removal of the stamped grid that is the separation of the individual leadframes 10 from one another may be also effected before the separation of each leadframe 10 into individual conductors 15 as a subsequent process step the terminal tabs 11 are bent upwardly perpendicularly to the carrier 18 thereafter the individual conductors 15 are in a subsequent processing station provided with the components 22 before such step however the terminal contacts of the components 22 are provided with a soldering paste the connection of the conductors 15 with the components 22 is effected in case of a multipanel carrier 18 for example in such a manner that the individual conductors 15 present for the multipanel carrier 18 are provided in one process step with the components 22 thereafter the conductors 15 mounted on the carrier plate 18 and associated with the components 22 are advanced to a soldering device in which the components 22 are soldered to the conductors 15 for example in a reflow soldering process subsequently the separation of the multipanel carriers 18 occurs so that eventually there is provided a single device mounted on the carrier 18 and having conductors 15 with components 22 electrically connected thereto the device obtained in accordance with the above described process is utilized for contacting electric devices for this purpose the carrier 18 is mounted on the electric device and the conductor terminals of the device are connected with the terminal tabs 11 of the conductors 15 after mounting the electric device the carrier 18 is provided with a non illustrated cover so that the conductors 15 and the components 22 including the plugs 12 are surrounded by a housing it will be understood that the above description of the present invention is susceptible to various modifications.