an initial curing is avoided and the roll application of thermally curable powdery solder stop lacquers is enabled after adjusting the thickness of the layer by means of the metering rolls 5 and 9 the absence of lacquer on the edges is achieved by a film having a thickness of about 30 150 u03bcm which is stuck onto the fixed metering roll 9 the coating area being left free subsequently this lacquer is transferred to the smooth rz 5 10 u03bcm and supple 20 to 40 shore a rubber surface of the applicator roll 4 by the metering roll 5 running in opposite direction and applied with a viscosity of preferably 5000 to 15000 mpas and with a speed of 1 to 4 m min in a thickness of the layer of 20 to 70 u03bcm onto the bottom side of the printed circuit board 1 in case of using a thermally curable powdery solder stop lacquer for the coating each roll and the printed circuit board to be coated is heated to a temperature with which the required viscosity of the coating is achieved the present invention is explained in more detail by the following examples printed circuit board 300 u00d7 420 u00d7 1 5 mm type fr 4 according to nema height of the conductor max 100 u03bcm width of the conductor 150 u03bcm solder stop lacquer probimer 65 fa vantico ag 100 parts by.