sentences:  Starting in the mid-1980s, the capacitor has been moved above or below the silicon substrate in order to meet these objectives.DRAM cells featuring capacitors above the substrate are referred to as "stacked" or "folded plate" capacitors; whereas those with capacitors buried beneath the substrate surface are referred to as "trench" capacitors.In the 2000s, manufacturers were sharply divided by the type of capacitor used by their DRAMs, and the relative cost and long-term scalability of both designs has been the subject of extensive debate.