isolation sleeve could be filled with thermally conductive and or electrically insulating potting compound completely encasing the main circuit board assembly in another embodiment conformal coating could be applied to the main circuit board prior to final assembly referring to fig9 further details of the heatsink collar 909 the double sided thermal adhesive tape 908 or any alternate bonding material and the led mcpcb 907 assembly are shown heatsink collar 909 is shown with vent holes 909 b which allows enhanced heat circulation from the main printed circuit board assembly not shown to the chamber enclosed by the glass bulb not shown angled shoulders 909 d on the top of the heatsink collar 909 provide an exact thermal and mechanical interference fit to the corresponding shape of the double sided thermal adhesive tape 908 and the underside of the petals 907 d of the led mcpcb 907 to maximize mechanical rigidity and heat transfer the bend angle of the petals 907 d on the led mcpcb 907 and the corresponding slope of the angled shoulders 909 d of the heatsink color 909 are chosen to optimize the radiated light performance of the 4 in this example smt leds 906 which are soldered onto their corresponding pads 907 g on led mcpcb 907 slot 908 a in the thermal adhesive tape 908 and slot 907 a in the led mcpcb 907 allow the tab on the main circuit board assembly not shown to pass through such that electrical connections can be made between it and the led mcpcb 907 and the antenna not shown board to board connectors 904 connect the led electrical drive from.