generating device 450 and the heat sink 400 the gap pad material 418 may be of a springing or flexible nature with good thermal conduction properties such that it creates a positive mechanical force toward a contact plate 405 of the heat sink 400 and the heat generating device 450 and be a suitable thermal interface between the heat generating device 450 and the heat sink 400 fig5 is a top view diagram of a heat sink 500 with an attachment structure 515 having faces that extend from a contact structure 105 at an angle the heat sink 500 may also have thermally conductive elements 510 extending from the contact structure 505 in this arrangement the heat sink 500 may provide heat transfer and emi shielding to other drives with the cavity 517 while reducing the volume of the cavity 517 as well as the amount of material used to form the heat sink 500 the heat sink 500 may be secured as discussed above with reference to fig2 by solder wicking features 520 which are not plainly visible in this top view but are located on the attachment structure 515 where it comes in contact with the member such as a pcb to which the heat generating device is coupled it should be understood that the solder wicking features may be any one of or a combination of pegs slots ridges long and narrow grooves or any other type.