led according to the second embodiment has almost the same construction as the smd type led according to the first embodiment however the smd type led according to the second embodiment is different from that of the first embodiment only in that liquid resin 40 is filled inside the package 20 having the led chip 60 mounted therein since the smd type led according to the second embodiment also has the phosphor mixed layer 80 formed on the surface of the lens 90 adjacent to the light emission window of the package 20 it is possible to obtain the same operation and effect as the first embodiment further the led chip 60 and the wire 70 mounted in the package 20 can be protected from conductive impurities and external impact by the liquid resin 40 filled in the package 20 which makes it possible to obtain more excellent effect than in the first embodiment the second embodiment can be applied to the modifications according to the first embodiment according to the present invention the phosphor mixed layer is formed on the surface of the lens adjacent to the light emission window of the package the thickness and concentration of the phosphor mixed layer can be easily adjusted so that uniform white light is implemented further the lens and the phosphor mixed layer are integrated so as to be spaced at a uniform distance from the outer surface of the led chip that is the upper and side surface.