such that when moving the wafer support pins 89 to approach the wafer w the charge removing pin 94 comes into contact with the susceptor 52 before the wafer support pins 89 comes into contact with the wafer w the charge removing pin 94 is arranged such that when the charge removing pin 94 is subjected to a force that moves the charge removing pin 94 into the support rod 93 the charge removing pin 94 moves into the support rod 93 but when the force is released the charge removing pin 94 protrudes from the support rod 93 in an illustrative embodiment the charge removing pin 94 is held in the support rod 93 via an elastic member next the operation of the wafer elevating mechanism will be described at the time of the completion of the tin film on the wafer w the wafer support pins 89 and the charge removing pin 94 are spaced at respective distances from the wafer w and the susceptor 52 respectively fig3 a that is the wafer support pins 89 and the charge removing pin 94 are not in contact with wafer w and the susceptor 52 respectively as the driving mechanism 91 moves the wafer support pins 89 so that they approach the wafer w the charge removing pin 94 firstly comes into contact with the susceptor 52 fig3 b a tin film is formed on the surface of the susceptor 52 when a tin film is formed on the wafer w an electric charge accumulated in the susceptor 52 and the wafer w is removed through the charge removing pin 94 which is connected to ground as the driving mechanism 91 further moves the wafer support pins 89 in.