the wafer holder 220 has a central hole 222 through which a laser beam is irradiated on the camera screen 290 from a laser 130 to measure a marking position by the camera screen 290 the camera screen 290 is positioned at the front of the camera 140 by actuating the motor 292 next an x y stage 150 is actuated to move the camera 140 and the camera screen 290 to a predetermined position and then a laser beam is irradiated onto the camera screen 290 then the irradiated beam point is measured by the camera 140 and the position information of the beam point is input to a controller 170 fig8 is a partially cutaway perspective view of another embodiment of a screen according to the present invention here the screen is made by attaching a semi translucent layer 284 to a round frame 282 the semi translucent layer 284 may be formed of tracing paper for example such a semi translucent layer 284 indicates a point where the laser beam is irradiated as described above in a method and apparatus for calibrating a marking position in a chip scale marker according to the present invention a marking position is measured and the direction of a laser beam is calibrated before marking characters and or numbers on a wafer during a marking process the position of a laser beam can be easily adjusted by irradiating the laser beam on a semi translucent layer formed at the edge of a wafer holder measuring the irradiated laser beam point and calibrating a marking position further since the calibration of a marking position is performed directly on a beam point irradiated on a screen the marking position can be precisely calibrated thereby performing a marking process at the desired position.