resistor layer 10 contains a layer of glass microfiber impregnated dielectric 12 which is further processed by adding thru holes 13 by laser drilling or mechanical drilling as known in the art and a second dielectric layer 12 that is processed by removing a portion of the copper cladding or foil conductor using a photosensitive film applied to the metal coating 11 pursuant to the invention the coating 11 is then exposed to patterned activating radiation and developed an etchant not shown is then used to remove copper bared by the development of the photosensitive film finally the remaining photosensitive film is removed to provide the circuit trace that in this case is a resistor core 14 the removal of copper cladding to create a trace can also be accomplished by the addition of metal to the dielectric the description of removing the cladding here is not meant to be limiting of the invention referring now to fig2 there is shown a laminated structure of the buried resistor layer 10 containing a first dielectric layer 12 with thru hole 13 that is fusion bonded 16 with the second dielectric layer 12 that contains the resistor core 14 positioned so that the resistor core 14 is located within the constraints of thru hole 13 of the first layer 12 referring now to fig3 through 5 the laminate structure of buried resistor layer 10 is further processed by adding a soldermask 18 to fill the space surrounding resistor 14 within thru hole 13.