and pads on the board 409 a mask or photomask may be used to etch the pattern so as to remove conductive material after the pattern 422 is etched rails 421 along each edge remain and the rails 421 have not had conductive material removed during patterning the rails 421 are partially etched or completely etched so that no continuous lengths of conductive material remains from one end of the board 409 to the other to remove continuous lengths of conductive material from the rails 421 all of the conductive material in the rail may be removed or gaps of removed conductive material in the rail could be created the module board 409 can be further processed by connecting integrated circuits and devices while having a reduced tendency to deform or warp compared to boards having continuous lengths of such a conductive material fig5 is a method 500 for fabricating a circuit board having a non continuous conductive layer according to one embodiment of the invention a conductive layer is laminated onto an insulating layer at block 501 the conductive layer can be composed of a conductive material such as a metal such as copper the insulating layer can be of a material such as fiberglass a pattern is then etched into the conductive layer of the circuit board at block 502 this removes some of conductive material.