includes for example an epoxy or silicone resin having light transparency such an encapsulating resin may contain a fluorescent material or the like the light emitting element used is preferably an led element more preferably a blue led or an ultraviolet led where white color or visible light can be obtained through wavelength conversion by the fluorescent material above working examples are described below but the present invention is not limited to the following examples a copper made plate material with the surface being plated with silver was punched into a predetermined shape see fig2 thereby preparing a lead frame and a bare chip of blue led sl v b15aa manufactured by semileds was die bonded to each electrode part a longitudinal column of four electrode parts u00d7 three columns in the transverse direction of the prepared lead frame by using a silver paste thereafter the chips were packaged by wire bonding using a gold wire and the lead frame was cut at the position of cut line shown in fig2 to produce a lead frame portion l for light emission test subsequently while a positive electrode was connected to the positive side power supply lead frame of the lead frame portion l the negative electrode of the power source was connected to the negative side power supply lead frame and in a state of lighting each blue led the emission wavelength was measured using a spectrophotometer mcpd 7000 manufactured by otsuka electronics co ltd the acceptance criterion in the test was the reference wavelength u00b1 10 nm thereafter a silicone elastomer lr7665 produced by wacker asahikasei silicone co ltd was dropped in the electrode.