and a series resistance the resistance is part of a flat thin device that occupies very little horizontal area beyond the area of the die and requires no external components which would be unwieldy and expensive as illustrated in fig2 section 18 of acicular ito layer 13 interconnects the area under die 14 and area 19 of overlap with bus bar 12 the geometry of section 18 can be changed to change resistance area 19 is sufficient to provide a reliable low resistance connection between layer 13 and bus bar 12 the series resistance of the interconnection is largely determined by the shape of section 18 between die 14 and bus bar 12 in fig3 section 21 is reduced in width or constricted to increase series resistance the constriction can take place from one edge or from both edges of section 21 as indicated by dashed line 22 the edges of the constriction need not be rectangular or any particular shape a rectangular shape is illustrated for convenience in fig4 section 23 and area 25 are both reduced thus the series resistance of acicular ito section 23 is higher than the series resistance of acicular ito section 21 which in turn is higher than the series resistance of acicular ito section 18 it is undesirable to reduce the contact area underneath die 14 because one wants the best possible electrical and thermal contact with the die the acicular ito layer is shown surrounding die 14 which is preferable to provide a margin of error when placing the die in an array current does not flow through the margin.