chambers 55 a cap 70 is sealed to the chamber portion the cap 70 rests on lip 75 of the chamber portion 50 the final locking seal between the cap 70 and the lip 75 is typically an epoxy which when heated allows the cap to be removed and resealed thereby allowing for the removal and the replacement of faulty die however other locking seals such as a snap seal a grooved seal and a pressure seal may work equally well the chamber portion 50 and the cap 70 are typically molded plastic fig3 is representative of a single bare die 76 designed to fit into the encapsulation device 45 in this case the single die 76 has eight die pads 77 although it is possible for the bare die to have any number of die pads fig4 is a cross sectional view of a single die chamber 55 having parallel walls 78 a bare die 76 inserted into the die chamber 55 is retained against the retaining edges 60 by retaining contact 85 the retaining contact 85 and electrical contacts one of the die pad 77 of bare die 76 see fig3 at a spring portion 86 and electrically contacts a circuit board 90.