and or plating of the lead frame and does not permit solder flux and tin which may be inadvertently deposited on the lead fingers 14 to seep through the coating 16 and contact the lead fingers 14 further the coating 16 is readily dissolved with a de coating operation such as with a flux cleaning solution in one embodiment the coating 16 comprises a solution of organic compounds including about 5 5 cationic surfactants and 93 5 non hazardous compounds in one embodiment the coating is formed of non hazardous compounds such as alkyl alkene aryl hydrocarbon and relative ramifications ester oxygenous compounds organic acid etc and other atomic organic compounds and cationic surfactants such as poly methyl u03b3 2 hydroxyl 3 n n dimethyl n benzyl ammonium chloride propyl siloxane fig2 shows a semiconductor die 18 attached to the die flag 12 with solder 20 as is known in the art high power circuits often are attached to a die flag using solder unfortunately after a solder reflow operation of the die attach process is performed flux and tin are deposited on the lead fingers and tin clouds are formed on the lead fingers fig2 shows such tin clouds 22 and flux 24 on the lead fingers 14 note that with the coating 16 the tin clouds 22 and flux 24 do not contact at least the upper surface of the lead.