the second component 610 is bonded to the first microstructure 604 after all subsequent operations including the optional placement of other components on the microstructure 604 the microstructure 604 is released by selective removal or etch of the sacrificial material 606 the result is a freestanding microstructure 612 containing components that are bonded to it which would normally not be possible to bond to a micromachined device referring to fig7 a manufacturing process depicted as using several layers of laminating materials to form a hollow mold cavity that can be used for injecting a second material thus forming a 3 d device the process includes preparing layers of laminate sheets 702 are prepared on a carrier material 704 openings are cut into the laminate sheets 702 either prior to lamination or after lamination sheets 702 are laminated together to produce a layered structure openings 706 in sheets 702 overlap to form a cavity material 708 is formed in the cavity by flowing material electroplating or other means portions of the laminate adjacent to the cavities are etched away to reveal a freestanding part 710 some laminate layers 702 may be made of different materials that are not etched away at the end of the process or may leave parts embedded within the freestanding part some laminate layers 702 may consist of multiple.