heating assembly 2 in this embodiment heating assembly 2 is integrated with the stationary post 20 that forms the dispensing assembly of this embodiment as shown in greater detail in fig2 the dispensing assembly comprises a non rotating stationary post 20 whose nozzle 25 penetrate the cover of the heating assembly fig2 also shows that the heating assembly 2 is mounted in a cantilever fashion such that it is spaced from both the overlying wafer w as well as from the rotating upper surface of chuck 1 spin chuck 1 is mounted to the rotor of a hollow shaft motor 42 schematically shown in fig2 and the stationary post 20 penetrates through a central opening of the spin chuck 1 the stator of the hollow shaft motor 42 is mounted to a mounting plate which is in turn mounted to a stationary frame 44 of the apparatus to which the stationary post 20 is also mounted an upper liquid dispenser 30 supplies treatment liquid from above and can incorporate a plurality of different liquid dispensing nozzles for dispensing a variety of different treatment liquids as described for example in commonly owned u s pat no 7 891 314 corresponding to wo 2006 008236 upper liquid dispenser 30 is preferably displaceable radially of the wafer w to aid in spreading treatment liquid over the entire upwardly facing surface of wafer w as it is rotated on the spin chuck the housing of heating assembly 2 is covered by a plate 21 of material that has high transparency i e high transmission to the radiation generated by the led elements 23 preferably plate 21 is formed from quartz glass plate 18 preferably forms a liquid tight seal with the housing of heating assembly 2 to exclude process liquids such as hot isopropyl.