applying the dielectric layer to the surfaces 46 is called a 0s1p substructure in fig5 the 0s3p substructure 50 comprises an interior power plane 54 a surface power plane 51 a surface power plane 58 a dielectric layer 152 between the power planes 54 and 51 and a dielectric layer 153 between the power planes 54 and 58 the power plane 54 includes a continuously conductive layer 55 having a hole 56 and a hole 57 wherein the holes 56 and 57 each include dielectric material from the dielectric layers 152 and 153 while the continuously conductive layer 55 includes the two holes 56 and 57 the continuously conductive layer 55 may include any number of holes or no hole the power plane 51 includes a continuously conductive layer 52 having a hole 53 while the continuously conductive layer 52 includes the hole 53 the continuously conductive layer 52 may include any number of holes or no hole the power plane 58 includes a continuously conductive layer 59 having a hole 151 while the continuously conductive layer 59 includes the hole 151 the continuously conductive layer 59 may include any number of holes or no hole the continuously conductive layers 52.