34 34 c 34 and 34 d 34 respectively thus fig5 was made according to the preferred embodiment of the ceramic composite layer on aluminum alloy substrate forming method of the present invention by utilizing tic powder mixed in with the alloy powder of silicon and copper while fig6 and 8 were made by comparison methods not according to the present invention further fig9 through 12 are cross sectional photomicrograph views at enlargements of 10x taken transversely through the bead portions 8 produced as described above utilizing the ceramic powder materials 34 a 34 through 34 d 34 respectively in the case of the first preferred embodiment of the present invention which utilized the ceramic powder material 34 a 34 the composite layer bead portion 8 was about 1 2 mm by about 4 8 mm in cross sectional dimensions had surface hardness about 350 to 450 hv 5 kg and had good surface appearance in the case of the first comparison method which utilized the ceramic powder material 34 b 34 which contained only tic powder the composite layer bead portion 8 was not formed while the aluminum alloy substrate material which remained had surface hardness about 80 to 90 and had bad surface appearance in the case of the second comparison method which utilized the ceramic powder material 34 c 34 which contained ti powder and silicon powder without any admixture of copper with the silicon the composite layer bead portion 8 was not properly formed insofar as it could be determined had surface hardness about 80 to 550 550 were agglomerations of tic powder were generated and the surface appearance of the general area thereof was poor and similarly for the case of the third comparison method which utilized the ceramic powder material.