Superior Thermal Conductivity of Graphene Film/Cu-Zr Alloy Composites for Thermal Management Applications.As the power density of electronic devices continuously increases, there is a growing demand to improve the heat conduction performance of thermal management materials for addressing heat dissipation issues.  Single-/few-layer graphene is a promising candidate as a filler of a metal matrix due to its extremely high thermal conductivity (k); however, the well-arranged assembly of 2D-component graphene with a high volume fraction remains challenging.  The thermal transfer mechanisms were investigated by experiments and theoretical calculations.  Meanwhile, the relation between interfacial microstructure and heat transfer is established in the composites using interfacial thermal resistance as a bridge.  This work yields in-depth insight into the heat conduction mechanism in highly oriented structures and provides a promising solution for the thermal management issues of high-power electronics.
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