pressure in the hot runner 100 fig4 represents the point in the injection molding cycle whereby the molded product 200 has been previously ejected and molten resin 115 is being forced through the gate orifice 186 and into the mold cavity 190 which is currently unoccupied as compared to fig3 previous the lack of presence of solidified resin 230 along the inside of the gate bubble 175 can be explained by the highly pressurized flow of the molten resin 115 under high shear re melting the solidified resin 230 and forcing a cold slug 260 of resin into the mold cavity 190 which is currently vacant referring now to fig5 a a finite element analysis fea simulation of the thermal characteristics around the nozzle tip outlet end 169 and particularly adjacent to the tip insert 235 reveals that in steady state that is when no pressurized injection of the molten resin 115 is occurring the molten resin 115 will never solidify or freeze in the gate orifice 185 due to the excessive thermal conduction of heat by the tip insert 235 of similar thermally conductive material as that of the nozzle tip body 166 when the mold opens to eject the molded product 200 both the molten resin 116 and the solidified resin 230 nearby will be strained and will result in the production of at least one string 255 at the gate orifice 185 the crystallization boundary 265 shown in fig5 b between the molten resin 115 and the transition layer 240 of resin marks its phase change which in this particular example occurs at about 110 u00b0 c and may be noted as being located.