ic is shown the tfc capacitor 402 is shown in an embodiment having an organic substrate 404 which may be a multilayered printed circuit board having a top side formed capacitor 406 and a bottom side formed capacitor 408 the capacitors may also be embedded in the substrate the top and bottom capacitors may be connected in various ways for example they may be totally isolated from one another and serve different portions of the mounted ic 412 or they may be connected to each other to essentially double the amount of available capacitance or any combination of connections as needed for the specific application to which the tfc is applied the bottom surface of the tfc capacitor 402 has a number of connection pads shown to which external contacts maybe connected for example the illustrative embodiment shows an area array of pins 410 for connection to a through hole printed circuit board alternative connections might include gull wing leads for surface mount applications ball grid arrays or socket connector pins such as the full grid socket i e fgs shown in the figure the top surface of the tfc capacitor 402 in this illustrative embodiment has an area array of connection pads arranged to receive and solder a packaged ic 412 using solder ball array 414 alternative connection methods might include flip chip mounting of a non packaged silicon die using plated solder or gold bumps or surface mounting a ceramic leaded ic package having an attached heat sink with such an arrangement the ic 412 has a short electrical connection to any desired number of different power and reference supply.