socket assembly by dissipating electrostatic charge through the conductive frame the invention will next be illustrated with reference to the figures in which the same numbers indicate the same elements in all figures such figures are intended to be illustrative rather than limiting and are included to facilitate the explanation of the process and device of the present invention turning now to fig1 an exemplary electrostatic dissipative alignment plate 100 is illustrated in accordance with the present invention the alignment plate 100 comprises base portion 110 and frame portion 120 base portion 110 and frame portion 120 are formed from different materials to prevent electrostatic charge buildup in sockets and electrical systems and to prevent current leakage base 110 receives electrical conductors and also aligns the device leads of ic 130 when the ic is positioned in alignment plate 100 base 110 has a plurality of openings for receiving electrical conductors which contact the device leads of ic 130 thus aligning and electrically coupling the device leads of the ic to the electrical system ic 130 may comprise one or more semiconductor chips that may or may not be positioned on a module or printed circuit board frame portion 120 is positioned on base 110 and receives ic 130 for ic devices with.