fixed on the transparent substrate and utilized for radiating at least a light beam the circuit is disposed on the transparent substrate and electrically connected to the led chips the transparent encapsulant is utilized for packaging the led chips the light beam of the led chips can propagate from two opposite sides of the transparent substrate blue led chips and the circuit of the transparent substrate can be directly soldered and the phosphors are arranged to convert the wavelength of blue light so a dual side white light emitting device can therefore be provided application_number US 64830609 A description please refer to fig1 through fig3 fig1 is a schematic structural diagram illustrating a led device 100 in accordance with a first preferred embodiment of the present invention fig2 is a schematic top view illustrating the first transparent substrate 124 shown in fig1 and fig3 is a schematic explosion diagram illustrating the led chips 128 and the first transparent substrate 124 shown in fig1 as shown in fig1 an led device 100 can include a first transparent substrate 124 a plurality of led chips 128 mounted on the first transparent substrate 124 and a transparent encapsulant 130 covering the led chips 128 the first transparent substrate 124 can include.