dielectric insulation to insulate the resistor from other components or metallic surfaces it may contact during its actual operation the encapsulating material 62 is applied in any manner which covers only the resistive element materials 28 a liquid high temperature coating material roll coated to both sides of the resistor body is the preferred method the conductive elements 30 32 of each body are left exposed these conductive strips 30 32 of the resistor serve as electrical contact points for the resistor when it is fastened to the printed circuit board by the end user since the ends 30 32 on the resistor are thicker then the resistive element 28 in the center of the resistor the necessary clearance is provided for the encapsulation on the bottom side of the resistor as shown in fig6 a next in the manufacturing process is the application of marking information printing to the encapsulated front surface of the resistor this step is represented by block 64 in fig2 this is accomplished by transfer printing the necessary information on the front surface of the resistor with marking ink the strip is then moved to the separating station represented by block 70 where the individual resistors are cut away from the carrier strip 24 the individual resistors are plated with solder to create a solder coating 68 as shown in fig7 a the individual resistors 10 are then complete and they are attached to a plastic tape 74 at a packaging station represented by the numeral 72 the above process can be accomplished in one continuous operation as illustrated in fig2 or it is possible to do the various operations one at a time on the complete strip for example the attachment and removing steps can.