frame should be connected to ground or negative terminal of power supply and hence some circuit configurations cannot be used the instant invention addresses this problem as discussed further below in consideration for the manufacturing process steps of double bonding first coat the insulation glue on the lead frame second dry via high temperature e g baking third coat the conductive glue on the surface of the insulation glue finally bond the ic on the surface of the conductive glue the insulation glue can isolate the ic from the lead frame so the lead frame can be connected to vcc or positive terminal of power supply and hence any kind of circuit configurations can be applied and the conductive glue can firmly fix the position of the ic fig1 illustrates another embodiment including the double bonded structure as shown by the input output led device 290 which comprises an ic wafer 201 led wafer 202 a lead frame 2031 to 2035 insulation glue of bonding agents 2041 conductive glue of bonding agents 2042 and 2043 and coupling wires 205 part of the lead frame 2032 such as an upper surface portion is coated with the insulation glue of bonding agents 2041 the insulation glue of bonding agents 2041 is baked at a high temperature for drying next the surface of the insulation glue is coated with the conductive.