submount 302 by for example 10 to 20 microns fiber 602 may be then attached to submount 302 with a suitable bonding agent for example an adhesive such as ultraviolet cross linked epoxy after attaching fiber 602 to submount 302 the temporary stop is removed fiber 602 may be positioned near the center of hole 612 in submount 602 but it may not be necessary to align fiber 602 with respect to the sides of hole 612 in submount 302 a circle may be an object for recognition and centroid determination by a machine vision system for placing fiber 602 into submount 602 end 608 of fiber 602 presents such an object for a vision system of a die placement tool the outside diameter of fiber 602 may be used as a fiducial mark or alternatively visible light may be supplied into fiber 602 and the illuminated core of fiber 602 may be used for placing fiber 602 into submount 302 corresponding marks which may be keyed to a position of optically active areas may be fabricated on optoelectronic chip 604 the flip chip die placement tool then may be aligned with the supplied fiducial marks to the image of the forward end of fiber 602 the procedure explained above in fig6 has been devoted to alignment of a single fiber to a single optoelectronic element however these concepts may be extended to.