but may also include lands at the ends of the jumping conductor jumper conductors 110 are ready made onto or inside the supporting part 120 the embedding of components i e the microcircuit chip 10 passive component 11 and jumper element 100 can be accomplished by any known compatible method examples of useful methods for embedding are cavity embedding face down and face up embedding etc additionally the conventional connecting of components and any contact pads 15 to the wiring layer 41 can be accomplished by any known compatible method one useful method for connecting the components is using microvias 130 further examples of these methods are described in the following patents and patent applications u s pat no 6 991 966 u s pat no 7 294 529 u s pat no 7 299 546 u s pat no 7 609 527 u s pat no 7 663 215 u s pat no 7 673 387 u s pat no 7 696 005 u s ser no 11 797 609 u s ser no 11 878 557 u s ser no 12 603 324 u s ser no 11 570 673 u s ser no 11 667 429 u s ser no 11 791 547 u s ser no 11 587 586 u s ser no 11 917 724 u s.