center line of the laser diode 205 from that of the eyelet 201 can be 2 u00b0 at the maximum and depends on the accuracy of an assembling apparatus a length x by which the au ball 109 bulges out of the wire bonding area 111 when the au ball 109 is formed in the wire bonding area 111 is given by the following equation if the maximum allowable value of the bulging length x is set at d 8 corresponding values of l and lb are given by the following equations since tan 2 u00b0 0 0349 in this embodiment the electrode edge 105 is employed as a wire bonding reference pattern which is a reference for determination of a wire bonding position wire bonding is performed at such a position that the distance l between this wire bonding reference pattern and the center of the au ball 109 having the diameter d and formed in the wire bonding area 111 satisfies a relationship at this time positioning is performed so that the distance lb between the center line in the direction parallel with the longer sideline of the electrode pattern 103 of the wire bonding recognition pattern 107 formed in the electrode pattern 103 which is parallel with the shorter sidelines of the electrode pattern 103 and the center of the au ball 109 satisfies a relationship for example in a high output power recording laser diode in which the longitudinal length is 2 000 u03bcm the width is 120 u03bcm and the electrode width is 80 u03bcm if the au ball diameter is 80 u00b1 10 u03bcm the distance l is about 286 u03bcm therefore without the wire bonding recognition.