the clamp 24 actuated to clamp the end 15 of the lead finger 14 against the heat block 20 or the adhesive strip 30 the wire bonding apparatus 26 is then actuated to form a wire bond on end 17 of wire 16 to an appropriate bond pad on die 10 after the formation of the bond of end 17 of wire 16 to the bond pad of die 10 the bonding apparatus is moved to appropriate end 15 of lead finger 14 for the formation of a suitable wire bond thereto by end 18 of wire 16 after the formation of the bond of the end 18 of wire 16 to the end 15 of lead finger 14 the independent clamp 24 and the bonding apparatus are actuated to substantially simultaneously remove the clamp 24 and the bonding apparatus 26 from the end 15 of the lead finger 14 alternately the bonding apparatus 26 is actuated to remove the apparatus from the bond location at the end 15 of the lead finger 14 either prior to or after the removal of the independent clamp 24 from a lead finger 14 during the removal of the bonding apparatus 26 from.