component package will be a 34 die out 34 in which the package is separated from the lead frame 20 in a die the die separates the package along lateral edges of the terminals s g and d with the chosen location of the cut outs 52 54 56 the separation line of the die terminates in the plastic material p that has flowed into the cut outs during molding as best seen from fig6 by terminating the separation line in the plastic avoiding unwanted residual metal portions of the terminals after 34 die out 34 is facilitated as those skilled in the art will immediately appreciate the component placement area 42 defined by raised rib 40 is intended to house an electronic component such as a field effect transistor for which the specifically illustrated embodiment is designed in a typical use of the package the field effect transistor is positioned in the component placement area 42 and gold wire leads from the transistor are gold bonded to the appropriate terminals s g and d which terminals have a surface exposure in the component placement area 42 in order to facilitate this gold bonding the portions of the terminals s g and d that are exposed in the component placement area 42 are preferably gold plated furthermore for economy of manufacturing the exposed portions of the bottom surfaces of the terminals may be tin plated to facilitate soldering of the package to a printed circuit board one way in which such plating can be achieved is by localized gold plating on the top surface of the lead frame 20 in the vicinity of the terminals masking the gold plate.