and oriented such that the main oscillation direction runs at an angle with a difference of 90 u00b0 to the main defining line application_number US 56334306 A description the semiconductor component shown in fig1 has a multiplicity of active cells 1 in the form of strip cells which are formed regularly along a repetition direction r the strip cells 1 are formed in a common semiconductor body 2 the semiconductor body or semiconductor chip has a rectangular shape and outer boundary edges 4 the strip cells 1 have a longitudinal extent in the direction of the double arrow 6 and main boundary lines 8 parallel to the longitudinal extent with regard to mechanical loading the main boundary lines 8 are particularly sensitive to force components which act on the strip cells 1 transversely i e in the exemplary embodiment at right angles to the main boundary lines 8 in the direction of the double arrow u201c critical direction u201d 10 on the top side 12 of the semiconductor component provision is made of metallic connecting areas 14 16 for making electrical contact by means of bonding wires 18 20 the connecting areas 14 16 are also referred to as bonding areas or bonding pads the end regions of the bonding wires are conductively connected to the bonding areas 14 16 by bonding a particularly high mechanical.