may be used and should be clear to those skilled in the art in view of the above disclosure in an additional embodiment illustrated in fig6 an integrated circuit package generally designated by reference numeral 94 uses a different arrangement for electrically connecting package 94 to other elements as shown in fig6 package 94 includes integrated circuit die 40 bonding wires 72 flex tape substrate 84 and encapsulating material 44 as were described above however in this embodiment flex tape substrate 84 has an outermost peripheral edge 96 and does not include contact terminals 66 on its bottom surface instead electrically conductive traces indicated by line 68 extend outwardly along the top surface of substrate 84 beyond peripheral edge 96 of substrate 84 rather than through substrate 84 as described in the previous embodiments as described above traces 68 are electrically connected to terminal pads 64 on the top surface of flex tape substrate 84 however in this embodiment they extend outwardly along the top surface of substrate 84 beyond peripheral edge 96 rather than electrically connecting terminal pads 64 to contact terminals on the bottom surface of substrate 84 these traces which extend beyond outermost peripheral edge 96 allow integrated circuit package 94 to be electrically connected to other electrical elements such as a.