2 of fig1 of subassembly 100 shown previously in fig1 the relative positions of electronic insulating material 104 exposed terminations such as gull wing component lead termination 102 and discrete or analog component lead termination 106 are shown in fig2 upper gull wing component package 202 having lead 208 is mounted on middle component package 204 lead 208 extends beyond package 204 and reaches a surface of electronic insulating material 104 middle component package 204 is mounted on discrete or analog component 206 whose lead termination surface 106 reaches the surface of electronic insulating material 104 termination surface 102 and termination surface 106 as well as other termination surfaces are exposed and available for electrical connection to other terminations traces and or a pcb fig3 shows a subassembly 300 viewed from the lead termination side of components encapsulated in electronic insulating material 304 exposed are terminations such as blind via plated interconnection termination surface 302 and land grid array lga integrated circuit ic package termination surface 306 fig4 is a section taken along 4 4 of fig3 of subassembly 300 shown previously in fig3 the relative positions of electronic insulating material 304 exposed terminations such as component lead termination 302 and component lead termination 306 are shown in fig4 upper component package 402 having area array ic package wiring substrate 410 and blind via plated interconnection lead 408 is mounted on lower component package 404 in turn component package 404 has area array ic package wiring substrate 412 lead 408 extends beyond substrate 410 and reaches a surface of electronic insulating material 304 a via extends from the surface of material 304 into lead 408 component package 404 through substrate 412 has termination surface 306 reaching the surface of electrical electronic insulating material 304 lead.