one type such as a memory chip cannot become joined to chips of the same type because the pattern of keys 18 is designed to interfere with the upper surface features 16 this prevents plugging of two chips 12 of the same type into one another in one embodiment the fluidic self assembly may take place in a heated fluid the temperature of the fluid may be higher than the melting point of surface mount techniques on either or both of the chips 12 and 14 as a result the surface mount material such as solder may help to join the chip 12 to the chip 14 for example using a high temperature flux as the immersion fluid the solder connection between the chips 12 and 14 may be facilitated in addition the heat of the immersion fluid may further heat the surface mount connection to form a molten material that enables a solder connection to be formed between the chips 12 and 14 using surface mount technology in one embodiment the chips 12 and 14 may fit snugly together in this intermeshing fashion in such an embodiment intervening fluid may be displaced from between the chips 12 and 14 resulting in the reduction of possible shorts from the fluid and ensuring a better electrical connection between the two chips 12 and 14 referring to fig3 in accordance with another embodiment of the present invention a wafer 14 a may be a plurality of unsingulated elements destined to.