fabricated with a pattern of receptor sites that matches the pattern of functional elements 102 that are formed on the wafer the template substrate is then placed on the wafer in one embodiment with relative alignment such that the functional elements 102 are then released into the template substrate to reduce the adhesion of the dicing tape uv release dicing tape could be used and the uv exposure could be either a flood exposure or through a stencil or mask so that only the adhesive touching the chips that are to be transferred is uv treated as the dicing tape releases the functional elements 102 the elements 102 are released into the template substrate the layout of the wafer containing the functional elements 102 is important for the transfer of many devices at one time it is preferable to layout the functional elements 102 on the wafer such that the spacing between every i functional elements 102 in the x axis and every j functional elements 102 in the y axis matches the x and y spacing between holes on the punched web 108 to which the devices will be transferred if such a layout is not convenient or practical then the transfer of the functional elements 102 could be completed in more than one step as described above analogously the transfer of two or more different functional elements 102 could be completed in a sequential index and transfer process as described above another option would be to first cut the.