be embodied in different forms and should not be construed as limited to the embodiments set forth herein rather these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art in the drawings the thickness of layers and regions are exaggerated for clarity it will also be understood that when a layer is referred to as being u201c on u201d another layer or substrate it can be directly on the other layer or substrate or intervening layers may also be present like numbers refer to like elements throughout an electrostatic drive type rf mems relay is described below as a mems device according to an embodiment of the present invention 0036 fig3 a to fig3 f illustrate views for sequentially showing stages in a process for fabricating an electrostatic drive type mems relay according to an embodiment of the present invention first as shown in fig3 a a driving electrode layer 320 for providing an electrostatic driving force is formed on a substrate 310 through patterning as shown in fig3 b a flattening mold 330 is formed as an insulation layer on the substrate 310 on which the driving electrode layer 320 is formed a tetraethyl orthosilicate teos oxide film is preferably used for the insulation layer thereafter the flattening mold 330 of the insulation layer is patterned and the regions for an anchor part a of the mems relay and a contact part.