the height of the solder wave falling over the front plate 51 which has a substantially fixed position relative to the nozzle 8 the height of the solder wave increases or decreases as a flow rate of molten solder delivered through the wave nozzle 8 increases or decreases once the wave nozzle 8 is set up for operation the front gate 50 needs no further adjustment from an outside operator as the front gate 50 pivots and automatically adjusts to an appropriate position to accommodate differences in solder wave height as the height of the solder wave rises the front gate 50 adjusts by pivoting or floating to create a larger gap between the gate 50 and front plate 51 to accommodate the greater height of the solder wave the front gate 50 reduces the impact of the flow of the solder wave as the solder wave free falls over the front plate 51 the pivoting movement of the front gate allows the front gate 50 to adjust its position relative to the height of the solder wave and to reduce the impact of free falling solder against the back portion 60 of the front gate thereby eliminating splashing of free falling solder and reducing the turbulence of the solder wave as a solder wave passes over the front plate 51 the free falling solder contacts the baffle 57 the automatic pivoting and adjustment of the position of the front gate 50 in response to changes in the height of the solder wave also adjusts an angle of the baffle 57 in relation to the front plate 51 such that irrespective of solder.