in an encapsulation resin 4 b in the package of fig3 a semiconductor chip 3 is mounted on a lead frame 7 of metal and the semiconductor chip 3 is electrically connected to an inner lead 8 via a wire 6 including the wire 6 the semiconductor chip 3 is resin encapsulated in an encapsulation resin 4 c in the package of fig4 a semiconductor chip 3 is mounted on a lead frame 10 of metal and the semiconductor chip 3 is electrically connected to an inner lead 11 provided around the lead frame 10 via a wire 6 including the wire 6 the semiconductor chip 3 is resin encapsulated in an encapsulation resin 4 d in the invention the interconnection electrode is to electrically connect the insulating substrate 1 to the semiconductor chip 3 for example as in fig1 it may be any well known electrode alone but its concept is to include an electrode and a conductor such as a joint ball to be disposed around the electrode the concept of the conductor wire in the invention is to include the wire 6 that electrically connects the semiconductor chip 3 to the insulating substrate or the semiconductor chip 3 to the inner lead 8 or the semiconductor chip 3 to the inner lead 11 as well as the inner leads 8 11 and the other wires on the insulating substrate 5 as in fig2 to fig4.