the wafer the other configuration is the same as that of the first embodiment of the present invention and accordingly description thereof will be omitted the wafer 100 b mounts two saw resonators 9 and a coil antenna 8 a as shown in fig1 each saw resonator 9 includes two reflectors 91 and 92 and a comb shaped electrode 93 provided between the two reflectors 91 and 92 the coil antenna 8 a is provided along the edge of the wafer 100 b and is electrically connected to the two comb shaped electrodes 93 included in the two saw resonators 9 fig1 is a diagram which shows the frequency properties of the saw resonator 9 in fig1 the vertical axis represents the reflection coefficient s 11 and the horizontal axis represents the frequency fig1 indicates that when the frequency of the saw resonator 9 matches f saw1 f saw2 f saw3 or f saw4 the reflection coefficient s 11 is small the resonance frequencies f saw1 f saw2 f saw3 and f saw4 change according to the temperature of the wafer 100 in the same way as with the frequency f 0 of the resonator 5 according to the first embodiment of the present invention a semiconductor manufacturing system including the above described wafer 100 b provides the same advantages as those of the semiconductor manufacturing system 1 according to the first embodiment of the present invention.