following is a description and discussion with reference to the drawings it should be noted that such discussion and description is not meant to unduly limit the scope of the invention it will also become apparent that the cutter wheel of the present invention may be utilized for specific uses as well as performing other cutting application on various materials and readily recognize to those skilled in the art fig1 shows a front view of the cutter wheel 10 of the present invention the cutter wheel 10 comprises a chemical vapor deposition diamond center layer 12 forming the cutting line 13 at an angle of approximately 160 u00b0 bonded to a right side hub 14 and a left side portion 15 alternatively the center layer 12 can comprise a monocrystalline diamond as formed by the cvd process free standing or substrate supported cvd diamond film is available from p1 diamond inc in various thickness from a few micron up to 1 mm in thickness whereas cvd diamond is grown in sheets its thickness is containable to a height sufficient to attain the required thickness of the cutting edge accordingly minimizing both material and processing cost this cvd diamond film is laser cut into an annular ring 12 as shown in fig4 using conventional nd yag laser cutting machine the right side preformed hub 14 is formed from preferably a metallic material the left side preformed flange 15 is provided from compatible material that readily bond to the right side hub 14 affixed by brazing shrink fit or conventional bonding method with resin well know in the art for substrate supported cvd diamond not shown the shrink fit method of attachment to.