upon ejecting can be improved further the wettability between the inorganic protective film and the organic adhesive is bad and therefore they are hard to conform to each other upon baking thus causing a possibility of further reduction in adhesive strength consequently by the use of organic films for both the protective film and the adhesive the adhesive strength can be increased to thereby improve the ejecting stability and the durability against the deformation of the side walls of the piezoelectric ceramics plate upon ejecting ink in the ink ejecting printer head according to the embodiments the third embodiment is explained with reference to fig4 in the third embodiment an organic material especially an epoxy resin is used as the material of the protective film 20 and also serves as the adhesive for bonding the piezoelectric ceramics plate 1 and the cover plate 2 for example an appropriate quantity of epoxy resin e g epo tek 377 manufactured by epoxy technology is dropped on the piezoelectric ceramics plate 1 and is then spin coated at a rotating speed of 3000 rpm to thereby form an epoxy resin film having a thickness of 10 u03bcm or less in each groove 12 and on the upper surface of each side wall 11 of the piezoelectric ceramics plate 1 immediately after the formation of the epoxy resin film the cover plate 2 is placed on the piezoelectric ceramics plate 1 through the epoxy resin film and is lightly pressed so as to be attached to the piezoelectric ceramics plate 1 then the assembly is baked at 150 u00b0 c for 1 hour in a clean oven to complete curing of the epoxy resin film accordingly as compared with the manufacturing.