or temporary electronic storage medium including for example a dram sram sgram disk tape memory card memory module or programmable logic array as shown in still another embodiment of this invention in fig1 a and 12b a method for testing any one of the above described inventive ic dice or modules includes the steps of 160 providing a test mode initiate signal to an externally accessible terminal of an ic module 162 conducting the test mode initiate signal exclusively to bond pads on dice in the ic module adapted to receive the signal to initiate a test mode in the dice 164 testing each of the dice in the test mode by providing test signals to each die through the externally accessible terminals of the ic module 166 receiving response signals from each die through the terminals of the ic module in response to the test signals 168 evaluating the response signals from each die to identify any failing elements in the dice of the ic module 170 providing repair control signals to a redundant circuit in each die to direct each die to replace any identified failing elements with redundant elements 172 re testing each die by providing re test signals to each die through the ic module 39 s externally accessible terminals 174 receiving response signals from each die through the ic module 39 s terminals in response to the re test signals and 176 evaluating the response signals from each die to confirm the repair of any failing elements therein as shown.