molding a conductive compound bs is injection molded around the insulation body as for example in the two component injection molding procedure debinding and presintering is performed under an inert gas at a pressure of 1 bar and a temperature of up to 900 u00b0 c a primary sintering process follows the forming process after debinding and presintering primary sintering occurs under a defined n 2 partial pressure with the n 2 partial pressure being not higher than 10 bar and the total sintering pressure being elevated through addition of an inert gas such as for example ar to values up to 100 bar the sintering gas being at a temperature between 1000 u00b0 c and the sintering temperature which is no higher than 1900 u00b0 c alternatively primary sintering is performed under a defined n 2 partial pressure with the n 2 partial pressure varied with the temperature so that the partial pressure is within a range which is bounded by the following relationships and the total sintering pressure being elevated through addition of an inert gas such as for example ar to values up to 100 bar where t is the sintering temperature in u00b0 c and p n 2 is the partial pressure of n 2 in bar the sintering temperature is no higher than 1900 u00b0 c the electrical contact surfaces may also be provided with a thin metal coating such as one based on ni or the like in an exemplary embodiment of the present invention a composite powder a of 54 wt si 3 n 4 2 58 wt al 2 o 3 3 42 wt.