a conventional bonding tool capillary 10 of the prior art the bonding tool 10 has a cylindrical portion 11 and a tapered working tip portion 12 coupled to the cylindrical portion 11 at the end of the working tip portion 12 working tip 13 is formed working tip 13 typically has a chamfer not shown which has one end in connection to the capillary 15 and its other end that opens to the environment the bonding tool 100 is deficient use in bonding materials having a low k value due to the susceptibility of said materials to metal lifting cratering and metal peel off the ultrasonic energy delivered at the working tip 13 of conventional bonding tools is insufficient and not optimized to allow for the bonding of low k bond pads and metallization thereof the working tip 13 of the conventional capillary 100 requires ultrasonic energy at a higher power than what is typically required however using ultrasonic energy at higher than normal levels further aggravates the metal lifting cratering and metal peel off problems furthermore the conventional capillary bonding tool 100 cannot provide at such ultrasonic energy levels a high level of reliable intermetallic coverage between a deformed ball bond and a bonding pad this lack of intermetallic coverage causes excessive aluminum extrusion between the ball bond formed on the bond pad metallization fig2 is the side view of a first embodiment 200 of the invention having two discrete intervals at which a reduction in diameter takes place as shown in fig2 the bonding tool 200 has a two steps defined by vertical relief 206 and 209 the distances of vertical relief 206 and vertical relief 209 from the working tip are 7 10.