is designed which is typically the wavelength range of visible radiation even more preferably at least 90 of this radiation is transmitted here the electrode lines 42 a 42 b are arranged according to a hexagonal pattern however various alternative patterns are possible as shown in fig6 a c at least one conditional electric bypass element 30 is mounted against the electric support layer 41 the conditional electric bypass element 30 has a first and a second terminal 31 32 that are each connected to a collector line 44 a 44 b of a respective one of the neighbouring electric support layer portions 41 a 41 b fig5 shows a cross section according to v v in fig4 the conditional electric bypass element 30 shown in more detail in fig5 has a conditionally electrically conductive channel 33 between said first and said second terminal 31 32 typically the conditional electric bypass element 30 is formed by a silicon based chip various methods are available to the person skilled in the art to provide for a mechanical and electrical connection between the element 30 and the electric support layer 41 for example a direct wire bonding may be provided alternatively gold or solder bumps may be used for providing the connections with the electric support layer 41 instead of directly mounting the conditional electric bypass element 30 on the electric support layer 41 an interposer may be used the conditional electric bypass element 30 may be mounted on the interposer for example with bumps and the interposer can subsequently be connected to the electric support layer 41 by soldering gluing or crimping fig6 a shows an alternative arrangement for an electric support layer 41 a b therein the electrode lines 42 a b are arranged in.