device is transmitted through the thin metallic ground plane 40 and into the substrate from where it is quickly and efficiently dissipated into the environment in accordance with the embodiments described above an improved communication device such as a phased array antenna may be manufactured to exhibit improved efficiency and cooling for instance as shown in fig3 the embodiments disclosed herein may be used to create advanced phased array systems the antenna array forms the foundation upon which the front end rf components and signal processing electronics are registered and assembled an aperture coupled antenna fed in accordance with the principles disclosed herein enables the input and output antenna elements 50 to be fully integrated with the front end mmic components in a way that achieves high rf efficiency and excellent thermal management of the mmic components while retaining the advantages of the large scale self assembly this approach achieves these goals by electromagnetically coupling the mmic component directly to a patch antenna radiator 55 through an aperture in the mmic ground as illustrated by the double arrow 100 in fig3 in an embodiment a template transfer method may be used to enable mass integration of precisely registered arrays of high performance front end rf components with such an antenna array in this approach high performance components including inp mmics based on high electron mobility transistors hemts suitable for low noise amplifiers and heterojunction bipolar transistors hbts suitable for high power amplifiers and sources may be directly.