a the driving ic 15 includes a base layer 2 a plurality of bumps 8 formed in the bottom surface of the base layer 2 a first layer 4 formed on the upper surface of the base layer 2 and second layers 6 formed on the first layer 4 to correspond to locations where the plurality of bumps 8 are formed the base layer 2 may be made of silicon and the first layer 4 and the second layer 6 may be made of a flexible and heat resistive material such as polyimide pi or polyethylene terephthalate pet in addition the plurality of bumps 8 may be made of one of gold au silver ag copper cu and the like as shown in fig2 b the plurality of bumps 8 formed in the bottom surface of the base layer 2 are electrically connected to a plurality of substrate pad portion 9 formed on the substrate 10 in order to attach the driving ic 15 to the substrate 10 the driver ic 15 is pressed using a compression tool 50 interposing a shock absorbing member 40 therebetween pressure of about 30 mpa to about 150 mpa is applied to the compression tool 50 with a temperature of about 200 u00b0 c to about 500 u00b0 c for thermal compression of the driver ic 15 to the substrate 10 the shock absorbing member 40 provided between the compression tool 50 and the driving ic 15 is made of a material.