insure conductivity so the bond is extremely thick and uneven and it is not useful for high frequency ultrasound applications referring now to fig2 a second embodiment 30 of the present invention is shown in the embodiment 30 a first substrate 32 is electrically connected to a second substrate 34 the first substrate 32 is comprised of a layer of piezoelectric material 36 having a sputtered chromium layer 38 applied thereon following the sputtering of layer 38 onto the layer of piezoelectric material 36 the atomized spheres copper spheres 40 are applied by any suitable means such as by spraying them onto the sputtered layer 38 then an additional overcoat layer 42 preferably also of chromium is sputtered onto the layer 38 with the spheres 40 thereon as shown second sputtered layer 42 conforms to the shape of the spheres 40 accordingly when the epoxy 44 is applied over the layer 42 and the second substrate 34 is pressed onto the epoxy 44 the epoxy 44 fills the gaps surrounding the spheres 40 thereby providing adhesion between the layers 38 40 while electrical conductivity occurs through the layers 38 42 and the spheres 40 the purpose of the spheres 40 in this embodiment 30 is to provide areas for the gaps for the epoxy 44 to fill while maintaining a very close spacing between the two substrates 32 34 it has been found that.