been adequately redistributed on all portions of the sidewalls of the via hole 20 then the second barrier material 22 is not as necessary and may optionally be omitted however for the considerations as described above deposition of the second barrier material 22 is a preferred option as mentioned above in regard to the barrier material 16 the properties of the second barrier material 22 are preferably selected so as to provide a good barrier between the non electrically conductive material 18 and the material that will be used to substantially fill the via hole 20 fig8 depicts the integrated circuit 10 after the via hole 20 has been filled with an electrically conductive plug material 24 the plug material 24 is preferably a metal or metal alloy and is most preferably copper fig9 depicts the integrated circuit 10 with an overlying electrically conductive layer 26 such as an m 2 layer to continue the example as introduced above where the electrically conductive layer 14 is an m 1 layer the electrically conductive layer 26 is preferably formed of a metal or metal alloy and is most preferably formed of copper the via structure as depicted in fig9 is most preferably used in several different layers of the.