adipate propanediol sebacate polyester phthalic polyester and so on epoxy plasticizer including epoxidized soybean oil epoxy flaxseed oil butyl epoxy stearate octyl epoxy stearate epoxy triglyceride di 2 ethylhexyl 4 5 epoxytetrahydrophthalate and so on chlorine plasticizer including chlorinated paraffin methylpentachlorostearate reactive plasticizer including dibutyl maleate dioctyl maleate acrylic polyol ester methyl acrylic polyol ester fumarate itaconate unsaturated polyester resin and so on the above mentioned leveling agent consists of a kind of the following substance or at least two kinds of the following substances polydimethyl siloxane and polymethyl phenyl siloxane the above mentioned coupling agent consists of a kind of the following substance or at least two kinds of the following substances trimethoxy 2 7 oxabicyclo 4 1 0 hept 3 yl ethyl silane u03b3 glycidoxypropyl trimethoxy silane u03b3 methacryloxy propyl trimethoxy silane the above mentioned antioxidant consists of a kind of the following substance or at least two kinds of the following substances aromatic amine antioxidants hindered phenol antioxidant secondary antioxidant a kind of preparation method of the above mentioned light heat dual curing anisotropic conductive adhesive includes the following steps step one weigh light curing activated monomer 15 0 18 0 light cured resin 4 5 12 5 light curing agent 3 0 5 0 thermosetting resin 20 0 25 0 latent heat curing agent 12 0 16 0 elastomer 5 0 10 0 plasticizer 3 0 6 0 conductive particles 4 0 18 0 insulating nanoparticles 8 0.