the art a second circuit carrying substrate 110 is formed of a deformable material such that at least one peripheral edge of the substrate exhibits one or more apertures 104 that correspond to the protrusions 102 on the first circuit carrying substrate 100 the dimensions of the apertures 104 are such that the protrusions 102 and apertures 104 must deform somewhat in order to effect the electrical interconnection i e a friction or interference fit depending on the application as few as one protrusion 102 and one aperture 104 can be used to join the first and second circuit carrying substrates 100 and 110 however if it is desired to effect an interconnection for shielding applications a series of protrusions 102 and apertures 104 can be formed along the respective edges of the first and second circuit carrying substrates 100 and 110 referring to fig2 the preferred embodiment of the invention is shown wherein the surfaces of the circuit carrying substrates 100 and 110 are covered with conductive material 202 when the first circuit carrying substrate 100 is intercoupled with the second circuit carrying substrate 110 the leading edges of the apertures 104 will partially deform to allow coupling to the protrusions when fully inserted the protrusions 102 will electrically contact the apertures 104 such that an electrically.