embodiment of the present disclosure the interior elevational view of the second chamber 80 includes a first input output device 82 a second input output device 84 a third input output device 86 a second chamber side panel 88 a first rear fan 90 a second rear fan 92 and a third rear fan 94 fig7 illustrates the air flow of the first chamber of the separation mechanism of fig4 in accordance with the first embodiment of the present disclosure similar elements of fig5 are omitted with reference to fig7 fig7 illustrates the air flow through the case 40 in chamber 42 specifically 4 air flows are mentioned an inlet air flow 53 a motherboard air flow 55 a cpu air flow 77 and an outlet air flow 59 the inlet air flow 53 moves through the upper front fan 56 and lower front fan 58 through the motherboard 72 as motherboard air flow 55 through the cpu 70 as cpu air flow 57 and out the first rear fan 66 and the second rear fan 68 as outlet air flow 59 therefore the cool air passes through and around the interior components of the first chamber 50 fig8 illustrates the air flow of the second chamber of the separation mechanism of fig4 in accordance with the first embodiment of the present disclosure similar elements of fig6 are omitted with reference to fig8 fig8 illustrates the air flow through the case 40 in chamber 44 specifically 2 air flows are mentioned an inlet air flow 83 and an outlet air flow 85 the inlet air flow 83 moves through the first input output device.