or capacitor in one embodiment the lead frame 301 can have no vacancy or at least one vacancy the structure 300 can include any other equivalent structure for a package structure and it can be made of any suitable material and manufactured by any suitable process a lead frame 301 can be made of conductive material such as ag cu sn or a combination thereof a conductive pattern 312 is formed on the lead frame 301 by some known techniques such as film process printing process laser drilling or a combination thereof in one embodiment at least one conductive layer is patterned on the lead frame 301 to make better performance of a plurality of electrical connections to the pins 315 one aspect of structural difference between lead frames lies in whether it has vacancy or not besides that the remaining of the structure of lead frame are almost the same the preferred structures and manufacturing method in the following description refer to performing the film process on the lead frame which has at least one vacancy fig5 b to fig5 h illustrate a sectional view of process flow for manufacturing the package structure 300 as illustrated in fig5 b a recess 303 is formed in the lead frame 301 with at least one vacancy 302 the recess 303 can be formed by a known technology such as etching or surface coarsening there are many different ways to locate the recess for example in one embodiment the recess is formed inside of the lead frame in another embodiment the recess is formed with one side aligned with one edge of the lead.