material is shown wafers 12 and 272 can be held together by a mechanical fixture during capillary filling in and curing of the sealing material the ridges 268 prevent the sealing material from getting inside the cavity after curing this hermetic sealing material 260 in the capillary opening 266 a true hermetization with the required bonding force is achieved liquid hermetization bonding in comparison with pecvd hermetization has these advantages there is no need to expose all the edges of the die sawing around the die to provide uniform hermetization the mechanical non hermetic bonding need not be as strong or can be eliminated and mechanical protection of the contact pads during the bonding if necessary can be achieved more easily as in fig3 an illustration of hermetic sealing for an entire wafer assembly 278 is shown in cross section in fig3 upper wafer 280 is bonded to lower wafer 282 by bonding material 284 applied at profiled ridges 286 funnels 290 extend through upper wafer 280 into lower wafer 282 to allow the liquid hermetic sealing material 292 to extend into capillary regions 296 fig3 shows a similar wafer assembly 300 with different shaped funnels 302 which do not penetrate into the lower wafer 304 but do penetrate through upper wafer 306 with hermetic sealing material 308 covering metal area feedthroughs 310 as described above at capillary regions 314 at the first stage the wafers are either mechanically bonded fig3 or clamped not shown with a temporary mechanical fixture fig3 then the liquid hermetic is applied to the top surface of the upper wafer this hermetic flows through the funnels and fill in the capillaries.