attached to the thermoformed carrier element by an attachment means such as a glue adhesive melt bond chemical bond solvent bond or mechanical fit such as a friction fit fig1 illustrates a flow diagram of an antenna forming process in accordance with an exemplary embodiment of the present invention in step 100 this exemplary embodiment involves applying conductive ink to a dielectric thin sheet an example would be silver ink applied on a 0 003 inch thick mylar u00ae or other polyester film that is then cured in step 101 to form the antenna element an antenna element can be cured using a reflow oven or other drying system to cure the conductive ink step 102 includes providing the carrier material which may comprise a non conductive material such as plastic however as noted earlier the carrier may include any suitable material other than plastic that can be utilized in the thermoforming process the carrier material herein referred to as a thermoformable carrier material will have a melting temperature t m between about 50 0 u00b0 c and about 500 0 u00b0 c and preferably between about 50 0 u00b0 c and about 300 0 u00b0 c the carrier material will have a relaxed state at temperatures below 50 0 u00b0 c and will be rigid in the relaxed state in step 104 the antenna is attached to the thermoformed plastic carrier with an adhesive furthermore depending on the antenna design specifications and preferences the conductive pattern may be adhered to one or both sides of the thermoformed carrier finally in step 105 the thermoformed antennas are cut into individual antenna assemblies that can be.