the body in some embodiments the system could include 2 20 thermal treatment devices fig1 is a block diagram showing one system 100 for local thermal treatment in an embodiment a power supply 110 provides electrical power to system 100 a controller 120 provides control of system 100 components a solid state heat pump 130 pumps heat in response to an applied voltage solid state heat pump 130 includes a p type and an n type semiconductor material aligned in parallel and an electrical junction connecting the two materials at one end when a voltage is applied across the two materials at their opposite end flow of electrical current through the dissimilar materials causes a temperature difference between the two ends as a result heat moves from one end of solid state heat pump 130 to the other forming a hot end and a cold end a thermal conductor 140 is thermally connected to one end of solid state heat pump 130 such that heat is transferred between solid state heat pump 130 and thermal conductor 140 by conduction thermal conductor 140 may be made of any material with sufficient thermal conductivity such as a metal a thermal pack 150 is thermally connected to thermal conductor 140 such that heat is transferred between thermal conductor 140 and thermal pack 150 by conduction a heat sink 160 is thermally connected to solid state heat pump 130 on the opposite end of thermal conductor 140 and thermal pack 150 such that heat is transferred between solid state heat pump 130 and heat.