high regardless of the relatively low melting point each printhead module 11 includes an upper micro molding 28 and a lower micro molding 34 separated by a mid package film layer 35 shown in fig3 the mid package film layer 35 can be an inert polymer such as polyimide which has good chemical resistance and dimensional stability the mid package film layer 35 can have laser ablated holes 65 and can comprise a double sided adhesive ie an adhesive layer on both faces providing adhesion between the upper micro molding the mid package film layer and the lower micro molding the upper micro molding 28 has a pair of alignment pins 29 passing through corresponding apertures in the mid package film layer 35 to be received within corresponding recesses 66 in the lower micro molding 34 this serves to align the components when they are bonded together once bonded together the upper and lower micro moldings form a tortuous ink and air path in the complete u201c memjet u201d printhead module 11 there are annular ink inlets 32 in the underside of the lower micro molding 34 in a preferred embodiment there are six such inlets 32 for various inks black yellow magenta cyan fixitive and infrared there is also provided an air inlet slot 67 the air inlet slot 67 extends across the lower micro molding 34 to a secondary inlet which expels air through an exhaust hole 33 through an aligned hole 68 in.