be any type of dielectric material from standard liquid epoxy polyimide teflon cyanate resins powdered resin materials or filled resin systems exhibiting enhanced dielectric constants coating of the dielectric material is performed with any number of methods known in the industry such as roller draw powder or curtain coating electrostatic or electrophoretic deposition screen printing spraying dipping or transfer of a dry film any of these coating methods is capable of providing uniformly thin films in the preferred embodiment of the invention the dielectric is morton lb 404 applied by vacuum lamination the asm is applied to a thickness of about 2 5 mil a second surface metal 20 forming a second conductive layer then is applied on top of the layer of dendrites 16 and dielectric resist 18 the top of the layer of dendrites 16 is inherently substantially planar for this reason the second surface metal 20 easily is applied there is no need to provide for pre drilled holes in the second conductor layer or in the dielectric to accommodate the dendrites 16 any technique known in the art such as sputtering plating or laminating may be used to attach the second surface metal 20 the second surface metal 20 may be made of copper or copper over nickel or chrome in the preferred embodiment of the invention the second surface metal 20 is a copper foil that is 0 3 to 2 mils thick after application of the second surface metal 20 the dielectric resist 18 is fully cured by baking at the appropriate temperature and time in the case of morton lb 404 2 hours at 200 u00b0 c is a typical.