is fashioned to hold a microfluidic device such as a wafer die or microchip upon placement of a microfluidic device on the receiving plate 102 the connector plate 203 is attached to a telescoping means 204 that lowers to compress the sealing fittings 104 against ports in the microfluidic device optionally a drive force mechanism applies a pre determined sealing force the drive force mechanism may also provide feedback and monitor the sealing force this drive force can be a spring selected to yield a specific force a pneumatic cylinder where a given amount of applied gas pressure provides a specific force an electric motor which applies a certain amount of torque to provide a specific force or alternatively the drive force could be hydraulic optionally a load cell or force sensor is placed in line to provide a continuous force read back in one embodiment the sealing fittings further contain electrical contacts for common application or isolated with individual contact pads the controlled compression system may close and open allowing for the substrate to be changed the figures shows a linear array however fittings may be placed in any position in the connector plate in one embodiment as shown in fig9 a 9b the sealing fittings are along a track in the connector plate allowing the sealing fitting to travel along the track referring to fig7 there is shown a.