in a probe shank 14 overhanging the edge of the wafter die 24 fig3 g the structure and operation of some embodiments of the invention can be characterized as follows a 1 d array b 2 d array c multiple probes at arbitrary locations in a 2 d plane an array which is electrically insulated by a polymer coating on the scanning tips this probe array requires no z axis actuation prior art requires an external actuator to move the probe array or sample or requires an embedded actuator to act on the probes individually or as a group the probe tips connect to the substrate through a pliable mechanism that permits the probe tips to deflect in a manner such as to follow the sample topography without causing damage to the sample each probe tip connects to the substrate through a separate pliable mechanism that permits each probe tip to deflect individually without affecting the other probe tips the probe tips connect to the substrate through a pliable mechanism with a large many micrometers deflection range each probe tip connects to the substrate through a separate pliable mechanism with a low thermal conductance to minimize the thermal cross talk between probe tips in a preferred implementation each probe shares a common electrical ground to minimize pin count probes with a varying probe tip height may be co fabricated on the same array probes with a varying spring constant may be.