through fig1 h are schematic flow diagrams showing the process for integrating at least one passive component within a substrate according to a first embodiment of the present invention refer to fig1 a again first a circuit layer 110 is provided the circuit layer 110 includes an intermediate layer 111 and an electrically conductive layer 112 the intermediate layer 111 is made of dielectric material the electrically conductive layer 112 is formed at both sides of the intermediate layer 111 and made of metal material such as cu ni or au refer to fig1 b again next at least one positioning blind hole 113 is formed in the circuit layer 110 the positioning blind hole 113 may be formed by a method such as laser drilling or mechanical drilling the positioning blind hole 113 is drilled from one side of the circuit layer 110 of the electrically conductive layer 112 and another side of the electrically conductive layer 112 is not drilled thereby forming the blind hole refer to fig1 c again next the electrically conductive layer 112 of the circuit layer 110 is patterned to form a circuit 114 the electrically conductive layer 112 is patterned by a method such as photolithography etching or laser etching the circuit 114 includes at least one contact 114 a connected to the positioning blind hole 113 thereby forming an electrical connection to at least one passive component 120 refer to fig1 d again next a conductive material 115 is formed in such as filled in the positioning blind hole 113 the conductive material 115 is preferably adhesive such as a conductive glue or a melted metal refer to.