a stiffener member 24 which in its plane may be essentially of a box shaped configuration with a central opening 26 extending in spaced relationship about the peripheral extent of the chip 14 the stiffener member 24 may be of a suitable electrically conductive material similar to the lid or heat dissipating cap 18 by being constituted of the materials as set forth hereinabove of both metallic and non metallic compositions the lid or cap structure 18 is fastened to the stiffener 24 through the interposition of an electrically conductive adhesive 28 whereas in contrast the adhesive between the chip and lid is normally a compliant thermally conductive and electrically non conductive adhesive alternatively the adhesive 28 may be electrically non conductive but provided with internal conductive elements to form an electrical path between the stiffener 24 lid 18 and the substrate 12 as indicated pursuant to invention the opposite side of the organic substrate 12 may include electrical connections to the solder balls 16 such as for example such as a circuit path to array a bga 30 only schematically indicated and which form electrical interconnections with the chip 14 as is well known in the technology the area along the perimeter of the organic substrate 12 includes embedded therein a ring shaped electrical ground band 32 extending between the top surface of the organic substrate and.