agents and catalysts for epoxide based formulations include anhydrides amines imidazoles and the like as readily recognized by those of skill in the art curing agents contemplated for use in the practice of the present invention will vary with the reactive functionality ies present the presence of optional co reactant s and the like typically the quantity of curing agent will fall in the range of about 1 percent by weight up to about 50 percent by weight of the total composition with presently preferred amounts of curing agent falling in the range of about 5 percent by weight up to about 40 percent by weight of the total composition initiators contemplated for use with epoxide based adhesive formulations include hydroxy functionalized compounds such as for example alkylene glycols preferred alkylene glycols include ethylene glycols and propylene glycols fillers contemplated for optional use in the practice of the present invention include for example aluminum nitride boron nitride silicon carbide diamond graphite beryllium oxide magnesia silicas such as fumed silica or fused silica alumina perfluorinated hydrocarbon polymers i e teflon u2122 thermoplastic polymers thermoplastic elastomers mica glass powder and the like preferably the particle size of these fillers will be about 20 microns if aluminum nitride is used as a filler it is preferred that it be passivated via an adherent conformal coating e g silica or the like some of those fillers may impart properties to the adhesive formulation such as for example reduced thermal expansion of the cured adhesive reduced dielectric constant improved toughness increased hydrophobicity and the like flexibilizers also called plasticizers contemplated for optional use in the practice of the present invention include branched polyalkanes or polysiloxanes that lower the t g of the formulation such flexibilizers include for example polyethers polyesters polythiols.