mm from the outer peripheral end 51 of the wafer 50 in the radial direction of the wafer position of 6 mm outward a diameter is u03c6306 mm and more preferably between u2212 5 mm 5 mm inward and 0 mm position of a wafer end 51 from the outer peripheral end 51 of the wafer 50 in the radial direction of the wafer and more preferably at 0 mm position of a wafer end 51 see fig3 since the zone heater 15 in the zone 2 and the zone heater 16 in the zone 3 are physically separately formed it is impossible to completely coincide the divided position between the zone heater 15 and the zone heater 16 with the corresponding divided position of the susceptor 20 however if each end of the zone heaters is positioned in a range of 5 to 10 mm with respect to the corresponding divided position on the side of the wafer 50 of the susceptor 20 it is possible to control the zone heaters to obtain the heat uniformity efficiently in the present embodiment a distance between an inner end 18 of the zone heater 16 and a wafer side end 28 of a divided susceptor 23 is in a range of 5 to 10 mm as shown in fig3 an engaging member 27 is provided at the lower side on the side of the heater 10 of the inner end of the outer peripheral divided susceptor 23 an engaging member 26 is provided at the upper side on the side of the wafer 50 of the outer end of the inner side divided susceptor 22 and the engaging member 26 is superposed on the engaging.