the following organic peroxides generally di tertiary alkyl peroxides including but not limited to 2 5 dimethyl 2 5 di t butylperoxy hexane 2 5 dimethyl 2 5 di t butylperoxy hexyne 3 dicumyl peroxide t butyl cumyl peroxide and u03b1 u03b1 u2032 di 2 t butylperoxyisopropyl benzene thioureas including but not limited to 1 3 dibutylthiourea trimethylthiourea 1 3 diethylthiourea and ethylenethiourea and sulfur donors including but not limited to tetramethylthiuram disulfide tetraethylthiuram disulfide dipentamethylenethiuram tetrasulfide or hexasulfide or elemental sulfur combined with traditional sulfur accelerators known to the rubber industry in another embodiment of the present invention the primary rubber bonding polymer is not provided with a cure agent but rather a separate thermosetting composition is added to the primary rubber bonding polymer to provide a thermosetting film upon cure which entraps and stabilizes the primary rubber bonding polymer in a thermoset film the thermosetting composition is preferably compatible with the primary adhesive constituents so as to provide good mixing and adhesive film formation further the thermosetting composition is preferably absent internal or pendant unsaturation so as to prevent curing while the components are mixed in powdered form in a preferred embodiment of the present invention the cure is not initiated until the mixture is heated during a sintering step in a further embodiment of the present invention a rubber bonding polymer such as a halogenated polybutadiene is employed as the primary rubber bonding polymer and a second thermosetting composition comprising chlorosulfonated polyethylene and a curative such as poly dinitrosobenzene dnb are provided to affect a thermoset film upon heating the chlorosulfonated polyethylene and dnb will react to form a thermoset film which entraps and stabilized the primary rubber bonding polymer additionally since chlorosulfonated polyethylene and dnb are preferred rubber adhesive components they are.