amide compound produced as a by product has a relatively high boiling point to be hardly removed by dissipation so that the room temperature curable composition formulated with the alkoxy terminated diorganopolysiloxane synthesized by the route using an amido group containing organosilane cannot be used as a material in electronics due to the corrosiveness of the amide compound when an oxime group containing organosilane is used to react with the silanol terminated diorganopolysiloxane on the other hand the reaction can readily proceed even in the absence of any catalyst and the resultant alkoxy terminated diorganopolysiloxane is stable under atmospheric air even not in a hermetically sealed condition in addition to the advantage of the absence of any corrosive compound formed as a by product in the general formula i representing the silanolterminated diorganopolysiloxane as the starting material in the inventive method each of the groups denoted by the symbol r 1 is a substituted or unsubstituted monovalent hydrocarbon group selected from the class consisting of methyl vinyl phenyl and 3 3 3 trifluoropropyl groups and the subscript n is a positive integer in the range from 20 to 1000 the diorganopolysiloxane should preferably have a viscosity in the range from 100 to 1 000 000 centistokes at 25 u00b0 c in the step a of the inventive method the above mentioned silanol terminated diorganopolysiloxane is reacted with the organosilane compound represented by the general formula ii in which r 3 is a substituted or unsubstituted monovalent hydrocarbon group selected from the class consisting of methyl ethyl propyl vinyl phenyl and 3 3 3 trifluoropropyl groups the symbol x denotes a divalent group of the formula u2550 cr 4 2 or str2 in which r 4 and r 5 are.