzle 204 is set on top of the wafer 202 during the cleaning process in accordance with the preferred embodiment the rotation device 203 will rotate the rotation table 12 and wafer 14 when the cleaning process starts next the curved slab 302 is guided over the wafer 202 and the cleaning nozzle 204 may spray cleaning solvent or stripper on the surface of the wafer 202 the nozzle 204 is used to spray deionized di water or chemical solution such as surfactant hot alkaline or acidic hydrogen peroxide h 2 o 2.