have a hollow or a solid construction in the case of the hollow chimney a highly thermally conductive material e g an embedded copper metal or some electrical contrivance 311 e g to augment heat flow through the hollow chimney may be incorporated within the hollow chimney the chimney 254 may be in close proximity or direct contact e g at a proximal end with the component 206 the chimney 254 is preferably substantially perpendicular to the component 206 as one of ordinary skill in the art will understand the heat sink 250 may draw point heat from the component 206 e g a source load via conduction through the chimney 254 into the dissipation element 252 the heat or heat load from the component 206 may be dissipated e g via convection into the environment from the fins 256 fig3 a shows a cross sectional view of another exemplary embodiment of a device 300 a according to the present invention the device 300 a includes a housing 302 a e g a plastic housing enclosing for example a circuit board 304 a the circuit board 304 a includes at least one component 306 a the device 300 a includes at least one heat sink 350 a according to the present invention the heat sink 350 a includes a dissipation element 352 a at least one chimney 354 a and fins.