due to the surface characteristics this leads to non layer transfer areas resulting in loss of transferred device film of up to 5 millimeters unbonded inboard of the circular area at the handle wafer edge thus as shown in fig1 the wafers 12 may be pressed together to direct bond and transfer the film 14 from the donor wafer 12 b to the handle wafer 12 a the donor wafer 12 b may be mounted on a mounting plate 20 the wafers 12 a and 12 b may be pressed together centrally or peripherally as indicated by the pressure element 16 and the associated arrow at such time the wafers 12 may be held in alignment by the jig 18 after direct bonding the bonded pair may be put into a pressure bonding apparatus shown in fig2 to flatten and bring into contact unbonded areas that split from the initial bonding of the handle and donor wafers 12 in this case a pair of rigid flat parallel plates 22 a and 22 b may be positioned on either opposed surface of the bonded wafers 12 and pressure may be applied substantially uniformly across at least one plate 22 while the other plate 12 is supported in one embodiment the applied pressure may.