can be for example copper note that the heat path from the led is pad 25 and is separate from the electrical path to optimize the heat dissipation from the die to the back structure the led is mounted to pad 25 using a thermally conductive but non electrically conductive adhesive dielectric the heat dissipation is better than in prior art metal core pcbs because the pad has a wider surface area reflector cup 21 is constructed having an optimum angle for reflecting led side light to the top of the package the reflector cup is formed for example using bright color opaque material once the led is mated with pad 25 transparent material is poured around the led to encapsulate the led and wire bond to form complete led package 10 optical dome 12 fig1 is constructed to direct the light from the led source in a desired direction the light output of the led can be changed as desired to applications simply by redesigning the dome shape fig3 a shows a sectional cut away side view of led package 10 taken along section line 3 a 3 a of fig2 having light source such as led 31 physically bonded to heat dissipation pad 25 by bonding material 302 bond wire 32 connects one terminal of led 31.