pillar bumps with a solder cap electroplated directly onto electrical pads of the integrated circuit element 104 the integrated circuit element 104 is configured to provide signals to control the operation of the actuators 401 as shown in fig7 for example integrated switching elements 302 e g transistors in the integrated circuit element 104 can be connected to actuators 401 on the die 103 with electrical contacts and leads thus when a signal is sent from the flex circuit 201 to the input trace 403 on the die 103 it can be transmitted to an input pad 301 on the integrated circuit element 104 processed on the integrated circuit element 104 such as at the transistor 302 and output at an output pad 303 to the input pad 402 on the die 103 which is connected by the input trace 407 to drive the actuator 401 in some implementations the integrated circuit element 104 also includes one or more diodes the integrated circuit element 104 shown in fig6 includes input pads 301 see fig7 that are connected to the input traces 403 on the die 103 for example the input pads 301 on the integrated circuit elements 104 can be connected to the proximal ends 422 of the input traces 403 which are closer to a center of the die 103 than distal ends 420 of the input traces 403 the input.