is held by the convex distal end 32 of the lead holding arm 31 and the lead receiving portion 30 of the seat 28 and the v shaped groove 26 of the lead 25 engages with the lead receiving portion 30 therefore descriptions of the other structures are omitted according to the second embodiment as described above in addition to the advantages of the first embodiment the lead 25 is prevented from bending toward an the ic package side when the measuring pin 16 is pressed and the measuring arm 14 is rotated to bring the pin 16 into contact with an end surface of the lead 25 because a pressure applied to the distal end of the lead 25 is controlled by the v shaped groove 26 and lead receiving portion 30 fig6 a and 6b are views showing the third embodiment of the present invention and fig6 a is a top view of the ic package and fig6 b is an enlarged top view of a portion f in fig6 a at which portions of a seat and a measuring pin are added a distal end of a lead 34 of an ic package 33 is cut when the distal end of the lead is worked after solder plating an end surface of the distal end is formed into a concave shape such as the v shape shown in fig6 b moreover a measuring pin 35 of the measuring arm is formed into a convex shape such as a reversed v shape so as to engage an end surface shape of the distal end of the lead 34.