polymerization and provides the cured shaped article it may be desirable to add solvent to solubilize components and aid in processing solvent preferably organic solvent in an amount up to 99 weight percent but preferably in the range of 0 to 90 weight percent most preferably in the range of 0 to 75 weight percent of the polymerizable composition can be used representative solvents include acetone methyl ethyl ketone tetrahydrofuran cyclopentanone methyl cellosolve acetate methylene chloride nitromethane methyl formate acetonitrile gamma butyrolactone and 1 2 dimethoxyethane glyme in some applications it may be advantageous to sorb the curing agent onto an inert support such as silica alumina clays etc as described in u s pat no 4 677 137 in general thermally induced polymerization of cyanate monomers with organometallic compounds may be carried out at 80 u00b0 to 250 u00b0 c preferably 80 u00b0 to 150 u00b0 c in general radiation induced polymerization of cyanate monomers with latent curing agents comprising an organometallic compound can be carried out at 25 u00b0 to 300 u00b0 c preferably at 80 u00b0 to 125 u00b0 c for the majority of energy curable compositions although low temperature e g 25 u00b0 to 80 u00b0 c or elevated temperature e g 125 u00b0 to 300 u00b0 c preferably 125 u00b0 to 200 u00b0 c can be used to subdue the exotherm of polymerization or to accelerate the polymerization respectively temperature of polymerization and amount of curing agent catalyst will vary and be dependent on the particular curable composition used and the desired application of.