second semiconductor die 34 has been replaced with two smaller semiconductor dies 38 and 40 the two smaller semiconductor dies 38 and 40 are placed next to one another i e horizontally stacked and are on top of the first semiconductor die 26 the two semiconductor dies 38 and 40 are coupled to the first semiconductor die 26 in a manner as previously discussed above wirebonds 30 are used to coupled the semiconductor dies 38 and 40 to the substrate 24 wirebonds are further used to coupled the semiconductor dies 38 and 40 to one another once the wirebonds 30 are complete the entire semiconductor package 10 is encapsulated referring now to fig5 another embodiment of the semiconductor package 10 of the present invention is shown in this embodiment the prepackaged device 12 is a leadframe prepackaged device 12 a the leadframe prepackaged device 12 a includes a substrate 16 with a plurality of leads 23 a and a die pad 23 b the semiconductor die 14 is electrically connected to the leads 23 a by wirebonds 20 the leads 23 a are used to couple the leadframe prepackaged device 12 a to the upper surface 24 a of the substrate 24 in any of the previous embodiments the prepackaged device 12 may be a bga prepackaged device 12 as shown in the fig1.