or without the use of a catalyst in another embodiment the intermediate is water soluble in one embodiment the curing agent of the invention is prepared in accordance to the following generic reaction scheme in the above reaction scheme it is understood that the water molecule in the u201c intermediate product u201d is part of the 8 member ring by hydrogen bonding in one embodiment the curing compositions of the invention may be included in resin systems used in a wide variety of applications for example in one embodiment the curing compositions of the invention may be included in resin systems used in the manufacture of structural composites for example in the automotive marine and aerospace industries in another embodiment the curing compositions of the invention may be included in resin systems used in the manufacture of electrical laminates such as used in printed circuit boards in another embodiment the curing compositions of the invention may be included in resin systems used in the manufacture of coating compositions in another embodiment the curing compositions of the invention may be included in resin systems used in the manufacture of friction materials in order to provide a better understanding of the present invention including representative advantages thereof the following examples are offered it is understood that the examples are for illustrative purposes and should not be regarded.