used in integrated circuit fabrication the wire bonder attaches wire bonds 22 between bond pads 16 on integrated circuit chip 12 and leads 20 on leadframe 18 before a production run of integrated circuit chips is begun the wire bonder is programmed with the locations of bond pads 16 on chip 12 and leads 20 of leadframe 18 in the past each new chip design would differ from other chip designs in the placement of circuit functional blocks and bond pads thereby necessitating the reprogramming of the wire bonder before each production run however in accordance with the present invention chip 12 has a regular linear array of circuit functional blocks 14 and bond pads 16 this regular design may be used for any integrated circuit chip package requiring the same number of leads 20 thus the wire bonder need only be programmed before one production run and the same programming may be used in all subsequent production runs for the same chip size and number of leads as a result package 10 becomes less time consuming and expensive to produce at step 42 the integrated circuit chip assembly is placed in an injection molder of the type commonly used in integrated circuit fabrication integrated circuit chip 12 and leadframe 18 are surrounded by a thin rectangular mold with only leads 20 protruding.