machining to minimize damage to the substrate 112 utilizing a laser may result in a tapered opening 116 as shown in fig3 as well as a laser slag or laser residue 126 formed along the wall s 118 of the opening 116 also while the opening 116 is shown to be tapered such a shape of the opening 116 is not required for practicing the presently disclosed technology but is a shape not uncommon to substrate openings fig4 is an illustration of a cross sectional view of the via 110 of fig3 metalized with a metallic adhesion layer 120 in accordance with the first exemplary embodiment of the present disclosure the metallic adhesion layer 120 is formed in the opening 116 against the wall 118 the metallic adhesion layer 120 is chemically bonded to the wall 118 the metallic adhesion layer 120 may be titanium tungsten titanium molybdenum and or nickel as examples these and other metallic adhesion layers may be provided to allow for an improved chemical bond between the braze fill material 122 not shown and the substrate 112 fig5 is an illustration of a cross sectional view of the via 110 of fig4 filled with a braze fill material 122 in accordance with the first exemplary embodiment of the present disclosure the braze fill material 122 is deposited in each via against the metallic adhesion layer 120 and heated to an approximate melting temperature of the braze fill material 120 then allowed to cool the braze fill material 120 may be heated up to approximately 1000 degrees celsius to melt the braze fill material 120 the entirety of the braze fill.