transfer molding finally areas on the lower surface of the metal carrier plate 240 without protection of the second metal coating are etched such that each of the peripheral bulges 235 b is separated from one another so as to form the connection pads 230 thereby obtaining the low pin count chip package 300 as shown in fig1 referring to fig1 in the preferred embodiments of the present invention the projecting portions of the die pad 230 and the connection pads 232 from the bottom of the package body 220 are preferably provided with a third metal coating 256 formed thereon thereby protecting the side surfaces thereof from corrosion or contamination the third metal coating 256 is preferably formed by electroless gold deposition or electroless nickel deposition according to the present invention the die pad 232 as well as the connection pads 230 have a concave profile thereby enhancing the u201c locking u201d of the die pad and the connection pads in the package body as well as prolonging the path and time for moisture diffusion into the package further a portion of the die pad and a portion of each connection pad extend outward from the bottom of the package body to enhance.