is a plan view illustrating an external structural arrangement of a cathode part of the magnetron sputtering apparatus as shown in fig1 a sputtering apparatus 1 of the present embodiment has a vacuum chamber 2 connected to a vacuum evacuating system not shown schematically the vacuum chamber 2 is at ground potential inside the vacuum chamber 2 a flat plate shaped substrate object to be film formed 3 is held by a substrate holder 4 in such a manner that the substrate 3 faces a cathode part 6 via a mask 5 the cathode part 6 has a backing plate holding mechanism 8 for holding a target 7 whereby the target 7 faces the substrate in parallel the backing plate 8 is connected to a direct current power source 30 in the region around the target 7 for example an inner shield member 9 made of a ring shaped metal is arranged in the region around the backing plate 8 for example an outer shield member 10 made of a ring shaped metal is provided the inner shield member 9 is in a floating potential state on the other hand the outer shield member 10 is insulated from the inner shield member 9 and is at ground potential as shown in fig2 on the backside of the backing plate 8 a plurality of magnets 12 five in the present embodiment made of permanent magnets held by a holding part 11 is provided in the present embodiment a rod shaped magnet is used for each of magnets 12 a to 12 e and magnets are arranged in parallel with one another at a predetermined interval the size and position of each of the magnets 12 a to 12.