beneath the metallic coating 211 a second circuit line 220 is coupled to the bottom surface 206 of the substrate 204 and is conductively coupled to the first circuit line 210 the second circuit line 220 has a thickness t 6 which may be any thickness in a range of about 3 microns to about 50 microns other than t 5 while t 6 is shown in fig1 as exceeding t 5 t 6 may nevertheless be less than t 5 a third circuit line 230 of thickness t 7 where t 7 u2260 t 6 and t 7 gt t 5 is coupled to the bottom surface 206 of the substrate 204 and is conductively coupled to the second circuit line 220 the third circuit line 230 includes a pad 232 which is coupled to a solder ball 250 wherein the pad 232 includes the volumetric portion of the third circuit line 230 that interfaces with the solder ball 250 if the solder ball 250 is a bga solder ball connected to an electronic device 260 such as an electronic carrier e g circuit card where the bga solder ball has a diameter in a range of about 25 mils to about 30 mils then t 7 should be in the range of about 17 microns to about 50 microns if the solder ball 250 is a small solder.