on one or both of the surfaces being brazed together it is possible to accomplish these desirable results and to reduce or eliminate the undesirable effects enumerated previously by means of a solid liquid reaction that occurs at the brazing temperature between the liquid braze alloy and the gold surfaces a braze joint having a melting point much higher than the original braze alloy is the result in accordance with the present invention the thick gold layers are replaced by copper copper rich layers or by solid copper or copper rich parts the copper partially substitutes for gold in the desirable u03b2 phase discussed above thus providing a cheap and relatively simple alternative in accomplishing the results cited above in accordance with the invention the process is as follows 1 braze at the standard braze temperature say 400 u00b0 c to form the joint and to establish the limits of the fillet 2 hold at this temperature sufficiently long to allow some uptake of copper to occur with its concomitant partial solidification 3 raise the temperature say to 425 u00b0 475 u00b0 c to allow the copper uptake reaction to occur more completely without fear of flowout 34 pin climb 34 and 4 cool to room temperature fig1 shows a multilayered ceramic substrate 10 carrying a molybdenum pad 11 which is conventionally protected with a layer of nickel 12 about 3 4 micrometers thick next is a layer 13 of a relatively thick film of copper about 0 0002 0 0025 cm thick the layer 13 is coated with a very thin layer 14 up to 1 25 u03bcm thick of a group viii metal such as fe co ni ru rh pd os ir or pt to serve as a source of.