thereof with a plurality of conductive electrodes formed in a zigzag pattern as shown in fig5 with an interconnection circuit provided in the interior of each of the secondary substrates to electrically connect the conductive electrodes to each other of course the conductive electrodes of the secondary substrates may be arrayed in a linear pattern or another pattern in place of the zigzag pattern the inside conductive electrodes of the secondary substrates 640 a and 640 b are placed on and thermo compressed to the conductive electrodes 611 a and 611 b of the active ic 610 with solder bonds interposed between them thus the secondary substrates 640 a and 640 b are bonded to the active ic 610 so that an electrical path is provided between them in the same manner the outside conductive electrodes of the secondary substrates 640 a and 640 b are placed on and thermo compressed to the conductive electrodes 621 a and 621 b of the lower support substrates 620 a and 620 b with solder bonds interposed between them thus the secondary substrates 640 a and 640 b are bonded to the lower support substrates 620 a and 620 b so that an electrical path is provided between them the driver ics 630 a and 630 b having conductive electrodes 631 a and 631 b on their upper surfaces are mounted to the upper surfaces of the lower support substrates 620 a and 620 b furthermore the lower support substrates 620 a and 620 b have bond pads 622 a and 622 b on the upper surfaces thereof to be wire bonded to the driver ics 630 a and 630 b thus when the bond pads 622 a and 622 b of the lower support.