respective pads are bonded together to create continuous turns of conductors around the three cores such bonding for example is advantageously provided using a solder reflow oven after bonding together of the respective solder pads 1 13 the individual transformer assemblies are separated to form individual transformers 125 as shown in fig1 the flex strip configurations shown in fig3 7 and 9 a 9 b 10 11 and 12 are advantageously manufactured using conventional mass production techniques fig1 illustrates a copper plane having a multiplicity of the bottom flex circuits 70 shown in fig9 a these circuits are adhered to a flex panel 150 made of a dielectric such as polyimide or other flexible materials such a panel can be fabricated by the ordinary processes used to construct a flex circuit this picture shows a typical arrangement of 49 circuit arrangements grouped into 7 rows and 7 columns with a number of copper paths per circuit the number of circuits on the panel and the copper paths will vary depending upon the individual transformer or inductor design but a simplified arrangement is shown for ease of illustration after the circuit patterns are etched onto the panel 150 a protective cover is bonded over the copper with a suitable dielectric as is typical of the methods used to build flex circuitry this cover has access holes that exposes the copper in chosen locations to create the solder pads so that the.