back to back schottky diodes are also connected between circuit the logic ground is tied to the device substrate each of the other grounds i e btl gnds bg0 bg1 bg8 and quiet ground qend is internally connected to logic ground through a back to back schottky pair that is as shown in fig3 schottky pair d150 d151 is connected between quiet ground qvss and logic ground schottky pair d111 d112 is connected between logic ground and ground b0 gnd schottky pair d113 d114 is connected between is connected between logic ground and ground b1 gnd and schottky pair d115 d116 is connected between logic ground b8 gnd similarly supply vcc is connected to supply qvcc by schottky pair d11 d12 using the dissipation circuitry 10 in conjuction with the fig1 circuit in a first example of providing a dissipation path in accordance with the present invention with any combination of inputs a n tied to ground and one of the inputs a 1 for example judner test a high stress esd voltage appearing on input a 1 will follow an energy dissipation path through diode d177 in fig1 to supply vcc this causes the resistor divider r14 r15 in the dissipation circuit 10 fig2 to provide sufficient drive to turn npn transistor p16 on thus clamping input line a 1 at 10v that is as shown in fig3 with input a 1 grounded an over stress voltage applied to input a n will be clamped to again using the circuitry 10 in conjuction with the fig1 circuit in a second example the fig1 circuit shows multiple output ground paths as shown.