including those made of semiconductors other than silicon when reference is made to a semiconductor substrate or wafer in the following description previous process steps may have been utilized to form regions or junctions in or over the base semiconductor or foundation the substrate also need not be semiconductor based but may be any support structure suitable for supporting an integrated circuit including but not limited to metals alloys glasses polymers ceramics and any other supportive materials as is known in the art as used herein the term u201c elastomeric material u201d and u201c flexible material u201d are to be understood to include any material including but not limited to epoxy polyimide polyester or any other material capable of withstanding a 180 u00b0 angle bend at a radius of at least u215b inch or less similarly an u201c elastomeric material u201d or u201c flexible material u201d may be any material having substantially the same or equivalent properties as dupont kapton u00ae or oasis u00ae specifically the material may have a tensile strength of about 10 kpsi or greater a tensile modulus of about 200 kpsi or greater and or an elongation property of about 25 or more values based on astm d 882 83 method a embodiments are now explained with reference to the figures throughout which like reference numbers indicate like features fig1 is a partial cross sectional view of an.