wavelength converting potting mass but by a transparent envelope 15 the transparent envelope 15 does not cause any change in the wavelength of the radiation emitted by the semiconductor body 1 and for instance comprises an epoxy silicone or acrylate resin conventionally used in led technology or some other suitable radiation permeable material such as inorganic glass a layer 4 is applied to the transparent envelope 15 the layer 4 comprises a wavelength converting casting composition and as shown in fig2 covers the entire surface of the envelope 15 it is equally conceivable for the layer 4 to cover only a portion of the surface the layer 4 for instance comprises a transparent epoxy resin which is mixed with luminous substance particles 6 once again for a semiconductor component that emits white light yag ce is preferred as the luminous substance fig3 illustrates a particularly advantageous and preferred embodiment of the invention the first and second electrical terminals 2 3 are embedded in an opaque and optionally prefabricated basic housing 8 that has a recess 9 the term u201c prefabricated u201d is understood to mean that the basic housing 8 is already finished at the terminals 2 3 for instance by means of injection molding before the semiconductor body is mounted on the terminal 2 the basic housing.