third embodiment of the present invention similar to the aforementioned embodiments as shown in steps 202 and 204 of fig1 a die 72 and a substrate 74 are provided and the die 72 is mounted on the substrate 74 in the third embodiment the package structure could have two configurations such as a first configuration shown on the left that includes a first bump pad 76 and a second bump pad 78 on the die 72 a first dummy pad 80 and a second dummy pad 82 on a first surface 84 of the substrate 74 a first dummy bump 86 between and contact the first bump pad 76 and the first dummy pad 80 and a second dummy bump 88 between and contact the second bump pad 78 and the second dummy pad 82 and a second configuration on the right that includes only one dummy bump 86 formed between the first bump pad 76 and the first dummy pad 80 preferably in this embodiment the first bump pad 76 and the second bump pad 78 are electrically connected internally through an electrical connection 77 in the die 72 the package structure also includes a first solder pad 90 and a second solder pad 92 on a second surface 94 of the substrate 74 and a.