layer of contact metal such as gold is then applied to a selected area of the contact region this plating is performed at a second station 107 web 102 is then fed to a third station 108 where an adhesive carrying tape 109 is applied in continuous fashion to the plated contact area adhesive carrying tape 109 protects the plated contact area and also interconnects and supports finger contacts 101 during subsequent handling after web 102 leaves tape application station 108 it passes through a fourth station 110 at which a coat of adhesive 301 as shown in fig3 is applied to finger contacts 101 on a side opposite that on which tape 109 is applied adhesive 301 is used to bond finger contacts 101 to the circuit board not shown following application of adhesive 301 web 102 passes through a fifth station 111 where a solder paste 303 is applied to web 102 for connector strips which are to be used in a reflow solder application following application of solder paste 303 web 102 is heated and dried at a sixth station 112 this heating step drives off any volatile materials associated with adhesive 301 and solder paste 303 a free length of web 102 which may or may not have forced air directed at it at station 113 is.