for efficient curing in accordance with another aspect of the invention the dies 30 might be evenly arranged on substrate 34 to form a generally circular array as illustrated in several of the embodiments disclosed in u s patent application ser no 09 009 205 and as illustrated in fig2 b the dies might also be mounted in various groupings such as subgroups of four or some other number and then such subgroups would be mounted on the substrate that is sub groups of multiple dies could be individually mounted and electrically coupled together and subsequently the subgroups could be mounted on the substrate with other subgroups as such the invention would not be limited to individual mounting of all of the dies fig3 illustrates another embodiment of the invention wherein the die array is also positioned proximate the distal or radiating end 17 of the barrel portion 16 of the housing in the alternative embodiment the structure is somewhat similar to the device 10 illustrated within fig1 2 and 2 a with a different construction at the distal or radial end 17 as illustrated in fig3 specifically the alternative embodiment utilizes an array of dies 60 mounted on a substrate layer 62 the substrate layer could be sapphire or diamond which has suitable thermally conductive properties for heat dissipation while remaining electrically insulated substrate 62 is then bonded to a heat sink 64 which may be made of a suitable material such as copper the die array 60 and the assembly including the substrate 62 and heat sink 64 are.