s pat no 3 770 598 which issued on nov 6 1973 to h g creutz entitled u201c electrodeposition of copper from acid baths u201d describes baths for obtaining ductile lustrous copper containing therein dissolved a brightening amount of the reaction product of polyethylene imine and an alkylating agent to produce a quaternary nitrogen organic sulfides carrying at least one sulfonic group and a polyether compound such as polypropylene glycol which patent is incorporated herein by reference u s pat no 3 328 273 which issued on jun 27 1967 to h g creutz et al entitled u201c electrodeposition of copper from acidic baths u201d describes copper sulfate and fluoborate baths for obtaining bright low stress deposits with good leveling properties that contain organic sulfide compounds of the formula xr 1 u2014 s n u2212 r 2 u2014 so 3 h where r 1 and r 2 are the same or different and are polymethylene groups or alkyne groups containing 1 6 carbon atoms x is hydrogen or a sulfonic group and n is an integer of 2 5 inclusive which patent is incorporated herein by reference additionally these baths may contain polyether compounds organic sulfides with vicinal sulphur atoms and phenazine dyes in u s pat no 3 328 273 table i lists a number of polysulfide compounds which may be added to a bath in the instant invention table ii lists a number of polyethers which may be added to a bath in the instant invention additives may be added to the bath for accomplishing various objectives the bath may include a copper salt and a mineral acid additives may be included for inducing in the conductor specific film microstructures including large grain size relative to film thickness or randomly.