on the side of the carrier block c 1 in the unit shelf u 6 there are stacked transfer modules trs and cpl a buffer module bu and a wafer transfer part 14 provided to transfer a wafer w to and from a shuttle 13 described below the transfer module trs includes a stage for placing a wafer w thereon and the transfer module cpl includes a stage for placing a wafer w thereon and a temperature adjusting means for adjusting the temperature of the wafer w placed on the stage the buffer module bu can accommodate therein a plurality of wafer w at vertical intervals disposed near the unit shelf u 6 is a wafer transfer unit d 1 having an arm that moves vertically to transfer a wafer w between modules included in the unit shelf u 6 the unit shelf u 7 is disposed in the processing block c 2 on the side of the interface block c 3 in the unit shelf u 7 there are stacked a transfer module cpl a hydrophobing module adh and a wafer transfer part 15 provided to transfer a wafer w from the shuttle 13 to the interface block c 3 disposed near the unit shelf u 7 is a wafer transfer unit d 2 having an arm that moves vertically to transfer a wafer w between the modules included in the unit shelf u 7 the shuttle 13 is disposed on an upper part in the dev layer b 1 the shuttle 13 transfers a wafer w directly from the transfer part 14 of the unit shelf u 6 to the transfer part 15 of the unit shelf u 7 although many transfer modules trs and cpl and the buffer modules bu are disposed.