division multiple access cdma global system for mobile communications gsm north american digital cellular nadc extended time division multiple access e tdma wideband cdma wcdma cdma2000 wi fi muni wi fi bluetooth digital enhanced cordless telecommunications dect wireless universal serial bus usb flash orthogonal frequency division multiplexing flash ofdm ieee 802 20 general packet radio service gprs iburst wibro wimax wimax advanced umts tdd high speed packet access hspa evolution data optimized evdo long term evolution lte advanced multichannel multipoint distribution service mmds and so forth the semiconductor package techniques described herein may be applied to a memory system fig2 is a schematic block diagram illustrating an example of a memory system including a semiconductor package according to some embodiments referring to fig2 a memory system 1400 may include a non volatile memory device 1410 and a memory controller 1420 the non volatile memory device 1410 and the memory controller 1420 may store data or may read stored data the non volatile memory device 1410 may include at least one non volatile memory device applied with the semiconductor package techniques according to some embodiments described herein the memory controller 1420 may control the non volatile memory device 1410 to read the stored data and or to store data in response to a read write request of a host 1430 according to some embodiments described herein a semiconductor device may include conductive patterns which may be connected to connection terminals and may have a concavo convex top surface accordingly top surfaces of the conductive patterns.