invention gold is a noble material it is also an excellent conductor unlike the other good conductors such as al cu etc gold is inert and will not be oxidized and corroded therefore au is an ideal dimple contact material for switches according to the present invention however gold is very precious and expensive much gold is wasted during evaporation in forming the cantilever beam that consists of the dimple contact attached to the beam at the free standing end and the dc actuation electrode anchored to the metal base at the opposite end this is because both the dimple contact and the actuation pad are fabricated in a single au deposition step the invention described herein will provide a solution to forming the dimple contact and the actuation pad separately this permits selection of materials other than au to form the actuation bias electrode while gold is still being used as the material for the metal dimple furthermore by doing so there is an additional advantage that is a lighter metal such as ta may be used for the actuation bias electrode to reduce the mass of the cantilever beam to increase the switching speed step 1 forming the metal dimple in the sacrificial oxide by using a photolithographic lift off process same process as in step u2032 step 2 depositing the lower nitride structure over the sacrificial oxide and the metal dimple same step 3 etching a hole through the lower nitride structure into the metal dimple same as step 4 evaporating au above the metal dimple to fill up the hole by the lift off process or plating process same as except no metal deposition in the actuation electrode step 5 removing the nitride in the base region to form.