of an integrated circuit fabrication technique silicon dioxide is widely used in such techniques as is known silicon dioxide is simply an extremely pure glass it follows that in this application the sidewalls 12 14 can be in the form of glass or a glass like material furthermore most inks are substantially water based it follows that interaction between the sidewalls 12 14 and the liquid 16 can be similar to an interaction between glass and water thus in the structure 10 since the liquid 16 is water like and the sidewalls 12 14 are of a glass like material capillarity will manifest itself between the sidewalls 12 14 and could draw the liquid 16 out between the sidewalls 12 14 so that leakage occurs between the sidewalls 12 14 this is especially so when the sidewall 12 is displaced relative to the sidewall 14 in fig2 reference numeral 32 generally indicates a sealing structure of a liquid displacement assembly in accordance with the invention that is suitable under predetermined conditions for setting up an effective fluidic seal to inhibit such leaking with reference to fig1 like reference numerals refer to like parts unless otherwise specified the structure 32 has a complementary sidewall 34 a sealing formation 36 is positioned on the.