emitting structures in another embodiment the material of the buffer layer includes al x ga 1 u2212 x as 0 u2266 x u2266 1 al a ga b in 1 u2212 a u2212 b p 0 u2266 a u2266 1 0 u2266 b u2266 1 0 u2266 a b u2266 1 or al a ga b in 1 u2212 a u2212 b n 0 u2266 a u2266 1 0 u2266 b u2266 1 0 u2266 a b u2266 1 the insulating layer 44 is for protecting and insulating the first light emitting structure 41 from the second light emitting structure 43 the material of the insulating layer 44 can be insulating material such as such as su8 benzocyclobutene bcb perfluorocyclobutane pfcb epoxy acrylic resin cyclic olefin copolymers coc polymethyl methacrylate pmma polyethylene terephthalate pet polyimide pi polycarbonate pc polyetherimide fluorocarbon polymer glass al 2 o 3 sio 2 tio 2 sin x spin on glass sog or tetraethoxysilane teos the electrical connecting structure 46 is for electrically connecting the first light emitting structure 41 and the second light emitting structure 43 the material of the electrical connecting structure 46 can be transparent conductive material such as ito ino sno cto ato zno mgo algaas gan gap azo zto gzo izo or ta 2 o 5 or metal material such as ge cu al mo cu u2014 sn cu u2014 zn cu u2014 cd ni u2014 sn ni u2014 co or au alloy it will be apparent to those having ordinary skill in the art that various modifications and variations can be made to the devices in accordance with the present disclosure without departing from.