de lamination of the epoxy between the chip and heat spreader would cause a critical reduction in heat transfer from the chip resulting in an extreme increase in chip temperature and failure fig3 shows a cpga ceramic pin grid array module 200 the front side bottom of a semiconductor flip chip die 202 is attached to a rectangular ceramic chip carrier 204 single or multi layer as shown by a perimeter row or area array of joints 206 alternatively substrate 204 may be organic or metal coated with organic a matrix of pins 208 are wave soldered 210 to copper pads 212 on both end of pths plated through holes extending through substrate 214 e g fiberglass epoxy or flexible laminate of copper polyimide films joints 206 are encapsulated with epoxy 220 and heat spreader 224 is attached to the back side of chip 202 using adhesive 226 of flexible epoxy or more preferably silicone fig4 shows a bga ball grid array module 240 which is similar to the cpga of fig3 substrate 242 may be ceramic cbga or plastic pbga and may be single layer or multi layer as shown again adhesive 244 of flexible epoxy or more preferably silicone is used to attach heat sink 246 to flip chip 248 in this case the heat sink is only slightly larger than the chip and the attach adhesive does not extend significantly between the heat sink and the conformal coating fig5 shows a tape ball grid array tbga module 250 the bottom front side of flip chip 252 is attached to copper pads 254 of a flexible chip carrier substrate 256 the substrate is a laminate of one or more patterned copper films and polyimide films the copper may be dry deposited.