possible to make a cavity in the top layer so that it overlaps the chip the following step consists in laminating the whole set comprising the cover the thermoplastic layer and the top layer at a temperature of 160 u00b0 c and at a pressure of about 200 bar the thickness of the thermoplastic layer chosen depends on the thickness of the chip that is used and the flexibility that is desired for the entire rfid device and cover during the lamination or thereafter the outside of the booklet cover may be subjected to a plate having special raised designs to produce a particular grain on the cover to make the identity booklet tamper resistant although this embodiment is particularly advantageous for passports whose cover is made of reinforced paper it is also applicable to passports whose cover is made of cloth advantageously the rfid device and the identity booklet according to the embodiments of the invention may be subjected to a passage through a washing machine without the electrical connection between the chip and the antenna being altered thus maintaining for these items the ability to be read by electromagnetic coupling with a reader provided for this purpose the rfid device support and the rfid device may also be made in iso format of smart cards so that they can be used to manufacture contactless smart cards the two outer layers of synthetic paper and the pvc layer are in the iso format of smart cards and the antenna is also adapted.