a vlsi process and its integration on the same chip with components of an electronic circuit that is provided for the operation of the sensor the production occurs essentially with a standard vlsi process relatively few additional steps need to be inserted into the standard process in order to produce the sensor in an exemplifying embodiment which is depicted cross sectionally in fig2 doped regions 5 are produced in a substrate of semiconductor material which regions are provided as lower counter electrodes e g drive or detection electrodes additional doped regions which are provided for electronic components can be produced at the same time for example in the framework of a cmos process the doped regions which are provided for the source and drain mosfets are produced on the top side the deposition of an auxiliary layer ensues onto which layer a layer of the material that is provided for the ring is first deposited whole surface and is then appropriately structured from this layer the ring 1 the strut 11 the springing braces 10 and the anchoring arrangements 9 are produced preferably so as to be continuous to be able to place the anchoring arrangements fixedly on the substrate it is advantageous if prior.