includes at least one host component 5 which is amorphous plastic having a softening temperature range if said host component 5 is heated above the softening point or the softening temperature the plastic housing composition 3 furthermore has the incorporated component 6 including a plastic or a salt the incorporated component 6 being present in the manner finely distributed in the volume of the host component 5 said incorporated component 6 may be arranged in microbubbles 22 the dimensions of which may be a few micrometers the material of the incorporated component 6 not completely filling the microbubbles 7 as long as the incorporated material is in the solid state or in the amorphous state the microbubbles 7 ensure that there is enough space for a phase transition of the incorporated component 6 from an amorphous to a crystalline structure or from a solid to a liquid phase so that this phase can expand in the microbubbles 7 without bursting the plastic housing composition or producing microcracks the behavior of the incorporated component 6 in interaction with the semiconductor device housing 2 is examined in detail below in the discussion of fig2 the plastic housing composition also covers a top side 23 of the carrier substrate 9 alongside the semiconductor chip 4.