obtaining a smaller heat capacity of the resistor layer 52 which allows a faster rate of heating cooling of the resistor layer 52 fig8 shows a partial schematic plan view of a variation of the thermal printhead of fig5 the resistor portion 53 shown in fig8 has an opening 56 inside the same photolithographic process to form the resistor portion 53 of the resistor layer 52 can be used to form this opening 56 the opening 56 has an effect of flattening the temperature profile of the resistor portion 53 such as the one shown in fig3 by positioning the opening 56 in the area where the highest temperature would be reached without the opening 56 the temperature profile would become more flattened because the highest temperature point is now without the resistive film to heat up this will also contribute to improving the printing quality without slowing down the speed of printing the shape of this opening 56 is merely an example and is not limited to a circle as shown in fig8 fig9 shows examples of alternate shapes for the opening 56 in addition to the circle triangle trapezoidal rectangular elliptical half circle and the like can be used for the opening 56 depending on such factors as materials of the resistor layer 52 applications and environments for printing and manufacturability of devices among other factors fig1 shows a partial schematic plan view of a thermal printhead according to a second embodiment of the present invention the second embodiment of a thermal printhead has a different topology from that of the first embodiment shown in fig5 in that a set of first and second resistor portions 53 a 53 b constitutes a heating element to imprint a dot improving resolution of printing fig1 shows a schematic cross.