are still well attached to the substrate 1 but that the pins 5 b are attached to a conductor 5 a but that the other end is no longer attached to the insulator 1 and in this example overhang the edge of the circuit board these pins can be formed for instance into the shape commonly known as a u201c gull wing u201d pin and this is shown in fig6 such a board is ready to have components placed on it and soldered in situ the whole module is then soldered to the motherboard there are a number of variations of this process which do not affect the validity of the invention but which may enhance the functionality of its use for instance the circuit board could be double sided with or without through connections in such a case holes would be drilled either prior to the processing described here or just after the fabrication of regions 2 a and 2 b in this latter case the holes would also need treating to ensure that the conductive layer that is well adhered to the insulator also extends down the holes the circuit board could be a multilayer board where the inner layers have been formed previously and bonded together the processing described here would then be applied to the outer layers of the board although the process has been described as releasing the conductor 5 b from layer 2 b after removing the mask 4 it is also valid to release the conductor 5 b from layer 2 b at the same time as removing layer 4 the release of conductor 5 b from the insulator in the region 2 b may be carried out.