to substantially fill the undercut area a column forming layer is deposited into the void area and the undercut area to create polymeric posts or columns which are embedded in the sacrificial layer and will later provide support for the structural layer during wet etching of the remaining sacrificial layer the void area may be formed with or without the preferred undercut area where the undercut areas are not present the void areas will produce posts or columns which only overlap the top surface of the structural layer and support the structural layer by adhesion thereto in this regard the area of overlap may be varied to provide a greater or lesser surface area for adhesion depending on the adhesive force required to support the structural layer the void areas also may be etched in the sacrificial layer to a depth less than the depth between the structural layer and the substrate posts or columns which extend from the structural layer short of the substrate may be formed thereby during evaporation of the etching solution and rinsing solution the structural layer will deflect somewhat but will be stopped by the posts or columns before contacting the substrate shorter posts are not preferred however as the spacing between the posts must be closer requiring more holes in the structural.