ratio between linearly structured polymer 130 and crosslinker 140 in the mixture may be within the range of approximately 30 1 to approximately 1 30 curing of the mixture results in a polymer blend system lti 150 as illustrated in fig6 as illustrated lti 150 includes a linearly structured polymer doped with crossed linked networks alkyl groups employed may be methyl ethyl phenyl or aryl groups in one embodiment curing may occur at a temperature between approximately 80 u00b0 c and approximately 165 u00b0 c in another embodiment curing may occur at a temperature of approximately 125 u00b0 c fig7 shows a schematic of strands of lti 150 which illustrates that the polymer exhibits reduced liquid polymer macromolecule mobility thus improved surface tension compared to linearly structured polymer 130 fig2 as a result polymer 150 can be used as an lti the methods and structures as described above are used in the fabrication of integrated circuit chips the resulting integrated circuit chips can be distributed by the fabricator in raw wafer form that is as a single wafer that has multiple unpackaged chips as a bare die or in a packaged form in the latter case the chip is mounted in a single chip package such as a plastic carrier with leads that are affixed.