ratio of the overall height h to dielectric width w d controls the electric and magnetic field penetration to an adjacent contact the aspect ratio to minimize coupling beyond a and b is approximately unity as illustrated in fig1 the lines 30 32 34 36 and 38 in fig1 are equipotentials of voltage in the air dielectric space taking an equipotential line close to one of the ground planes and following it out towards the boundaries a and b it will be seen that both boundary a are very close to the ground potential this means that at both boundary a and boundary b we have virtual ground surfaces and if two or more i beam modules are placed side by side a virtual ground surface exists between the modules and there will be no coupling between the modules in general the conductor width w c and dielectric thickness should be small compared to the dielectric width or module pitch given the mechanical constraints on a practical connector design the proportioning of the signal conductor blade beam contact width and dielectric thicknesses will of necessity deviate somewhat from the preferred ratios and some minimal coupling will exist between adjacent signal conductors however designs using the basic i beam guidelines will have lower cross talk than more conventional approaches referring to fig l a an alternate embodiment is shown in which the dielectric is shown at 12 u2032 and 14 u2032 with their respective ground planes at 13 u2032 and 15 u2032 in this embodiment the conductor 26 u2032 and 28 u2032 extend respectively from dielectric layers 12 u2032 and 14 u2032 but the conductors 26 u2032 and 28 u2032 abut side to side rather than edge to.