be formed with a radially through slit to increase the resiliency of the clipping member 43 thereby to facilitate the mounting of the clipping member 43 to the connecting member 41 the fixing member 44 is attached in a bottom face of the circuit board 20 and forms a threaded hole 441 therein for engagingly receiving the fixing portion 413 of the connecting member 41 the resilient member 42 such as a coil spring first embodiment fig1 5 or a resilient metal plate spring second embodiment fig6 is for providing resilient force to push the head portion 412 of the connecting member 41 and accordingly the circuit board 20 and the electronic component 21 to move upwardly as the resilient members 42 is sandwiched between the head portion 412 and the supporting plate 31 of the thermal module 30 after the clipping member 43 is snapped in the clasping groove 411 b and the fixing portion 413 is engagingly received in the fixing member 44 the upward movement of the electronic component 21 by the resilient member 42 ensures that the electronic component 21 has an intimate contact with the thermal module 30 referring to fig3 to fig5 in assembly of the heat dissipating apparatus 10 the coil springs 42 are mounted to surround the main portions 411 of the connecting members 41 with the top ends of the coil springs 42 engaging with the flanges 411 a respectively the connecting members 41 of the fastening elements 40 are placed in the corresponding.