the inquiry side surface of the edge extended wafer translator thereby creating a u201c well u201d with the central portion at the bottom and the edge extended portion at the top inquiry system interface refers to apparatus disposed between the inquiry side of a translator and an inquiry system inquiry system interfaces provide at least electrical pathways coupled between the inquiry side of a translator and an inquiry system inquiry system interfaces may incorporate a variety of passive and or active electrical components as well as a variety of mechanical devices for attaching coupling connecting or communicating to the inquiry side of a translator and or the inquiry system e g a tester various implementations of inquiry system interfaces may be as simple as a circuit board that passes signals from one surface to the other or may be complex apparatus including active electronics and mechanical devices suitable for placing orienting and or aligning the inquiry system interface the expression u201c translated wafer u201d refers to a wafer wafer translator pair in the attached state wherein a predetermined portion of or all of the contact pads of the integrated circuits on the wafer are in electrical contact with corresponding electrical connection means disposed on the wafer side of the translator typically the wafer translator is removably attached to the wafer removable attachment may be achieved for example by means of vacuum or pressure differential attachment the terms die chip integrated circuit semiconductor device and microelectronic device are sometimes used interchangeably in this field the present invention relates to the manufacture and test of chips integrated circuits semiconductor devices and.