second pattern may also have one or more intersecting lines 13 which cross one or more of the spokes 11 by applying a pattern of spokes 11 and or intersecting lines 13 the temperature at a plurality of locations on the workpiece 10 may be measured further by limiting the amount of coating that is applied to the workpiece 10 the coating has a minimal effect on the intrinsic temperature of the workpiece 10 in other words the application of the coating may affect the temperature of the workpiece relative to an uncoated workpiece for example in the present semiconductor processing device the workpieces are disposed in close proximity to other components the coating may absorb heat from these neighboring components changing the temperature of the workpiece 10 by minimizing the applied pattern this effect may be reduced for example in certain embodiments the coating covers less than 20 of the total surface of the workpiece 10 in other embodiments the coating may occupy less than 10 of the total surface of the workpiece it is noted that while fig1 a 1b show two patterns of coating the disclosure is not limited to these patterns other patterns may also be used some of these patterns are also shown in fig6 other embodiments are also possible one such pattern is a checkerboard pattern where a grid like pattern of coating is applied to the workpiece another such pattern may be a spiral pattern where curved lines radiate outward from the center of the workpiece another such pattern is a.