fig3 may comprise any suitable material such as oxides nitrides and metals light transmissive materials are more preferable and materials such as metals are less preferable the bumps 30 may be formed by methods such as depositing the material and etching the triangular shape over the microlens 10 u2032 forming the bumps 30 by etching provides accurate control in shaping the bumps however other methods are also possible the bumps 30 may also be formed by depositing a photoresist over the material and etching by photolithography if formed by photolithography the bumps 30 would have a parallel orientation relative to each other as represented by bumps 40 in fig4 described below the bumps 30 may also be formed by preparing the microlens 10 u2032 surface with a plasma vapor deposition process spin developing or spin wetting to deposit the material and growing the bumps 30 the bumps 30 may also be formed by forming studs in the microlens 10 u2032 and etching away the surface of the microlens to expose the bumps 30 fig4 illustrates a cross section of microlens 10 u2033 in another exemplary embodiment of the invention in this embodiment the microlens 10 u2033 features bumps 40 having a rectangular shape and are arranged in an approximately parallel configuration bumps 40 preferably have a height h 3 equal to or greater than a wavelength of light the wavelength of light is in the range of approximately 400 nm to approximately 700 nm the bumps 40 preferably have a width w 3 along the x and z axes as with bumps 20 of fig2 c width w 3 is much less than a subwavelength of light preferably in the range of approximately.