on the profiling blade 30 by simply dipping it into a reservoir of uncured encapsulant epoxy of course the bead 40 may also be formed by any other convenient method such as running the discharge needle along one end of the blade 30 fig6 b show the blade 30 having been lowered to touch the bead 40 onto the die 4 when the encapsulant material touches the die surface it wets and wicks along the surface while remaining pinned to the edge of the blade the blade 30 is held at a predetermined height above the die 4 and moved over the bead 2 to flatten and lower its profile the encapsulant displaced from the top of the bead 2 by the blade 30 spreads over the pcb side of the bead 2 it is not relevant if the encapsulant spreads further over the pcb than necessary as long as the wire bonds 16 and the bonds pads 12 are covered any additional encapsulant on the pcb 8 surface is not detrimental in fig6 c the wire bond 16 height has been reduced by collapsing the arc in accordance with the techniques discussed above as previously discussed the bead 2 deposited.