even when the above described cross bonding is performed thus improving the reliability of the products further it becomes possible to perform the above described cross bonding easily thus improving the degree of freedom of bonding 0098 fig8 is a sectional view showing another feature of a lead frame according to the present invention and fig9 is a longitudinal sectional view showing a semiconductor device manufactured using this lead frame the lead frame 1 according to the present invention is featured by the fact that a wire supporting portion 15 is provided between the semiconductor chip mounting area 2 of the supporting body 8 and the points of the inner leads 4 this wire supporting portion 15 is arranged around the mounting area 2 of the supporting body 8 and is capable of supporting and maintaining a loop of the wire bonded between the pad electrodes of the semiconductor chip and respective leads at a fixed height when the semiconductor device is assembled the wire supporting portion 15 is formed by fixing an insulating material such as a polyimide resin and epoxy resin by adhesives or the like or by working the supporting body 8 partially so as to apply an insulating process to at least the portion where the wire comes in contact according to such a lead frame 1 of the present invention it is possible to maintain the loop height of the wire constant because a wire supporting portion 15 for supporting the bonding wire is provided thus the possible occurrence of a short circuit among mutual wires can be reduced 0102 fig1 is a sectional view showing a variation of.