the card surface which critically damages appearance of the ic card however according to this embodiment the adhesives 51 and 52 are applied so as to form the two overlapped layers therefore a portion 86 around the opening portion formed in the core sheets 23 and 24 which are held by the adhesives 51 and 52 of the card substrate is held with slide surfaces at the time of molding the stacked structure by heat and pressure as a result the portion 6 can move sideways very easily causing the gap 7 to be plugged filled as shown in fig2 b by the core sheets 23 and 24 which can slide furthermore as shown in the drawings in detail since the adhesives 51 and 52 are simply held between the core sheets the area that each of the portions to which the adhesives 51 and 52 have been respectively applied is enlarged by the amount of the adhesives 51 and 52 before the integral molding is performed however since the gap is filled by the core sheet after integral molding with heat and pressure the surface can be flattened the portion of the ic card to which no adhesive is applied does not of course slide sideways during molding of the stacked structure the sheets made of for example vinyl chloride resin of the.