and the wires are driven to run the ingot is moved upward and cut by the wires to obtain wafers the wires are displaced toward one side of cut surfaces of the wafers by lowering the wafers as the wires remains displaced toward the one side of cut surfaces of the wafers the wires are pulled out of the wafers without contacting the other side cut surfaces of the wafers thus the multiwire saw does not cause any damage to major surfaces of the wafers and is used many times without cutting the wires application_number US 52239700 A description hereinbelow the present invention is described in detail by way of embodiments thereof illustrated in the accompanying drawings fig1 is a perspective view of an ingot 1 as a workpiece before cutting and a multiwire saw 2 the ingot 1 is for example a cylindrical shaped compound semiconductor single crystal ingot having a zinc blende structure grown in lt 111 gt bearing by lec liquid encapsulated czochralski technique the multiwire saw 2 has a plurality of wires 2 a arranged in parallel on the same plane the ingot 1 is stuck on a mount 3 such as a ceramic base and cut by the multiwire saw 2 under a sprinkle of an abrasive solution including abrasive grains having grain size of 2000 or more preferably 3000 6000 according to jis japanese industrial standard r6001 even after the ingot 1 is completely cut to be formed into wafers 1 a as cut objects the wafers 1 a are fixed on the mount 3 this mount 3 is fitted onto a stage 6 and the stage 6 has a mechanism not shown which is slidable in directions of y axis and z axis.