sheet 110 slides across the subpad between or during polishes with some of the polishing sheets described herein a number of wafers and each wafer will be polished by a portion of the polishing sheet that has not previously been used to polish another pad alternatively the polishing sheet can be moved incrementally rather than a full length between each substrate polish pad wear will not be a factor in polishing subsequent wafers because each wafer is exposed to substantially the same polishing pad conditions a steady state for the pad surface will result once the sheet has been incremented the distance equal to the diameter of the polishing area grooves in the top surface of the polishing sheet that are perpendicular to the direction of travel of the polishing sheet can aid the polishing sheet in bending when the sheet is rolled or stretches across the small radius of the feed roller 130 before reaching the wafer if a system has grooves in a subpad the subpad can form temporary grooves in the polishing surface aiding in slurry transport and flow across the surface of the pad the temporary grooves can be more pronounced when a vacuum is applied to the subpad alternatively or in addition the polishing surface of.