n u2032 n u2032 tetraglycidal 4 4 u2032 methylenebisbenzenamine ciba geigy my720 this tetra functional resin has a higher reactivity than one based on bisphenol a a mixture of my720 with mthpa at 90 of the stoichiometric ratio was prepared with stannous octoate used as the catalyst and added at 1 part based on the weight of the resin using this composition in the rapid heating method described in example 1 the solder spread and formed a metallurgical connection to the copper however when using the heating method involving the multizone oven the solder did not spread or wet onto the copper eliminating the stannous octoate and using the my70 mthpa combination described showed the same result the solder was inhibited from wetting the copper when heating the sample in the multizone oven when cycloaliphatic resins such as 3 4 epoxycyclohexylmethyl 3 4 epoxycyclohexane carboxylate union carbide erl 4221 are used in combinations with mthpa are used with stannous octoate as the catalyst the soldering result observed is similar to example 1 the composition cures before solder melt point and inhibits the spread of the solder to the copper at a heating rate of 10 u00b0 c min showed the exotherm onset at 90 u00b0 c with a peak exotherm at 155 u00b0 c thus the exotherm peak which correlates to the chemical reaction rate is lower than the melting point of.