frequency tag 300 that comprises a substrate 141 a semiconductor circuit 311 a first connection 321 a second connection 322 third connection 323 a fourth connection 324 a first wire 331 bound 321a to the first connection 221 step 1120 and a second wire 332 bound 322a to the second connection 322 step 1120 and a third wire 333 bound 323a to the third connection 323 step 1120 and a fourth wire 334 bound 324a to the fourth connection 324 step 1120 these components are covered by an organic cover 151 that serves as environmental protection for the wires 331 334 and bonds 321a 324a and circuit 311 step 1150 in the preferred embodiment the bonds are wire bonds 321a 324a step 1120 or their equivalents as described above in fig3 the pairs of wires 331 333 and 332 334 are arranged in a different non parallel direction from each other preferably perpendicular so as to maximize the reception and transmission of radio frequency energy in directions perpendicular to each other this eliminates nulls in the reception transmission pattern fig4 is a drawing of a novel radio frequency tag 400 that comprises a substrate 141 a semiconductor circuit 411 a first connection 421 a second connection 422 a wire 431 bound to the first connection 421 by a bond 421 a at one end of the wire and the same wire 431 bound to the second connection 422 by a bond 422a at the other end of the wire 431 these components are covered by an organic cover 151 that serves as.