at least one of the stainless steel and the iron should not be exposed and is to be lined with a nonmetallic material such as alumina natural rubber urethane and the like a resin composition according to the present invention is described hereinafter the resin composition of the present invention includes a resin and the powder of the present invention the content of the powder in the resin composition is preferably 10 to 95 by mass and more preferably 40 to 93 by mass as the resin epoxy resin silicone resin phenol resin melamine resin urea resin unsaturated polyester fluorine resin a polyamide such as polyimide polyamide imide and polyetherimide polyester such as polybutylene terephthalate and polyethylene terephthalate polyphenylene sulfide aromatic polyester polysulfone liquid crystal polymer polyether sulfone polycarbonate maleimide modified resin abs resin aas acrylonitrile acrylic rubber styrene resin abs acrylonitrile ethylene propylene diene rubber styrene resin and the like can be exemplified among these the resin in the resin composition used for a semiconductor sealant is preferably epoxy resin having no less than 2 epoxy groups in one molecule such as phenolic novolac type epoxy resin ortho cresol novolac type epoxy resin epoxidized novolac resin of phenols and aldehydes glycidyl ether such as bisphenol a bisphenol f bisphenol s and the like glycidyl ester acid epoxy resin obtained by a reaction of polybasic acid such as phthalic acid and dimer acid with epochlorohydrin linear aliphatic epoxy resin alicyclic epoxy resin heterocyclic epoxy resin alkyl modified polyfunctional epoxy resin u03b2 naphthol novolac type epoxy resin.