contacting the flexible substrate with to the adhesive coated carrier the specific softening temperature for use in the present invention can be determined empirically based on the teachings herein and depends upon the specific material used in adhesive layer for example t g can be determined using techniques such as but not limited to thermogravimetric analysis tga thermomechanical analysis tma differential scanning calorimetry dsc and or dynamic mechanical analysis dma in one embodiment the flexible substrate comprises stainless steel the rigid support comprises alumina and the adhesive layer comprises n butylacrylate in another embodiment the flexible substrate comprises stainless steel the rigid support comprises alumina and the adhesive layer comprises polysiloxane in another embodiment the flexible substrate comprises stainless steel the rigid support comprises alumina and the adhesive layer comprises polysilicone in another embodiment the flexible substrate comprises stainless steel the rigid support comprises alumina and the adhesive layer comprises polyimide in further embodiments the adhesive layer may comprise more than one constituent layer for example the adhesive layer can comprise a first layer comprising a viscoelastic polymer and a second layer formed over the viscoelastic polymer for example the second layer can comprise a metal or insulating material layer preferred metals include but are not limited to metals which can be deposited by sputtering for example aluminum gold and silver preferred insulating layers include those which can be deposited by plasma enhanced chemical vapor deposition pecvd such as sin and sio 2 such metal films typically can have a thickness ranging from about 50 u00e5 to about 10 000 u00e5 in certain embodiments the thickness can.