integrated circuit materials the functional layers are etched to define various moving components and the sacrificial layers are etched away to release the components as is known such fabrication techniques generally involve the replication of a large number of similar components on a single wafer that is subsequently diced to separate the various components from each other this reinforces the submission that a person of ordinary skill in the field can readily obtain the printhead chip of this invention by replicating the nozzle arrangement 10 an electrical drive circuitry layer 14 is positioned on the silicon wafer substrate 12 the electrical drive circuitry layer 14 includes cmos drive circuitry the particular configuration of the cmos drive circuitry is not important to this description and has therefore not been shown in any detail in the drawings suffice to say that it is connected to a suitable microprocessor and provides electrical current to the nozzle arrangement 10 upon receipt of an enabling signal from said suitable microprocessor an example of a suitable microprocessor is described in the above referenced patents patent applications it follows that this level of detail will not be set out in this specification an ink passivation layer 16 is positioned on the drive circuitry layer 14 the ink passivation layer 16 can be of any suitable material such as silicon nitride the nozzle arrangement 10 includes an ink inlet channel 18 that is one of a plurality of such ink inlet channels defined in the substrate 12 the nozzle arrangement 10 includes an active ink ejection structure 20 the active ink.