good anchor when attached to the printed circuit board on the wafer level the leveling process enforces coplanarity among all the solder columns in the wafer this technique differs from the above techniques in that a flexible laminate is used in place of the master wafer to provide for the stretching stage 1 pattern flexible laminate the process starts with a copper foil u2014 dry film flexible laminate that is supplied in a roll form the laminate is then patterned to expose the copper foil with the desired pattern of solder bumps stage ia formation of solder bumps on a flexible laminate if so desired the patterned flexible laminate may be coated with a solder pattern by using either printing plating or jetting dry film serves as mask during any of these processes stage 2 mounting and solder merging the functional wafer as well as the flexible laminate with patterned pad or solder bumps are held by a set of vacuum chucks equipped with heating using vacuum the chuck for the function wafer is attached to a machine spindle that has x y z u03c6 degrees of freedom similar to a standard flip chip attach machine using the x y u03c6 degrees of freedom the functional wafer is aligned and positioned at a distance over the flexible tape.