photodiodes one or more signal processing chips 41 may be mounted on the frame section 52 for communicating with the optoelectronic device 40 and more particularly providing drive signals to transmitter elements or providing signal amplification and conditioning in the case of receiver elements referring now to fig8 and 9 the lens and alignment frame 44 includes a main body or base 56 and a tower 43 the base 56 is mostly planar and includes cavities 57 into which adhesive materials can flow during mounting and a large but shallow recess 55 for accommodating components and wiring on the front side of the carrier frame section 52 on which the lens and alignment frame 44 is mounted the tower 43 resides on the front side of the frame section 52 and projects well forward of the base 56 the tower 43 includes a pair of turret like elevated end sections 49 on top of which the guide pins 34 are mounted so as to project outward and forward from the base 56 and lens array 48 the lenses 46 in the array 48 are deployed at regular 250 micron intervals along a line extending between the elevated end sections 49 and guide pins 34 in a manner corresponding to the arrangement of the photoactive components 36 of the optoelectronic device 40 and fibers 17 of the ferrule 12 the lenses 46 are precisely aligned with.