bores 8 for the lifting and contact pins 7 0076 fig3 b shows a section of fig3 a seals 4 are arranged in recesses provided in the mobile electrostatic substrate holder 2 in this way the back side of the substrate wafer 1 as well as the back side of the mobile electrostatic substrate holder 2 facing away from the substrate wafer 1 and the individual bores 8 for the lifting and contacting pins 7 are sealed the clamping ring 3 secures the mobile electrostatic substrate holder 2 the bore 5 for gas cooling continues into the stationary receptacle receiving device 6 by means of the employed seals 4 between the substrate wafer 1 and the mobile electrostatic substrate holder 2 as well as between the stationary receptacle 6 sealed highly effective intermediate spaces 14 are provided for cooling the substrate wafer 1 0077 fig3 c shows an additional section of fig3 a illustrating a further proposal according to the invention the description is essentially identical to that of fig3 b in deviation therefrom the seals 4 are also arranged in recesses in the stationary receptacle 6 of the mobile electrostatic substrate holder 2 0078 fig4 shows in section a further part of the invention the mobile electrostatic substrate holder 2 is secured by a clamping ring 3 on the receptacle receiving device 6 the mobile electrostatic substrate holder 2 secures the substrate wafer 1 as a result of the seals or sealing surfaces arranged in the recesses of the mobile electrostatic substrate holder 2 and the stationary receptacle receiving device 6 the intermediate spaces 14 for providing the required gas cooling action are realized by means of the indicated cooling gas flow 15 that.